JP2004235411A - Bonding method and apparatus for electronic parts - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a bonding method for electronic parts and apparatus therefor capable of effectively solving problems upon pressure welding, by effectively pressurizing the top surfaces of electronic parts individually with uniform pressure without forming any gap by using an electronic parts pressure-welding means to a substrate to include a plurality of semiconductor chips being the electronic parts at a predetermined position. <P>SOLUTION: The bonding apparatus for electronic parts includes the electronic parts pressure-welding means 1 composed of a pressing mechanism 3 and a pressurizing/equalizing mechanism 4. Further, a plurality of the semiconductor chips 2 and the substrate 5 are effectively pressure-welded by using the pressure-welding means 1 in the state where the top surfaces of the plurality of the semiconductor chips 2 are pressed corresponding to the heights thereof, and the top surfaces of the plurality of the semiconductor chips 2 can be pressurized uniformly, effectively, and individually without causing the gap with the aid of the pressurizing means 1, thereby, the problems upon the pressurization of the plurality of the chips 2 and the substrate 5 can be solved effectively. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an improvement in a method and an apparatus for bonding electronic components, in which a substrate on which a plurality of electronic components (semiconductor chips) arranged at predetermined locations are mounted is pressed by an electronic component pressing unit.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a substrate (flip chip substrate) on which a plurality of electronic components (semiconductor chips) are integrally mounted via bumps is collectively crimped.
[0003]
That is, a substrate in which a plurality of semiconductor chips are temporarily bonded to predetermined locations via bumps (connection electrodes) is combined with a plurality of crimping tools heated to a predetermined temperature using a conventional crimping apparatus and crimping method. There is described a face-down system in which a plurality of electronic components (the chip) are fully press-bonded to the top surface of the chip via an elastic body (for example, see Patent Document 1).
[0004]
[Patent Document 1]
JP-A-2002-324821 (page 3, FIG. 2)
[0005]
[Problems to be solved by the invention]
However, in recent years, the size and thickness of substrates have been reduced and the size of electronic components (semiconductor chips) has been minimized and reduced. Also, a plurality of electronic components have been arranged in a matrix on a single substrate and are collectively pressed. In the conventional crimping apparatus and crimping method, it is considered that the following problems at the time of crimping occur.
First, even if it is possible to heat a plurality of crimping tools to a predetermined temperature via an elastic body corresponding to the height of the electronic component, it is necessary to fully compress the electronic component and the board. It is difficult to uniformly and evenly heat a plurality of electronic components to a predetermined temperature, and it is also difficult to individually control heating.
Secondly, it is possible to carry out the final press-bonding of the top surface of one electronic component with a plurality of press-bonding tools, if it is a flip-chip board by a face-down method, but it is a face-up method. For example, to fully crimp an electronic component to a board that electrically connects the top of the electronic component and the board with wires, it is necessary to press the top of the electronic component locally with a crimping tool. Therefore, electronic part defects such as damage or chipping of the chip occur.
Third, even if a plurality of electronic components can be pressed individually via the elastic body, the difference in the height of the electronic components is slightly different in the conventional crimping apparatus. It is considered that it is very difficult to individually control the weight of the.
Fourth, in order to perform final crimping with a conventional crimping device on a single substrate on which electronic components arranged in a matrix in recent years are mounted, a plurality of crimping tools are required for one electronic component. It is necessary to use a large amount of crimping tools and elastic bodies for the electronic components on the entire board. Since it is necessary to mass-produce, it is very difficult to maintain the crimped parts.For example, it is difficult to grasp the load control status of each electronic component separately and to control the load individually for each electronic component. It is considered very difficult with a conventional crimping device.
[0006]
Therefore, according to the present invention, a substrate on which a plurality of semiconductor chips arranged at predetermined locations, which are electronic components, is mounted on the top surface of each electronic component efficiently with no gap and even pressure using electronic component crimping means. An object of the present invention is to provide a method and an apparatus for bonding electronic components, which can perform good pressure bonding and efficiently solve various problems at the time of pressure bonding.
[0007]
[Means for Solving the Problems]
In order to solve the above technical problem, an electronic component bonding method according to the present invention is an electronic component arranged at a predetermined position on a semiconductor substrate using an electronic component bonding apparatus equipped with an electronic component crimping unit. A method of bonding an electronic component, wherein a plurality of semiconductor chips are pressure-bonded onto the substrate by the pressure-bonding means, wherein the electronic component-pressure bonding means includes a plurality of chip top surfaces arranged at the predetermined locations. According to the height, the chips are individually crimped with uniform pressure without gaps.
[0008]
According to another aspect of the present invention, there is provided a method for bonding an electronic component, comprising: a plurality of the top surfaces of the chip; It is characterized in that a film for protecting electronic components is supplied between the chip and the side crimping surface, and the chip top surface is crimped through the film.
[0009]
Further, in order to solve the above technical problem, the present invention provides an electronic component bonding apparatus comprising: a plurality of semiconductor chips, which are electronic components arranged at predetermined locations on a semiconductor substrate; An electronic component bonding apparatus for crimping, wherein the electronic component crimping means presses the chip top surfaces individually according to the heights of the plurality of chip top surfaces arranged at the predetermined locations. It is characterized by including a pressing mechanism for the chip and a pressure equalizing mechanism for applying a uniform pressure to the pressing mechanism without any gap.
[0010]
According to another aspect of the present invention, there is provided an electronic component bonding apparatus according to the present invention, wherein a plurality of the chip top surfaces and the chips of the above-described crimping unit are provided. It is characterized by including the film supply mechanism for supplying a film for protecting an electronic component between the side pressure bonding surface.
BEST MODE FOR CARRYING OUT THE INVENTION
That is, basically, an electronic component bonding apparatus is characterized in that an electronic component crimping means having a pressing mechanism and a pressure equalizing mechanism is provided.
In the above-mentioned electronic component crimping means, a film supply mechanism for supplying a film for protecting the electronic component is further provided between the pressing mechanism and the top surface of the electronic component.
The plurality of semiconductor chips and the substrate are crimped using the above-described electronic component crimping means while the top surfaces of the plurality of semiconductor chips are pressed according to their heights.
In addition, since the top surfaces of the plurality of semiconductor chips can be pressed evenly and without gaps by the electronic component pressing means, there are various problems in pressing the plurality of semiconductor chips and the substrate. Is solved efficiently.
Therefore, a substrate on which a plurality of semiconductor chips arranged at predetermined positions, which are electronic components, is efficiently pressed on the top surface of each electronic component without gaps and with uniform pressure using electronic component pressing means. In addition, it is possible to provide a bonding method of an electronic component and a device therefor that efficiently solve various problems at the time of pressure bonding.
[0011]
【Example】
Hereinafter, description will be given based on FIGS. 1 to 3.
1 and 2 show a main part of a bonding apparatus according to the present invention.
FIG. 3 is a diagram showing a substrate used in the present invention.
[0012]
That is, in the bonding apparatus according to the present invention, as shown in FIG. 1, an electronic component crimping means 1 and a crimping stage 7 for crimping (finally crimping) the chip 2 and the substrate 5 by the crimping means 1 are provided. At the same time, the crimping means 1 includes a tip pressing mechanism 3 for individually pressing the top surface of the chip 2 corresponding to the height of the top surface of the chip 2, and the pressing mechanism 3 for each of the pressing mechanisms 3 without gaps. A pressure equalizing mechanism 4 for applying a uniform pressure is provided.
[0013]
As shown in FIG. 1, for example, the substrate 5 used in the present embodiment is formed by electrically connecting a plurality of the chips 2 arranged at predetermined positions on the substrate 5 and the substrate 5 and the chips 2. And at least a bump 6 (connection electrode) connected to the second electrode.
Accordingly, a bonding apparatus for completing a flip chip substrate 8 (hereinafter, referred to as an FC substrate 8) in which a plurality of chips 2 are integrally mounted on a substrate 5 via bumps 6 is shown, and a face-down system is shown. The product which is the FC substrate 8 can be completed by using the electronic component crimping means 1 for crimping according to the above.
[0014]
That is, as described above, the electronic component crimping means 1 has the pressing mechanism 3 and the pressure equalizing mechanism 4 provided almost immediately above the top surface of the crimping stage 7, and the number, shape, arrangement, etc. of the chips 2 , So that each can be detachably attached and detached.
Further, as shown in FIG. 1, the pressing mechanism 3 includes a pressing tip member 9 that abuts on the top surface of the chips 2, which individually presses corresponding to the height of the plurality of chips 2, and a pressing tip member. There is provided a pressing rod 10 to which the pressing member 9 can be attached, and an optional elastic member 11 made of a spring or the like wound around the pressing rod 10.
As shown in FIG. 1, the pressure equalizing mechanism 4 has a convex shape with respect to each of the pressing mechanisms 3. A pressurizing unit 13 such as an arbitrary cylinder or the like driven by two air pressures, hydraulic pressures, water pressures, etc. for applying uniform pressure to horizontal portions provided on both sides of the convex portion of the pressure member 12; The pressure unit 13 is mounted and fixed, the pressing mechanism 3 is mounted and fixed in the vertical direction, and the pressing mechanism 3 applies a uniform and uniform pressure to the pressing mechanism 3 without gaps. A drive unit 15 such as an arbitrary cylinder that applies uniform pressure using water pressure or the like as a drive source is provided.
In this embodiment, at least the pressing tip member 9 and the pressure bonding stage 7 are heated to a predetermined temperature necessary for thermocompression bonding in order to press the chip 2 onto the substrate 5 via the bumps 6. Arbitrary heating means is embedded.
[0015]
Further, as shown in FIG. 3, the number and arrangement of the chips 2 of the FC board 8 in this embodiment to be crimped by the electronic component crimping means 1 are, for example, top views of the mounting side of the chips 2 viewed from above. 3 are arranged at predetermined positions on a single substrate 5 having an arbitrary shape via bumps 6 in three rows in the horizontal direction and three blocks in the vertical direction in FIG. Four blocks (A, B, C, D) are formed from the right to form twelve rows, that is, thirty-six chips 2 on the top surface.
In this embodiment, the order in which the chip 2 is crimped by the crimping means 1 is, for example, as shown in FIG. 3, when the FC substrate 8 is conveyed and supplied from the left side to the right side in FIG. First, the three rightmost columns A1, B1, C1, and D1 in the vertical direction of the blocks A, B, C, and D, that is, twelve chips 2 are respectively and substantially simultaneously pressed by the pressing mechanism 3. Crimping is performed at the portion of the pressing tip member 9 (see FIG. 1), and then, the twelve chips A2, B2, C2, D2, and the twelve chips A3, B3, C3, D3 The chip 2 is configured so that one substrate 5 is completely pressed in three steps. This means that the chip 2 can be mounted on a single substrate 5 in large quantities in recent years. Therefore, the chip on one substrate 5 can be adapted to various quantities and arrangements of the substrate 5. In a case where it is difficult to press-bond all of the substrates 2 at a time, the press-fitting order is efficiently changed as appropriate so that the press-bonding can be performed while the entire substrate 5 is held in a horizontal state as described above. Have been.
[0016]
Therefore, in order to press-bond the chip 2 on the substrate 5 described above, first, the bonding apparatus mounts the chip 2 on the substrate 5 on which the chip 2 is not mounted, for example, the chip cut and separated from the wafer. The bumps 6 are mounted on the substrate mounting side of the substrate 2, and the respective chips 2 are arranged at predetermined positions on the substrate 5 and are temporarily joined.
Next, the substrate 5 in the temporarily bonded state is supplied to a predetermined position of the pressure bonding stage 7, and the pressing tip member 9 and the pressure bonding stage 7 of the pressing mechanism 3 of the electronic component pressure bonding means 1 which are waiting almost immediately above the pressure bonding stage 7 in advance. Is heated to a predetermined temperature necessary for pressure bonding, and the substrate 5, the chip 2 and the bumps 6 in the temporarily joined state are also heated.
Next, three columns A1, B1, C1, and D1 of each block A, B, C, and D in the temporarily bonded substrate 5 placed on the pressure bonding stage 7, that is, twelve Twelve pressing tip members 9 respectively contact the top surface of the chip 2 almost simultaneously. Here, until the pressing tip member 9 comes into contact with the top surface of the chip 2, the pressing mechanism 3 attached to the pressing uniform member 14 at the same time as the entire pressing unit 1 moves down via the driving unit 15. The pressure member 12 and the pressure means 13 also move downward.
Until the pressing tip member 9 contacts the top surface of the chip 2, the elastic member 11 is wound around the upper part of the pressing rod 10 in a restored state in which no elastic force acts on the elastic member 11, and the elastic member 11 The lower part of the pressing rod 10 is formed larger than the upper part of the pressing rod 10 on which the pressing member 10 can be mounted, and the upper part of the pressing rod 10 in which the elastic member 11 is wound around the convex part of the pressing member 12 is penetrated. To the pressing member 12.
Further, the bottom surface of the pressing tip member 9 corresponding to each of the chips 2 and the top surface of the chip 2 may be substantially the same size, or the bottom surface of the pressing tip member 9 may be formed larger. The substrate 5 in the temporarily bonded state is sequentially conveyed and supplied to a predetermined position where pressure bonding is performed on the stage 7 (the FC substrate 8 is supplied from the left side to the right side in FIGS. 1 and 3).
[0017]
Next, as shown in FIGS. 1 and 2, when the driving unit 15 further moves downward, the pressing mechanism 3 is pressed against the top surface of the chip 2, and the pressing rod 10 slightly moves upward to move the elastic member. 11 is also in a contracted state in which the elastic force has acted, and the bump 6 to which the chip 2 has been heated is pressed to a predetermined position on the substrate 5.
Until the time required for completely pressing the chip 2 onto the substrate 5 at the predetermined position elapses, each chip 2 pressed by each pressing mechanism 3 is pressed by the pressing uniform mechanism 4. Ultimately, a uniform pressure is applied between the top surface of the chip 2 and the bottom surface of the pressing tip member 9 by the member 12 and the pressing portion 13 without any gap, that is, individually corresponding to the height of the chip 2 , Load control can be performed.
That is, the control mechanism for heating control, load control, and the like is incorporated in any part of the crimping means 1 and is configured to be able to continuously control during the step of crimping the substrate 5 on the chip 2. ing.
[0018]
Next, at the same time as the drive member 15 moves upward from the twelve chips 2 that have been completely pressed, the elastic member 11 in the contracted state where the elastic force has acted returns to the restored state, and the pressing mechanism 3 Is slightly moved downward, and the top surface of the twelve completely crimped chips 2 (three in each row A1, B1, C1, D1 of each block A, B, C, D, that is, The bottom surfaces of the other twelve pressing tip members 9 are separated from the top surfaces of the two chips 2). Next, at the same time when the driving unit 15 further moves upward, the pressing mechanism 3, the pressing member 12, and the pressing means 13 attached to the pressing uniform member 14 also move upward.
Next, as described above, next, twelve chips A2, B2, C2, and D2, and then twelve chips A3, B3, C3, and D3, one sheet The substrate 5 is pressure-bonded in three stages, that is, the FC substrate 8 (product), which is the substrate 5 in which all 36 chips 2 are completely pressed on the substrate 5, is completed.
Next, almost simultaneously with moving and unloading the FC substrate 8 as a product from the pressure bonding stage 7, the temporarily bonded substrate 5 is moved onto the pressure bonding stage 7 to continuously and efficiently bond the FC substrate 8 to the bonding apparatus. Can be completed by the crimping means 1.
[0019]
Therefore, the plurality of semiconductor chips 2 and the substrate 5 can be efficiently crimped by using the electronic component crimping means 1 in a state where the top surfaces of the plurality of semiconductor chips 2 are pressed according to their heights. At the same time, the top surface of the plurality of chips 2 can be individually and efficiently compression-bonded by the electronic component crimping means 1 without any gaps. Can be solved efficiently.
That is, the substrate 5 on which a plurality of semiconductor chips 2 arranged at predetermined locations, which are electronic components, is mounted on the top surface of each electronic component efficiently using the electronic component crimping means 1 with no gap and even pressure. It is possible to provide an electronic component bonding method and apparatus which can efficiently solve various problems at the time of press bonding.
[0020]
In this embodiment, although not shown, between the pressing mechanism 3 and the top surface of the chip 2 by using the electronic component crimping means 1 of the bonding apparatus shown in FIG. May be provided with the film supply mechanism for supplying a film for use.
In this case, the crimping operation can be performed without more efficiently causing a defect in the electronic part such as damage or chipping of the chip 2, which is an electronic component, which is a problem during crimping.
[0021]
As another embodiment, although not shown, a face-up type substrate for electrically connecting the top surface of the chip 2 and the substrate 5 by a wire (connection electrode) by a face-up method is used. 1 can be carried out, and in this case, it is preferable to carry out the crimping operation using the film supply mechanism for supplying a film for protecting electronic components.
In order to press-bond the chip 2 and the substrate 5 of the face-up type substrate, an arbitrary adhesive member made of an epoxy resin or the like having an adhesive property is attached to the substrate 5 and the chip bottom surface. After the chip 2 is temporarily bonded to the top surface of the chip 2 and the bottom surface of the pressing tip member 9 of the pressing mechanism 3 of the pressing unit 1, a pressing operation is performed via a film for protecting electronic components. Will be.
In this case, as in the present embodiment, the time required for completely pressing the chip 2 arranged in a matrix shape on the substrate 5 (particularly, the time for curing the epoxy resin) is the same as the FC substrate in the present embodiment. Since it is necessary to press the bumps longer than the time required for pressing the bumps 6 in step 8, it is possible to efficiently press the top surfaces of a plurality of the chips (electronic components) with a uniform pressure without gaps by a single pressing operation. By using the crimping means 1 of this embodiment, various problems at the time of crimping can be more efficiently solved, and further, the productivity of the product is improved.
In addition, it is possible to efficiently carry out the crimping operation of the face-up type substrate by the face-up method, which has been difficult to perform with the conventional crimping apparatus.
[0022]
Further, in the above-described face-down type FC substrate 8 or face-up type substrate used in the present invention, the shape of the substrate 5 itself may be any shape such as a circle or a polygon (preferably a square). In addition, the number, shape, arrangement, and the like of the chips 2 mounted on the substrate 5 are not limited to those shown in FIG. 3 in this embodiment, and the chips 2 may be arbitrarily formed. 2 can be appropriately selected and implemented on the substrate 5 mounted.
[0023]
In this embodiment, as shown in FIG. 1, the arrangement of the pressing mechanism 3 in the crimping means 1 for crimping the chip 2 is such that the pressing rod 10 for crimping A1 and C1 in each block A and C is vertical. The length in the direction is formed to be shorter than B1 · D1 in each block B · D, and the length is alternately changed, and, as shown in FIG. 2, three A1 rows viewed from the short side direction of the substrate. The length of the pressing rod 10 is also changed alternately, but the components of the crimping means 1 are not limited to those shown in FIG. 1 and FIG. -Control etc. may be performed by arbitrary composition.
Although the pressurizing unit 13 and the driving unit 15 in this embodiment are described as being driven by an arbitrary cylinder, the crimping unit 1 may be driven by an arbitrary motor that applies uniform pressure using air pressure, hydraulic pressure, water pressure, or the like as a driving source. The whole or the pressing mechanism 3 may be configured to move up and down.
[0024]
Further, the present invention is not limited to the above-described embodiments, and can be arbitrarily and appropriately changed / selected as needed and adopted without departing from the spirit of the present invention. .
[0025]
【The invention's effect】
According to the present invention, a substrate on which a plurality of semiconductor chips arranged at predetermined locations, which are electronic components, is mounted on the top surface of each of the electronic components efficiently by using an electronic component crimping means without any gap and with uniform pressure. The present invention provides an excellent effect of providing a method and an apparatus for bonding electronic components, in which the bonding is performed well and the various problems at the time of bonding are efficiently solved.
[Brief description of the drawings]
FIG. 1 is a schematic side view showing a main part of a bonding apparatus according to the present invention.
FIG. 2 is a schematic plan view showing a main part of the apparatus corresponding to FIG. 1;
FIG. 3 is a schematic plan view showing an example of a substrate used in the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Electronic component crimping means 2 Semiconductor chip 3 Pressing mechanism 4 Pressure equalizing mechanism 5 Substrate 6 Bump (connection electrode)
7 Crimping stage 8 Flip chip board (FC board)
9 Pressing Tip Member 10 Pressing Rod 11 Elastic Member 12 Pressing Member 13 Pressing Unit 14 Pressing Uniform Member 15 Drive Unit

Claims (4)

An electronic component in which a plurality of semiconductor chips, which are electronic components arranged at predetermined locations on a semiconductor substrate, are crimped onto the substrate by the crimping means using an electronic component bonding apparatus equipped with electronic component crimping means. The bonding method of
In the electronic component crimping means described above,
A method of bonding electronic components, wherein the chips are individually pressure-bonded with a uniform pressure in accordance with the heights of the plurality of chips arranged at predetermined locations. The electronic component crimping means according to claim 1, wherein a film for protecting an electronic component is supplied between the plurality of chip top surfaces and the chip-side crimp surface of the crimping means, and the film is formed. Bonding the electronic component to the top surface of the chip by pressure bonding. An electronic component bonding apparatus for pressing a plurality of semiconductor chips, which are electronic components arranged at predetermined positions on a semiconductor substrate, onto the substrate by electronic component pressing means,
In the electronic component crimping means described above,
A tip pressing mechanism for individually pressing the chip top surface in accordance with the heights of the plurality of chip top surfaces arranged at the predetermined locations, and applying a uniform and uniform pressure to the pressing mechanism. An electronic component bonding apparatus, comprising: a pressure equalizing mechanism. 4. The electronic component crimping device according to claim 3, wherein the film supply mechanism supplies a film for protecting an electronic component between the plurality of chip top surfaces and the chip-side crimp surface of the crimping device. An electronic component bonding apparatus comprising:

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