JP3881195B2 - 半導体部品実装済部品の製造方法、半導体部品実装済部品、半導体部品実装済完成品の製造方法、及び半導体部品実装済完成品 - Google Patents

半導体部品実装済部品の製造方法、半導体部品実装済部品、半導体部品実装済完成品の製造方法、及び半導体部品実装済完成品 Download PDF

Info

Publication number
JP3881195B2
JP3881195B2 JP2001184836A JP2001184836A JP3881195B2 JP 3881195 B2 JP3881195 B2 JP 3881195B2 JP 2001184836 A JP2001184836 A JP 2001184836A JP 2001184836 A JP2001184836 A JP 2001184836A JP 3881195 B2 JP3881195 B2 JP 3881195B2
Authority
JP
Japan
Prior art keywords
semiconductor component
component
reinforcing member
manufacturing
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001184836A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003006587A5 (https=
JP2003006587A (ja
Inventor
法人 塚原
尚士 秋口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2001184836A priority Critical patent/JP3881195B2/ja
Publication of JP2003006587A publication Critical patent/JP2003006587A/ja
Publication of JP2003006587A5 publication Critical patent/JP2003006587A5/ja
Application granted granted Critical
Publication of JP3881195B2 publication Critical patent/JP3881195B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

Landscapes

  • Credit Cards Or The Like (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2001184836A 2001-06-19 2001-06-19 半導体部品実装済部品の製造方法、半導体部品実装済部品、半導体部品実装済完成品の製造方法、及び半導体部品実装済完成品 Expired - Fee Related JP3881195B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001184836A JP3881195B2 (ja) 2001-06-19 2001-06-19 半導体部品実装済部品の製造方法、半導体部品実装済部品、半導体部品実装済完成品の製造方法、及び半導体部品実装済完成品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001184836A JP3881195B2 (ja) 2001-06-19 2001-06-19 半導体部品実装済部品の製造方法、半導体部品実装済部品、半導体部品実装済完成品の製造方法、及び半導体部品実装済完成品

Publications (3)

Publication Number Publication Date
JP2003006587A JP2003006587A (ja) 2003-01-10
JP2003006587A5 JP2003006587A5 (https=) 2005-06-02
JP3881195B2 true JP3881195B2 (ja) 2007-02-14

Family

ID=19024529

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001184836A Expired - Fee Related JP3881195B2 (ja) 2001-06-19 2001-06-19 半導体部品実装済部品の製造方法、半導体部品実装済部品、半導体部品実装済完成品の製造方法、及び半導体部品実装済完成品

Country Status (1)

Country Link
JP (1) JP3881195B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11151437B2 (en) 2017-09-07 2021-10-19 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
KR102931665B1 (ko) * 2017-10-18 2026-02-26 컴포시큐어 엘.엘.씨. 윈도우 또는 윈도우 패턴 및 선택적인 백라이팅을 갖는 금속, 세라믹, 또는 세라믹 코팅된 트랜잭션 카드

Also Published As

Publication number Publication date
JP2003006587A (ja) 2003-01-10

Similar Documents

Publication Publication Date Title
US7229293B2 (en) Connecting structure of circuit board and method for manufacturing the same
JP4241147B2 (ja) Ｉｃカードの製造方法
US20020115278A1 (en) Method of mounting a semiconductor chip, circuit board for flip-chip connection and method of manufacturing the same, electromagnetic wave readable data carrier and method of manufacturing the same, and electronic component module for an electromagnetic wave readable data carrier
JP5181724B2 (ja) Ｉｃカード及びその製造方法
WO2001006558A1 (en) Package of semiconductor device and method of manufacture thereof
KR0169554B1 (ko) 비접촉 ic카드, 그의 제조방법 및 제조장치
JP3916405B2 (ja) 電子部品実装済部品の製造方法、電子部品実装済完成品の製造方法、及び半導体部品実装済完成品
JP3951409B2 (ja) Ｉｃカードとその製造法
JP3529657B2 (ja) 熱可塑性樹脂基板に半導体素子を取付ける方法、非接触ｉｃカードの製造方法及び半導体素子を取付けた熱可塑性樹脂基板
US7375421B2 (en) High density multilayer circuit module
JP4179736B2 (ja) 半導体素子実装済部品の製造方法及び半導体素子実装済完成品の製造方法
JP3916407B2 (ja) 積層型電子部品実装済部品の製造方法、電子部品実装済完成品の製造方法、及び電子部品実装済完成品
GB2279612A (en) Integrated circuit or smart card.
JP3891743B2 (ja) 半導体部品実装済部品の製造方法、半導体部品実装済完成品の製造方法、及び半導体部品実装済完成品
JP3881195B2 (ja) 半導体部品実装済部品の製造方法、半導体部品実装済部品、半導体部品実装済完成品の製造方法、及び半導体部品実装済完成品
JP3661482B2 (ja) 半導体装置
JP2000331138A (ja) 非接触型ｉｃカード
JP4209574B2 (ja) 半導体部品実装済部品の製造方法
JP4306352B2 (ja) 接触型非接触型ハイブリットｉｃモジュールとそれを使用した接触型非接触型ハイブリットｉｃカード
JP3979797B2 (ja) 電子部品実装済部品の製造方法、電子部品実装済完成品の製造方法、及び半導体部品実装済完成品
JP4285347B2 (ja) 電子部品実装済基板および回路モジュール
JP2004171087A (ja) Ｉｃカード
JP2000132655A (ja) 非接触型ｉｃカードの製造方法および非接触型ｉｃカード
JP2011199138A (ja) 電子部品相互の接続方法及び接続構造
JP2008235838A (ja) 半導体装置、その製造方法、その実装方法およびこれを用いたｉｃカード

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040813

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040813

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060704

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060828

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20061031

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20061109

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20091117

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101117

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101117

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111117

Year of fee payment: 5

LAPS Cancellation because of no payment of annual fees