JP3891164B2 - 吐出装置 - Google Patents

吐出装置 Download PDF

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Publication number
JP3891164B2
JP3891164B2 JP2003355257A JP2003355257A JP3891164B2 JP 3891164 B2 JP3891164 B2 JP 3891164B2 JP 2003355257 A JP2003355257 A JP 2003355257A JP 2003355257 A JP2003355257 A JP 2003355257A JP 3891164 B2 JP3891164 B2 JP 3891164B2
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JP
Japan
Prior art keywords
nozzle
axis direction
nozzle row
head
discharged
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003355257A
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English (en)
Japanese (ja)
Other versions
JP2005118656A (ja
Inventor
雅之 田代
満 栗林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2003355257A priority Critical patent/JP3891164B2/ja
Priority to KR1020040081635A priority patent/KR100698572B1/ko
Priority to CNB2004100881439A priority patent/CN100379560C/zh
Priority to US10/965,005 priority patent/US7748824B2/en
Priority to TW093131162A priority patent/TW200526326A/zh
Publication of JP2005118656A publication Critical patent/JP2005118656A/ja
Application granted granted Critical
Publication of JP3891164B2 publication Critical patent/JP3891164B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/191—Deposition of organic active material characterised by provisions for the orientation or alignment of the layer to be deposited
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • H10K71/236—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers using printing techniques, e.g. applying the etch liquid using an ink jet printer

Landscapes

  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Optical Filters (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Electroluminescent Light Sources (AREA)
  • Ink Jet (AREA)
  • Liquid Crystal (AREA)
  • Nozzles (AREA)
JP2003355257A 2003-10-15 2003-10-15 吐出装置 Expired - Fee Related JP3891164B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2003355257A JP3891164B2 (ja) 2003-10-15 2003-10-15 吐出装置
KR1020040081635A KR100698572B1 (ko) 2003-10-15 2004-10-13 토출 장치, 도포 방법, 컬러 필터 기판의 제조 방법,일렉트로루미네선스 표시 장치의 제조 방법, 플라즈마표시 장치의 제조 방법, 및 배선 제조 방법
CNB2004100881439A CN100379560C (zh) 2003-10-15 2004-10-14 喷出装置、涂布方法、滤色器基板的制造方法
US10/965,005 US7748824B2 (en) 2003-10-15 2004-10-14 Ejecting apparatus, applying method, manufacturing method of color filter substrate, manufacturing method of electroluminescence display apparatus, manufacturing method of plasma display apparatus, and manufacturing method of wire
TW093131162A TW200526326A (en) 2003-10-15 2004-10-14 Ejecting apparatus, applying method, manufacturing method of color filter substrate, manufacturing method of electroluminescence display apparatus, manufacturing method of plasma display apparatus, and manufacturing method of wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003355257A JP3891164B2 (ja) 2003-10-15 2003-10-15 吐出装置

Publications (2)

Publication Number Publication Date
JP2005118656A JP2005118656A (ja) 2005-05-12
JP3891164B2 true JP3891164B2 (ja) 2007-03-14

Family

ID=34612917

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003355257A Expired - Fee Related JP3891164B2 (ja) 2003-10-15 2003-10-15 吐出装置

Country Status (5)

Country Link
US (1) US7748824B2 (enExample)
JP (1) JP3891164B2 (enExample)
KR (1) KR100698572B1 (enExample)
CN (1) CN100379560C (enExample)
TW (1) TW200526326A (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100493735C (zh) * 2006-01-17 2009-06-03 欣兴电子股份有限公司 涂布工艺
JP2009000837A (ja) * 2007-06-19 2009-01-08 Seiko Epson Corp 液体吐出装置及び液体吐出方法
TWI484301B (zh) * 2012-10-26 2015-05-11 Nat Univ Tsing Hua 形成連續性三維結構的噴墨方法
JP6232239B2 (ja) * 2013-09-30 2017-11-15 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置
KR102092149B1 (ko) * 2013-11-01 2020-03-23 세메스 주식회사 처리액 토출 장치 및 방법, 그리고 처리액 도포 설비
KR102314565B1 (ko) * 2014-03-10 2021-10-18 무사시 엔지니어링 가부시키가이샤 도포 장치 및 도포 방법
CN103895346B (zh) * 2014-04-04 2016-03-30 深圳市华星光电技术有限公司 一种喷墨涂布装置及喷涂方法
TWI659784B (zh) * 2015-02-04 2019-05-21 萬潤科技股份有限公司 Liquid material coating method and device
US10940501B2 (en) * 2018-01-30 2021-03-09 Ford Motor Company Composite ultrasonic material applicators with individually addressable micro-applicators and methods of use thereof
US11872580B2 (en) * 2018-01-30 2024-01-16 Ford Motor Company Composite ultrasonic material applicators with embedded shaping gas micro-applicators and methods of use thereof

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0911455A (ja) 1995-06-29 1997-01-14 Mita Ind Co Ltd 画像記録装置
JP3059678B2 (ja) * 1995-07-14 2000-07-04 キヤノン株式会社 カラーフィルタの製造方法及び製造装置
US6328400B1 (en) * 1997-04-02 2001-12-11 Seiko Epson Corporation Printer system, method of generating image, and recording medium for realizing the method
JPH10286966A (ja) 1997-04-16 1998-10-27 Minolta Co Ltd インクジェット記録装置
JP4028067B2 (ja) * 1998-02-26 2007-12-26 東芝テック株式会社 記録ヘッドの駆動方法
JP2000255045A (ja) * 1999-03-05 2000-09-19 Seiko Epson Corp インターレース式プリンタおよびインターレース式プリント方法
JP2001026101A (ja) 1999-07-15 2001-01-30 Canon Inc インクジェット記録装置及び記録ヘッド駆動方法
JP2001088291A (ja) * 1999-09-21 2001-04-03 Seiko Epson Corp インクジェット式記録ヘッド
JP2002137388A (ja) * 2000-11-01 2002-05-14 Konica Corp インクジェットヘッド
JP3997747B2 (ja) 2001-10-19 2007-10-24 セイコーエプソン株式会社 ヘッドユニット、そのセット方法および電子機器
US6679583B2 (en) * 2001-10-31 2004-01-20 Agfa-Gevaert Fast mutually interstitial printing
JP2003275647A (ja) * 2002-03-20 2003-09-30 Seiko Epson Corp 機能液滴吐出装置、並びにこれを用いた液晶表示装置の製造方法、有機ｅｌ装置の製造方法、電子放出装置の製造方法、ｐｄｐ装置の製造方法、電気泳動表示装置の製造方法、カラーフィルタの製造方法、有機ｅｌの製造方法、スペーサ形成方法、金属配線形成方法、レンズ形成方法、レジスト形成方法および光拡散体形成方法
JP4408608B2 (ja) * 2002-06-24 2010-02-03 株式会社リコー ヘッド駆動制御装置及び画像記録装置

Also Published As

Publication number Publication date
JP2005118656A (ja) 2005-05-12
US20060051496A1 (en) 2006-03-09
CN1611356A (zh) 2005-05-04
KR100698572B1 (ko) 2007-03-21
TW200526326A (en) 2005-08-16
CN100379560C (zh) 2008-04-09
TWI292726B (enExample) 2008-01-21
US7748824B2 (en) 2010-07-06
KR20050036748A (ko) 2005-04-20

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