JP3877735B2 - 接続装置 - Google Patents

接続装置 Download PDF

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Publication number
JP3877735B2
JP3877735B2 JP2004079745A JP2004079745A JP3877735B2 JP 3877735 B2 JP3877735 B2 JP 3877735B2 JP 2004079745 A JP2004079745 A JP 2004079745A JP 2004079745 A JP2004079745 A JP 2004079745A JP 3877735 B2 JP3877735 B2 JP 3877735B2
Authority
JP
Japan
Prior art keywords
spiral
contact
outer peripheral
support
contacts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004079745A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005268079A5 (enExample
JP2005268079A (ja
Inventor
泰志 岡本
信 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP2004079745A priority Critical patent/JP3877735B2/ja
Priority to KR1020050015361A priority patent/KR100803958B1/ko
Priority to US11/077,277 priority patent/US7080993B2/en
Priority to CNB200510054764XA priority patent/CN100369335C/zh
Priority to TW094108224A priority patent/TWI286868B/zh
Publication of JP2005268079A publication Critical patent/JP2005268079A/ja
Publication of JP2005268079A5 publication Critical patent/JP2005268079A5/ja
Application granted granted Critical
Publication of JP3877735B2 publication Critical patent/JP3877735B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
    • H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/04—Pins or blades for co-operation with sockets
    • H01R13/05—Resilient pins or blades
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Connecting Device With Holders (AREA)
JP2004079745A 2004-03-19 2004-03-19 接続装置 Expired - Fee Related JP3877735B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004079745A JP3877735B2 (ja) 2004-03-19 2004-03-19 接続装置
KR1020050015361A KR100803958B1 (ko) 2004-03-19 2005-02-24 스파이럴 접촉자 및 상기 스파이럴 접촉자를 구비한 컨택트시트 그리고 상기 컨택트 시트를 구비한 접속 장치
US11/077,277 US7080993B2 (en) 2004-03-19 2005-03-09 Spiral contactor, contact sheet having spiral contactor, and connecting device having contact sheet
CNB200510054764XA CN100369335C (zh) 2004-03-19 2005-03-11 螺旋触头及接触片
TW094108224A TWI286868B (en) 2004-03-19 2005-03-17 Spiral contactor, contact sheet having spiral contactor, and connecting device having contact sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004079745A JP3877735B2 (ja) 2004-03-19 2004-03-19 接続装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006202840A Division JP3904592B2 (ja) 2006-07-26 2006-07-26 スパイラル接触子を備えた接続装置

Publications (3)

Publication Number Publication Date
JP2005268079A JP2005268079A (ja) 2005-09-29
JP2005268079A5 JP2005268079A5 (enExample) 2006-07-20
JP3877735B2 true JP3877735B2 (ja) 2007-02-07

Family

ID=34986940

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004079745A Expired - Fee Related JP3877735B2 (ja) 2004-03-19 2004-03-19 接続装置

Country Status (5)

Country Link
US (1) US7080993B2 (enExample)
JP (1) JP3877735B2 (enExample)
KR (1) KR100803958B1 (enExample)
CN (1) CN100369335C (enExample)
TW (1) TWI286868B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006100746A1 (ja) * 2005-03-18 2006-09-28 Fujitsu Limited 電子部品および回路基板
JP4528657B2 (ja) * 2005-03-23 2010-08-18 アルプス電気株式会社 接点部材及びその製造方法
JP4644762B2 (ja) * 2005-11-01 2011-03-02 株式会社アドバンストシステムズジャパン スパイラル状接触子およびその製造方法
US7322831B1 (en) * 2006-07-18 2008-01-29 Cheng Uei Precision Industry Co., Ltd. Matrix board-to-board connector
TW200903912A (en) 2007-03-13 2009-01-16 Alps Electric Co Ltd Contact sheet and connection device having same
JP2010211940A (ja) * 2009-03-06 2010-09-24 Alps Electric Co Ltd 弾性接触素子
CN106785540A (zh) * 2017-01-19 2017-05-31 启东乾朔电子有限公司 电子卡连接器及其导电端子
US10270193B1 (en) * 2017-12-18 2019-04-23 Continental Automotive Systems, Inc. Concentric springs for sensor connection

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59230741A (ja) * 1983-06-15 1984-12-25 株式会社日立製作所 形状記憶複合材料
JP2533511B2 (ja) * 1987-01-19 1996-09-11 株式会社日立製作所 電子部品の接続構造とその製造方法
US4961709A (en) * 1989-02-13 1990-10-09 Burndy Corporation Vertical action contact spring
US5810609A (en) * 1995-08-28 1998-09-22 Tessera, Inc. Socket for engaging bump leads on a microelectronic device and methods therefor
US6354845B1 (en) * 2000-06-01 2002-03-12 Lucent Technologies Inc. Apparatus and method for connecting a plurality of electrical circuits borne upon a plurality of substrates
JP3440243B2 (ja) * 2000-09-26 2003-08-25 株式会社アドバンストシステムズジャパン スパイラルコンタクタ
JP4210049B2 (ja) 2001-09-04 2009-01-14 株式会社アドバンストシステムズジャパン スパイラル状接触子
JP3814231B2 (ja) 2002-06-10 2006-08-23 株式会社アドバンストシステムズジャパン スパイラルコンタクタ及びその製造方法、並びにそれを用いた半導体検査装置、及び電子部品

Also Published As

Publication number Publication date
KR100803958B1 (ko) 2008-02-15
US20050208796A1 (en) 2005-09-22
KR20060042141A (ko) 2006-05-12
JP2005268079A (ja) 2005-09-29
TW200534546A (en) 2005-10-16
US7080993B2 (en) 2006-07-25
CN100369335C (zh) 2008-02-13
CN1671009A (zh) 2005-09-21
TWI286868B (en) 2007-09-11

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