JP2007516591A - プリント回路基板アセンブリ - Google Patents
プリント回路基板アセンブリ Download PDFInfo
- Publication number
- JP2007516591A JP2007516591A JP2006518363A JP2006518363A JP2007516591A JP 2007516591 A JP2007516591 A JP 2007516591A JP 2006518363 A JP2006518363 A JP 2006518363A JP 2006518363 A JP2006518363 A JP 2006518363A JP 2007516591 A JP2007516591 A JP 2007516591A
- Authority
- JP
- Japan
- Prior art keywords
- pcb
- component
- clip member
- assembly
- secured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000002893 slag Substances 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 9
- 230000000712 assembly Effects 0.000 abstract description 2
- 238000000429 assembly Methods 0.000 abstract description 2
- JAYCNKDKIKZTAF-UHFFFAOYSA-N 1-chloro-2-(2-chlorophenyl)benzene Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1Cl JAYCNKDKIKZTAF-UHFFFAOYSA-N 0.000 description 33
- 101100084627 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) pcb-4 gene Proteins 0.000 description 33
- 241000237858 Gastropoda Species 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 239000011810 insulating material Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
- H05K9/0035—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids with retainers mounted beforehand on the PCB, e.g. clips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Details Of Aerials (AREA)
Abstract
Description
Claims (12)
- PCBと、前記PCB上に実装されたコンポーネントとを備え、前記PCBおよびコンポーネントが、固定手段によって互いに取り外し可能に固定されるプリント回路基板(PCB)アセンブリであって、前記固定手段が、前記PCBおよび前記コンポーネントの一方に固定された弾性的に柔軟でばねバイアス付与されたクリップ部材と、前記PCBおよび前記コンポーネントの他方に設けられた第一および第二の表面とを含み、前記PCBおよび前記コンポーネントが組み立て中に最初に押圧されると、前記第一の表面が、前記クリップ部材のバイアスに対して第一の方向に、前記クリップ部材をカム駆動して弾性的に曲げるように配設され、前記PCBおよび前記コンポーネントがさらに押圧されると、前記第二の表面が、前記バイアスによって、前記第一の方向とは反対の第二の方向に前記クリップ部材が移動できるように配設され、前記クリップ部材が、前記PCBおよび前記コンポーネントが分解しないようにするために、前記第二の表面でラッチ止めされることを特徴とする、アセンブリ。
- 前記クリップ部材が前記第二の表面に隣接した状態にばねバイアスされるように、前記PCBおよび前記コンポーネントが互いに固定される、請求項1に記載のアセンブリ。
- 前記PCBおよび前記コンポーネントが互いに隣接した状態にされると、前記第二の表面が、前記クリップ部材のばねバイアスが前記PCBおよび前記コンポーネントを互いの方へバイアスするような前記クリップ部材に対する角度で配置される、請求項2に記載のアセンブリ。
- 前記固定手段が、前記PCBおよび前記コンポーネントの一方に固定されたさらなる弾性的に柔軟でばねバイアス付与されたクリップ部材を含み、前記さらなるクリップ部材が、前記二つのクリップ部材のばねバイアスが、一般的に、互いに反対の方向に作用するような位置にある、請求項1から3のいずれか一項に記載のアセンブリ。
- 各クリップ部材のばねバイアスが、一般的に、他方のクリップ部材の方向に作用するように、前記クリップ部材が、実質的に互いに対向した位置に設けられる、請求項4に記載のアセンブリ。
- 前記または各クリップ部材が、前記PCBまたはコンポーネントの材料から切り取られた前記または各クリップ部材により、前記PCBおよび前記コンポーネントの一方に固定される、請求項1から5のいずれか一項に記載のアセンブリ。
- 前記または各クリップ部材が、前記コンポーネントに固定され、前記PCB上に前記第一および第二の表面が設けられる、請求項1から6のいずれか一項に記載のアセンブリ。
- 前記コンポーネントが、無線周波数干渉シールドである、請求項1から7のいずれか一項に記載のアセンブリ。
- 前記第一および第二の表面が、前記PCBおよび前記コンポーネントとは元々別個のものであるスラグに設けられる、請求項1から8のいずれか一項に記載のアセンブリ。
- PCBと、前記PCB上に実装されたコンポーネントとを備え、前記PCBおよびコンポーネントが、固定手段によって互いに取り外し可能に固定されるプリント回路基板(PCB)アセンブリであって、前記固定手段が、前記PCBおよび前記コンポーネントの一方に固定された弾性的に柔軟でばねバイアス付与されたクリップ部材と、前記PCBおよび前記コンポーネントの他方に固定され、前記PCBおよび前記コンポーネントとは元々別個である少なくとも一つのスラグとを含むことを特徴とする、アセンブリ。
- 前記スラグの長手軸に対して垂直に切り取られた前記スラグの断面の形状が、四角形、五角形、六角形、七角形、または八角形である、請求項10に記載のアセンブリ。
- 添付の図面を参照して記述し図示した、請求項1から11に記載のアセンブリ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0316364A GB2404089B (en) | 2003-07-11 | 2003-07-11 | Printed circuit board assembly |
PCT/GB2004/002977 WO2005009099A1 (en) | 2003-07-11 | 2004-07-09 | Printed circuit board assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007516591A true JP2007516591A (ja) | 2007-06-21 |
JP2007516591A5 JP2007516591A5 (ja) | 2010-01-07 |
Family
ID=27742074
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006518363A Ceased JP2007516591A (ja) | 2003-07-11 | 2004-07-09 | プリント回路基板アセンブリ |
Country Status (6)
Country | Link |
---|---|
US (1) | US20070035938A1 (ja) |
EP (1) | EP1645175A1 (ja) |
JP (1) | JP2007516591A (ja) |
CN (1) | CN1836476A (ja) |
GB (1) | GB2404089B (ja) |
WO (1) | WO2005009099A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012046965A2 (ko) * | 2010-10-06 | 2012-04-12 | 주식회사 케이티엑스 | 전자파 차단용 쉴드캔 고정용 클립 |
JP2012178537A (ja) * | 2011-02-25 | 2012-09-13 | Joinset Co Ltd | 電磁波遮蔽用シールドケース |
KR101307779B1 (ko) * | 2012-01-03 | 2013-09-12 | 정한순 | 쉴드캔 클립 |
WO2019164190A1 (ko) * | 2018-02-21 | 2019-08-29 | 삼성전자 주식회사 | 쉴드 캔 구조를 구비한 전자 장치 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2426633A (en) * | 2005-05-27 | 2006-11-29 | Arka Technologies Ltd | Component securing means |
US7855983B2 (en) | 2006-06-14 | 2010-12-21 | Cts Corporation | Time division duplex front end module |
EP2050197A1 (en) * | 2006-07-07 | 2009-04-22 | CTS Corporation | RF Rx FRONT END MODULE FOR PICOCELL AND MICROCELL BASE STATION TRANSCEIVERS |
JP6127724B2 (ja) * | 2013-05-29 | 2017-05-17 | 北川工業株式会社 | 導電性クリップ |
CN203722975U (zh) * | 2013-11-19 | 2014-07-16 | 中兴通讯股份有限公司 | 一种移动终端散热装置和屏蔽罩架 |
US20160057897A1 (en) * | 2014-08-22 | 2016-02-25 | Apple Inc. | Shielding Can With Internal Magnetic Shielding Layer |
AU2016100745B4 (en) | 2016-05-24 | 2019-02-21 | Stm Management Pty Ltd | A case for a tablet shaped device and a method for making a case for a tablet shaped device. |
CN206559732U (zh) * | 2017-01-24 | 2017-10-13 | 深圳视爵光旭电子有限公司 | 一种用于弯曲板材的装置及led模组 |
FR3076172B1 (fr) | 2017-12-21 | 2019-11-22 | Continental Automotive France | Dispositif electronique pour la determination de la position angulaire d'un arbre d'un vehicule automobile |
DE102018125216B3 (de) * | 2018-10-11 | 2020-02-06 | Neotech AMT GmbH | Verfahren zur Vorbereitung der automatisierten Herstellung einer Elektronikkomponente, Verfahren zur automatisierten Herstellung und/oder zum automatisierten Nachbearbeiten einer Elektronikkomponente, Recheneinrichtung, Computerprogramm und elektronisch lesbarer Datenträger |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58148990U (ja) * | 1982-03-31 | 1983-10-06 | 日本電気株式会社 | 電気回路機器のシ−ルドケ−ス |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4433886A (en) * | 1981-12-17 | 1984-02-28 | Elco Corporation | Connector mounting for integrated circuit chip packages |
US4575038A (en) * | 1984-07-02 | 1986-03-11 | Thermalloy Incorporated | Spring clip fastener for mounting of printed circuit board components |
DE3515564A1 (de) * | 1985-04-30 | 1986-10-30 | RIA electronic Albert Metz, 7712 Blumberg | Mehrpolige elektrische anschlussklemme |
US5640762A (en) * | 1988-09-30 | 1997-06-24 | Micron Technology, Inc. | Method and apparatus for manufacturing known good semiconductor die |
US5117330A (en) * | 1990-04-09 | 1992-05-26 | Hewlett-Packard Company | Fixture for circuit components |
US5199879A (en) * | 1992-02-24 | 1993-04-06 | International Business Machines Corporation | Electrical assembly with flexible circuit |
JPH05347491A (ja) * | 1992-06-16 | 1993-12-27 | Matsushita Electric Ind Co Ltd | プリント基板装置 |
GB2295927A (en) * | 1994-12-08 | 1996-06-12 | Gareth Rhys Baron | Mounting of an integrated circuit on a printed circuit board |
EP0735616A3 (de) * | 1995-03-31 | 1997-03-19 | Wieland Elektrische Industrie | Elektrischer Steckverbinder insbesondere für Leiterplatten |
DE69507462T2 (de) * | 1995-07-21 | 1999-07-08 | Molex Inc | Abschirmdeckel mit zugehörigem Abschirmverfahren |
JPH0951182A (ja) * | 1995-08-09 | 1997-02-18 | Mitsubishi Electric Corp | 部品の取付装置 |
US5633786A (en) * | 1995-08-21 | 1997-05-27 | Motorola | Shield assembly and method of shielding suitable for use in a communication device |
DE29705621U1 (de) * | 1997-03-27 | 1997-05-15 | Siemens AG, 80333 München | Vorrichtung zum Befestigen eines Schirmdeckels |
JPH1117305A (ja) * | 1997-06-27 | 1999-01-22 | Sony Corp | プリント配線基板 |
US6051781A (en) * | 1997-09-24 | 2000-04-18 | Autosplice, Inc. | Surface mount electromagnetic frequency interference shield clip |
US6136131A (en) * | 1998-06-02 | 2000-10-24 | Instrument Specialties Company, Inc. | Method of shielding and obtaining access to a component on a printed circuit board |
US6274808B1 (en) * | 1999-05-06 | 2001-08-14 | Lucent Technologies, Inc. | EMI shielding enclosure |
CA2302925C (en) * | 1999-06-07 | 2009-05-19 | Ekstrom Industries, Inc. | Watthour meter socket adapter with circuit board mounts |
US6320121B1 (en) * | 1999-09-14 | 2001-11-20 | Lucent Technologies Inc. | Radio frequency shield can cover with internal fingers |
US6222734B1 (en) * | 1999-11-29 | 2001-04-24 | Intel Corporation | Clamping heat sinks to circuit boards over processors |
TW477516U (en) * | 2000-04-18 | 2002-02-21 | Hon Hai Prec Ind Co Ltd | Shielding structure of electronic device |
US6424537B1 (en) * | 2000-10-18 | 2002-07-23 | Compaq Computer Corporation | Mounting system for circuit board |
US20020129971A1 (en) * | 2001-03-19 | 2002-09-19 | Kolb Lowell E. | Filler material and pretreatment of printed circuit board components to facilitate application of a conformal EMI shield |
US20020185294A1 (en) * | 2001-04-27 | 2002-12-12 | Anatoliy Shlyakhtichman | Push-fit shield and method for fabricating same |
US6949706B2 (en) * | 2001-09-28 | 2005-09-27 | Siemens Information And Communication Mobile, Llc | Radio frequency shield for electronic equipment |
US20040075982A1 (en) * | 2002-10-21 | 2004-04-22 | Kim David K. | Heat sink frame with improved electromagnetic interference (EMI) suppression characteristics |
US7095626B2 (en) * | 2003-05-29 | 2006-08-22 | Interplex Nas Inc. | Openable one-piece electrical RF shield and method of manufacturing the same |
US7087835B2 (en) * | 2004-10-19 | 2006-08-08 | Bi-Link Metal Specialties Inc. | Apparatus and method for shielding printed circuit boards |
-
2003
- 2003-07-11 GB GB0316364A patent/GB2404089B/en not_active Expired - Fee Related
-
2004
- 2004-07-09 CN CNA2004800198943A patent/CN1836476A/zh active Pending
- 2004-07-09 US US10/564,196 patent/US20070035938A1/en not_active Abandoned
- 2004-07-09 WO PCT/GB2004/002977 patent/WO2005009099A1/en active Application Filing
- 2004-07-09 JP JP2006518363A patent/JP2007516591A/ja not_active Ceased
- 2004-07-09 EP EP04743318A patent/EP1645175A1/en not_active Withdrawn
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58148990U (ja) * | 1982-03-31 | 1983-10-06 | 日本電気株式会社 | 電気回路機器のシ−ルドケ−ス |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012046965A2 (ko) * | 2010-10-06 | 2012-04-12 | 주식회사 케이티엑스 | 전자파 차단용 쉴드캔 고정용 클립 |
WO2012046965A3 (ko) * | 2010-10-06 | 2012-06-07 | 주식회사 케이티엑스 | 전자파 차단용 쉴드캔 고정용 클립 |
KR101169955B1 (ko) * | 2010-10-06 | 2012-09-19 | (주)케이티엑스 | 전자파 차단용 쉴드캔 고정용 클립 |
JP2012178537A (ja) * | 2011-02-25 | 2012-09-13 | Joinset Co Ltd | 電磁波遮蔽用シールドケース |
KR101307779B1 (ko) * | 2012-01-03 | 2013-09-12 | 정한순 | 쉴드캔 클립 |
WO2019164190A1 (ko) * | 2018-02-21 | 2019-08-29 | 삼성전자 주식회사 | 쉴드 캔 구조를 구비한 전자 장치 |
US11076512B2 (en) | 2018-02-21 | 2021-07-27 | Samsung Electronics Co., Ltd. | Electronic device having shield can structure |
Also Published As
Publication number | Publication date |
---|---|
EP1645175A1 (en) | 2006-04-12 |
GB0316364D0 (en) | 2003-08-13 |
GB2404089A (en) | 2005-01-19 |
GB2404089B (en) | 2007-05-02 |
CN1836476A (zh) | 2006-09-20 |
WO2005009099A1 (en) | 2005-01-27 |
US20070035938A1 (en) | 2007-02-15 |
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