TW447088B - Rolling attachment method for thin film of ball grid array substrate and heat sink - Google Patents

Abstract

This invention is about a kind of rolling attachment method for thin film of ball grid array substrate and heat sink. This method includes the following steps: making thin film of ball grid array substrate corresponding to the heat sink of heat sink material panel; placing the thin film of ball grid array substrate on the heat sink; using the roller tool to perform the rolling process onto the heat sink material panel; performing the pre-curing and the post-curing processes onto heat sink material panel in order to raise the attachment reliability.

Description

447088 V. Description of invention α) _ [Field of invention]

The present invention relates to the rolling and bonding of a seeding grid, a ball grid array substrate film, and a heat sink. The invention relates to the use of a roller tool to roll the ball grid plate film to heat dissipation. An attachment process is performed on the chip to eliminate the gap [gap] and air bubbles remaining between the film of the ball grid array substrate and the heat sink by squeezing. [Previous technology] The conventional ball grid array semiconductor device, [June 9, 1998] US Patent No. 5,766,74 issued to Olson on June 6, and US Patent No. 5, 7 issued to Olson on August 25, 1998 « No. 8, 171 discloses a semiconductor device structure, as shown in the first figure. The semiconductor device includes an active circuit 110, an insulating layer 120, and a heat sink 130. The insulating layer is composed of an unfilled thermoplastic plastic sheet [un f i 11 ed thermoplastic sheet] and two adhesive layers (adhesive layers) located on both sides of the plastic sheet. The substrate 110, the insulating layer 120, and the heat sink 130 are stacked on each other, so that the insulating layer 120 isolates the substrate 110 and the heat sink 130, and a semiconductor layer 100 is formed by using an adhesive layer to adhere to each other in structure. However, when performing the bonding process, there is often a gap and air between the substrate 110 and the heat sink 130, and when the substrate 110 and the heat sink 130 are bonded by means of compression, there is a gap. The formation of a closed space causes gas remaining in the space to form bubbles. The bubble group causes the surface of the substrate 110 to form an uneven surface.

C: \ Logo-5 \ Five Coininents \ PK7244.ptd Page 4 447088 5. Description of the invention (2) The position of the bonding pad [bondi ng pad] and ball (bal 1 pad) on the surface of the substrate 110 is offset. [Shift], therefore, the semiconductor device 100 has a disadvantage that a wiring error occurs during a wire bonding process or a delaminate is generated between the substrate 11 and the heat sink 130. The semiconductor device 100 failed the rel iabi 1 i ty test. Although U.S. Patent Nos. 5,766,740 and 5,798,171 use substrate 110 to provide a flat surface and adhere to a heat sink 130 to improve the problem that the gap hinders heat conduction, the structural improvement can improve the gap. The extent of the problem remains limited. In view of this, the present invention improves the above-mentioned disadvantages, and uses a roller set to roll the ball grid array substrate and the film on the heat sink to perform the sticking process, so as to squeeze and eliminate the remaining between the ball grid array substrate film and the heat sink. Gaps and bubbles, and the present invention improves the ageability of semiconductor device products. [Summary of the invention] 'The main purpose of the present invention is to provide a method of rolling and pasting', which uses a roller to perform a pasting process on a heat sink, with the effect of the gap between the plate film and the heat sink and the reliability of the conductive component product. According to the ball grid array substrate method of the present invention, the method includes the following steps: placing a heat sink substrate on a heat sink sheet; mounting the ball; using the ball grid array substrate binding film and a heat sink group on the heat sink substrate strip. Rolling and extruding the ball grid array substrate film to eliminate the remaining bubbles in the ball grid array base makes the roll-adhesion of the ball grid array substrate with a semi-thin film and heat sink of the present invention thin, corresponding to the thin grid array substrate. The heat sink rollers are rolled;

44708 8 V. Description of the invention (3) Pre- and post-curing treatment of substrate strips to improve adhesion [Explanation of the invention] »In order to make the above and other objects, features, and advantages of the present invention more clearly understood ' Hereinafter, the preferred embodiments of the present invention will be specifically described, and the formulas will be described in detail as follows. The ball grid array substrate film and the radiating fin rolling method of the present invention, f mainly uses a roller set to roll the ball grid array substrate film on the heat radiating fin to perform the sticking process, so as to squeeze out the remaining ball grid array substrate film And the gaps and bubbles between the sheets. This roll-to-stick method eliminates the need for changes in other semiconductor cell processes. '' The second and third figures of the present invention disclose three-dimensional schematic diagrams of heat sink substrate strips undergoing a bonding process to form a ball grid array semiconductor device.

Please refer to the second figure, a heat sink base strip A includes a plurality of heat sinks a for the sticking process. According to the roll-adhesive method of the preferred embodiment of the present invention, the ball grid array substrate film B corresponds to the heat sink a- 'of the heat sink base material strip A—' The ball grid array substrate film B includes an adhesive layer. Place the ball grid array ^ plate film B with a punching tool [punching tool] and place it on the corresponding position & position [position], so that the heat sink substrate strips of the eighth ^ hot sheet: formed on the adhesive layer At this time, a ball array substrate film B is formed. A gap is formed between the ball, the array substrate film B and the heat sink a, and gas is formed in the gap to form air bubbles. Therefore, the gaps and air bubbles between the ball grid array substrate film B and the heat sink sheet a must be eliminated to improve product reliability. In order to eliminate gaps and bubbles, the heat sink base material strip A and the ball grid array

C: \ Logo-5 \ Fivc Continents \ PK7244.ptd Page 6 447088 V. Description of the invention (4) Adhesive processing in / into the house. Please refer to the third figure again: = ㈣The heat sink substrate strip Aϊ into the 红 group 200 is red, and the roller group 2 0 0 includes a plurality of conveying wheels 201,-the lower roller 203. Conveying wheel 201 is used for heat sink fin substrate strip 2 ^ roller 202 and lower roller 203 for roll pressing, the heat sink a of the sheet A is adhered to the ball grid array substrate film B, and the upper roller 202 = The surface of the roller 203 has elasticity, so that the ball grid array substrate is thin and is not easily scratched by the surfaces of the upper roller 202 and the lower roller 203. When the fin substrate strip A passes through the upper roller 202 and the lower roller 203, the upper roll is passed to the bottom roller 203 in February from the fin substrate strip a to the other end. The upper roller 202 and the lower roller 203 are gradually pressed to eliminate the gaps and air bubbles remaining between the ball array substrate film ^ and the heat sink a. Therefore, the ball grid array semiconductor device 100 using the roller bonding method of the present invention includes a substrate, an adhesive, and a heat sink. The substrate, the adhesive layer and the heat sink are stacked on each other, so that the ^ ... adhesive layer is located between the substrate and the heat sink, and the semiconductor element 100 is formed by using the adhesive layer to adhere to each other. After the roll-adhesive treatment is performed between the heat sink substrate strip A and the ball grid array substrate film B, 'in order to improve the adhesion between the heat sink a and the ball grid array substrate film b', the heat sink substrate The strip A and the ball grid array substrate film B are subjected to the first curing treatment, which is a pre-curing treatment. The heat sink base material strip A is placed under a press head to perform pre-curing treatment. In order to prevent the ball grid array substrate film B from being crushed by the heavy plate, an elastic block is provided on the plate to avoid direct contact with the ball grid array substrate film B °

C: \ Logo-5 \ Five Continents \ PK7244.ptd Page 7 447088 V. Description of the invention (5) After the heat treatment substrate strip A and the ball grid array substrate film B are cured in advance, in order to further improve The adhesion reliability between the heat sink a and the ball grid array substrate film B is>, and then the heat sink substrate strip A and the ball grid array substrate film B are subjected to a second curing process, which is a subsequent curing. For processing, the heat sink base sheet is placed in a curing oven for subsequent curing treatment. Compared with the conventional sticking method, the sticking method of the present invention eliminates the gaps and air bubbles between the ball grid array substrate film B and the heat sink ^ by means of an affinity method.

(J Although the present invention has been disclosed in the aforementioned preferred embodiments, it is not intended to limit any person skilled in the art with this art 'without departing from the spirit and scope of the present invention' as various changes and modifications can be made, therefore The protection of this invention shall be determined by the scope of the attached patent application.

C: \ Logo-5 \ Five Continents \ PK7244.ptd Page 8 & 447088 Schematic description [Schematic description]

C: \ Logo-5 \ Five Continen ts \ PK7244.p td Page 9 Figure 1: Part of the conventional ball grid array semiconductor element of US Patent Nos. 5,766,740 and 5,798,171 View; Figure 2: Schematic three-dimensional exploded view of a ball grid array semiconductor device before the bonding process according to a preferred embodiment of the present invention; and 'Figure 3: Schematic view of the preferred embodiment of the present invention when a similar manufacturing process is performed. Automotive semiconductor components are pasting

Claims (1)

447088 6. Application Patent Scope 1. A ball-and-roller array substrate Yang M # 卞 n, a method of rolling and pasting film-seeking and heat-radiating fins includes: a method of applying a ball-grid array substrate film to a heat-radiating fin substrate strip, light sheet The heat radiation sheet will use the ball grid array to release the heat when the heat is applied to the rolling plate film. 2. The heat radiation curing treatment is carried out according to the application of the roll adhesive sheet substrate strip. 3. The heat treatment is performed under the roll adhesive board according to the application. 4. Roll-bond the heavy plate array substrate according to the application. 5. Roll-bond the substrate according to the application. The film, substrate, strip, substrate, and substrate. The sheet and the ball grid array substrate strips are placed on the heat sink; and the roller set is used for rolling and the ball grid array substrate film. The heat sink substrate strips and bubbles are eliminated by being squeezed. The ball grid array substrate is thin and the adhesion between the rows of substrate films after the roll-adhesion and the ball grid array substrate film is beneficial. The sticking method is first fixed in the oven. The sticking method is directly connected to the film. Advantageous range of pasting method The ball grid array substrate of item 2 is thin ′ wherein the heat dissipation substrate is treated in a stripe manner; the heat sink substrate is subsequently cured. The ball grid array of item 3, wherein the heavy plate includes a film of the ball grid array substrate that enters the roller base ball array array film and heat sink. The film and heat dissipation are performed twice for the reliability of the heat sink. Sheets are placed on the heavy-duty sheet Substrate film and heat radiating sheet to avoid crushing the ball grid The ball grid array of item 1 ′ wherein the roller set includes an upper roller and a lower substrate film and heat radiating sheet 447 088 6. Scope of patent application Roller, between the report wheel and the lower roller, the strip of heat sink base material is passed for roll bonding. 6. According to the first patent application scope of the ball grid array substrate thin and cooling month In the roll-adhesive method ', the roller set is a high-temperature roller set. The method of rolling and pasting according to item 1. of the patent application scope, wherein the "袼 array substrate film and heat sink wheel group scratches the ball grid array substrate film wheel" and has elasticity to avoid the pro