JPS6317541A - Inspection method for series of electronic parts - Google Patents

Abstract

PURPOSE:To inspect the appearance of a chip-shaped electronic part precisely and efficiently by inspecting the appearance of the chip-shaped electronic part from the pattern of the electronic part image-sensed at a position where the chip-shaped electronic part is moved up to adjacent another inner wall surface along an inner wall surface in a housing section. CONSTITUTION:When a chip-shaped electronic part 1 is carried up to an electrostatic chuck 16, it is positioned at a corner section 2c formed by adjacent two inner wall surfaces 2a, 2b of a hole 2. A video camera 12 image-senses the chip-shaped electronic part 1 when the chip-shaped electronic part 1 positioned in the hole 2 in a base tape 3 for a series of electronic parts 8 in this manner reaches the position of image-sensing at approximately the central section of the electrostatic chuck 16, compares the image-sensing pattern with a predetermined pattern previously memorized, and inspects appearance, dimensions, housing into the hole 2 of the chip-shaped electronic part 1, etc. Accordingly, inspection can be conducted precisely and efficiently.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for inspecting a series of electronic components using tape as a packaging material.

(Prior Art) In recent years, with the miniaturization and high-density packaging of electronic devices, chip-based electronic components such as capacitors and resistors are increasingly being used.

Electronic components that have been made into chips in this way are usually mounted on printed circuit boards using automatic machines. It is being used effectively.

As shown in FIG. 4, this series of chip-shaped electronic components consists of rectangular holes 2.2. . . . is formed using a base tape 3 made of cardboard, and the holes 2 are
．． 2. ...Inside there are chip-shaped electronic components 1. ■,...
is accommodated, and a cover tape 4.5 made of a transparent film is attached to the top and bottom of the base tape 3,
In this state, it is wound onto a reel (not shown). This reel is loaded into an automatic component mounting device (not shown), and the chip-shaped electronic component chain 8 shown in FIG. 4 wound around the reel is pulled out from one end and the cover tape 4 is peeled off. and the holes 2, 2 of the base tape 3. ...Chip-shaped electronic components housed inside! , 1. ... is sucked into a suction nozzle (not shown) and mounted at a predetermined position on a printed circuit board (not shown). The series of chip-shaped electronic components 8 is fed using feed holes 6 formed in the base tape 3. Further, although not specifically shown, instead of the base tape 3, a so-called embossed tape made of resin and having a recessed portion for accommodating the chip-shaped electronic component 1 may be used.

By the way, after manufacturing the chip-shaped electronic component chain 8 as described above, when winding the chip-shaped electronic component chain 8 onto a reel, it is important to check whether the chip-shaped electronic component l is in the hole 2 of the base tape 3 or not. Further, after inspecting the chip-shaped electronic components 1 housed in the holes 2 of the base tape 3 for any abnormalities in appearance due to cracks, chips, etc., the chip-shaped electronic component string 8 is wound onto a reel. It's spinning.

Conventionally, in order to check whether or not a chip-shaped electronic component l is contained in the hole 2 of the base tape 3, a light-receiving element and a light-emitting element (both not shown) are placed above and below a chip-shaped electronic component series 8, respectively. Then, depending on whether the light emitted from the light emitting element passes through the hole 2 of the base tape 3, it is optically detected whether or not the chip-shaped electronic component l is present in the hole 2. . However, an external appearance inspection, such as whether or not there are any external abnormalities such as cracks or chips, in the chip-shaped electronic component l accommodated in the hole 2 of the base tape 3 is performed by checking the light emitting element and the light receiving element as described above. This made it difficult to carry out the inspection, and the inspection had to be done visually by the inspector.

By the way, in such visual inspection of electronic components 8, defects in appearance of chip-shaped electronic components 1 may be overlooked due to inspector fatigue, resulting in low inspection reliability and low inspection efficiency. There was a problem.

Therefore, a video camera (not shown) is used to inspect the appearance and presence of chip-shaped electronic components 1, and the chip-shaped electronic components 1 accommodated in the holes 2 of the base tape 3 are sequentially placed at the imaging position of the video camera. It is conceivable to automatically inspect the chip-like electronic component I for abnormalities in appearance by sending it in and taking an image of the chip-like electronic component I, and comparing the imaged pattern with a pre-stored pattern.

In this way, the appearance inspection of the chip-shaped electronic component l can be carried out by
This can be done more accurately and efficiently than by visual inspection. However, when the appearance of the chip-shaped electronic component 1 is automatically inspected using a video camera, as shown in FIG. Since the gap 7 is provided so that the shaped electronic component 1 can be easily accommodated inside the hole 2, the position of the electronic component series 8 and the acceleration/deceleration of the conveyance of the electronic component series 8 may cause the video camera to move to the imaging position. There was a problem in that the position of the chip-shaped electronic component 1 with respect to the hole 2 fluctuates when it is transported, making it impossible to obtain a constant imaging pattern for each chip-shaped electronic component 1.

(Object of the Invention) An object of the present invention is to provide a method for inspecting a series of electronic components, which uses a video camera to accurately and efficiently inspect the presence or absence of chip-shaped electronic components in a series of chip-shaped electronic components and the appearance thereof. It is to be.

(Structure of the Invention) For this reason, the present invention provides for a series of electronic components in which chip-shaped electronic components are housed in a housing portion of a base tape and sealed with a cover tape to be erected in the width direction of the base tape, and each chip-shaped electronic component is After the components are dropped into the storage section and brought into contact with one of the inner walls, the chip-shaped electronic component series is moved relative to the electrostatic chuck, and the chip-shaped electronic components are electrostatically moved within the storage section. The electrostatic force of the chuck moves the chip-shaped electronic component along the inner wall surface to another inner wall surface next to it, and at this position, an image of the chip-shaped electronic component is taken, and the appearance of the chip-shaped electronic component is determined from the pattern of the imaged chip-shaped electronic component. It is characterized by being designed to be inspected.

(Effects of the Invention) According to the present invention, the position of the chip-shaped electronic component conveyed to the imaging position of the video camera is regulated so that it is always at a constant position, so that the chip-shaped electronic component is captured by the video camera. Under constant conditions, it is possible to easily and accurately and efficiently inspect the presence, appearance, dimensions, etc. of a series of chip-shaped electronic components.

(Example) Hereinafter, an example in which the method of the present invention is applied to the inspection of the electronic component series 8 described in FIG. 4 will be specifically described.

FIG. 1 shows an overall perspective view of an inspection apparatus for carrying out the method of the present invention, and FIG. 2 shows an enlarged view of the main parts thereof.

The above-mentioned inspection device transports the electronic component series 8 in the width direction of the base tape 3 to the imaging position of the video camera 12! , a video camera 12 , and an arc-shaped electrostatic chuck 16 placed above the sprocket 11 .

The sprocket 11 has feed pawls 15 that protrude outward at equal angular intervals from the outer peripheral surface of a disc 14 that rotates in the direction indicated by arrow A1 around a vertical rotation axis 13.

This feed pawl 15 is fitted into a feed hole 6 formed in the base tape 3 of the electronic component chain 8, and moves the electronic component chain 8 along the arrow A2.
Transport in the direction of

Furthermore, the electrostatic chuck 16 has an outer surface having a radius of curvature equal to the radius of the disc 14 of the sprocket 2 . This electrostatic chuck 16 is arranged on the disc 14 such that the distance of its outer surface from the center of the rotating shaft 13 is equal to the radius of the disc 14 of the sprocket 11.

At one end of the electrostatic chuck 16, the electronic parts chain 8 has the feed pawl 15 of the sprocket 11 fitted into the feed hole 6 of the base tape 3, and while slidingly contacting the outer surface of the electrostatic chuck 16, the electronic component chain 8 moves as shown by the arrow A. It is sent to the other end of the electrostatic chuck 16 in the direction shown in FIG.

The imaging position of the video camera 12 is preferably set at approximately the center of the portion where the sprocket 11 is in contact with the electronic component chain 8. This is because at approximately the center of the contact area, the electronic component chain is pulled together from both ends at the part where the feed pawl 15 begins to enter the feed hole 6 and the part where the feed pawl exits. , feed hole 6 and feed claw 1
This is because 5 is concentric and the position is the most stable.

The electronic component chain 8 is separated from the sprocket 11 at the other end of the electrostatic chuck 16 and wound around a reel (not shown).

The electronic component series 8 is inspected as follows using the apparatus described above.

First, when the electronic component chain 8 is placed upright in the width direction of the base tape 3 and is fed to the sprocket 11 as shown by arrow A in FIG. The shaped electronic component 1 falls between the cover tapes 4.5 inside the hole 2, and as shown in FIG.
It is placed on the inner wall surface 2a directly above the wall 1.

In this state, when the chip-shaped electronic component l is conveyed to the electrostatic chuck 16, the chip-shaped electronic component l is attracted to the electrostatic chuck 16 by the electrostatic force of the electrostatic chuck 16. Therefore, the chip-shaped electronic component 1 is placed inside the hole 2 of the base tape 3 on the inner wall surface 2a in a direction opposite to the conveyance direction of the electronic component series 8 indicated by arrow A. Slide until it comes into contact with another inner wall 2b adjacent to 2a.

That is, as shown in FIG. 3, the chip-shaped electronic component 1 is manufactured by standing the chip-shaped electronic component series 8 in the width direction of the base tape 3, so that the inner wall surface 2a of the hole 2 is fixed as shown by the arrow A. fall downwards towards. Next, when it is conveyed to the electrostatic chuck 16, it slides toward the other inner wall 2b of the hole 2, as shown by arrow A4. Therefore, the above-mentioned chip-shaped electronic component l is the electrostatic chuck 1.
6, it is positioned at a corner 2C formed by two adjacent inner wall surfaces 2a and 2b of the hole 2.

When the chip-shaped electronic component l positioned in the hole 2 of the base tape 3 of the electronic component series 8 as described above reaches the imaging position approximately in the center of the electrostatic chuck 16, the video camera 12 An image of the electronic component 1 is taken, and the imaged pattern is compared with a predetermined pattern stored in advance to inspect the appearance, dimensions, and whether or not the chip-shaped electronic component 1 is accommodated in the hole 2.

In this way, the position of the chip-shaped electronic component 1 with respect to the video camera 12 is kept constant both in the longitudinal direction of the base tape 3 of the electronic component series 8 and in the width direction of the base tape 3. stipulated in

Also, chip-shaped electronic components and a video camera! Since the chip-shaped electronic component l is attracted to the electrostatic chuck 16, the distance between the chip and the electrostatic chuck 16 is also fixed.

Therefore, the above inspection of the chip-shaped electronic component 1 using the video camera 12 can be performed accurately and efficiently. Also,
When the transportation of the electronic parts group 8 is started or stopped,
Even when the electronic component series 8 is intermittently fed, the position of the dip-shaped electronic component 1 is accurately defined, so that the above-mentioned inspection can be performed accurately as well.

[Brief Description of the Drawings] Fig. 1 is a perspective view of an inspection device for carrying out the method of the present invention, Fig. 2 is a perspective view showing the main parts of the inspection device of Fig. 1, and Fig. 3 is a perspective view of a chip-shaped electronic FIG. 4 is an explanatory diagram of the positioning of components, FIG. 4 is an explanatory diagram of an example of a series of chip-shaped electronic components, and FIG. 5 is an explanatory diagram of a conventional inspection method for a series of chip-shaped electronic components. l... Chip-shaped electronic component, 2... Hole (2a, 2b... inner wall, 2c... corner part) 3... Base tape, 4, 5... Cover tape, 7... Gap, 8...Electronic components,
I2...video camera, 16...electrostatic chuck. Patent applicant Murata Manufacturing Co., Ltd. Representative Patent attorney Aoyama Aoyama and 2 others *1 Figure 5 □

Claims (1)

[Claims] (1) A chip-shaped electronic component is accommodated in each accommodating section of the chip-shaped electronic component formed at a predetermined pitch in the longitudinal direction of the base tape, and a transparent cover tape is pasted on the base tape, and a transparent cover tape is attached to the above-mentioned base tape. The series of electronic components, which are made by sealing chip-shaped electronic components, is transported to the imaging position of a video camera, and the video camera images the chip-shaped electronic components through the cover tape. When inspecting the external appearance of chip-shaped electronic components, the electronic component series is erected in the width direction of its base tape, and each chip-shaped electronic component is dropped within the housing section so as to come into contact with the inner wall surface of one of the electronic components. The series of chip-shaped electronic components is moved relative to the electrostatic chuck, and the chip-shaped electronic components are moved along the inner wall surface by the electrostatic force of the electrostatic chuck in the housing section to another inner wall adjacent to the inner wall surface. A method for inspecting a series of electronic components, comprising moving the chip-shaped electronic components until they come into contact with a wall surface, and capturing an image of the chip-shaped electronic components at this position.