JP3928166B2 - Tape conveyor for image processing inspection - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an image processing inspection tape transport apparatus that inspects a pattern of a semiconductor mounting tape such as a CSP tape or a TAB tape by image processing.
[0002]
[Prior art]
As an inspection device for inspecting a printed circuit board for mounting, there is a mounted substrate inspection device described in Japanese Patent Laid-Open No. 5-40020 and a printed circuit board pattern inspection device described in Japanese Patent Laid-Open No. 5-322537. Each of these inspection apparatuses is an apparatus that collects light that illuminates the substrate with a lens and inspects it with a photoelectric conversion element or an illumination sensor.
[0003]
In addition, the pattern hole inspection method and apparatus described in Japanese Patent Application Laid-Open No. 6-218425 describes a method of inspecting a shadow mask pattern for a color television using a CCD line sensor.
[0004]
In these conventional inspection methods and the like, in particular, in the method of inspecting by image processing using a CCD line sensor, the inspection object is photographed within the depth of field of the CCD camera, that is, the focus range that can be accurately determined. It is necessary to install a surface.
[0005]
On the other hand, when the pattern of a semiconductor mounting tape used for a CSP tape, a TAB tape, or the like is inspected by image processing, the depth of field of the CCD camera is extremely limited, and is generally in the range of about 50 μm. Is set to Therefore, when a semiconductor mounting tape is inspected by image processing, the inspection object must be accurately placed within this slight imaging range.
[0006]
In addition, since an extremely thin polyimide tape or the like is generally used as a semiconductor mounting tape, an accurate inspection cannot be performed even if the thin tape is slightly distorted at the photographing position. Therefore, in order to install this mounting tape within the depth of field, conventionally, the mounting tape is sandwiched between glass plates, or the perforation parts provided on both sides of the mounting tape. A method of moving the mounting tape horizontally by fixing with a roller.
[0007]
[Problems to be solved by the invention]
However, in the method in which the mounting tape is sandwiched between the glass plates and installed at the photographing position, the mounting operation on the glass plate is obstructed, and the mounting tape cannot be inspected continuously. Moreover, printed wiring or punching wiring using copper or the like is performed on the mounting tape. For this reason, when the surface of the mounting tape is installed at the photographing position, it is desirable that the surface of the mounting tape be installed so as not to contact the surface of the mounting tape as much as possible. However, when the glass plate is brought into contact with the surface of the mounting tape, the surface of the mounting tape may be damaged, which is not preferable.
[0008]
On the other hand, when the mounting tape is moved horizontally by pressing the perforation part with a roller, the tension generated when the mounting tape is transported by the rotational force of the roller is applied to the mounting tape, which distorts the mounting tape. Cause. For this reason, the method of horizontally moving the mounting tape with a roller has a disadvantage that the accuracy is inferior to the method of photographing by sandwiching between glass plates due to distortion caused by this tension. Further, in the method of horizontally moving by pressure bonding with a roller, there is a lot of meandering when the mounting tape is moved, and the mounting tape cannot be set at an accurate photographing position, and the mounting tape may come off from the roller.
[0009]
Therefore, the present invention was created to solve the above-described problems, and it is possible to accurately maintain the shooting position of the mounting tape, prevent distortion of the shooting portion, and accurately perform continuous inspection. In addition, an object of the present invention is to provide an image processing inspection tape transport device that can inspect the surface of the mounting tape in a non-contact state.
[0010]
[Means for Solving the Problems]
In order to achieve the above-described object, the present invention is directed to an image processing inspection apparatus T that inspects a semiconductor mounting tape P with a line sensor S, and holds the surface of the mounting tape P while holding the mounting tape P in a curved state. A holding drum 10 that is continuously installed at the photographing position of the line sensor S is provided, a transport device 20 that transports the mounting tape P along a curved side surface of the holding drum 10, and a mounting tape P held by the holding drum 10. Winding drum 30 from the position where it is hung by the weight of the mounting tape P, and the holding drum 10 holds the perforation P1 portion of the mounting tape P by a pair of opposing drum bodies 11, A holding groove 12 into which the mounting tape P is inserted is provided in the holding portion, and the conveying device 20 is in surface contact with the perforation P1 portion of the mounting tape P held in the holding groove 12. In which the mounting tape P provided the transport belt 21 rotating conveying together with the holding drum 10 Te.
[0011]
According to the transport device of the present invention, the mounting tape P held by the holding drum 10 is wound and wound from the transport device 20 transported with the rotation of the holding drum 10 and the position where the mounting tape P hangs down by its own weight. The take-up device 30 is continuously transported without tension.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Reference numeral T shown in the figure is an image processing inspection apparatus, which is an apparatus for inspecting the surface of a semiconductor mounting tape P with a line sensor S. In the present invention, the mounting tape P is held curved. Then, the surface of the curved mounting tape P is aligned with the photographing position of the line sensor S and inspected by the line sensor S.
[0013]
The transport device of the present invention includes a holding drum 10, a transport device 20, and a winding device 30 (see FIG. 1).
[0014]
The holding drum 10 holds the mounting tape P in a curved state by placing the mounting tape P on the side surface of the holding drum 10. Then, the mounting tape P is conveyed along the curved side surface of the holding drum 10, and the surface of the mounting tape P held on the holding drum 10 is continuously installed at the photographing position of the line sensor S. In the holding drum 10 shown in FIG. 2, a pair of opposing drum bodies 11 holds the perforation P1 portion of the mounting tape P. The holding portion of the holding drum 10 is provided with a holding groove 12 into which the mounting tape P is inserted. The mounting tape P is conveyed while being guided by the holding grooves 12. Although not shown, the line sensor S is inspected by providing an illumination device for irradiating the back surface of the mounting tape P held by the holding drum 10 inside or below the pair of opposing drum bodies 11. The image to be made can be made clear.
[0015]
The transport device 20 is a device for transporting the mounting tape P along the curved side surface of the holding drum 10, and means for transporting the mounting tape P by the rotation of the holding drum 10 itself, or the holding drum 10 that rotates freely. A means for transporting the mounting tape P by rotating it with another rotating device may be adopted.
[0016]
The conveyance device 20 shown in FIGS. 1 to 3 uses a conveyance belt 21 that rotates the holding drum 10. The conveyance belt 21 is pressed along the holding groove 12 of each drum body 11, and the holding drum 10 is rotated by the rotation of the conveyance belt 21 (see FIG. 3). The conveying belt 21 presses the perforation P1 portion of the mounting tape P disposed along the curved surface of the holding groove 12 in a curved state, and the mounting tape P is conveyed along with the rotation of the holding drum 10 (FIG. 2). At this time, the pressing force of the conveyor belt 21 that presses the perforation P1 portion is set to a very weak pressing force. With this weak pressing force, the mounting tape P is successively conveyed while being held in a curved state.
[0017]
Further, when the holding drum 10 which can set the friction coefficient of the holding groove 12 to a minimum and can smoothly slide the mounting tape P is used, the mounting tape P can be transported without rotating the holding drum 10. Is possible. It is also possible to convey the mounting tape P by rotating the holding drum 10 itself (not shown).
[0018]
The winding device 30 is a device that winds the inspection mounting tape P around a predetermined reel 31. The winding device 30 winds up the mounting tape P held by the holding drum 10 from a position where the mounting tape P hangs down by its own weight. By ensuring that the mounting tape P hangs down under its own weight, the mounting tape P is wound around the reel 31 without applying tension to the mounting tape P held by the holding drum 10.
[0019]
【The invention's effect】
The present invention achieves the original object by being configured as described above. That is, since the mounting tape P held by the holding drum 10 is continuously conveyed without being tensioned, the continuous inspection can be accurately performed.
[0020]
Furthermore, since the pair of opposing drum bodies 11 hold the perforation P1 portion of the mounting tape P, continuous inspection can be performed in a non-contact state on the surface of the mounting tape.
[0021]
As a result, rigidity can be imparted to the extremely thin mounting tape and distortion of the imaging surface can be prevented, so that the mounting tape can be accurately set at the imaging position, and an extremely accurate inspection can be performed.
[0022]
As described above, according to the present invention, it is possible to accurately maintain the shooting position of the mounting tape, to prevent distortion of the shooting portion, and to perform continuous inspection accurately, and on the surface of the mounting tape. Various industrially beneficial effects such as inspection in a non-contact state can be achieved.
[Brief description of the drawings]
FIG. 1 is a front view showing an embodiment of the present invention.
FIG. 2 is a perspective view showing a conveyor belt according to the present invention.
FIG. 3 is a cross-sectional view of a main part showing a drum body and a holding groove of the present invention.
[Explanation of symbols]
P Mounting tape P1 Perforation S Line sensor T Image processing inspection device 10 Holding drum 11 Drum body 12 Holding groove 20 Conveying device 21 Conveying belt 30 Winding device 31 Reel

Claims (1)

In a transfer device of an image processing inspection apparatus that inspects a semiconductor mounting tape with a line sensor, a holding drum that holds the mounting tape in a curved state and continuously installs the surface of the mounting tape at the imaging position of the line sensor. provided, comprising a conveying device for conveying the mounting tape along the curved sides of the holding drum, and taking up winding device from hung mounting tapes held by the holding drum by the weight of the mounting tape position, holding The drum has a pair of opposing drum bodies that hold the perforation portion of the mounting tape, and the holding portion is provided with a holding groove into which the mounting tape is fitted. image processing inspection tape transportable, characterized in that a conveyor belt which rotates carrying the mounting tape with holding drum in surface contact with the perforated portion Apparatus.

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