TWI286868B - Spiral contactor, contact sheet having spiral contactor, and connecting device having contact sheet - Google Patents
Spiral contactor, contact sheet having spiral contactor, and connecting device having contact sheet Download PDFInfo
- Publication number
- TWI286868B TWI286868B TW094108224A TW94108224A TWI286868B TW I286868 B TWI286868 B TW I286868B TW 094108224 A TW094108224 A TW 094108224A TW 94108224 A TW94108224 A TW 94108224A TW I286868 B TWI286868 B TW I286868B
- Authority
- TW
- Taiwan
- Prior art keywords
- spiral
- spiral contact
- contact
- support
- start end
- Prior art date
Links
- 238000004804 winding Methods 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 16
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 230000009466 transformation Effects 0.000 abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 238000007747 plating Methods 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000034303 cell budding Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 239000000077 insect repellent Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
- H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/04—Pins or blades for co-operation with sockets
- H01R13/05—Resilient pins or blades
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Connecting Device With Holders (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004079745A JP3877735B2 (ja) | 2004-03-19 | 2004-03-19 | 接続装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200534546A TW200534546A (en) | 2005-10-16 |
| TWI286868B true TWI286868B (en) | 2007-09-11 |
Family
ID=34986940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094108224A TWI286868B (en) | 2004-03-19 | 2005-03-17 | Spiral contactor, contact sheet having spiral contactor, and connecting device having contact sheet |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7080993B2 (enExample) |
| JP (1) | JP3877735B2 (enExample) |
| KR (1) | KR100803958B1 (enExample) |
| CN (1) | CN100369335C (enExample) |
| TW (1) | TWI286868B (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006100746A1 (ja) * | 2005-03-18 | 2006-09-28 | Fujitsu Limited | 電子部品および回路基板 |
| JP4528657B2 (ja) * | 2005-03-23 | 2010-08-18 | アルプス電気株式会社 | 接点部材及びその製造方法 |
| JP4644762B2 (ja) * | 2005-11-01 | 2011-03-02 | 株式会社アドバンストシステムズジャパン | スパイラル状接触子およびその製造方法 |
| US7322831B1 (en) * | 2006-07-18 | 2008-01-29 | Cheng Uei Precision Industry Co., Ltd. | Matrix board-to-board connector |
| TW200903912A (en) | 2007-03-13 | 2009-01-16 | Alps Electric Co Ltd | Contact sheet and connection device having same |
| JP2010211940A (ja) * | 2009-03-06 | 2010-09-24 | Alps Electric Co Ltd | 弾性接触素子 |
| CN106785540A (zh) * | 2017-01-19 | 2017-05-31 | 启东乾朔电子有限公司 | 电子卡连接器及其导电端子 |
| US10270193B1 (en) * | 2017-12-18 | 2019-04-23 | Continental Automotive Systems, Inc. | Concentric springs for sensor connection |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59230741A (ja) * | 1983-06-15 | 1984-12-25 | 株式会社日立製作所 | 形状記憶複合材料 |
| JP2533511B2 (ja) * | 1987-01-19 | 1996-09-11 | 株式会社日立製作所 | 電子部品の接続構造とその製造方法 |
| US4961709A (en) * | 1989-02-13 | 1990-10-09 | Burndy Corporation | Vertical action contact spring |
| US5810609A (en) * | 1995-08-28 | 1998-09-22 | Tessera, Inc. | Socket for engaging bump leads on a microelectronic device and methods therefor |
| US6354845B1 (en) * | 2000-06-01 | 2002-03-12 | Lucent Technologies Inc. | Apparatus and method for connecting a plurality of electrical circuits borne upon a plurality of substrates |
| JP3440243B2 (ja) * | 2000-09-26 | 2003-08-25 | 株式会社アドバンストシステムズジャパン | スパイラルコンタクタ |
| JP4210049B2 (ja) | 2001-09-04 | 2009-01-14 | 株式会社アドバンストシステムズジャパン | スパイラル状接触子 |
| JP3814231B2 (ja) | 2002-06-10 | 2006-08-23 | 株式会社アドバンストシステムズジャパン | スパイラルコンタクタ及びその製造方法、並びにそれを用いた半導体検査装置、及び電子部品 |
-
2004
- 2004-03-19 JP JP2004079745A patent/JP3877735B2/ja not_active Expired - Fee Related
-
2005
- 2005-02-24 KR KR1020050015361A patent/KR100803958B1/ko not_active Expired - Fee Related
- 2005-03-09 US US11/077,277 patent/US7080993B2/en not_active Expired - Fee Related
- 2005-03-11 CN CNB200510054764XA patent/CN100369335C/zh not_active Expired - Fee Related
- 2005-03-17 TW TW094108224A patent/TWI286868B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR100803958B1 (ko) | 2008-02-15 |
| JP3877735B2 (ja) | 2007-02-07 |
| US20050208796A1 (en) | 2005-09-22 |
| KR20060042141A (ko) | 2006-05-12 |
| JP2005268079A (ja) | 2005-09-29 |
| TW200534546A (en) | 2005-10-16 |
| US7080993B2 (en) | 2006-07-25 |
| CN100369335C (zh) | 2008-02-13 |
| CN1671009A (zh) | 2005-09-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |