JP3881195B2 - 半導体部品実装済部品の製造方法、半導体部品実装済部品、半導体部品実装済完成品の製造方法、及び半導体部品実装済完成品 - Google Patents

半導体部品実装済部品の製造方法、半導体部品実装済部品、半導体部品実装済完成品の製造方法、及び半導体部品実装済完成品 Download PDF

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Publication number
JP3881195B2
JP3881195B2 JP2001184836A JP2001184836A JP3881195B2 JP 3881195 B2 JP3881195 B2 JP 3881195B2 JP 2001184836 A JP2001184836 A JP 2001184836A JP 2001184836 A JP2001184836 A JP 2001184836A JP 3881195 B2 JP3881195 B2 JP 3881195B2
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JP
Japan
Prior art keywords
semiconductor component
component
reinforcing member
manufacturing
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001184836A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003006587A5 (enExample
JP2003006587A (ja
Inventor
法人 塚原
尚士 秋口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2001184836A priority Critical patent/JP3881195B2/ja
Publication of JP2003006587A publication Critical patent/JP2003006587A/ja
Publication of JP2003006587A5 publication Critical patent/JP2003006587A5/ja
Application granted granted Critical
Publication of JP3881195B2 publication Critical patent/JP3881195B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group

Landscapes

  • Credit Cards Or The Like (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2001184836A 2001-06-19 2001-06-19 半導体部品実装済部品の製造方法、半導体部品実装済部品、半導体部品実装済完成品の製造方法、及び半導体部品実装済完成品 Expired - Fee Related JP3881195B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001184836A JP3881195B2 (ja) 2001-06-19 2001-06-19 半導体部品実装済部品の製造方法、半導体部品実装済部品、半導体部品実装済完成品の製造方法、及び半導体部品実装済完成品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001184836A JP3881195B2 (ja) 2001-06-19 2001-06-19 半導体部品実装済部品の製造方法、半導体部品実装済部品、半導体部品実装済完成品の製造方法、及び半導体部品実装済完成品

Publications (3)

Publication Number Publication Date
JP2003006587A JP2003006587A (ja) 2003-01-10
JP2003006587A5 JP2003006587A5 (enExample) 2005-06-02
JP3881195B2 true JP3881195B2 (ja) 2007-02-14

Family

ID=19024529

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001184836A Expired - Fee Related JP3881195B2 (ja) 2001-06-19 2001-06-19 半導体部品実装済部品の製造方法、半導体部品実装済部品、半導体部品実装済完成品の製造方法、及び半導体部品実装済完成品

Country Status (1)

Country Link
JP (1) JP3881195B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11151437B2 (en) 2017-09-07 2021-10-19 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
HUE069252T2 (hu) 2017-10-18 2025-02-28 Composecure Llc Fém, kerámia vagy kerámia-bevonatos tranzakciós kártya ablakkal vagy ablakmintázattal és háttérvilágítással

Also Published As

Publication number Publication date
JP2003006587A (ja) 2003-01-10

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