JP5212089B2 - Led発光装置 - Google Patents
Led発光装置 Download PDFInfo
- Publication number
- JP5212089B2 JP5212089B2 JP2008330669A JP2008330669A JP5212089B2 JP 5212089 B2 JP5212089 B2 JP 5212089B2 JP 2008330669 A JP2008330669 A JP 2008330669A JP 2008330669 A JP2008330669 A JP 2008330669A JP 5212089 B2 JP5212089 B2 JP 5212089B2
- Authority
- JP
- Japan
- Prior art keywords
- led chip
- lead frame
- led
- emitting device
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
Description
11、16、36:凹部
12:パッケージ
13a、13b:リードフレーム
14a、14b:ワイヤ
15:封止樹脂
27、37:凸部
Claims (4)
- 側面が上方に向かって広がるように傾斜した凹部を有し、樹脂からなるパッケージと、
前記パッケージの前記凹部底面に形成されたリードフレームと、
前記リードフレーム上に配置され、前記リードフレームと電気的に接続された矩形のLEDチップと、
前記パッケージの前記凹部を埋める封止樹脂と、
を備え、
前記リードフレームの前記LEDチップ近傍に、前記リードフレームが屈曲されて前記LEDチップの対向する一対の辺に沿って平行な凹部および凸部が形成されていて、
その凹部と凸部は、前記LEDチップに近い側を凹部、遠い側を凸部として連続して形成され、
そのリードフレームの凹部の前記LEDチップとは反対側の側面、および凸部の前記LEDチップ側の側面は、前記LEDチップから離れる方向であって上方へ向かう方向に傾斜していて、かつ、その傾斜した凹部側面と、傾斜した凸部側面とが一続きに形成されている、
ことを特徴とするLED発光装置。 - 前記LEDチップは長方形であり、
前記リードフレームの凹部および凸部は、前記LEDチップの長辺に沿って形成されていることを特徴とする請求項1または請求項2に記載のLED発光装置。 - 前記LEDチップは、フェイスアップ型であることを特徴とする請求項1ないし請求項3のいずれか1項に記載のLED発光装置。
- 前記リードフレームには、Agめっきが施されていることを特徴とする請求項1ないし請求項4のいずれか1項に記載のLED発光装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008330669A JP5212089B2 (ja) | 2008-12-25 | 2008-12-25 | Led発光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008330669A JP5212089B2 (ja) | 2008-12-25 | 2008-12-25 | Led発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010153624A JP2010153624A (ja) | 2010-07-08 |
JP5212089B2 true JP5212089B2 (ja) | 2013-06-19 |
Family
ID=42572397
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008330669A Active JP5212089B2 (ja) | 2008-12-25 | 2008-12-25 | Led発光装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5212089B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6221387B2 (ja) | 2013-06-18 | 2017-11-01 | 日亜化学工業株式会社 | 発光装置とその製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11274572A (ja) * | 1998-03-23 | 1999-10-08 | Nec Corp | Led表示素子および表示装置 |
JP2003158302A (ja) * | 2001-11-21 | 2003-05-30 | Toyoda Gosei Co Ltd | 発光ダイオード |
JP4009097B2 (ja) * | 2001-12-07 | 2007-11-14 | 日立電線株式会社 | 発光装置及びその製造方法、ならびに発光装置の製造に用いるリードフレーム |
JP2007109915A (ja) * | 2005-10-14 | 2007-04-26 | Stanley Electric Co Ltd | 発光ダイオード |
JP3974154B2 (ja) * | 2006-02-27 | 2007-09-12 | 株式会社東芝 | 光半導体モジュール及び光半導体装置 |
KR100772433B1 (ko) * | 2006-08-23 | 2007-11-01 | 서울반도체 주식회사 | 반사면을 구비하는 리드단자를 채택한 발광 다이오드패키지 |
-
2008
- 2008-12-25 JP JP2008330669A patent/JP5212089B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2010153624A (ja) | 2010-07-08 |
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