TWI607884B - Pressing method of thin film display and flexible circuit board and pressing device thereof - Google Patents

Description

Pressing method of film display and flexible circuit board and pressing device thereof

The invention provides a film bonding method and a pressing device for a flexible circuit board, and a pressing device thereof, in particular, a pressing device capable of adjusting the hot pressing temperature of the heating and pressing module, and a pressing method thereof, for the film display device The exact alignment of the signal transmission side and the docking side of the flexible circuit board is electrically combined to achieve the purpose of accelerating the hot pressing cooperation.

Traditionally used in screens such as video tube televisions or cathode ray tubes that display audio and video signals. Because of the large size and bulkiness of traditional screens, it is quite inconvenient for handling or installation applications. Progress, audio and video displays have been moving toward thinner, flatter and lighter, etc., various types of liquid crystal displays, light-emitting diode displays or organic light-emitting diode displays, etc., due to the lighter size, significantly reduced weight, and less It occupies a space position and has completely replaced the traditional screen. It is widely used in televisions, computers, etc., as a video signal display screen.

Through the advancement of electronic technology, the use of flat-panel displays has evolved into thin-film displays (or flexible displays, flexible displays, or liquid crystal panels, etc.), because thin-film displays are lighter, thinner, and more convenient to store. Carrying, not occupying too much space, too much space position, but also making the thin film display the trend of the current display development, and applied to the display screen of various electronic products; because the thickness of the thin film display may be less than 1mm, And plastic materials (such as PI, PET or PE, etc.) are used as the upper and lower substrates to form a protective effect, and then the thin film display and the flexible circuit board are thermally bonded by an anisotropic conductive adhesive (ACF), such as In the seventh and eighth figures, the film display A is placed on the working platform B, and the transmission interface A1 on the side of the film display A is exposed to the outside of the working platform B, and the working platform B1 on the other side of the transmission interface A1. The flexible circuit board C (which may be a COF (Chip On Film) or a Flexible Printed Circuit (FPC)) is provided, and the connection interface C1 of the flexible circuit board C is extended. Between the transmission interface A1 and the connection interface A1 and the connection interface C1, an anisotropic conductive adhesive D (ACF) is placed, that is, the upper transmission interface E1 and the lower pressure connector E2 are respectively pressed against the floating transmission interface A1. Connected to the outside of the interface C1, and is electrically connected by the anisotropic conductive adhesive D (ACF) for the transmission interface A1 and the connection interface C1, but because of the flexible circuit board C [COF or FPC] and the thin film display A The ratio of thermal expansion is different, and the general anisotropic conductive adhesive The heat curing temperature of D (ACF) needs to be heated to 60~200 degrees. Therefore, the length of the transmission interface A1, the plurality of first line contacts A11 on the connection interface C1, and the plurality of second line contacts C11 must be considered. The length (H, h) of the thermal expansion after the display A is combined with the material of the flexible circuit board C, but the first interface of the transmission interface A1 of the thin film display A is the first line contact A11, the flexible circuit board C (COF or FPC) The plurality of second line contacts C11 of the connection interface C1 are formed by exposure, development, etching, etc. of the mask, so that when the material is selected or changed, the thermal expansion changes when the material is subjected to hot pressing. In the case, it is often necessary to modify the size of the reticle, resulting in a very waste of time and money, which causes an increase in processing and manufacturing costs.

Moreover, when the film display A or a plastic material (for example, various films such as PI, PET, or PE) is used as the upper and lower substrates, when the film display A and the flexible circuit board C are subjected to thermal compression processing, the plastic film may be caused by The phenomenon that the lower substrate is heated and warped, curved, etc., which affects the deviation of the alignment accuracy when the transmission interface A1 and the connection interface C1 are pressed, leads to an increase in the defect rate of the product, and there are many defects in the actual operation process.

Therefore, how to solve the problem of the difference in thermal expansion ratio between different materials affecting the transmission interface and the size of the connection interface when the film display and the flexible circuit board are hot-pressed, and it is easy to cause the plastic of the film display system and the flexible circuit board. When the substrate is thermally deformed and affects the hot pressing cooperation industry, the lack of alignment accuracy of the transmission interface and the connection interface is the direction for the relevant manufacturers in this industry to research and improve.

Therefore, in view of the above problems and shortcomings, the inventors have collected relevant information, evaluated and considered through multiple parties, and through years of experience in the industry, through continuous trial and modification, this design can be used to flatten the film display. The adsorption and signal transmission sides are not suspended, and are accurately combined with the butt side of the flexible circuit board, the process is quite time-saving, labor-saving, and the manufacturing method of the thin film display and the flexible circuit board is reduced, and the pressing device thereof The birth of the invention patent.

The main purpose of the present invention is to provide a hollow channel on one side of the porous suction platform of the press-fit device, a top-through absorbing plane adsorption film display, and a working platform on the outer side of the porous suction platform of the adjacent channel. Providing a flexible circuit board for extending the side of the flexible circuit board to the signal transmission side of the film display side, and then providing an anisotropic conductive glue between the signal transmission side and the docking side, that is, using the porous suction Above and below the channel on one side of the platform The upper pressing head and the lower pressing head of the hot pressing module respectively resist the heating and pressing of the anisotropic conductive rubber on the mating side and the signal transmitting side, so that the adjustable upper pressing head and the lower pressing head are the same. Or the purpose of thermocompression at different temperatures, and according to the thermal expansion size produced by the thin film display and the flexible circuit board (COF or FPC), adjust the temperature range of the pressing head under control, so that the signal transmission side of the thin film display and the flexible circuit board The distance between the butt sides of the butt joints is the same, and it is not necessary to modify the size of the mask for making the signal transmission side or the docking side.

The secondary object of the present invention is to perform the step of thermocompression bonding of the thin film display and the flexible circuit board, and the thin film display is placed on the porous absorbing platform, so that the signal transmission side of the thin film display side is located in the porous sorption. Above the channel on one side of the platform, and above the signal transmission side, the conductive adhesive is placed on the position, and the butt side of the flexible circuit board is stacked on the anisotropic conductive paste, so that the porous suction platform can be utilized. Above and below the side channel, through the hot pressing module, the upper pressing head and the lower pressing head are heated and pressed toward the butting side and the signal transmitting side, respectively, according to the film display and the flexible circuit board (COF or FPC) The generated thermal expansion size, and simultaneously adjusts the heating temperature of the pressing head under control, that is, the signal transmission side of the thin film display is electrically connected to the mating side of the flexible circuit board, and the processing and bonding of the optical connection between the thin film display and the flexible circuit board is completed. .

Another object of the present invention is to provide a control system for adjusting the heating temperature of the pressing head under the hot pressing module, and the control system can be based on a thin film display and a flexible circuit board (COF or FPC). The material properties are different, and the thermal expansion size of the heat is changed by the control system. The temperature of the lower pressure head is between 60 degrees and 200 degrees for the signal transmission side of the thin film display and the flexible circuit board (COF). Or the position of the plurality of metal contacts on the butt side of the FPC).

1‧‧‧ Pressing device

11‧‧‧Porous sorption platform

110‧‧‧ channel

111‧‧‧Sucking plane

12‧‧‧Working platform

2‧‧‧Film display

21‧‧‧ Signal transmission side

211‧‧‧First metal joint

3‧‧‧ anisotropic conductive adhesive

4‧‧‧Soft circuit board

41‧‧‧Docking side

411‧‧‧Second metal joint

5‧‧‧Hot pressurizing module

51‧‧‧Upper press head

52‧‧‧Under pressurizing head

53‧‧‧Control system

A‧‧‧film display

A1‧‧‧Transport interface

A11‧‧‧First line contact

B‧‧‧Working Platform

B1‧‧‧Working Platform

C‧‧‧Soft Board

C1‧‧‧Connection interface

C11‧‧‧second line contact

D‧‧‧ anisotropic conductive adhesive

E1‧‧‧Upper pressure joint

E2‧‧‧ press fitting

The first figure is a flow chart of the pressing method of the present invention.

The second figure is a side view of the invention.

The third figure is a side cross-sectional view of the present invention.

The fourth figure is a side view of the hot pressing module of the present invention before processing.

The fifth figure is a side view of the hot pressurization module of the present invention after processing.

Figure 6 is a plan view showing the manner in which the thin film display and the flexible circuit board are connected to each other.

The seventh figure is a side view of a conventional heat pressurizing module.

The eighth figure is a top view of a conventional method of docking a thin film display and a flexible circuit board.

In order to achieve the above objects and effects, the technical means, the structure, the method of the implementation, and the like, which are used in the present invention, are described in detail in the preferred embodiments of the present invention.

Please refer to the first, second, third, fourth and fifth figures, which are the flow chart, side view, side cross-sectional view, side view of the hot pressing module before processing, and hot pressing die according to the present invention. The side view after processing, as can be clearly seen from the figure, the method for pressing the film display and the flexible circuit board of the present invention includes a pressing device 1, a film display 2, an anisotropic conductive adhesive 3, The flexible circuit board 4 and the thermal compression module 5, wherein the steps of performing thermal compression are:

(a) The film display 2 is placed on the top surface of the porous suction platform 11 of the press-fit device 1 for the signal transmission side 21 on the side of the film display 2, and is vacant on the side of the porous suction platform 11 Above the channel 110.

(b) placing the anisotropic conductive paste (ACF) 3 and the flexible circuit board 4 on the side of the signal transmission side 21 of the film display 2, and placing the flexible circuit board 4 on the channel of the porous suction platform 11. The working platform 12 on the outer side of the 110 extends the mating side 41 of the flexible circuit board 4 to the outside of the working platform 12, and is stacked above the anisotropic conductive paste 3 above the signal transmitting side 21.

(c) that is, above and below the channel 110 on the side of the porous suction platform 11, through the thermal compression module 5, the upper pressing head 51 and the lower pressing head 52 respectively face the mating side 41 and the signal transmitting side 21 The lower outer pressing head 52 is provided with a control system 53 for the outer side, and the lower pressing head can be used for the thin film display 2, the anisotropic conductive adhesive 3 and the flexible circuit board 4, etc., due to different thermal expansion ratios. The heating temperature sensing required by the 52-pressure cooperation industry is adjusted to control the heating temperature of the pressing head 52.

(d) That is, the signal transmission side 21 of the thin film display 2 is electrically connected to the abutting side 41 of the flexible circuit board 4 through the anisotropic conductive paste 3.

(e) A processing operation of electrically connecting and bonding the thin film display 2 and the flexible circuit board 4 is completed.

The pressing device 1 of the thin film display and the flexible circuit board of the present invention comprises a porous absorbing platform 11, a working platform 12 and a hot pressing module 5, wherein: the porous absorbing device 11 of the pressing device 1 The utility model is a porous ceramic absorbing platform, and has a absorbing plane 111 on the top of the porous absorbing platform 11 for adsorbing the thin film display 2, and a hollow channel 110 is arranged on one side of the porous absorbing platform 11 The porous passage of the adjacent passage 110 sucks the outside of the platform 11, and the working platform 12 is further provided for the flexible circuit board 4.

The hot pressurizing module 5 includes two upper pressing heads 51 and a lower pressing head 52, and the upper pressing head 51 and the lower pressing head 52 are oppositely disposed on the side of the porous suction platform 11 Above and below the channel 110, the lower pressing head 52 is further connected with a control system 53 for sensing the required heating temperature and then adjusting the heating temperature of the lower pressing head 52 to be adjusted by the control system 53. The temperature of the pressurizing head 52 ranges from 60 degrees to 200 degrees.

Furthermore, the thin film display 2 (which may be a flexible display, a light emitting diode display, an organic light emitting diode display panel (OLED), a liquid crystal display panel, or an electronic paper) is placed in a porous sorption system. The illuminating plane 111 at the top of the platform 11 and the signal transmitting side 21 provided on the side of the film display 2 are located opposite the channel 110, and do not form a floating state, and the upper surface of the signal transmitting side 21 of the opposite channel 110 is provided with a plurality of A metal contact 211 is disposed on the plurality of first metal contacts 211, and the anisotropic conductive paste (ACF) 3 is stacked on the side of the working platform 12 on the adjacent porous absorbing platform 11 side. There is a flexible circuit board 4 (which may be a COF (Chip On Film) or a Flexible Printed Circuit (FPC), and the butt side 41 of the flexible circuit board 4 side is extended. The plurality of second metal contacts 411 are disposed on the outer surface of the working platform 12, and the plurality of second metal contacts 411 of the butting side 41 are stacked on the anisotropic conductive adhesive 3, and the signal is connected to the signal. The transmission side 21 is opposed to the upper and lower sides.

Please refer to the third, fourth, fifth and sixth figures, which are side sectional views of the present invention, a side view before processing of the hot pressing module, a side view after processing of the hot pressing module, and a film display. The top view of the docking mode of the flexible circuit board and the flexible circuit board can be clearly seen from the figure. The pressing method of the thin film display and the flexible circuit board of the present invention is provided on the upper and lower channels 110 of the porous suction platform 11 The upper pressurizing head 51 and the lower pressurizing head 52 are relatively displaced toward the mating side 41 of the flexible circuit board 4 and the signal transmitting side 21 of the thin film display 2, respectively, and are pressed against the docking by the upper pressing head 51. Above the side 41, the lower pressing head 52 extends into the channel 110 and presses under the signal transmitting side 21, that is, the upper pressing head 51 and the lower pressing head 52 are heated and heated by the hot pressing module 5 (temperature The range is between 60 degrees and 200 degrees, whereby the anisotropic conductive adhesive 3 is thermally fused for the plurality of first metal contacts 211 of the signal transmission side 21 and the plurality of second metal contacts 411 of the butting side 41, When the anisotropic conductive paste 3 is electrically connected to the electrical connection, and when the upper pressing head 51 and the lower pressing head 52 perform a hot pressing operation, the lower pressing head 52 is controlled by the control system 53 to the film. Display 2, anisotropic conductive adhesive 3 and flexible circuit board 4 for sensing, analyzing thin film display 2, anisotropy Different thermal expansion ratios of different materials such as conductive adhesive 3 and flexible circuit board 4, according to the heat curing temperature required for the anisotropic conductive adhesive 3 to the flexible circuit board 4 (COF or FPC, etc.), the film display 2, the anisotropic conductive adhesive 3 and the thermal expansion mode change mode generated when the flexible circuit board 4 is heated, the temperature range of the lower pressing head 52 is adjusted through the control system 53 (the temperature range is between 60 degrees and 200 degrees), thereby providing the signal transmission side 21 The plurality of first metal contacts 211 and the plurality of second metal contacts 411 of the butting side 41 can be matched by the change in the pitch (W1, W2) after heating, and the plurality of first metal contacts 211 and the plurality of second metals are connected The point 411 can be accurately aligned and electrically connected through the anisotropic conductive adhesive 3, and the deviation phenomenon is less likely to occur, and the product of the heat-compression processing of the signal transmitting side 21 of the film display 2 and the butting side 41 of the flexible circuit board 4 can be improved. Yield; and the plurality of first metal contacts 211 and the docking side 41 of the signal transmission side 21 The second metal contact 411 can be used for exposure, development, etching, and the like by using a mask during the pre-processing, and can be used for the signal transmission side 21 and the flexible circuit board 4 of the thin film display 2 without constantly modifying the size of the mask. The processing work of the docking side 41 has the unpredictable effect of saving time and labor.

When the film display 2 is processed, the film display 2 and the side signal transmission side 21 are uniformly absorbed by the absorbing plane 111 of the porous absorbing platform 11 and the signal transmission side 21 is located at the channel 110. The upper side, that is, the signal transmission side 21 is not suspended. When the film display 2 and the flexible circuit board 4 are thermally pressed by the thermal compression module 5, the signal transmission side 21 and the docking side 41 do not cause the film display 2 When the flexible circuit board 4 is warped, twisted, or bent, the film display 2 and the flexible circuit board 4 are kept in a good flatness, and the product of the film display 2 and the flexible circuit board 4 is improved. rate.

Therefore, the above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. The method for pressing the film display of the present invention and the flexible circuit board and the pressing device thereof utilize the pressing device 1 The porous suction absorbing platform 111 on the top of the platform 11 is placed on the thin film display 2, and is connected to the channel 110 on the side of the porous absorbing platform 11 by the signal transmitting side 21 of the thin film display 2 side. The thin film display 2 is fully absorbed by the absorbing plane 111, and the working platform 12 is disposed outside the porous absorbing platform 11 of the near channel 110, and the flexible circuit board 4 is placed on the working platform 12, and the flexible circuit board is provided. 4 abutting side 41 extends outside the working platform 12 and is placed above the signal transmitting side 21, that is, anisotropic conductive adhesive 3 is placed between the signal transmitting side 21 and the butting side 41, and the porous absorbing platform is used. 11 above and below the hot pressurizing module 5 on the side channel 110 The pressing head 51 and the lower pressing head 52 are respectively electrically connected to the signal transmitting side 21 and the butting side 41 by thermal compression, and the lower pressing head 52 is controlled by the control system 53 to sense the thin film display 2 and the opposite side. The different thermal expansion ratios of the conductive adhesive 3 and the flexible circuit board 4, and then the temperature of the lower pressing head 52 is adjusted by the control system 53, so that the signal transmission side 21 and the docking side 41 can be accurately aligned and electrically connected. Moreover, the hot pressurization process does not cause the practical effect of the warpage or the arc bending phenomenon of the thin film display 2 and the flexible circuit board 4, and therefore the structure and device which can achieve the foregoing effects are covered by the present invention, and the simple modification and Equivalent structural changes shall be included in the scope of the patent of the present invention and shall be combined with Chen Ming.

Therefore, the present invention is mainly directed to a film bonding method and a soft circuit board pressing method and a pressing device thereof, which utilizes a porous suction platform at the top of a suction device to adsorb a film display, and a signal transmission side of the film display side. The porous side absorbs the channel on one side of the platform, and a working platform is arranged outside the adjacent porous suction platform for placing the flexible circuit board, and the opposite side of the flexible circuit board extends out of the working platform and is located at the signal docking The side of the upper side, and the anisotropic conductive adhesive is placed between the signal transmitting side and the mating side, and the pressing head and the lower pressing head are respectively pressed against the butting side by the hot pressing module located above and below the channel. The signal transmission side performs hot pressing processing, and the temperature of the pressing head is sensed by the control system to sense the difference of different thermal expansion ratios of the film display, the anisotropic conductive adhesive and the flexible circuit board, so as to control the temperature of the pressing head under the control system. The electrical connection between the transmission side and the docking side for the signal transmission side is the main protection point, and the absorbing surface at the top of the porous sorption platform can fully flatten the adsorption film display. Therefore, only the film display and the flexible circuit board are not subjected to warping or arc bending during the thermal pressing process, and it is not necessary to frequently modify the size of the mask when the signal transmission side and the docking side are manufactured in advance, so that the processing process is more economical. Time and labor saving, and improve the yield of the processed products of the thin film display and the flexible circuit board, and the practicality is excellent, however, The above is only the preferred embodiment of the present invention, and thus is not intended to limit the scope of the present invention. Therefore, the simple modifications and equivalent structural changes that are made by using the description and the drawings of the present invention should be included in the same manner. Within the scope of the patent of the present invention, it is combined with Chen Ming.

In summary, the method for pressing the film display and the flexible circuit board of the present invention and the pressing device thereof are actually implemented and implemented, so that the invention can achieve its efficacy and purpose, so the invention is excellent in practical research and development. In order to meet the application requirements of the invention patent, 提出 apply in accordance with the law, and hope that the trial committee will grant the case as soon as possible to protect the inventor's hard work in research and development and creation. If there is any doubt in the ruling committee, please do not hesitate to give instructions to the inventor. Strive to cooperate, the real sense of virtue.

1‧‧‧ Pressing device

11‧‧‧Porous sorption platform

110‧‧‧ channel

111‧‧‧Sucking plane

12‧‧‧Working platform

2‧‧‧Film display

21‧‧‧ Signal transmission side

211‧‧‧First metal joint

3‧‧‧ anisotropic conductive adhesive

4‧‧‧Soft circuit board

41‧‧‧Docking side

411‧‧‧Second metal joint

5‧‧‧Hot pressurizing module

51‧‧‧Upper press head

52‧‧‧Under pressurizing head

53‧‧‧Control system

Claims (9)

A method for pressing a film display and a flexible circuit board, wherein the pressing step is: (a) placing the film display on the porous suction platform of the pressing device for the signal transmission side of the film display side, It is located above the hollow channel on one side of the porous absorbing platform; (b) is placed on the signal transmission side of the film display side, and the positional conductive adhesive and flexible circuit board are placed at the position, and the mating side of the flexible circuit board is provided. Located on the signal transmission side; (c) on the side of the porous suction platform side, below, through the thermal compression module relative to the upper pressing head, the lower pressing head toward the butting side, the signal transmission side opposite to the outside Heating and pressing, and using the control system to adjust the heating temperature of the pressing head; (d) that is, the signal transmitting side of the thin film display is electrically connected to the mating side of the flexible circuit board; (e) completing the thin film display and the flexible circuit board The electrical connection is pressed. The method for pressing a thin film display and a flexible circuit board according to claim 1, wherein the thin film display is a flexible organic light emitting diode panel (OLED), a liquid crystal display panel or an electronic paper (Electronic paper). . The method for pressing a film display and a flexible circuit board according to the first aspect of the invention, wherein the porous absorbing platform is a porous ceramic absorbing platform, and is provided on the side of the hollow channel. The upper pressing head and the lower pressing head are opposite to each other, and the lower pressing head extends into (or exits) the hollow passage to abut the signal transmission side of the film display, and the upper pressing head resists the flexible circuit board. Above, and through the upper pressing head and the lower pressing head heating and heating, the butt side of the flexible circuit board is thermocompression bonded to the signal transmitting side of the thin film display, and is electrically Turn on. The method for pressing a film display and a flexible circuit board according to claim 3, wherein the upper pressurizing head and the lower pressurizing head perform heating and pressing cooperation, and the heating temperature can be controlled, and the lower pressing head Then, a control system for adjusting the heating temperature for the temperature sensing of the thin film display, the anisotropic conductive adhesive and the flexible circuit board is provided. The method for pressing a film display and a flexible circuit board according to the fourth aspect of the invention, wherein the upper pressing head and the lower pressing head are the same or different pressing temperatures when performing the heating and pressing cooperation. The method for pressing a thin film display and a flexible circuit board according to claim 4, wherein the control system is a flexible circuit board (COF) according to a heat curing temperature required for an anisotropic conductive adhesive (ACF). Or the thermal expansion size produced by the flexible flexible circuit board (FPC), and the heating temperature range of the lower pressing head is adjusted. A pressing device for a thin film display and a flexible circuit board comprises a porous absorbing platform and a hot pressing module, wherein: the top of the porous absorbing platform has a absorbing plane for the adsorption film display, and the porous absorbing a hollow channel is arranged on one side of the platform, and a working platform for placing a flexible circuit board is arranged outside the porous suction platform of the adjacent channel; and the hot pressing module is disposed on one side of the porous suction platform The upper and lower portions include two upper pressing heads and a lower pressing head, and the lower pressing head is connected with a control system for adjusting the heating temperature by sensing the required heating temperature. The film-forming device and the flexible circuit board pressing device according to claim 7, wherein the film display is a flexible flexible display, a light-emitting diode display, and A light-emitting diode display panel (OLED), a liquid crystal display panel or an electronic paper, with a signal transmission side on one side of the channel above the porous suction platform, and an extension of the flexible circuit board side The power supply is combined with the anisotropic conductive adhesive (ACF) on the opposite side of the signal transmission side and the opposite side of the signal transmission side. The pressing device of the thin film display and the flexible circuit board according to claim 8 , wherein the pressing head and the lower pressing head of the hot pressing module are oppositely disposed on the side of the porous suction platform Above and below the hollow passage, and the lower pressing head extends into the hollow passage to resist the lower side of the signal transmission side of the thin film display, and the upper pressing head abuts above the mating side of the flexible circuit board, and passes through the upper pressing head The lower pressing head is heated and heated, and the anisotropic conductive rubber is used for the butt side to be thermally pressed to the signal transmitting side and electrically connected, and the upper pressing head and the lower pressing head are heated and pressed to be the same or different. Pressing temperature.