JP3945940B2 - 試料研磨方法及び試料研磨装置 - Google Patents

試料研磨方法及び試料研磨装置 Download PDF

Info

Publication number
JP3945940B2
JP3945940B2 JP15573699A JP15573699A JP3945940B2 JP 3945940 B2 JP3945940 B2 JP 3945940B2 JP 15573699 A JP15573699 A JP 15573699A JP 15573699 A JP15573699 A JP 15573699A JP 3945940 B2 JP3945940 B2 JP 3945940B2
Authority
JP
Japan
Prior art keywords
polishing
dressing
sample
dress
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP15573699A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000343406A (ja
JP2000343406A5 (enrdf_load_stackoverflow
Inventor
橋司 渡部
謙一 堀井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP15573699A priority Critical patent/JP3945940B2/ja
Publication of JP2000343406A publication Critical patent/JP2000343406A/ja
Publication of JP2000343406A5 publication Critical patent/JP2000343406A5/ja
Application granted granted Critical
Publication of JP3945940B2 publication Critical patent/JP3945940B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP15573699A 1999-06-02 1999-06-02 試料研磨方法及び試料研磨装置 Expired - Fee Related JP3945940B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15573699A JP3945940B2 (ja) 1999-06-02 1999-06-02 試料研磨方法及び試料研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15573699A JP3945940B2 (ja) 1999-06-02 1999-06-02 試料研磨方法及び試料研磨装置

Publications (3)

Publication Number Publication Date
JP2000343406A JP2000343406A (ja) 2000-12-12
JP2000343406A5 JP2000343406A5 (enrdf_load_stackoverflow) 2005-11-24
JP3945940B2 true JP3945940B2 (ja) 2007-07-18

Family

ID=15612333

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15573699A Expired - Fee Related JP3945940B2 (ja) 1999-06-02 1999-06-02 試料研磨方法及び試料研磨装置

Country Status (1)

Country Link
JP (1) JP3945940B2 (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4072810B2 (ja) * 2001-01-19 2008-04-09 株式会社荏原製作所 ドレッシング装置および該ドレッシング装置を備えたポリッシング装置
JP5390750B2 (ja) * 2007-03-30 2014-01-15 ラムバス・インコーポレーテッド 研磨装置、および研磨パッド再生処理方法
JP5444596B2 (ja) * 2007-08-31 2014-03-19 富士通セミコンダクター株式会社 半導体装置の製造方法
KR100930390B1 (ko) * 2008-03-27 2009-12-08 주식회사 하이닉스반도체 화학기계적연마 장비
CN110744450B (zh) * 2019-10-21 2021-11-26 西安奕斯伟材料科技有限公司 一种抛光垫的修整器及修整方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0631945U (ja) * 1992-09-25 1994-04-26 シチズン時計株式会社 研磨定盤修正用工具
JPH091457A (ja) * 1995-06-19 1997-01-07 Sony Corp ホイールドレッサ
JP3360488B2 (ja) * 1995-06-20 2002-12-24 ソニー株式会社 研磨装置およびこれを用いた研磨方法
JP3482321B2 (ja) * 1996-10-15 2003-12-22 新日本製鐵株式会社 半導体基板用研磨布のドレッサーおよびその製造方法
JP3660448B2 (ja) * 1996-11-13 2005-06-15 株式会社日立製作所 半導体装置の製造方法及び製造装置

Also Published As

Publication number Publication date
JP2000343406A (ja) 2000-12-12

Similar Documents

Publication Publication Date Title
US6537190B2 (en) Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates
US7052375B2 (en) Method of making carrier head backing plate having low-friction coating
US7156727B2 (en) Web-format polishing pads and methods for manufacturing and using web-format polishing pads in mechanical and chemical-mechanical planarization of microelectronic substrates
JP3823086B2 (ja) 研磨パッド及び研磨方法
US8021566B2 (en) Method for pre-conditioning CMP polishing pad
US6905400B2 (en) Method and apparatus for dressing polishing cloth
JPH07256554A (ja) ウェーハ研磨パッドのツルーイング装置
KR100525652B1 (ko) 폴리싱 장치
JP2004001152A (ja) ドレッサ、ドレッシング方法、研磨装置、及び研磨方法
JP3945940B2 (ja) 試料研磨方法及び試料研磨装置
US6648731B2 (en) Polishing pad conditioning apparatus in chemical mechanical polishing apparatus
KR20030067674A (ko) 웹형식의 패드조정시스템 및 이의 이용방법
JP2003179017A (ja) 研磨装置及び研磨装置における研磨パッドのドレッシング方法
US6780095B1 (en) Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates
WO2008082056A1 (en) Diamond tool and method for manufacturing the same
JP2000153445A (ja) 研磨装置用ドレッサ
US20030220051A1 (en) Conditioning disk actuating system
JP2001038602A (ja) ポリッシング装置
JP2003170346A (ja) 研磨パッドのドレッシング装置及び該装置を有する研磨装置
JP2004017214A (ja) パッドコンディショニング装置、パッドコンディショニング方法、及び研磨装置
US20030220049A1 (en) Conditioning disk actuating system

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20051007

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20051007

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20070406

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20070410

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20070410

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees