JP3858927B2 - 半導体圧力センサ装置 - Google Patents
半導体圧力センサ装置 Download PDFInfo
- Publication number
- JP3858927B2 JP3858927B2 JP2005098679A JP2005098679A JP3858927B2 JP 3858927 B2 JP3858927 B2 JP 3858927B2 JP 2005098679 A JP2005098679 A JP 2005098679A JP 2005098679 A JP2005098679 A JP 2005098679A JP 3858927 B2 JP3858927 B2 JP 3858927B2
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- Prior art keywords
- protective member
- sensor chip
- protective
- sensor device
- gasoline
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Description
図1は、本実施形態に係るフル充填構造を有するセンサ装置100を要部で切断した状態の縦断面図であり、図2は、同センサ装置100の概略的な平面図である。
上記第1実施形態は、フル充填構造のセンサ装置において保護部材7を1種類の材料(フッ素系ゲル)より構成したものであるが、本第2実施形態は、架橋密度を異ならせることで互いにヤング率を異ならせた2種類の材料により保護部材7を構成したところが上記第1実施形態と相違する。なお、上記第1実施形態と同一部分には図中、同一符号を付して説明を簡略化する。
本第3実施形態は上記第1実施形態を変形したものであり、保護部材7と保護部材7によって被覆される被覆部との間に、保護部材7と当該被覆部との密着性を向上させるための密着膜を介在させた構成としたものである。本実施形態においても、上記第1実施形態と同一部分には図中、同一符号を付して説明を簡略化する。
ところで、上記各実施形態はフル充填構造であったが、本発明の保護部材による被覆形態は部分充填構造であってもよい。部分充填構造では保護部材7を薄く形成可能なため、基本的には気泡発生の可能性は低いが、この部分充填構造に上記第1実施形態と同様の保護部材7を適用しても何ら構わない。
なお、本発明は上記実施形態に限定されるものではなく、次のような変形または拡張が可能である。まず、センサチップとしては、ピエゾ抵抗効果を利用したダイヤフラム形式のものに限らず、静電容量式の半導体センサチップなど、他の形式のものを利用しても良い。また、樹脂パッケージ1にセンサチップ2をマウントするための凹部3を設けたが、このような凹部3は必要に応じて設ければよい。
6…ボンディングワイヤ、7…保護部材、7a…第1の保護部材、
7b…第2の保護部材、10…有機薄膜、11…プライマー。
Claims (3)
- 圧力を検出してその検出値に応じたレベルの電気信号を発生する半導体よりなるセンサチップ(2)と、
前記センサチップに接続されたボンディングワイヤ(6)とを備える半導体圧力センサ装置において、
電気的な絶縁性を有し、前記センサチップのセンシング部を露出させた状態で少なくとも前記導体部及びその周辺部を覆うように設けられた第1の保護部材(7a)と、
電気的な絶縁性を有し且つヤング率が前記第1の保護部材よりも低いものとして構成され、前記センサチップの前記センシング部を覆うように設けられた第2の保護部材(7b)とを備え、
前記ボンディングワイヤは前記第1及び第2の保護部材により被覆保護されており、
更に、第1の保護部材と第2の保護部材との間に、第1の保護部材と第2の保護部材との中間の硬さを持つ第3の層を有し、
前記第1及び第2の保護部材は、20℃のガソリンに浸漬されたときの飽和膨潤率が7重量%以下のものであることを特徴とする半導体圧力センサ装置。 - 前記第1の保護部材(7a)はフッ素系のゴム材料よりなり、前記第2の保護部材(7b)はフッ素系のゲル材料よりなることを特徴とする請求項1に記載の半導体圧力センサ装置。
- 前記第3の層は、20℃のガソリンに浸漬されたときの飽和膨潤率が7重量%以下のものであることを特徴とする請求項1又は請求項2に記載の半導体圧力センサ装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005098679A JP3858927B2 (ja) | 1999-09-17 | 2005-03-30 | 半導体圧力センサ装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26432899 | 1999-09-17 | ||
JP2005098679A JP3858927B2 (ja) | 1999-09-17 | 2005-03-30 | 半導体圧力センサ装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000271889A Division JP3858577B2 (ja) | 1999-09-17 | 2000-09-07 | 半導体圧力センサ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005283587A JP2005283587A (ja) | 2005-10-13 |
JP3858927B2 true JP3858927B2 (ja) | 2006-12-20 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005098679A Expired - Lifetime JP3858927B2 (ja) | 1999-09-17 | 2005-03-30 | 半導体圧力センサ装置 |
Country Status (1)
Country | Link |
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JP (1) | JP3858927B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013029376A (ja) * | 2011-07-27 | 2013-02-07 | Denso Corp | 圧力センサ |
JP5884921B2 (ja) * | 2012-11-30 | 2016-03-15 | 富士電機株式会社 | 圧力センサ装置および圧力センサ装置の製造方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009250651A (ja) * | 2008-04-02 | 2009-10-29 | Denso Corp | 圧力センサ |
US9705069B2 (en) | 2013-10-31 | 2017-07-11 | Seiko Epson Corporation | Sensor device, force detecting device, robot, electronic component conveying apparatus, electronic component inspecting apparatus, and component machining apparatus |
JP5983592B2 (ja) | 2013-12-16 | 2016-08-31 | 株式会社デンソー | 車両用圧力検出装置 |
-
2005
- 2005-03-30 JP JP2005098679A patent/JP3858927B2/ja not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013029376A (ja) * | 2011-07-27 | 2013-02-07 | Denso Corp | 圧力センサ |
JP5884921B2 (ja) * | 2012-11-30 | 2016-03-15 | 富士電機株式会社 | 圧力センサ装置および圧力センサ装置の製造方法 |
Also Published As
Publication number | Publication date |
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JP2005283587A (ja) | 2005-10-13 |
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