玖、發明說明： 【發明所屬之技術領域】 本發明係關於電子零件安裝用薄膜承載膠帶之檢查方法及用於該 方法之電子零件安裝用薄膜承載膠帶的檢查裝置，係用來檢測電子零 件安裝用薄膜承載膠帶（TAB(捲帶式自動接合：Tape Automate(i Bonding)，T-BGA(球形柵陣列膠帶：Tape Ball Grid Array)、CSP(晶片-尺寸包裝：Chip Size Package)，ASIC(特殊應用積體電路：Appiicati〇n说明 Description of the invention: [Technical field to which the invention belongs] The present invention relates to a method for inspecting a film-bearing tape for mounting electronic parts, and an inspection device for a film-bearing tape for mounting electronic parts used in the method, which is used to detect the mounting of electronic parts Film carrier tape (TAB (Tape Automate (i Bonding), T-BGA (Tape Grid Array Tape: Tape Ball Grid Array), CSP (Chip Size Package: Chip Size Package), ASIC (Special Application integrated circuit: Appiicati〇n
Specicic Integrated Circuit)膠帶，COF(薄膜覆晶接合·· chip on Film)、2 金屬（兩面配線)膠帶、多層配線用膠帶等(以下，僅稱為「電子零件安 裝用薄膜承載膠帶」）標準記號、槽脊等記號不良。 ' 【先前技術】 隨著電子產業、技術的發達’安裝1C(積體電路）、LSI(大規模積體 電路)等電子零件的印刷電路配線板之需要急遽地增加，但隨著電子機 器之小型化、輕量化、高功能化之要求，作為該等電子零件的安裝方 法’在隶近採用了使用TAB(捲帶式自動接合）、t_BGA(球形柵陣列膠 帶）、CSP(晶片尺寸包裝)膠帶、ASIC(特殊應用積體電路)膠帶等， COF(薄膜覆晶接合）、2金屬(兩面配線)膠帶、多層配線膠帶等的安裝 方法，特別是，於電子產業中使用於如個人電腦等的高精細化、薄型 化，液晶畫面管道面積狹小化之液晶顯示元件(LCD)，乃增高其重要性。 如此的電子零件安裝用薄膜承載膠帶(TAB帶），習知，如第3圖所1 示’在安裝1C等電子零件之際的裝配，形成有用於定位的對準記號a、 膠帶固定用之槽脊B等記號。 & 可是在如此的記號，有時會產生記號部分缺少（缺損）等不良，當 發生此種不良時，安裝電子零件的裝配之際，不能正確地實行電子零 件安裝用薄膜承載膠帶的定位、固定等，有安裝不良等使品質受到影 響。 ^ 然而，這樣的記號係設在近電子零件安裝用薄膜承載膠帶兩端部 地方，所以如此由人為目視檢查容易看漏，而且因人為判斷所以無論 如何其斷有參差不齊，欲實行一定的穩定品質檢查困難，有流出不^ TP030048/SF-968f 5 200406574 的電子零件安裝用薄膜承載膠帶之慮。 本個鱗慮減的現狀，提供電子轉絲㈣膜承载膠帶的 檢查方法及用於該方法之電子零件安裝用承载膠帶的檢查裝置立以 安裝1C等電子零件之際的裝配使用於定位的對準記號、膠帶固定^之 ，脊等記號的不良檢查’可以不增加製程、作業人員，在低成本下實 行，能夠縮短檢查時間，而且檢查之精度優越為目的。 - 【發明内容】 , 本發明為了達成如於上述的先前技術之課題及目的所發明者，本 發明之電子零件安裝用薄膜承載膠帶的檢查方法，係為了檢查不良電_ 子零件安裝用薄膜承載膠帶之對準記號、槽脊等記號之檢查方法，其 特徵為，乃由於比較預先儲存的記號圖型形狀及以感測器所取入的記· 號之圖型形狀， 而其圖型形狀之一致度在規定的界限值以下時判斷為不良。 又本發明之電子零件安裝用薄膜承載膠帶之檢查裝置，係為了檢 查不良電子零件安裝用薄膜承載膠帶之對準記號、槽脊等記號之檢查 裝置’其特徵為由於比較預先儲存的記號圖型形狀及以感測器所取入 的記號之圖型形狀，其圖型形狀之一致度在規定的界限值以下時構成 為判斷不良的記號圖型比較裝置。 由於構成為如此，安裝1C等電子零件之際的裝配，對使用於定位 的對準記號、膠帶固定用槽脊等記號的不良檢查，以不增加製程、作· 業人員，可在低成本下實行，能夠縮短檢查時間，而且優越於檢查精 度。 又本發明之電子零件安裝用薄膜承載膠帶的檢查裝置，其特徵為 上述記號圖型比較裝置為附設在電子零件安裝用薄膜承載膠帶之電 子零件安裝用薄膜承载膠帶的引線配線圖型之電氣檢查裝置上。 又本發明之電子零件安裝用薄膜承載膠帶之檢查裝置，其特徵為 上述記號圖型比較裝置為附設在電子零件安裝用薄膜承載膠帶之電子 零件安裝用薄膜承載膠帶的引線配線圖型之外觀檢查裝置上。 由於構成為如此，僅附加於既有設備的電氣檢查裝置，外觀檢查 TP030048/SF-968f 6 200406574 裝置即可’所以不增加製程、人員實行自動檢查，同時設備費用亦低 廉。 【實施方式】 以下，參照圖式說明本發明的實施形態(實施例）。 第1圖係本發明電子零件安裝用薄膜承載膠帶之檢查裝置正視圖。 _ 如第1圖所示，10表示本發明知全體電子零件安裝用薄膜承載膠 帶之檢查裝置。 - 電子零件安裝薄縣讎帶之檢查裝置取以下，健「檢查裝置 10」），如第1圖所示，具有送出裂置2〇、檢查部30、標記部6〇及捲 取裝置50。送出裝置20係為電子零件安裝用薄膜承载膠帶(以下，僅 稱「薄膜承載膠帶」），製程結束的薄膜承載膠帶τ，藉由間隔物s捲丨 裝的捲轴R裝設於送出驅動軸22。 然後由未圖示之驅動馬達的驅動，旋轉退出驅動軸22，使薄膜承 載膠帶T從捲轴R與_件S —起撒放出來，藉由導軸21供應於檢查 部30。 /〜— 供應之際，暫時停止驅動齒輪34之驅動，停止薄膜承載膠帶τ的 送給，同時由繫合在薄膜承載膠帶τ的鏈輪孔之背拉力輪％逆轉，正 確地定位賴承娜帶Τ於規定齡置(彳情輯給），並即，暫時停 止驅動齒輪34的驅動，停止薄承載膠帶τ的送給。 了 又，此時之控制為，驅動齒輪34之旋轉係由使驅動齒輪34的驅丨 動機構之脈衝馬達驅動旋轉，依據控制内部脈衝來實行。圖中，3】、 33各為在該等錄之_祕住薄膜承轉了雜|輥子。因此如第 1圖所示，檢查部30配置有例如利用反射光或透射光以人為目視實施 斷線、短路、缺失、突起等外觀檢查之顯微鏡36。 、 然後以此顯微鏡，對發現不良部分的薄膜承栽膠帶τ b 面（以下’僅稱「不良面」）之電子零件安裝部，配置有由上】、ς孔 用來施予記號的標記部60。如此由標記部60，在薄膜承載膠帶τ的不 良地方之規定位置’施予規定之標記後，薄麻娜帶τ係通過 42，供應於下一個卷取裝置5〇。 TP030048/SF-968f 7 200406574 如第1圖所示，供應於捲取裝置5〇的薄膜承載膠帶τ，藉由導輥 42由未圖示的驅動馬達之驅動而旋轉捲取驅動轴兕，將薄膜承載膠帶 Τ捲取於裝設在卷取驅動轴52的捲轴R。此際，從送出裝置2〇之捲轴 R重複撒放出來的間隔物S，藉由導輥56、57供應於捲取裝置5〇之捲 轴R而介在於薄膜承載帶之間，依此薄膜承載膠帶接觸，形成保護薄 膜承載膠帶不至於損傷。 又檢查裝置10，卷裝在捲軸R的薄膜承載膠帶T從送出裝置2〇送· 出後，藉由導輥21供應至檢查部3〇。又同樣在檢查部3〇終檢查結束 時二施予一定標記之薄膜承載膠帶τ，藉由導輥42導引後，在導輥42 ♦ 與卷取裝置50之捲轴R之間，薄膜承載膠帶τ即因其自身重量僅下垂 -疋長度分量’由此自身重量附加拉力（張力)於薄膜承娜帶τ，形成籲 為卷取裝置50之捲轴R。 可是以人為目視由顯微鏡36實施外觀檢查後，薄膜承載膠帶τ如 第1圖及第2圖所示，由記號圖型比較裝置4〇，以安裝IC等電子零件 際之裝配中，構成為實施不良檢查定位所使用之對準記號，膠帶固定 用之槽脊等記號。 此記號圖型比較裝置40,具備有内裝有CCD作為攝影元件之具有 快門功能的感測器41。 然後依據比較取入感測器41之形成在薄膜承載膠帶τ上的標準記 號、槽脊等記號之圖型形狀，及預先輸入控制裝置8〇内之RAM等記籲 憶部的正常記號之圖型形狀(主圖型），當其圖型形狀之一致度在規定之 界限值以下時判斷為不良。 具體的例如第2圖所示，重疊所登錄的圖型C及取入圖型D，檢 測其一致度，如第2(B)圖所示，一致度為界限值以上時，作為良品 (OK) ’如第2(c)圖所示之記號有缺損等時，在界限值以下則形成判定 為不良品(NG>。 具體而言，依據下列方法進行：（1)識別檢測區域内之圖型為白、 其以外之區域為黑，由其白/黑之面積比求識別檢測區域面積的方法， 或(2)對合與識別圖型面積之重心位置座標的偏移，而由相對登錄之圖 TP030048/SF-968f 8 200406574 型識別一致度的方法。 然後其一致度，在預先所設定界限值以下時，判斷為記號不良， 判斷為不良時之不良部分的位置，亦即，不良記號之膠帶縱方向位置， 寬方向之位置，另外朝藉由上墨衝孔等對薄膜承載膠帶τ施予不良記 號標記之標記部60之控制裝置輸出。 又，此狀況下，作為獲得正常記號之圖型形狀(主圖型)之方法，亦 可以記號圖型比較裝置4〇之感測器41預先存入正常的TAB膠帶，又· 使用預先作成CAD等的主圖型亦可。 以上，說明了本發明之較佳實施形態，但本發明並不限定此者，在 上述實施例，係說明了外觀檢查裝置，但本發明之記號圖型比較裝置 40，亦可適用於附設在電氣檢查機等檢查裝置時，在不脫離本發明之馨 目的下，範圍可作各種變更 依據本發明，由於比較預先儲存的記號圖型形狀及感測器取入的 記號之圖型形狀，其圖型形狀之一致度在規定之界限值以下時，構成 判斷為不良，所以，以安裝1C等電子零件時之裝配，將檢查使用於定 位的對準記號，膠帶固定用槽脊等之記號不良，在不增加製程、作業 人貝之下’可以低成本進行’可縮短檢查時間’且檢查之精度優越。 又於本發明中，記號圖型比較裝置係附設在電子零件安裝用薄膜 承載膠帶之外觀檢查裝置，或電子零件安裝用薄膜承載膠帶的引線配 線圖型之電氣檢查裝置，故僅附加於該等既有之設備即可，以不增加 製程、人員即能實行自動檢查，同時設備費用也廉價。 曰 ® 【圖式簡單說明】 第1圖係本發明之電子零件安裝用薄膜承載膠帶之檢查裝置正視 圖。Specic integrated circuit (COF), chip on film (COF), 2-metal (two-sided wiring) tape, multi-layer wiring tape, etc. (hereinafter, referred to as "film carrier tape for electronic component mounting") , Ridges and other marks are bad. '[Previous technology] With the development of the electronics industry and technology' The need for printed circuit wiring boards for mounting electronic components such as 1C (Integrated Circuit) and LSI (Large Scale Integrated Circuit) has increased sharply. As requirements for miniaturization, weight reduction, and high functionality, TAB (tape-tape automatic bonding), t_BGA (ball grid array tape), and CSP (wafer size packaging) have been adopted as mounting methods for these electronic components. Adhesive tape, ASIC (special application integrated circuit) tape, etc., COF (film-on-chip bonding), 2-metal (two-sided wiring) tape, multi-layer wiring tape, and other mounting methods, especially used in the electronics industry such as personal computers, etc. Liquid crystal display elements (LCDs) with high definition, thinness, and narrow tube area on the LCD screen have increased their importance. Such a film-bearing tape (TAB tape) for mounting electronic components is conventionally formed as shown in FIG. 3 'When mounting electronic components such as 1C, an alignment mark a for positioning and a tape for fixing are formed. Slot B and other marks. & However, in such marks, defects such as lack of marks (defects) may sometimes occur. When such defects occur, the positioning of the film-bearing tape for the mounting of electronic parts cannot be carried out correctly when the electronic parts are assembled. The quality is affected by improper installation, etc. ^ However, such marks are located near the two ends of the film-bearing tape for mounting electronic parts, so it is easy to overlook them by human visual inspection, and because of human judgment, there is no uniformity in any case. Stable quality inspection is difficult, and there is a concern that the film does not flow out TP030048 / SF-968f 5 200406574. The present situation of scale reduction provides an inspection method for an electronic transfer wire film carrier tape and an inspection device for an electronic part mounting carrier tape used for the method. The assembly is used for positioning when mounting electronic parts such as 1C. In addition, quasi-marking, tape fixing, and poor inspection of marks such as ridges can be carried out at low cost without adding processes and operators, which can shorten the inspection time and have excellent inspection accuracy. -[Summary of the Invention] In order to achieve the above-mentioned problems and objectives of the prior art, the present invention is directed to a method for inspecting a film carrier tape for mounting electronic parts of the present invention, which is used to inspect defective electrical parts. The method for inspecting the alignment marks, ridges, and other marks of tapes is characterized by comparing the shape of the mark pattern stored in advance with the shape of the mark and mark taken by the sensor, and the pattern shape When the degree of agreement is below a predetermined limit value, it is judged as bad. In addition, the inspection device of the film-bearing tape for mounting electronic parts according to the present invention is an inspection device for inspecting marks such as alignment marks, ridges, and the like of the film-bearing tape for mounting defective electronic parts, and is characterized by comparing a previously stored mark pattern When the shape and the pattern shape of the mark taken in by the sensor are less than a predetermined limit, the pattern shape configuration is a mark pattern comparison device for judging a defect. Due to such a structure, the assembly when mounting electronic components such as 1C, and the defective inspection of alignment marks used for positioning and the tape fixing ridges, etc., can be performed at low cost without increasing the number of manufacturing processes and workers. The implementation can shorten the inspection time and is superior to the inspection accuracy. In addition, the inspection device of the film carrier tape for mounting electronic parts according to the present invention is characterized in that the above-mentioned mark pattern comparison device is an electrical inspection of the lead wiring pattern of the film carrier tape for mounting electronic parts attached to the film carrier tape for mounting electronic parts Device. In addition, the inspection device of the film-bearing tape for mounting electronic parts of the present invention is characterized in that the above-mentioned mark pattern comparison device is an appearance inspection of a lead wiring pattern of the film-bearing tape for mounting electronic parts attached to the film-bearing tape for mounting electronic parts Device. Because of this structure, only the electrical inspection device attached to the existing equipment can be visually inspected. TP030048 / SF-968f 6 200406574 can be used. Therefore, no additional process and personnel are required for automatic inspection, and the equipment cost is low. [Embodiment] Hereinafter, an embodiment (example) of the present invention will be described with reference to the drawings. FIG. 1 is a front view of an inspection device of a film-bearing tape for mounting electronic parts according to the present invention. _ As shown in FIG. 1, 10 indicates the inspection device for the film-bearing tape for mounting electronic components of the present invention. -Take the following inspection equipment for the installation of electronic parts in the thin belt, and use the "inspection equipment 10"), as shown in Fig. 1, with a sending-out crack 20, an inspection unit 30, a marking unit 60, and a winding device 50. The sending-out device 20 is a film-bearing tape for mounting electronic parts (hereinafter, simply referred to as a "film-bearing tape"). The film-bearing tape τ at the end of the manufacturing process is mounted on the sending-out drive shaft through a reel R wrapped by a spacer s twenty two. Then, driven by a driving motor (not shown), the driving shaft 22 is rotated and withdrawn, so that the film carrying tape T is released from the reel R and the piece S, and is supplied to the inspection unit 30 through the guide shaft 21. / ~ — When supplying, temporarily stop the driving of the driving gear 34, stop the feeding of the film-bearing tape τ, and at the same time reverse the% of the sprocket hole tied to the sprocket hole of the film-bearing tape τ to correctly position the Lai Chengna belt T It is set at a predetermined age, and the driving of the driving gear 34 is temporarily stopped, and the feeding of the thin carrier tape τ is stopped. In addition, the control at this time is such that the rotation of the driving gear 34 is driven by the pulse motor of the driving mechanism of the driving gear 34, and is executed in accordance with the control of the internal pulse. In the figure, 3] and 33 are each transferred in the recorded _secret film bearing miscellaneous | roller. Therefore, as shown in Fig. 1, the inspection unit 30 is provided with a microscope 36 that visually inspects, for example, a broken line, a short circuit, a missing portion, or a protrusion, using reflected light or transmitted light. Then, under this microscope, the electronic component mounting portion of the film-bearing tape τ b surface (hereinafter referred to simply as the “bad surface”) where a defective portion is found, is provided with a marking portion from the top] and a through hole for marking. 60. After the predetermined mark is applied to the predetermined position of the defective portion of the film carrying tape τ by the marking unit 60 in this manner, the thin mana tape τ passes through 42 and is supplied to the next winding device 50. TP030048 / SF-968f 7 200406574 As shown in the first figure, the film carrying tape τ supplied to the winding device 50 is rotated by a guide roller 42 driven by a driving motor (not shown), The film carrying tape T is wound up on a reel R mounted on the take-up drive shaft 52. At this time, the spacer S repeatedly discharged from the reel R of the feeding device 20 is supplied to the reel R of the winding device 50 by the guide rollers 56 and 57 and interposed between the film carrier tapes, and accordingly The film carrier tape contacts to form a protective film carrier tape from damage. In the inspection device 10, the film-carrying tape T wound on the reel R is fed and discharged from the feeding device 20, and then supplied to the inspection unit 30 through the guide roller 21. Similarly, at the end of the final inspection of the inspection section 30, a film bearing tape τ with a certain mark is given. After being guided by the guide roller 42, the film is carried between the guide roller 42 and the reel R of the winding device 50. Because the tape τ only sags due to its own weight, the 疋 length component is thus added to the film receiving belt τ by its own weight to form a reel R that is called a winding device 50. However, after the visual inspection by the microscope 36 is performed by human eyes, the film-carrying tape τ is configured as shown in Figs. 1 and 2 by a mark-type comparison device 40 and used for mounting electronic components such as ICs. Alignment marks used for defective inspection and positioning, ridges used for tape fixing, etc. This mark pattern comparison device 40 is provided with a sensor 41 having a shutter function in which a CCD is incorporated as an imaging element. Then, the figure of the standard mark, ridge, and other marks formed on the film-carrying tape τ of the sensor 41 taken in is compared with the figure of the normal mark of the memory and other memory sections input into the control device 80 in advance. The pattern shape (main pattern) is judged to be defective when the degree of pattern shape consistency is below a predetermined limit value. For example, as shown in Fig. 2, registered pattern C and fetched pattern D are superimposed, and the degree of coincidence is detected. As shown in Fig. 2 (B), when the degree of coincidence is greater than a threshold value, it is regarded as a good product (OK ) 'If the mark shown in Figure 2 (c) has defects, etc., it will be judged to be defective (NG >) if it is below the limit value. Specifically, it is performed according to the following methods: (1) identify the map in the detection area The pattern is white, and the other areas are black. The method of identifying the area of the detection area from the white / black area ratio, or (2) the offset of the coordinates of the center of gravity and the area of the pattern area, and the relative registration Figure TP030048 / SF-968f 8 200406574 The method of identifying the consistency degree. Then, if the consistency degree is below the preset limit value, it is judged to be a bad mark, and the position of the bad part when it is judged to be bad, that is, a bad mark. The position of the tape in the longitudinal direction and the position in the width direction is also output to the control device of the marking unit 60 that applies a bad mark to the film-carrying tape τ by inking punching or the like. Also, in this case, it is used to obtain a normal mark. Pattern shape (main pattern) It is also possible to mark the sensor 41 of the pattern comparison device 40 and store a normal TAB tape in advance, or use a main pattern such as CAD in advance. As mentioned above, the preferred embodiment of the present invention has been described. However, the present invention is not limited to this. In the above embodiments, the appearance inspection device was described. However, the symbol pattern comparison device 40 of the present invention can also be applied to inspection devices such as electrical inspection machines, without departing from the present invention. Under the purpose of the invention, the range can be variously changed. According to the present invention, since the shape of the mark pattern stored in advance and the shape of the mark taken by the sensor are compared, the degree of consistency of the shape of the pattern is below a predetermined limit value. At this time, the structure is judged to be defective. Therefore, the assembly marks used for mounting electronic components such as 1C will be inspected for alignment marks used for positioning, tape fixing ridges, and other marks that are defective. The inspection time can be reduced at low cost and the inspection accuracy is excellent. In the present invention, the comparison device of the mark pattern is attached to the film-bearing tape for mounting electronic parts. Appearance inspection device, or electrical inspection device of lead wiring pattern of film-bearing tape for electronic parts installation, so it can be attached only to such existing equipment, so that automatic inspection can be carried out without additional processes and personnel, and equipment costs It is also cheap. [Simplified description of the drawings] FIG. 1 is a front view of the inspection device of the film-bearing tape for mounting electronic parts of the present invention.
第2圖係本發明之電子零件安裝用薄膜承載膠帶之檢查方法中說 明記號圖型之檢查方法之斜視圖。 W 第3圖係電子零件安裝用薄膜承載膠帶的上視圖。 【符號之說明】 TP030048/SF-968f 9 200406574 10 檢查裝置 20 送出裝置 21 導輥 22 驅動轴 30 檢查部 31,33 推壓輥 32 背拉力齒輪 34 驅動齒輪 36 顯微鏡 40 記號圖型比較裝置 41 感測器 42 導輥 50 卷取裝置 52 驅動轴 56,57 導輥 60 標記部 A 對準記號 B 槽脊 C 圖型 D 圖型 R 捲轴 S 間隔物 T 膠帶 TP030048/SF-968fFig. 2 is a perspective view showing a method for inspecting a mark pattern in the method for inspecting a film-bearing tape for mounting electronic parts according to the present invention. W Fig. 3 is a top view of a film carrier tape for mounting electronic parts. [Explanation of symbols] TP030048 / SF-968f 9 200406574 10 Inspection device 20 Feeding device 21 Guide roller 22 Drive shaft 30 Inspection section 31, 33 Pressing roller 32 Back tension gear 34 Drive gear 36 Microscope 40 Symbol pattern comparison device 41 Sensing Detector 42 Guide roller 50 Winding device 52 Drive shaft 56, 57 Guide roller 60 Marking section A Alignment mark B Groove C Pattern D Pattern R Reel S Spacer T Tape TP030048 / SF-968f