JP2003088998A - Pressurizing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide shorten the time for pressurizing and heating of a pressure attachment which holds a workpiece in-between and pressurizes a workpiece by a plurality of pressurizing dies including a pressurizing die having a soft layer and heats the workpiece by heat transfer from the dies simultaneously therewith. SOLUTION: The upper die 30 which is one of the pressurizing dies is provided with a rubber plate 58 forming the soft layer. The material of the rubber plate is formed by incorporating it by 15 to 30%.wt., carbon whiskers into silicon rubber. A prescribed temperature can be attained in about half time compared with that by the silicon rubber alone and the time for heating can be shortened.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressurizing device for sandwiching and pressurizing an object to be pressed by a plurality of pressurizing molds, and simultaneously heating by heat transfer from the pressurizing molds.

[0002]

2. Description of the Related Art An object to be pressed is nipped and pressed by a plurality of press dies,
A device for molding and crimping is known.
In such a pressurizing device, a pressurizing device having a flexible layer is known. For example, JP-A-10-85
Japanese Patent Laid-Open No. 996 describes a pressure molding apparatus that pressurizes and heats a laminated body in which a ceramic green sheet and an electrode sheet are laminated to produce a ceramic capacitor. In the device of this publication, in order to absorb the inclination of the upper and lower surfaces of the laminate and the uneven thickness,
Flexible rubber is used in a portion facing the pressure-type laminate. Further, the heat applied to the laminated body which is the object of pressure molding is transmitted through the rubber.

[0003]

In the pressurizing device provided with the flexible layer as described above, since the heat transfer property of the flexible layer is poor, it takes time to raise the object to be pressurized to a necessary temperature. There was a problem that productivity was low because it was necessary.

The present invention has been made in consideration of the above problems, and an object of the present invention is to improve the heat conductivity of the flexible layer and improve the productivity.

[0005]

In order to solve the above-mentioned problems, in the pressure device according to the present invention, a pressure-type flexible layer is added to a flexible substrate. It is assumed that a substance that improves the thermal conductivity of the flexible layer is mixed therewith.

The base material of the flexible layer may be rubber, and the material to be mixed therewith may be carbon fine particles or fine fibers.

The pressure device according to the present invention can be used as a device for applying pressure and heating when mounting a circuit element on a substrate. That is, the circuit element is placed on the substrate with a thermosetting adhesive film sandwiched therebetween, and pressure,
This is hardened and pressed by heating. Further, if an anisotropic conductive film is used as the adhesive film, a predetermined portion is brought into conduction by pressurization, and the connection between the circuit element and the wiring of the substrate is
It can be performed at the same time as the above pressure bonding.

As described above, by improving the heat transfer property of the flexible layer, the thermosetting adhesive film can be thermoset in a short time and the productivity is improved.

The fine carbon particles and the like mixed in the rubber are preferably carbon whiskers, and the content ratio thereof can be 15 to 30% by weight. Also,
The carbon whiskers may have a diameter of 100 to 1000 nm and a ratio of length to diameter of about 100.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention (hereinafter referred to as embodiments) will be described below with reference to the drawings. Figure 1
It is a figure for explaining a mounting method of circuit elements, such as an integrated circuit chip of this embodiment. As shown in FIG.
Wirings 12 are formed on the surface of the substrate 10 in a predetermined pattern. On the substrate 10, the thermosetting anisotropic conductive film 14 for bonding and wiring and the circuit element 16 are arranged at predetermined positions. On the surface of the circuit element 16 facing the substrate 10 (the lower surface in the figure), the bumps 1 that serve as electrical contacts are formed.
A ridge called 8 is provided. The wiring 12 and the bump 18 are at positions facing each other with the anisotropic conductive film 14 interposed therebetween. In other words, the position where the wiring 12 is provided is determined based on the mounting position of the circuit element 16.

Next, as shown in FIG. 1B, the flexible layer 22 provided on the portion of the pressure type that contacts the circuit element 16 or the like is brought into contact with the surface of the circuit element 16. Then, the pressure die is further stroked to cause the flexible layer 22 to wrap around the side of the circuit element 16 and the anisotropic conductive film 14 as indicated by the arrow in the figure.

As shown in FIG. 1 (c), the circuit element 16 and the anisotropic conductive film 14 to be pressed are integrally pressed around the periphery thereof, that is, from the upper side and the side in the figure, so-called isotropic loading. Apply pressure. As described above, the wiring 12 and the bump 18 are raised from the surface on which they are arranged, and when pressed, the portion of the anisotropic conductive film 14 sandwiched between the wiring 12 and the bump 18 is removed. It is further compressed, and the compressed portion becomes conductive, so that the wiring 12 and the bump 18 become conductive. In addition, the pressure type,
The heaters 54 and 84 (see FIG. 2) are provided, and the anisotropic conductive film 14 is cured by the heat from this, and the circuit element 16 is pressure-bonded.

FIG. 2 is a diagram showing a schematic structure of a pressurizing device for crimping an integrated circuit chip. This device is composed of an upper mold 30,
The lower mold 32 and the side mold 34 form a cavity 36 in which the substrate 10, the circuit element 16 and the like to be pressed are placed. By moving the upper mold 30 toward the lower mold 32, pressure is applied to the object to be pressurized in the cavity 36. That is, the upper mold 30 and the lower mold 32 are used to form the substrate 10 and the anisotropic conductive film 1 placed thereon.
4. The circuit element 16 is clamped and pressed.

The upper die 30 includes an upper die body 46 which is connected to a fluid pressure piston (not shown), and a heating plate 48 and a pressure pad 50 are further fixed to the tip of the upper die body 46. The heating plate 48 is fixed to the upper mold body 46 by bolts 52 with holes. Further, a heater 54 is provided inside thereof. The heating of the heater 54 raises the temperature of the heating plate 48, and this is transmitted to the object to be pressed through the pressing pad 50.

The pressure pad 50 has a multi-layer structure including a back plate 56 and a rubber plate 58 which are bonded to each other. A suspension pin 62 is screwed to the back plate 56, and the suspension pin 62 is inserted into a hole 64 formed in the upper mold body 46 and fixed by a bolt 66 from the side. An O-ring 63 for sealing between the molds is arranged at a portion of the side surface of the back plate 56 in contact with the side mold 34 so as to reduce the pressure inside the cavity 36. The rubber plate 58 corresponds to the flexible layer 22 shown in FIG. 1 and has flexibility so that the circuit element 16 and the anisotropic conductive film 14 can be pressed from the surroundings. Further, due to its elasticity, the rubber plate 58 returns to the flat plate shape as shown when released from the pressed state after the circuit element is pressure-bonded, and the next pressing can be similarly performed.

The rubber plate 58 is used when the upper surface of the circuit element 16 mounted on the substrate 10 is not parallel to the substrate.
It functions to absorb this strain and apply uniform pressure to the whole. For example, when the upper surface of the circuit element 16 is not parallel to the tip surface of the upper mold 30, the rubber plate 58 is not provided and the upper mold 30 is not provided.
Is rigidly formed, a large pressure is applied to the highest part of the circuit element 16. By providing the rubber plate 58, the inclination of the circuit element 16 can be absorbed. That is, the rubber plate 58 functions as a flexible layer that can absorb the inclination of the circuit element 16. Therefore, this flexible layer can be made of another material instead of rubber as long as it has the required flexibility. In this embodiment, in particular, the rubber plate 58 is formed of silicon rubber in consideration of heat resistance, but it is also possible to use other types of rubber and other materials as described above.

A backup ring 68 is arranged at the edge of the surface of the rubber plate 58 that contacts the back plate 56. The backup ring 68 has a shape that fills an annular shoulder formed on the edge of the rubber plate 58. The outer peripheral surface of the backup ring contacts the inner surface of the side mold 34. This prevents the rubber plate 58 from leaking from the gap between the molds due to pressure. Further, the edge portion of the rubber plate 58 is recessed to form a shoulder portion, and the backup ring 68 is arranged so as to fill the shoulder portion. From behind, a force is applied to push this toward the side mold 34. As a result, a stronger seal can be achieved.

The side mold 34 comprises four fluid pressure cylinders 7.
It is hung and supported by the upper mold 30 via 2. The side mold 34 has an annular shape that surrounds the lateral sides of the pressure pad 50 and the cavity 36. The fluid pressure cylinder 72 allows the side mold 34 to move from the side mold 34 to the lower mold 32 during pressure molding.
Push towards and stick them together. At this time, the fluid pressure cylinder 72 tries to push up the upper die 30 as a reaction, but the pressing force that pushes the upper die 30 downward is sufficiently larger than the force of the fluid pressure cylinder 72, and the pressing force is substantially the same. It never decreases. Inside the side mold 34, an exhaust hole 74 for discharging gas or the like to the outside of the cavity 36 is formed. A ring-shaped seal frame 76 is fixed along the outer periphery of the side mold 34. This seal frame 76
Together with the contact piece 79 form a seal structure for sealing the space, which includes the cavity 36 and is substantially enclosed by the mold, from the outside.

The lower die 32 has a lower die body 78 on which the substrate 10 is placed, and the lower die body 78 is placed on a heating plate 82 fixed on a table 80. A heater 84 is provided inside the heating plate 82, and the heat generated by the heater 84 is applied to the substrate 10 via the heating plate 82 and the lower die main body 78.
And transmitted to the anisotropic conductive film 14. An annular contact piece 79 that contacts the inner surface of the seal frame 76 is fixed to the side of the lower mold body 78.

Legs 86 are formed at the four corners of the lower mold body 78 so as to face downward. The lower die body 78 and the legs 86 as a whole are shaped so as to straddle the heating plate 82 of the table 80. An upper and lower roller 90 that contacts the upper surface of a rail 88 formed on the table 80 and defines the upper and lower positions of the lower die 32 in FIG. 2 is rotatably supported by the leg portion 86. Further, the leg portion 86 is rotatably supported by the left and right rollers 92 that contact the side surface of the rail 88 and define the left and right positions of the lower die 32 in FIG.

As described above, the heat from the heating plate 48 provided in the upper mold 30 is transferred to the object to be heated via the rubber plate 58. Rubber is generally a material having relatively poor heat conductivity, and the portion of the rubber plate 58 may interfere with heat transfer from the heating plate 48. In the present embodiment, the rubber plate 58 is made of a rubber material that conducts heat better.

FIG. 3 is a diagram comparing the heat transfer characteristics of a general rubber material and a rubber material used in this apparatus. In this figure, different rubber materials as flexible materials are placed on a table whose temperature changes as indicated by a thin solid line A, and the temperature change of the upper surface thereof is shown. The thick broken line B is
It shows the temperature change of silicone rubber which is a general rubber material. The thick solid line C shows the temperature change of the rubber material obtained by mixing 30% by weight of carbon whiskers as fine particles or fine fibers of carbon into the above silicon rubber, and the thick dash-dotted line D shows the mixing ratio of carbon whiskers. The change in temperature of the rubber material is shown as 15%. The mixed carbon whiskers have a diameter of several tens to several hundreds nm, an average of about 200 nm, and a ratio of length to diameter (l / d) of about 100.

As shown in the figure, with respect to the silicon rubber in which the carbon whiskers are not mixed, both materials having a mixing ratio of 15% and 30% have a time to reach a certain temperature less than half. It can be seen that the thermal property is improved. Therefore, for example, in mounting the integrated circuit chip, the time required for curing the anisotropic conductive film can be shortened, and the productivity can be improved.

When a faster temperature rise or fall is required in the pressurizing process such as the pressure bonding process of the circuit element,
The feature of this device that the flexible material has good thermal conductivity works effectively.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of a method of mounting an integrated circuit chip of this embodiment.

FIG. 2 is a diagram showing a schematic configuration of a pressure device used for mounting an integrated circuit chip.

FIG. 3 is a diagram showing heat transfer characteristics of various rubber materials.

[Explanation of symbols]

10 substrate, 12 wiring, 14 anisotropic conductive film, 16
Circuit element, 18 bumps, 22 flexible layer, 30 upper mold,
32 lower mold, 34 side mold, 48 heating plate, 58 rubber plate (flexible layer).

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 4E088 DA07 EA03                 4E090 AA01 AB01 BA01 CA01 DA01                       HA10                 4J002 CP031 DA016 FA066 GM00

Claims (6)

[Claims] 1. A pressurizing device for sandwiching and pressurizing an object to be pressed by a plurality of pressing dies, and simultaneously heating the at least one pressing die, wherein at least one pressing die is flexible at a portion facing the object to be pressurized. A pressure-sensitive pad including a flexible layer having properties, the flexible layer is a base material having flexibility, and a substance which improves thermal conductivity of the flexible layer by being added to the base material is mixed. There is a pressure device. 2. A pressurizing device for sandwiching and pressurizing an object to be pressed by a plurality of pressing dies, and simultaneously heating the at least one pressing die, wherein at least one of the pressing dies is flexible in a portion facing the object to be pressurized. A pressure device including a pressure pad including a flexible layer made of different rubber, wherein the rubber of the flexible layer is mixed with carbon of fine particles or fine fibers. 3. The pressing device according to claim 2, when mounting a circuit element on a substrate, applies pressure to an adhesive film sandwiched between the substrate and the circuit element. The pressurizing device that is what you do. 4. The pressurizing device according to claim 2, wherein the mixed carbon is a carbon whisker. 5. The pressure device according to claim 4, wherein the carbon whisker content of the rubber of the flexible layer is 15 by weight.
~ 30 percent, a pressure device. 6. The pressurizing device according to claim 4, wherein the carbon whiskers have a diameter of 10 to 1000 nm and a ratio of length to diameter of about 100.