JP3858043B2 - プラズマ処理装置 - Google Patents

プラズマ処理装置 Download PDF

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Publication number
JP3858043B2
JP3858043B2 JP2005240542A JP2005240542A JP3858043B2 JP 3858043 B2 JP3858043 B2 JP 3858043B2 JP 2005240542 A JP2005240542 A JP 2005240542A JP 2005240542 A JP2005240542 A JP 2005240542A JP 3858043 B2 JP3858043 B2 JP 3858043B2
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JP
Japan
Prior art keywords
electrode
metal member
solid dielectric
dielectric plate
plasma processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005240542A
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English (en)
Japanese (ja)
Other versions
JP2006128078A5 (enExample
JP2006128078A (ja
Inventor
稔公 武内
節男 中嶋
直道 斎藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2005240542A priority Critical patent/JP3858043B2/ja
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to EP05785311A priority patent/EP1796442B1/en
Priority to CN2005800318901A priority patent/CN101023713B/zh
Priority to CN2005800318920A priority patent/CN101023714B/zh
Priority to PCT/JP2005/017251 priority patent/WO2006035628A1/ja
Priority to US11/664,133 priority patent/US7886689B2/en
Priority to PCT/JP2005/017252 priority patent/WO2006035629A1/ja
Priority to DE602005024702T priority patent/DE602005024702D1/de
Priority to KR1020077009562A priority patent/KR101020463B1/ko
Priority to US11/663,983 priority patent/US7886688B2/en
Priority to KR1020077009447A priority patent/KR101020411B1/ko
Priority to TW094132666A priority patent/TWI291203B/zh
Priority to TW094132660A priority patent/TW200623972A/zh
Publication of JP2006128078A publication Critical patent/JP2006128078A/ja
Publication of JP2006128078A5 publication Critical patent/JP2006128078A5/ja
Application granted granted Critical
Publication of JP3858043B2 publication Critical patent/JP3858043B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
JP2005240542A 2004-09-29 2005-08-23 プラズマ処理装置 Expired - Fee Related JP3858043B2 (ja)

Priority Applications (13)

Application Number Priority Date Filing Date Title
JP2005240542A JP3858043B2 (ja) 2004-09-29 2005-08-23 プラズマ処理装置
KR1020077009447A KR101020411B1 (ko) 2004-09-29 2005-09-20 플라즈마 처리 장치
CN2005800318920A CN101023714B (zh) 2004-09-29 2005-09-20 等离子加工设备
PCT/JP2005/017251 WO2006035628A1 (ja) 2004-09-29 2005-09-20 プラズマ処理装置
US11/664,133 US7886689B2 (en) 2004-09-29 2005-09-20 Plasma processing apparatus
PCT/JP2005/017252 WO2006035629A1 (ja) 2004-09-29 2005-09-20 プラズマ処理装置
DE602005024702T DE602005024702D1 (de) 2004-09-29 2005-09-20 Plasmaverarbeitungssystem
KR1020077009562A KR101020463B1 (ko) 2004-09-29 2005-09-20 플라즈마 처리 장치
EP05785311A EP1796442B1 (en) 2004-09-29 2005-09-20 Plasma processing system
CN2005800318901A CN101023713B (zh) 2004-09-29 2005-09-20 等离子加工设备
US11/663,983 US7886688B2 (en) 2004-09-29 2005-09-20 Plasma processing apparatus
TW094132666A TWI291203B (en) 2004-09-29 2005-09-21 Plasma processing apparatus
TW094132660A TW200623972A (en) 2004-09-29 2005-09-21 Plasma treatment device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004285506 2004-09-29
JP2005240542A JP3858043B2 (ja) 2004-09-29 2005-08-23 プラズマ処理装置

Publications (3)

Publication Number Publication Date
JP2006128078A JP2006128078A (ja) 2006-05-18
JP2006128078A5 JP2006128078A5 (enExample) 2006-07-27
JP3858043B2 true JP3858043B2 (ja) 2006-12-13

Family

ID=36722547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005240542A Expired - Fee Related JP3858043B2 (ja) 2004-09-29 2005-08-23 プラズマ処理装置

Country Status (1)

Country Link
JP (1) JP3858043B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007250426A (ja) * 2006-03-17 2007-09-27 Sharp Corp プラズマ処理装置の電極構造およびこれを備えたプラズマ処理装置
JP4820241B2 (ja) * 2006-08-29 2011-11-24 株式会社ケーヒン 配線基板収納構造
JP2008153065A (ja) * 2006-12-18 2008-07-03 Sekisui Chem Co Ltd プラズマ処理装置

Also Published As

Publication number Publication date
JP2006128078A (ja) 2006-05-18

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