JP3942282B2 - ポリッシング方法及び装置 - Google Patents

ポリッシング方法及び装置 Download PDF

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Publication number
JP3942282B2
JP3942282B2 JP23499598A JP23499598A JP3942282B2 JP 3942282 B2 JP3942282 B2 JP 3942282B2 JP 23499598 A JP23499598 A JP 23499598A JP 23499598 A JP23499598 A JP 23499598A JP 3942282 B2 JP3942282 B2 JP 3942282B2
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polishing
polished
water
ions
vicinity
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JP23499598A
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Japanese (ja)
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JP2000052235A5 (enExample
JP2000052235A (ja
Inventor
勇蔵 森
憲雄 木村
充彦 白樫
康 當間
明 福永
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Ebara Corp
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Ebara Corp
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Priority to JP23499598A priority Critical patent/JP3942282B2/ja
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Publication of JP2000052235A5 publication Critical patent/JP2000052235A5/ja
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Publication of JP3942282B2 publication Critical patent/JP3942282B2/ja
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP23499598A 1998-08-06 1998-08-06 ポリッシング方法及び装置 Expired - Fee Related JP3942282B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23499598A JP3942282B2 (ja) 1998-08-06 1998-08-06 ポリッシング方法及び装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23499598A JP3942282B2 (ja) 1998-08-06 1998-08-06 ポリッシング方法及び装置

Related Child Applications (1)

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JP2006139857A Division JP4409539B2 (ja) 2006-05-19 2006-05-19 研磨装置及び研磨部材

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JP2000052235A JP2000052235A (ja) 2000-02-22
JP2000052235A5 JP2000052235A5 (enExample) 2005-10-27
JP3942282B2 true JP3942282B2 (ja) 2007-07-11

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JP23499598A Expired - Fee Related JP3942282B2 (ja) 1998-08-06 1998-08-06 ポリッシング方法及び装置

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Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999055493A1 (en) * 1998-04-28 1999-11-04 Ebara Corporation Polishing grinding wheel and substrate polishing method with this grinding wheel
JP2001064799A (ja) 1999-08-27 2001-03-13 Yuzo Mori 電解加工方法及び装置
US6638143B2 (en) * 1999-12-22 2003-10-28 Applied Materials, Inc. Ion exchange materials for chemical mechanical polishing
JP4141114B2 (ja) 2000-07-05 2008-08-27 株式会社荏原製作所 電解加工方法及び装置
JP4043234B2 (ja) * 2001-06-18 2008-02-06 株式会社荏原製作所 電解加工装置及び基板処理装置
JP4409807B2 (ja) * 2002-01-23 2010-02-03 株式会社荏原製作所 基板処理方法
TWI224531B (en) 2001-09-11 2004-12-01 Ebara Corp Substrate processing apparatus and method
TWI275436B (en) 2002-01-31 2007-03-11 Ebara Corp Electrochemical machining device, and substrate processing apparatus and method
JP2004255479A (ja) * 2003-02-24 2004-09-16 Ebara Corp 電解加工方法及び電解加工装置
WO2004041467A1 (ja) * 2002-11-08 2004-05-21 Ebara Corporation 電解加工装置及び電解加工方法
US7527723B2 (en) 2004-01-16 2009-05-05 Ebara Corporation Electrolytic processing apparatus and electrolytic processing method
JP6188152B2 (ja) * 2014-02-27 2017-08-30 国立大学法人大阪大学 Ｓｉ基板の平坦化加工方法及びその装置

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JP2000052235A (ja) 2000-02-22

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