JP3949072B2 - Pressurizing device - Google Patents

Pressurizing device Download PDF

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Publication number
JP3949072B2
JP3949072B2 JP2003086417A JP2003086417A JP3949072B2 JP 3949072 B2 JP3949072 B2 JP 3949072B2 JP 2003086417 A JP2003086417 A JP 2003086417A JP 2003086417 A JP2003086417 A JP 2003086417A JP 3949072 B2 JP3949072 B2 JP 3949072B2
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Prior art keywords
film
pressurizing
mold
circuit element
flexible layer
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JP2004296746A (en
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隆博 森
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Nikkiso Co Ltd
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Nikkiso Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/568—Temporary substrate used as encapsulation process aid
    • H—ELECTRICITY
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75315—Elastomer inlay
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H01L2224/75744—Suction holding means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
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    • H01L2224/758—Means for moving parts
    • H—ELECTRICITY
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    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7598—Apparatus for connecting with bump connectors or layer connectors specially adapted for batch processes
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving a temporary auxiliary member not forming part of the bonding apparatus
    • H01L2224/81005—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving a temporary auxiliary member not forming part of the bonding apparatus being a temporary or sacrificial substrate
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Description

【０００１】
【発明の属する技術分野】
本発明は、加圧型により被加工物を加圧して、被加工物に対して圧着などの加工を行う加圧装置、および集積回路チップなどの回路素子を基板上に実装する方法に関する。
【０００２】
【従来の技術】
基板上に回路素子を実装する方法として、基板と回路素子の間に接着性のあるフィルムを配置し、回路素子を基板に向けて加圧、加熱し、圧着実装する方法が知られている。前記接着フィルムとして熱硬化性の異方性導電膜を用いることがあり、この場合、素子の接着と配線を同時に行うことができる。また、熱可塑性のものや、非導電膜や導電または非導電ペーストを用いることもある。これらの接着フィルムを利用した回路素子の実装工程を説明すれば、まず、基板上の、回路素子搭載位置に接着フィルムを載置し、その上に回路素子を置く。接着フィルムの表面は接着性を有しており、回路素子を置く際にわずかに押圧することによって、回路素子は仮固定または仮圧着される。回路素子には、外部と電気的な接続を行うためのバンプと呼ばれる電極が突設されている。素子を載置した際の、基板上の前記バンプに対向する位置には、配線が位置している。回路素子が基板上に載置された状態で、これを加圧すると、前記バンプと配線は、周囲より飛び出しているために、これらの間の接着フィルムがより加圧され、導通する状態となる。また、加熱によって接着フィルムが基板と回路素子を接着し、本圧着が行われる。
【０００３】
さらに、複数個の回路素子を同時に実装する技術が下記特許文献１に記載されている。この文献に記載の装置は、柔軟な緩衝層を介して加圧することにより、この緩衝層にて複数の回路素子の高さの違いを吸収し、同時に加圧し、実装を行っている。緩衝層の例としては、ゴム状弾性に富んだシート類、または気体、液体を内包した袋類、風船状物が挙げられている。
【０００４】
【特許文献１】
特開平１０−２５６３１１号公報（第３ページ左欄、図２）
【０００５】
【発明が解決しようとする課題】
前述のように、従来の装置においては、緩衝層として、ゴム状弾性を有するシートが提案されているが、シリコンゴムなどのシートでは、高さの高い回路素子の部分の圧力が高くなり、加圧の圧力の均等性が十分に確保できなかった。また、気体や液体を内包した袋類を用いる場合、袋の強度が不足し、十分な加圧の圧力を得ることができなかった。
【０００６】
本発明は、前述の問題点を考慮してなされたものであり、複数の回路素子に対して均等に加圧し、これらの実装を行うことを目的とする。
【０００７】
【課題を解決するための手段】
本発明にかかる加圧装置は、複数の加圧型で被加圧物を挟持し、少なくとも一つの前記加圧型と前記被加圧物の間に流動性があり柔軟な材料の流動性柔軟層を含む介在パッドを介在させて、加圧を行うものである。流動性があり柔軟な材料は、ゲル状材料とすることができる。
【０００８】
流動性のある柔軟な層を介して圧力を加えることにより、凹凸のある被加工物に対し、低い部分に対しても圧力を加えることができる。例えば、基板上に回路素子を圧着する際の加圧装置として用いれば、各回路素子の高さが異なっていても、ほぼ均等に加圧を行うことができる。
【０００９】
また、前記介在パッドは、前記流動性柔軟層を囲むように配置される枠体を有するものとでき、さらには、前記枠体の開口前面に張られ、前記被加圧物に接触する面を形成する膜状部材と、前記枠体と前記加圧型の隙間を覆うシール体と、を有するものとできる。
【００１０】
これらの枠体、膜状部材およびシール体は、流動性柔軟層を収容、保持する。また、膜状部材によって、流動性柔軟層を構成する材料が加圧方向に対して横方向に流れ、これのために被加工物がずれてしてしまうことが防止される。
【００１１】
さらに、前記介在パッドは、前記流動性柔軟層の、被加圧物に対向する側の反対側に配置された多孔質の柔軟層を含むものとすることができる。
【００１２】
さらに、前記流動性柔軟層の材料はゲル状材料とすることができる。
【００１３】
また、本発明の他の態様である回路素子を基板上に実装する方法は、基板上に接着フィルムと、これに重ねて回路素子とを配置する工程と、前記回路素子を、流動性があり柔軟な材料を含む流動性柔軟層を介して、前記基板に向けて加圧型により加圧し、圧着する工程と、を有する。流動性があり柔軟な材料は、ゲル状材料とすることができる。
【００１４】
【発明の実施の形態】
以下、本発明の実施の形態（以下実施形態という）を、図面に従って説明する。以下に説明する実施形態において、被加工物は、電子回路等の基板とこの基板上に実装される回路素子であり、これらが加圧されることによって、圧着と、所定の電気的接続が達成される。
【００１５】
図１は、本実施形態の集積回路チップなどの回路素子の実装方法を説明するための概念図である。図１（ａ）に示すように、基板１０の表面には、所定のパターンで、配線１２が形成されている。基板１０上に、接着用および配線用としての熱硬化性の接着シート１４と回路素子１６を所定位置に配置する。回路素子１６の基板１０に対向する面（図において下面）には、電気的な接点となるバンプ１８と呼ばれる突起が設けられている。配線１２とバンプ１８は、接着シート１４を挟んで対向する位置にある。言い換えれば、回路素子１６の実装位置に基づき配線１２を設ける位置が決定されている。
【００１６】
次に、図１（ｂ）に示すように、回路素子１６および基板１０の上方に位置する流動性のある柔軟層（以下、流動性柔軟層という）２２を、この流動性柔軟層の更に上方に位置する加圧型をストロークさせることにより回路素子１６の表面に接触させる。そして、加圧型をさらにストロークさせ、流動性柔軟層２２を図中矢印で示すように、回路素子１６や接着シート１４の側方へと回り込ませる。
【００１７】
図１（ｃ）に示すように、加圧対象となる回路素子１６および接着シート１４を一体に、その周囲、図においては上方および側方より加圧する、いわゆる等方加圧を行う。前述のように配線１２およびバンプ１８は、各々が配置された面より突起しており、加圧されることによって、これらの配線１２、バンプ１８で挟まれた接着シート１４の部分がより圧縮され、この圧縮された部分が導電性を有するようになり、配線１２とバンプ１８の間が導通状態となる。また、加圧型には、ヒータが備えられ、これからの熱により接着シート１４が硬化し、回路素子１６が圧着される。
【００１８】
図２は、集積回路チップの圧着を行う加圧装置の概略構成を示す図である。本装置は、基板１０、接着シート１４、回路素子１６などの被加工物が載置される下型３０と、この下型３０に対向し、加圧対象となる前記基板１０などを下型３０と共に挟む位置に上型３２と、対向した上型３２と下型３０の間の空間の側方を囲うサイド型３４を有している。サイド型３４のさらに外側を囲うようにシール型３６が配置されている。シール型３６は、上型３２、下型３０、サイド型３４で囲まれた空間を減圧するために、この空間を封止する。
【００１９】
サイド型３４の図中下端は、介在パッド３８を支持する枠体４０となっている。介在パッド３８は、前記枠体４０に直接支持される２枚の膜状の部材４２，４４と、２枚の膜状部材の間に収容される２種類の柔軟な材料が層をなす柔軟体４６を有している。柔軟体４６は、枠体４０に取り囲まれていることにより、型により圧力が加えられた際に、その圧力を被加工物に効率よく、確実に伝えることができる。下型３０側の膜状の部材４２（以下、膜状部材４２と記す）は、枠体４０の開口全面に張られ、加工時において被加工物に押圧される。膜状部材４２は、例えばシリコンゴムなどのゴム材料により構成することができる。また、ポリイミド繊維などの織物を心材としたシリコンゴムなどのゴム膜とすることもできる。膜状部材４２は、前述のように柔軟体を保持する機能の他に、後述する柔軟体を構成する材料の流動、特に横方向の流動によって生じる被加工物の横ずれを防止する機能がある。例えば、基板１０に回路素子１６を圧着する際に、柔軟体４６内の横方向の流れによって回路素子１６がずれて、配線１２とバンプ１８（図１参照）がずれる場合がある。膜状部材４２が回路素子１６などの横方向の動きを規制することによって圧着位置がずれることが防止される。前述のように、繊維を心材とした場合、膜状部材４２の面内方向の変形が心材によって抑制されるので、圧着位置のずれに関して、より有効となる。膜状部材４２は、このほかに、ゴム膜と金属薄膜とを積層したものとすることができる。上型３２側の膜状の部材４４は、中心部分が開口しており、収容されている柔軟体４６が、上型３２とサイド型３４の隙間に侵入し、漏れることを防止するシール部材となっている（以下、膜状の部材４４をシール部材４４と記す）。
【００２０】
膜状部材４２およびシール部材４４の周縁部は、３層に構成された枠体４０の層間に挟まれるようにして支持される。枠体の各層には、層間で相対する面に、互いに嵌り合う凹凸が形成されている。この凹凸によって膜状部材４２およびシール部材４４を噛み込み、これらを強固に保持固定している。
【００２１】
前述のように柔軟体４６は、異なる材料の２層を含む。下方、すなわち被加工物側の層には、柔軟性があり流動性の高い材料が用いられる。以下、この層を流動性柔軟層４８という。また、この流動性柔軟層４８は、図１の概念図に示した流動性柔軟層２２に対応する。流動性によって、凹凸のある被加工物の凹部分にも、この材料が十分流れ込んで、ここを満たし、加圧時に全体に均等な圧力を加えることができる。また、反発弾性は低い、すなわち反発弾性率が低いことが好ましい。反発弾性が高いと、変形が大きい部分に大きな反発力が発生し、圧力分布を不均一としてしまう。このような特性を満たす材料としては、ゲル状の材料がある。例えば、（株）ジェルテック製、高ダンピング熱伝導ゲルシート「αＧＥＬ（商標）」や、リケンテクノス（株）製、熱可塑性エラストマー、鬼怒川ゴム工業（株）超軟質エラストマー「フレンジェル（商品名）」などを用いることができる。柔軟体４６のもう一つの層は、多孔質の柔軟材料（により構成される。以下、この層を多孔質柔軟層５０という。多孔質柔軟材料は、例えば、シリコンスポンジ、フッ素スポンジなどを用いることができる。このような層を設けることによって、柔軟体４６の被加工物への当接初期に、まず多孔質柔軟層５０が変形することによって、流動性柔軟層４８の流動が確保される。また、圧着が終了し、圧力が解放された時点で、多孔質柔軟材料の復元力が、流動性柔軟層４８の復元にも寄与する。
【００２２】
上型３２や介在パッド３８を含む上部構造と、下型３０およびこれに載置された被加工物との間には、カバーフィルム５２が配置されている。カバーフィルム５２は、繰り出しロール５４と巻き取りロール５６との間に渡されており、使用のごとに、または所定回数の使用ごとに、新たな部分が、繰り出しロール５４から被加工物の上方へ、また使用済みの部分が巻き取りロール５６へと巻き取られる。
【００２３】
シール型３６の、サイド型３４と摺動する面には、第１のシールリング５８が配置されている。また、下型３０に対向する面には、第２のシールリング６０が配置されている。これら第１および第２のシールリング５８，６０により、シール型３４が下型３０に当接した際に、サイド型３４、介在パッド３８、下型３０およびシール型３６が囲む空間が密閉される。この密閉された空間から排気管６２，６４を介して排気ポンプ６６により排気がなされ、空間内が減圧される。また、下型３０側に延び、ここより排気を行う排気管６４は、カバーシート５２により被加工物を覆ったときに、これらの間の空気を吸引し、カバーシート５２を被加工物に密着させる。これにより、被加工物の動きが抑制される。前述の膜状部材４２の作用、すなわち被加工物の横方向の動きを抑制する作用が十分に達成されるのであれば、カバーシート５２は用いず、直接介在パッド３８を被加工物に当接させるようにすることもできる。
【００２４】
次に、基板１０と回路素子１６を被加工物の例とし、これらを圧着する際の本実施形態の加圧装置の動作を説明する。まず、図２に示すように下型３０上に基板１０と回路素子１６を、これらの間に接着シート１４を挟んで載置する。
【００２５】
次に、図３に示すように、繰り出しロール５４と巻き取りロール５６を降下させ、カバーフィルム５２にて、基板１０、回路素子１６と共に下型３０の上面を覆う。これと平行して、またはこれの後に、シール型３６を含む上部構造を降下させ、シール型３６をカバーフィルム５２で覆われた下型３０の上面に当接させる。このとき、介在パッドは、回路素子１６等に未接触である。シール型３６、サイド型３４に配置された第１および第２のシールリング５８，６０により基板１０および回路素子が配置される空間が密閉され、そして排気ポンプ６６により、その空間が減圧される。排気管６４を介してカバーシート５２と下型３０との間の空気を吸引することにより、カバーシート５２が下型３０および基板１０、回路素子１６に密着する。カバーシート５２の上側の空間も減圧され、この減圧と共に上型３２が降下される。シール型３６は、すでに下型３０に当接しているので、これ以外の、サイド型３４、上型３２を含む上部構造が降下する。このとき、サイド型３４とシール型３６は相対的に移動するが、第１のシールリング５８により密閉性は確保される。
【００２６】
サイド型３４の下端、すなわち枠体４０の下端が下型３０に当接し、更に上型３２がストロークした状態が図４に示されている。サイド型３４が下型３０に当接した後、上型３２が更に降下すると、多孔質柔軟層５０が変形し、また流動性柔軟層４８も基板１０および回路素子１６の凹凸に倣うように変形する。このとき、カバーシート５２および膜状部材４２も同様に変形する。シール部材４４は、図示するようにサイド型３４と上型３２の隙間で屈曲しつつ、この部分から柔軟体４６を構成する材料が漏れる、またははみ出すことを防止している。この加圧した状態を所定時間維持する。また、下型３０に備えられたヒータ（不図示）により、加圧と同時に加熱を行い、圧着を行う。所定時間経過後、上型３２、サイド型３４、シール型３６およびカバーシート５２などを上昇させ、回路素子１６が圧着された基板１０を取り出す。
【００２７】
図５は、上型３２の前面にゴムの層を設け、基板と回路素子を加圧したときの面圧分布を示す図である。また、図６は柔軟体４６を流動性柔軟層のみから構成した場合、図７は柔軟体４６を前述の実施形態のように流動性柔軟層と多孔質柔軟層の２層から構成した場合の圧力分布を示す図である。濃度がより濃い部分が圧力が高い部分である。
【００２８】
図５に示すように、ゴムの層では、圧力分布が不均一である。図６の流動性柔軟層のみを設けた場合には、ゴムより圧力分布が均一となっていることが分かり、図７の場合においては、更に圧力分布の均一化が達成されていることが分かる。このように、流動性柔軟層のみより柔軟体を構成しても、ある程度の圧力分布の均一化が図れ、装置に要求される条件によっては、この構成を採用することが可能である。
【００２９】
以上の装置によれば、厚さの異なる複数の回路素子を圧着する際、厚さの違いを柔軟体が変形して吸収するので、これらを同時に加圧圧着することができる。また、一つずつ圧着する場合には、隣接する未圧着の回路素子に熱が伝わり圧着前に接着シートの硬化が起こるために、素子の間隔を大きく取る必要があったが、本装置によれば同時に圧着することが可能なために、回路素子の間隔を小さくし、実装密度を高めることができる。
【００３０】
以上の説明においては、接着シートを用いて回路素子と基板上の配線の電気的な接続、および回路素子の基板への接着を行ったが、ハンダ接続にも有効である。また、平面や凹凸のあるものに、違法性導電膜に代えて導電機能を有さない接着用のフィルムを接着することもできる。
【図面の簡単な説明】
【図１】 基板と回路素子の圧着作業の各工程を概念的に示す図である。
【図２】 本実施形態の加圧装置の概略構成図である。
【図３】 本実施形態の加圧装置において、基板と回路素子を圧着する作業の中間工程を示す図である。
【図４】 本実施形態の加圧装置において、基板と回路素子を圧着するための加圧工程を示す図である。
【図５】 ゴム板を介して加圧を行ったときの面圧分布を示す図である。
【図６】 流動性柔軟層のみを介して加圧を行ったときの面圧分布を示す図である。
【図７】 流動性柔軟層と多孔質柔軟層の２層からなる柔軟体を介して加圧を行ったときの面圧分布を示す図である。
【符号の説明】
１０ 基板、１２ 配線、１４ 接着シート、１６ 回路素子、１８ バンプ、２２ 流動性柔軟層、３０ 下型、３２ 上型、３４ サイド型、３６ シール型、３８ 介在パッド、４０ 枠体、４２ 膜状部材、４４ シール部材、４６ 柔軟体、４８ 流動性柔軟層、５０ 多孔質柔軟層。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a pressurizing apparatus that pressurizes a workpiece with a pressurizing die and performs processing such as pressure bonding on the workpiece, and a method of mounting a circuit element such as an integrated circuit chip on a substrate.
[0002]
[Prior art]
As a method for mounting a circuit element on a substrate, a method is known in which an adhesive film is disposed between the substrate and the circuit element, the circuit element is pressed and heated toward the substrate, and then pressure-bonded. A thermosetting anisotropic conductive film may be used as the adhesive film, and in this case, the elements can be bonded and wired at the same time. Further, a thermoplastic material, a non-conductive film, a conductive or non-conductive paste may be used. The circuit element mounting process using these adhesive films will be described. First, the adhesive film is placed on the circuit element mounting position on the substrate, and the circuit element is placed thereon. The surface of the adhesive film has adhesiveness, and the circuit element is temporarily fixed or pressure-bonded by being slightly pressed when the circuit element is placed. The circuit element is provided with electrodes called bumps for electrical connection with the outside. Wiring is located at a position facing the bump on the substrate when the element is placed. When the circuit element is placed on the substrate and pressed, the bump and the wiring protrude from the surroundings, so that the adhesive film between them is further pressed and becomes conductive. . Further, the adhesive film bonds the substrate and the circuit element by heating, and the main pressure bonding is performed.
[0003]
Further, a technique for simultaneously mounting a plurality of circuit elements is described in Patent Document 1 below. The apparatus described in this document absorbs a difference in height of a plurality of circuit elements by this buffer layer and pressurizes them simultaneously to perform mounting. Examples of the buffer layer include sheets rich in rubber-like elasticity, bags containing gas or liquid, and balloons.
[0004]
[Patent Document 1]
Japanese Patent Application Laid-Open No. 10-256311 (left column on page 3, FIG. 2)
[0005]
[Problems to be solved by the invention]
As described above, in a conventional apparatus, a sheet having rubber-like elasticity has been proposed as a buffer layer. However, in a sheet of silicon rubber or the like, the pressure in a high circuit element portion is increased, and the sheet is applied. The uniformity of the pressure was not sufficient. In addition, when bags containing gas or liquid are used, the strength of the bag is insufficient, and a sufficient pressure cannot be obtained.
[0006]
The present invention has been made in consideration of the above-described problems, and an object thereof is to uniformly pressurize a plurality of circuit elements and mount them.
[0007]
[Means for Solving the Problems]
The pressurizing apparatus according to the present invention includes a plurality of pressurizing molds to sandwich an object to be pressed, and at least one of the pressurizing mold and the object to be pressed has a fluid flexible layer of fluid material and flexibility. Pressurization is performed with an intervening intervening pad interposed. The fluid and flexible material can be a gel material.
[0008]
By applying pressure through a fluid flexible layer, it is possible to apply pressure even to the lower part of the uneven workpiece. For example, if it is used as a pressurizing device when a circuit element is pressure-bonded on a substrate, pressurization can be performed almost evenly even if the height of each circuit element is different.
[0009]
Further, the interposed pad may have a frame disposed so as to surround the fluid flexible layer, and further, a surface that is stretched on an opening front surface of the frame and is in contact with the object to be pressed. A film-like member to be formed and a seal body that covers a gap between the frame body and the pressurizing mold can be provided.
[0010]
These frame body, film-like member, and seal body accommodate and hold the fluid flexible layer. Further, the membrane member prevents the material constituting the fluid flexible layer from flowing laterally with respect to the pressurizing direction, thereby preventing the workpiece from being displaced.
[0011]
Further, the interposed pad may include a porous flexible layer disposed on the opposite side of the fluid flexible layer to the side facing the object to be pressed .
[0012]
Furthermore, the material of the fluid flexible layer can be a gel material.
[0013]
In addition, the method for mounting a circuit element on another substrate according to another aspect of the present invention includes a step of placing an adhesive film on the substrate and a circuit element superimposed thereon, and the circuit element is fluid. And pressurizing the substrate with a pressurizing die through a fluid flexible layer containing a flexible material and pressing the substrate. The fluid and flexible material can be a gel material.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention (hereinafter referred to as embodiments) will be described with reference to the drawings. In the embodiments described below, the workpiece is a substrate such as an electronic circuit and a circuit element mounted on the substrate, and pressurization is performed to achieve crimping and predetermined electrical connection. Is done.
[0015]
FIG. 1 is a conceptual diagram for explaining a mounting method of a circuit element such as an integrated circuit chip according to the present embodiment. As shown in FIG. 1A, wirings 12 are formed on the surface of the substrate 10 in a predetermined pattern. On the substrate 10, a thermosetting adhesive sheet 14 for bonding and wiring and a circuit element 16 are arranged at predetermined positions. On the surface of the circuit element 16 facing the substrate 10 (lower surface in the figure), there are provided projections called bumps 18 serving as electrical contacts. The wiring 12 and the bump 18 are located at positions facing each other with the adhesive sheet 14 interposed therebetween. In other words, the position where the wiring 12 is provided is determined based on the mounting position of the circuit element 16.
[0016]
Next, as shown in FIG. 1 (b), a flexible layer having fluidity located above of the circuit element 16 and the substrate 10 (hereinafter, the fluidity of a flexible layer) 22, yet the flowable flexible layer The surface of the circuit element 16 is brought into contact with the upper surface by stroking the pressure mold located above . Then, the pressurizing mold is further stroked to cause the fluid flexible layer 22 to wrap around the side of the circuit element 16 and the adhesive sheet 14 as indicated by arrows in the figure.
[0017]
As shown in FIG. 1 (c), the circuit element 16 and the adhesive sheet 14 to be pressed are integrally pressed so as to press from the periphery, in the drawing, from above and from the side. As described above, each of the wiring 12 and the bump 18 protrudes from the surface on which the wiring 12 and the bump 18 are arranged. When pressed, the portion of the adhesive sheet 14 sandwiched between the wiring 12 and the bump 18 is further compressed. The compressed portion becomes conductive, and a conductive state is established between the wiring 12 and the bump 18. Further, the pressure type is provided with a heater, and the adhesive sheet 14 is cured by the heat from the heater, and the circuit element 16 is pressure-bonded.
[0018]
FIG. 2 is a diagram showing a schematic configuration of a pressurizing device for crimping an integrated circuit chip. The apparatus includes a lower mold 30 on which workpieces such as the substrate 10, the adhesive sheet 14, and the circuit element 16 are placed, and the lower mold 30 that faces the lower mold 30 and is the object to be pressed. An upper die 32 and a side die 34 surrounding the side of the space between the upper die 32 and the lower die 30 facing each other are provided. A seal mold 36 is disposed so as to surround the outer side of the side mold 34. The seal mold 36 seals this space in order to decompress the space surrounded by the upper mold 32, the lower mold 30, and the side mold 34.
[0019]
The lower end of the side mold 34 in the figure is a frame body 40 that supports the intervening pad 38. The interposition pad 38 is composed of two film-like members 42 and 44 that are directly supported by the frame body 40, and a flexible body in which two kinds of flexible materials accommodated between the two film-like members form a layer. 46. Since the flexible body 46 is surrounded by the frame body 40, when the pressure is applied by the mold, the flexible body 46 can efficiently and reliably transmit the pressure to the workpiece. A film-like member 42 (hereinafter referred to as a film-like member 42) on the lower mold 30 side is stretched over the entire opening of the frame body 40 and is pressed against the workpiece during processing. The film-like member 42 can be made of a rubber material such as silicon rubber, for example. Moreover, it can also be set as rubber | gum films | membranes, such as a silicone rubber which used textiles, such as a polyimide fiber, as a core material. In addition to the function of holding the flexible body as described above, the film-like member 42 has a function of preventing the lateral displacement of the workpiece caused by the flow of the material constituting the flexible body described below, particularly the lateral flow. For example, when the circuit element 16 is pressure-bonded to the substrate 10, the circuit element 16 may be displaced due to the lateral flow in the flexible body 46, and the wiring 12 and the bump 18 (see FIG. 1) may be displaced. The film-shaped member 42 is prevented from shifting the crimping position by restricting the lateral movement of the circuit element 16 or the like. As described above, when fibers are used as the core material, deformation in the in-plane direction of the film-like member 42 is suppressed by the core material, which is more effective with respect to the displacement of the crimping position. In addition, the film-like member 42 may be a laminate of a rubber film and a metal thin film. A film-like member 44 on the upper mold 32 side has an opening at the center, and a sealing member that prevents the accommodated flexible body 46 from entering and leaking into the gap between the upper mold 32 and the side mold 34. (Hereinafter, the membranous member 44 is referred to as a seal member 44).
[0020]
The peripheral portions of the film-like member 42 and the seal member 44 are supported so as to be sandwiched between the layers of the frame body 40 constituted by three layers. In each layer of the frame body, concavities and convexities that fit each other are formed on surfaces facing each other. The film-like member 42 and the seal member 44 are bitten by these irregularities, and these are firmly held and fixed.
[0021]
As described above, the flexible body 46 includes two layers of different materials. A material having flexibility and high fluidity is used for the lower layer, that is, the layer on the workpiece side. Hereinafter, this layer is referred to as a fluid flexible layer 48. The fluid flexible layer 48 corresponds to the fluid flexible layer 22 shown in the conceptual diagram of FIG. Due to the fluidity, the material can sufficiently flow into and fill the concave portions of the uneven workpiece, and a uniform pressure can be applied to the whole during pressurization. Further, it is preferable that the rebound resilience is low, that is, the rebound resilience is low. When the resilience is high, a large repulsive force is generated in a portion where the deformation is large, and the pressure distribution becomes non-uniform. As a material satisfying such characteristics, there is a gel material. For example, Geltech Co., Ltd., high damping heat conductive gel sheet “αGEL (trademark)”, Riken Technos Co., Ltd., thermoplastic elastomer, Kinugawa Rubber Industrial Co., Ltd. super soft elastomer “Frengel (trade name)”, etc. Can be used. Another layer of the flexible body 46 is composed of a porous flexible material (hereinafter, this layer is referred to as a porous flexible layer 50. As the porous flexible material, for example, silicon sponge, fluorine sponge, or the like is used. By providing such a layer, the flow of the fluid flexible layer 48 is ensured by first deforming the porous flexible layer 50 at the initial stage of contact of the flexible body 46 with the workpiece. In addition, when the pressure bonding is finished and the pressure is released, the restoring force of the porous flexible material contributes to the restoration of the fluid flexible layer 48.
[0022]
A cover film 52 is disposed between the upper structure including the upper mold 32 and the interposition pad 38 and the lower mold 30 and the workpiece placed thereon. The cover film 52 is passed between the feed roll 54 and the take-up roll 56, and a new part is moved from the feed roll 54 to the upper side of the work piece every time it is used or after every predetermined number of uses. In addition, the used part is taken up on the take-up roll 56.
[0023]
A first seal ring 58 is disposed on the surface of the seal mold 36 that slides with the side mold 34. A second seal ring 60 is disposed on the surface facing the lower mold 30. By these first and second seal rings 58, 60, when the seal die 34 comes into contact with the lower die 30, the space surrounded by the side die 34, the interposed pad 38, the lower die 30 and the seal die 36 is sealed. . Exhaust air is discharged from the sealed space by the exhaust pump 66 through the exhaust pipes 62 and 64, and the space is depressurized. Further, the exhaust pipe 64 that extends toward the lower mold 30 and exhausts air from here sucks air between them when the work sheet is covered with the cover sheet 52, so that the cover sheet 52 adheres to the work piece. Let Thereby, the movement of the workpiece is suppressed. If the above-described action of the film-like member 42, that is, the action of suppressing the lateral movement of the workpiece is sufficiently achieved, the cover sheet 52 is not used and the intervening pad 38 is brought into direct contact with the workpiece. It can also be made to do.
[0024]
Next, taking the substrate 10 and the circuit element 16 as examples of workpieces, the operation of the pressurizing apparatus of this embodiment when these are crimped will be described. First, as shown in FIG. 2, the substrate 10 and the circuit element 16 are placed on the lower mold 30 with the adhesive sheet 14 interposed therebetween.
[0025]
Next, as shown in FIG. 3, the feeding roll 54 and the take-up roll 56 are lowered, and the upper surface of the lower mold 30 is covered with the cover film 52 together with the substrate 10 and the circuit element 16. In parallel or after this, the upper structure including the seal die 36 is lowered, and the seal die 36 is brought into contact with the upper surface of the lower die 30 covered with the cover film 52. At this time, the intervening pad is not in contact with the circuit element 16 or the like. The space in which the substrate 10 and the circuit elements are disposed is sealed by the first and second seal rings 58 and 60 disposed in the seal mold 36 and the side mold 34, and the space is decompressed by the exhaust pump 66. By sucking air between the cover sheet 52 and the lower mold 30 through the exhaust pipe 64, the cover sheet 52 is in close contact with the lower mold 30, the substrate 10, and the circuit element 16. The space above the cover sheet 52 is also decompressed, and the upper mold 32 is lowered together with the decompression. Since the seal mold 36 is already in contact with the lower mold 30, the other upper structures including the side mold 34 and the upper mold 32 are lowered. At this time, the side mold 34 and the seal mold 36 move relatively, but the first seal ring 58 ensures sealing.
[0026]
FIG. 4 shows a state in which the lower end of the side mold 34, that is, the lower end of the frame body 40 is in contact with the lower mold 30 and the upper mold 32 is further stroked. When the upper die 32 is further lowered after the side die 34 comes into contact with the lower die 30, the porous flexible layer 50 is deformed, and the fluid flexible layer 48 is also deformed so as to follow the unevenness of the substrate 10 and the circuit element 16. To do. At this time, the cover sheet 52 and the membrane member 42 are similarly deformed. The seal member 44 is bent at a gap between the side mold 34 and the upper mold 32 as shown in the figure, and prevents the material constituting the flexible body 46 from leaking or protruding from this portion. This pressurized state is maintained for a predetermined time. Further, the heater (not shown) provided in the lower mold 30 is heated simultaneously with pressurization to perform pressure bonding. After a predetermined time has elapsed, the upper mold 32, the side mold 34, the seal mold 36, the cover sheet 52, and the like are raised, and the substrate 10 to which the circuit element 16 is pressure bonded is taken out.
[0027]
FIG. 5 is a diagram showing a surface pressure distribution when a rubber layer is provided on the front surface of the upper mold 32 and the substrate and the circuit element are pressed. 6 shows a case where the flexible body 46 is composed of only a fluid flexible layer, and FIG. 7 shows a case where the flexible body 46 is composed of two layers of a fluid flexible layer and a porous flexible layer as in the above-described embodiment. It is a figure which shows pressure distribution. The part where the concentration is higher is the part where the pressure is higher.
[0028]
As shown in FIG. 5, the pressure distribution is non-uniform in the rubber layer. In the case where only the fluid flexible layer of FIG. 6 is provided, it can be seen that the pressure distribution is more uniform than that of rubber, and in the case of FIG. . As described above, even if the flexible body is constituted by only the fluid flexible layer, the pressure distribution can be made uniform to some extent, and this configuration can be adopted depending on the conditions required for the apparatus.
[0029]
According to the above apparatus, when a plurality of circuit elements having different thicknesses are pressure-bonded, the difference in thickness is deformed and absorbed by the flexible body, so that these can be pressure-bonded simultaneously. In addition, when crimping one by one, heat is transferred to adjacent uncrimped circuit elements and the adhesive sheet is cured before crimping. Therefore, it is necessary to increase the spacing between the elements. In other words, since the pressure bonding can be performed at the same time, the distance between the circuit elements can be reduced and the mounting density can be increased.
[0030]
In the above description, the electrical connection between the circuit element and the wiring on the substrate and the adhesion of the circuit element to the substrate are performed using the adhesive sheet, but this is also effective for the solder connection. In addition, an adhesive film that does not have a conductive function can be bonded to a flat or uneven surface instead of an illegal conductive film.
[Brief description of the drawings]
FIG. 1 is a diagram conceptually showing each process of a crimping operation between a substrate and a circuit element.
FIG. 2 is a schematic configuration diagram of a pressure device according to the present embodiment.
FIG. 3 is a diagram showing an intermediate step of an operation for pressure-bonding a substrate and a circuit element in the pressurizing apparatus of the present embodiment.
FIG. 4 is a view showing a pressurizing process for press-bonding a substrate and a circuit element in the pressurizing apparatus of the present embodiment.
FIG. 5 is a diagram showing a surface pressure distribution when pressure is applied through a rubber plate.
FIG. 6 is a diagram showing a surface pressure distribution when pressure is applied only through a fluid flexible layer.
FIG. 7 is a diagram showing a surface pressure distribution when pressure is applied through a flexible body composed of two layers of a fluid flexible layer and a porous flexible layer.
[Explanation of symbols]
10 substrate, 12 wiring, 14 adhesive sheet, 16 circuit element, 18 bump, 22 fluid flexible layer, 30 lower mold, 32 upper mold, 34 side mold, 36 seal mold, 38 intervening pad, 40 frame, 42 film shape Member, 44 sealing member, 46 flexible body, 48 fluid flexible layer, 50 porous flexible layer.

Claims (4)

複数の加圧型で被加圧物を挟持し、加圧を行う加圧装置であって、
少なくとも一つの前記加圧型と前記被加圧物の間に介在し、流動性があり柔軟なゲル状材料の流動性柔軟層を含む介在パッドと、
前記流動性柔軟層の周囲を囲むように配置され、前記介在パッドを支持する枠体と、
を有し、
前記介在パッドは、さらに、
前記枠体の開口全面に張られ、前記被加圧物に接触する面を形成する膜状部材と、
前記枠体と前記加圧型の隙間を覆うシール体と、
を含み、
この介在パッドを介して加圧を行う、加圧装置。A pressurizing apparatus that sandwiches an object to be pressed with a plurality of pressurizing molds and pressurizes the pressurizing object,
An intervening pad interposed between at least one pressurizing mold and the object to be pressed and including a fluid flexible layer of a fluid and soft gel material;
A frame that is disposed so as to surround the fluid flexible layer and supports the intervening pad ;
Have
The interposed pad further includes:
A film-like member that is stretched over the entire opening of the frame and forms a surface that contacts the object to be pressed;
A seal body that covers a gap between the frame body and the pressure mold;
Including
A pressurizing device that pressurizes through the intervening pad. 請求項１に記載の加圧装置であって、前記膜状部材は、織物を心材としたゴム膜である、加圧装置。2. The pressurizing apparatus according to claim 1, wherein the film-like member is a rubber film having a woven fabric as a core material. 請求項１に記載の加圧装置であって、前記膜状部材は、ゴム膜と金属薄膜の積層体である、加圧装置。2. The pressurizing apparatus according to claim 1, wherein the film-like member is a laminate of a rubber film and a metal thin film. 請求項１から３のいずれか１項に記載の加圧装置であって、前記介在パッドは、前記流動性柔軟層の、被加圧物に対向する側の反対側に配置された多孔質の柔軟層を含む、加圧装置。It is a pressurization apparatus of any one of Claim 1 to 3, Comprising: The said interposition pad is a porous thing arrange | positioned on the opposite side of the side which opposes a to-be-pressurized object of the said fluid flexible layer. A pressure device including a flexible layer.
JP2003086417A 2003-03-26 2003-03-26 Pressurizing device Expired - Lifetime JP3949072B2 (en)

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