JP3897566B2 - プラズマ処理方法 - Google Patents

プラズマ処理方法 Download PDF

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Publication number
JP3897566B2
JP3897566B2 JP2001328980A JP2001328980A JP3897566B2 JP 3897566 B2 JP3897566 B2 JP 3897566B2 JP 2001328980 A JP2001328980 A JP 2001328980A JP 2001328980 A JP2001328980 A JP 2001328980A JP 3897566 B2 JP3897566 B2 JP 3897566B2
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Japan
Prior art keywords
antenna
plasma processing
processing method
plasma
dust
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Expired - Fee Related
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JP2001328980A
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English (en)
Japanese (ja)
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JP2003129239A5 (enExample
JP2003129239A (ja
Inventor
出 松田
幸弘 前川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Priority to JP2001328980A priority Critical patent/JP3897566B2/ja
Publication of JP2003129239A publication Critical patent/JP2003129239A/ja
Publication of JP2003129239A5 publication Critical patent/JP2003129239A5/ja
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Publication of JP3897566B2 publication Critical patent/JP3897566B2/ja
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  • Plasma Technology (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
JP2001328980A 2001-10-26 2001-10-26 プラズマ処理方法 Expired - Fee Related JP3897566B2 (ja)

Priority Applications (1)

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JP2001328980A JP3897566B2 (ja) 2001-10-26 2001-10-26 プラズマ処理方法

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Application Number Priority Date Filing Date Title
JP2001328980A JP3897566B2 (ja) 2001-10-26 2001-10-26 プラズマ処理方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006238705A Division JP2006339673A (ja) 2006-09-04 2006-09-04 プラズマ処理装置

Publications (3)

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JP2003129239A JP2003129239A (ja) 2003-05-08
JP2003129239A5 JP2003129239A5 (enExample) 2005-01-27
JP3897566B2 true JP3897566B2 (ja) 2007-03-28

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JP2001328980A Expired - Fee Related JP3897566B2 (ja) 2001-10-26 2001-10-26 プラズマ処理方法

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JP (1) JP3897566B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5080724B2 (ja) * 2004-03-05 2012-11-21 東京エレクトロン株式会社 基板処理装置、基板処理方法、及びプログラム
US20050233477A1 (en) 2004-03-05 2005-10-20 Tokyo Electron Limited Substrate processing apparatus, substrate processing method, and program for implementing the method
US7755561B2 (en) * 2006-03-17 2010-07-13 ConcealFab Corporation Antenna concealment assembly
JP7275927B2 (ja) * 2019-06-28 2023-05-18 日新電機株式会社 スパッタ装置の使用方法

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JP2003129239A (ja) 2003-05-08

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