JP3831726B2 - Non-contact type IC card manufacturing method - Google Patents

Description

  The present invention provides a non-contact type IC card that includes a flat coil and a semiconductor element, and manufactures a non-contact type IC card in which a terminal portion of the flat coil and an electrode terminal of the semiconductor element are electrically connected. Regarding the method.

The configuration of a conventional non-contact type IC card 50 will be described with reference to FIG.
The planar coil 52 is formed into a rectangular spiral shape by etching or the like on a metal foil (for example, copper foil) formed on one surface of an insulating resin thin film body 54 such as a resin film. It is manufactured by printing a conductive paste on one surface of 54 and forming it in a spiral shape by drying. Both end portions of the planar coil 52 become terminal portions 52a.
The semiconductor element 56 has two electrode terminals 58 protruding from one surface thereof, which are connected to the terminal portions 52a of the planar coil 52.

As shown in FIG. 7, the semiconductor element 56 has an insulating resin thin film so that the two electrode terminals 58 straddle part of the planar coil 52 and each electrode terminal 58 is positioned on each terminal portion 52 a of the planar coil 52. It is positioned and attached to one surface of the body 54.
Specifically, as shown in FIG. 8, the semiconductor element 56 is fixed by being crimped to the insulating resin thin film 54 via the anisotropic conductive film 60. Thus, a conductive path is formed between the protruding electrode terminal 58 and the terminal portion 52a facing the electrode terminal 58, and the electrode terminal 58 of the semiconductor element 56 and the terminal portion 52a of the planar coil 52 are electrically connected. The

  Then, a resin oversheet 62 having an adhesive layer 61 formed on one side is attached to the insulating resin thin film body 54 on which the planar coil 52 and the semiconductor element 56 are disposed, and the oversheet 62 is heated and heated. The contactless IC card 50 having the structure shown in FIG.

Further, in recent years, the semiconductor element 56 has been miniaturized, and accordingly, the distance between the pair of electrode terminals 58 formed in the semiconductor element 56 has been narrowed. In this case, as described above, The semiconductor element 56 cannot be disposed across the planar coil 52 so that the electrode terminals 58 are located inside and outside the planar coil 52.
For this reason, as shown in FIGS. 9 and 10, one terminal portion 52 a (for example, the inner terminal portion 52 a) of the planar coil 52 is placed outside the planar coil 52 via the other surface side of the insulating resin thin film body 54. And a structure in which the other terminal portion 52a is arranged close to the other terminal portion 52a has been proposed.
Thereby, even if it is the semiconductor element 56 where the space | interval of the electrode terminals 58 is narrow, the semiconductor element 56 is arrange | positioned in the position which does not overlap with the planar coil 52 of one surface of the insulating resin thin film body 54, and the planar coil 52 is arranged. The electrode terminal 58 can be electrically connected to the terminal portion 52a of the planar coil 52 by using the same mounting structure as in the above example without straddling.

  However, in the structure shown in FIGS. 9 and 10, it is necessary to form a metal foil on both surfaces of the insulating resin thin film 54 and etch it to form a lead wiring pattern 64 in addition to the planar coil 52. Since it is necessary to form a through hole 66 that electrically connects the planar coil 52 formed on the surface of the lead coil 52 and the lead-out wiring pattern 64 formed on the other surface, the number of manufacturing processes is increased, and metal foil is provided on both surfaces. Since it is necessary to use the pasted insulating resin thin film body, there is a problem that the material cost is increased and the product cost is increased.

  Accordingly, the present invention has been made to solve the above-mentioned problems, and the object of the present invention is to achieve a small and gap between electrode terminals without forming a wiring pattern on the back side of the plane coil forming surface of the insulating resin thin film body. It is an object of the present invention to provide a method for manufacturing a non-contact type IC card to which a semiconductor element having a narrow width can be attached.

According to the non-contact type IC card manufacturing method of the present invention, the planar coil and the semiconductor element are arranged on one surface of the insulating resin thin film body, and the terminal portion of the planar coil and the electrode terminal of the semiconductor element are In a non-contact type IC card manufacturing method for manufacturing an electrically connected non-contact type IC card, a flat coil forming step of forming a flat coil on one surface of an insulating resin thin film body, and both terminal portions of the flat coil Are exposed to the other surface of the insulating resin thin film body, and both electrode terminals of the semiconductor element disposed on one surface of the insulating resin thin film body are connected to the other side of the insulating resin thin film body. The third through hole and the fourth through hole exposed on the surface side are formed in the insulating resin thin film body, and the semiconductor element in which bumps are formed on both electrode terminals are formed in the third through hole and in the fourth. In the through hole A semiconductor element affixing step for adhering and fixing to one surface of the insulating resin thin film body, and a wiring pattern for electrically connecting the terminal portion of the planar coil and the electrode terminal of the semiconductor element. And applying the conductive paste to the other surface of the insulating resin thin film body, filling the conductive paste in the first through hole, the second through hole, the third through hole, and the fourth through hole; A paste drying step of drying the conductive paste, and a card forming step of mounting a resin oversheet on both sides of the insulating resin thin film body on which the planar coil and the semiconductor element are arranged.

According to the method for manufacturing a non-contact type IC card according to claim 2, the planar coil is disposed on one surface of the insulating resin thin film body, the semiconductor element is disposed on the other surface of the insulating resin thin film body, In a non-contact type IC card manufacturing method for manufacturing a non-contact type IC card in which a terminal portion of a flat coil and an electrode terminal of the semiconductor element are electrically connected, a flat coil is provided on one surface of an insulating resin thin film body. A planar coil forming step to be formed, and a third through hole and a fourth through hole that expose both electrode terminals of the semiconductor element disposed on the other surface of the insulating resin thin film body on one surface side of the insulating resin thin film body, A hole forming step in the insulating resin thin film body and a semiconductor element having bumps formed on both electrode terminals are formed on the other surface of the insulating resin thin film body so that each bump is positioned in the third through hole and the fourth through hole. Paste and fix The step of attaching the semiconductor element, the step of disposing an insulator so as to cover the planar coil at the site where the wiring pattern is formed across the planar coil, and the electrical connection between the terminal portion of the planar coil and the electrode terminal of the semiconductor element The conductive paste is applied to one surface of the insulating resin thin film body through the surface of the insulator at a portion crossing the planar coil so as to form a wiring pattern to be connected to the plane coil, and in the third through hole And a step of filling a conductive paste in the fourth through hole, a paste drying step of drying the conductive paste, and an insulating resin thin film body in which the planar coil and the semiconductor element are disposed, and a resin oversheet from both sides thereof And a card forming process for mounting the card.
Specifically, the surface of the planar coil that the wiring pattern crosses is covered with an insulator, and the wiring pattern is formed on the insulator.

Further, the planar coil may be formed by etching a metal foil attached to one surface of the insulating resin thin film body.
Furthermore, after performing the said drilling process, it is good also as performing the surface treatment process which forms a gold plating film on the surface of both the terminal parts of the planar coil exposed from the said 1st through-hole and a 2nd through-hole. . Thereby, the adhesiveness to the terminal part of an electrically conductive paste improves.

3. The method of manufacturing a non-contact type IC card according to claim 2, wherein the planar coil is formed by etching a metal foil attached to one surface of an insulating resin thin film body.
Furthermore, in the manufacturing method of the non-contact type IC card according to claim 5, a surface treatment step of forming a gold plating film on the surfaces of both terminal portions of the planar coil is performed after the punching step is performed. Also good. Thereby, the adhesiveness to the terminal part of an electrically conductive paste improves.

The planar coil may be formed by printing a conductive paste on one surface of the insulating resin thin film .

  According to the method of manufacturing a non-contact type IC card according to the present invention, a small semiconductor element having a narrow gap between electrode terminals can be formed without forming a wiring pattern on the back side of the plane coil forming surface of the insulating resin thin film body. Can be attached. For this reason, for example, it is not necessary to use an insulating resin thin film body in which copper foils are attached to both surfaces, the manufacturing cost can be reduced, and the product cost can be reduced.

Preferred embodiments of a method for producing a non-contact IC card according to the present invention will be described below in detail with reference to the accompanying drawings. In addition, the same code | symbol is attached | subjected about the same structure as a prior art example, and detailed description is abbreviate | omitted.
(First embodiment)
The structure of the non-contact type IC card 10 will be described. In addition, the same code | symbol is attached | subjected about the same structure as a prior art example, and detailed description is abbreviate | omitted.
First, an outline of the same configuration as the non-contact type IC card 50 described in the conventional example among the configurations of the non-contact type IC card 10 will be described with reference to FIG.
The planar coil 52 is formed on the surface of the insulating resin thin film body 54, and the semiconductor element 56 is similarly electrically connected to the surface of the insulating resin thin film body 54 with the electrode terminals 58 and the terminal portions 52 a of the planar coil 52. The semiconductor element 56, the planar coil 52, and the insulating resin thin film body 54 are integrally formed by being covered with an oversheet 62 attached from both sides of the insulating resin thin film body 54.

Next, an electrical connection structure between the planar coil 52 and the semiconductor element 56, which is a characteristic part of the non-contact type IC card 10 according to the present invention and is different from the conventional example, will be described.
In the present embodiment, as shown in FIGS. 1 and 2, the planar coil 52 and the semiconductor element 56 are disposed on the same surface of the insulating resin thin film body 54.
Specifically, the planar coil 52 is disposed on one surface (the lower surface in FIGS. 1 and 2) of the insulating resin thin film body 54, and similarly, the semiconductor element 56 is disposed on one surface of the insulating resin thin film body 54. .

The connection structure between the terminal portion 52a of the planar coil 52 and the electrode terminal 58 of the semiconductor element 56 is such that the terminal portion 52a of the planar coil 52 and the electrode terminal 58 of the semiconductor element 56 are connected to the other surface of the insulating resin thin film body 54. Through-holes (14a and 14b, 14c and 14d) exposed to the side are formed, and both end portions are formed in the through-holes 14a to 14d on the other surface (the upper surface in FIGS. 1 and 2) of the insulating resin thin film body 54. By forming the two connection wiring patterns 12a and 12b formed by using a conductive paste that is filled and extends between the terminal portion 52a of the planar coil 52 and the electrode terminal 58 of the semiconductor element 56, Each terminal portion 52a of the planar coil 52 and each electrode terminal 58 of the semiconductor element 56 are electrically connected.
This eliminates the need to previously form the lead wiring pattern 64 by etching the metal foil in advance on the back side of the surface of the insulating resin thin film 54 on which the planar coil 52 is formed. Since it is not necessary to use the insulating resin thin film 54 to which the foil is attached, the product cost can be reduced.

  In order to improve the electrical connection with the conductive paste filled in the through holes 14c and 14d, in the case of the electrode terminal 58 of the semiconductor element 56, for example, as shown in FIG. Alternatively, the gold bumps 16 may be projected. Similarly, in the case of the terminal portion 52a of the planar coil 52, a surface treatment such as gold plating is performed on the surface of the terminal portion 52a exposed from the through holes 14a and 14b so that the gold plating film 18 is formed. Also good.

Next, a method for manufacturing the non-contact type IC card 10 will be described with reference to FIG.
First, the gold bump 16 is formed on the surface of the electrode terminal 58 on the semiconductor element 56 side. In addition, an insulating resin thin film body (for example, a PET substrate) 54 in which a metal foil, for example, a copper foil is attached to one surface (one surface) is prepared.
Next, the planar foil 52 is formed by etching the metal foil of the insulating resin thin film 54 (planar coil forming step).

  Next, the through holes 14a to 14e are formed in the insulating resin thin film 54 using a laser or the like (drilling step). As described above, the first through hole 14 a and the second through hole 14 b that expose the terminal portion 52 a of the planar coil 52 on the other surface side of the insulating resin thin film body 54 and the insulating resin thin film body 54 are formed in the through holes. There are a third through hole 14 c and a fourth through hole 14 d that expose the electrode terminal 58 of the semiconductor element 56 disposed on one surface to the other surface side of the insulating resin thin film body 54. The fifth through hole 14e is provided in a region of the semiconductor element 56 disposed on one surface of the insulating resin thin film body 54, and is used for injecting a fixing resin.

Next, the gold plating film 18 is formed on the surface of the terminal portion 52a of the planar coil 52 exposed from the first through hole 14a and the second through hole 14b (surface treatment step of the planar coil terminal portion).
Thereby, the adhesiveness to the terminal part 52a of an electrically conductive paste improves.
Next, the semiconductor element 56 having the bumps 16 formed on the electrode terminals 58 is attached to one surface of the insulating resin thin film body 54 so that the bumps 16 are located in the third through holes 14c and the fourth through holes 14d. Attach and fix (semiconductor element pasting step). In the pasting operation, the semiconductor element 56 is adhered to the insulating resin thin film body 54 by pouring an adhesive from the fifth through hole 14 e in a state where the semiconductor element 56 is in close contact with the insulating resin thin film body 54.

  Next, on the other surface of the insulating resin thin film 54, a conductive paste (for example, an epoxy resin containing a silver filler) is placed between the first through hole 14a and the third through hole 14c. The coating is preferably performed at the shortest distance between the second through hole 14b and the fourth through hole 14d (conductive paste printing step). At this time, the through holes 14a to 14d are filled with a conductive paste so that the conductive paste adheres well to the electrode terminal 58 and the terminal portion 52a. As a result, the conductive paste extends between the first through hole 14a and the third through hole 14c, and between the second through hole 14b and the fourth through hole 14d.

Next, the conductive paste is dried to form the wiring patterns 12 (12a and 12b). Thereby, the terminal part 52a of the planar coil 52 and the electrode terminal 58 of the semiconductor element 56 are electrically connected (paste drying process).
Next, as in the conventional example, a resin oversheet 62 having an adhesive layer 61 formed on one side is attached to the insulating resin thin film body 54 on which the planar coil 52 and the semiconductor element 56 are arranged from both sides. Is attached to the insulating resin thin film body 54 side, and the oversheet 62 is integrally formed by heating and pressing to form a non-contact type IC card 10 as shown in FIG. 6 (card forming process). .

(Second embodiment)
In the present embodiment, as shown in FIGS. 3 and 4, the planar coil 52 and the semiconductor element 56 are disposed on different surfaces of the insulating resin thin film body 54.
Specifically, the planar coil 52 is disposed on one surface of the insulating resin thin film body 54 (upper surface in FIGS. 3 and 4), and the semiconductor element 56 is disposed on the other surface of the insulating resin thin film body 54 (in FIGS. 3 and 4). (On the lower surface).

  The connection structure between the terminal portion 52a of the planar coil 52 and the electrode terminal 58 of the semiconductor element 56 is such that the insulating resin thin film body 54 has a third through hole 14c that exposes the electrode terminal 58 of the semiconductor element 56 on one surface. And the fourth through hole 14d, one end of the insulating resin thin film body 54 is filled in the through holes 14c and 14d, and the other end overlaps the terminal portion 52a of the planar coil 52 and is flat. Two wiring patterns 12 (12a, 12b) formed using a conductive paste extending between the terminal portion 52a of the coil 52 and the electrode terminal 58 of the semiconductor element 56 are formed. The terminal portion 52a and the electrode terminal 58 of the semiconductor element 56 are electrically connected.

In the present embodiment, since the wiring pattern 12 is formed on the same surface as the surface on which the planar coil 52 of the insulating resin thin film 54 is formed, one wiring pattern 12b crosses the planar coil 52. .
Therefore, it is necessary to electrically insulate the planar coil 52 and the wiring pattern 12b crossing the planar coil 52 from each other so as not to be short-circuited. Therefore, as shown in FIGS. 3 and 4, an insulator 20 formed of an insulating paste, an insulating resin sheet, or the like is interposed between the wiring pattern 12 b and the planar coil 52, and the wiring is formed on the insulator 20. The pattern 12b is formed.

  As a result, even in the case of the non-contact type IC card of the present embodiment, the wiring pattern is formed by etching the metal foil in advance on the back side of the surface on which the planar coil 52 of the insulating resin thin film body 54 is formed as in the prior art. There is no need to form the insulating resin thin film body 54, and the insulating resin thin film body 54 with the copper foil attached to both sides may not be used. For this reason, the product cost can be reduced.

Next, a method for manufacturing the non-contact type IC card 10 will be described. Since the basic flow of the manufacturing process is the same as that of the first embodiment described above, only the different process will be described with reference to FIG.
The planar coil forming process is the same as that in the first embodiment.
In the drilling process, only the third through hole 14c and the fourth through hole 14d that expose the electrode terminal 58 of the semiconductor element 56 and the fifth through hole 14e for fixing the semiconductor element 56 are formed.
In the surface treatment process of the terminal portion of the planar coil, the gold plating film 18 is formed on the entire surface of the terminal portion 52a of the planar coil 52.
In the semiconductor element pasting step, the semiconductor element 56 having the bumps 16 formed on the electrode terminals 58 is placed on the other side of the insulating resin thin film body 54 so that the bumps 16 are positioned in the third through holes 14c and the fourth through holes 14d. Affix to the surface of and fix.

Then, after the semiconductor element pasting step and before the conductive paste printing step, the insulator 20 is disposed so as to cover the planar coil 52 at the portion of the planar coil 52 that the wiring pattern 12b crosses. As an example, an insulating paste is applied and dried to form the insulator 20 (insulating paste printing step). It is also possible to bond the insulating sheet to the planar coil 52 to form the insulator 20.
The other processes from the conductive paste printing process to the card forming process are the same as those in the first embodiment. In the conductive paste printing step, the conductive paste that becomes the wiring pattern 12 b extends between the fourth through hole 14 d and the terminal portion 52 a of the planar coil 52 via the surface of the insulator 20. .

In the first embodiment and the second embodiment described above, the planar coil 52 can also be formed by printing a conductive paste.
In this case, since the wiring patterns 12a and 12b that electrically connect the planar coil 52 and the semiconductor element 56 are also formed of a conductive paste, the surface of the terminal portion 52a of the planar coil 52 that contacts the wiring patterns 12a and 12b. Even if processing (gold plating processing) is not performed, it is possible to sufficiently ensure electrical connection between them. Therefore, the surface treatment process of the terminal portion 52a of the planar coil 52 shown in FIG.

Further, in each of the above-described embodiments, the semiconductor element 56 is positioned and arranged in an area outside the planar coil 52 that does not overlap the planar coil 52. However, the outer shape of the non-contact type IC card 10 can be reduced in size. In this way, it can be arranged in the inner region of the planar coil 52.
Further, as the planar coil 52, a coil formed by pressing or etching a thin metal plate and bonded to the insulating resin thin film 54 can be used.

It is explanatory drawing (principal part top view) for demonstrating the structure of 1st Embodiment of a non-contact-type IC card. It is WW sectional drawing of FIG. It is explanatory drawing (principal part top view) for demonstrating the structure of 2nd Embodiment of a non-contact-type IC card. It is WW sectional drawing of FIG. It is process drawing for demonstrating the manufacturing method of FIG. (A) is a top view for demonstrating the structure of a non-contact-type IC card, (b) is the WW sectional drawing. It is a top view for demonstrating the structure of an example of the conventional non-contact-type IC card. It is WW sectional drawing of FIG. It is a top view for demonstrating the structure of the other example of the conventional non-contact-type IC card. It is WW sectional drawing of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Non-contact type IC card 12 Wiring pattern 14a-14e Through-hole 52 Planar coil 52a Terminal part of planar coil 54 Insulating resin thin film 56 Semiconductor element 58 Electrode terminal

Claims (7)

A non-contact type IC card in which a planar coil and a semiconductor element are disposed on one surface of an insulating resin thin film body, and a terminal portion of the planar coil and an electrode terminal of the semiconductor element are electrically connected Type IC card manufacturing method,
A planar coil forming step of forming a planar coil on one surface of the insulating resin thin film body;
Insulates the first through hole and the second through hole exposing both terminal portions of the planar coil on the other surface side of the insulating resin thin film body, and both electrode terminals of the semiconductor element disposed on one surface of the insulating resin thin film body A step of opening the third through hole and the fourth through hole exposed on the other surface side of the resin thin film body in the insulating resin thin film body;
A semiconductor element affixing step of adhering and fixing a semiconductor element having bumps formed on both electrode terminals to one surface of the insulating resin thin film body so that each bump is located in the third through hole and the fourth through hole When,
A conductive paste is applied to the other surface of the insulating resin thin film body so as to form a wiring pattern that electrically connects the terminal portion of the planar coil and the electrode terminal of the semiconductor element , and in the first through hole, Filling the conductive paste in the second through hole, the third through hole, and the fourth through hole;
A paste drying step for drying the conductive paste;
A method of manufacturing a non-contact type IC card, comprising: a step of forming a card on the insulating resin thin film body in which a planar coil and a semiconductor element are arranged, and mounting a resin oversheet from both sides thereof. The planar coil is disposed on one surface of the insulating resin thin film body, the semiconductor element is disposed on the other surface of the insulating resin thin film body, and the terminal portion of the planar coil and the electrode terminal of the semiconductor element are electrically connected. In a non-contact type IC card manufacturing method for manufacturing a non-contact type IC card,
A planar coil forming step of forming a planar coil on one surface of the insulating resin thin film body;
Drilling step of opening the third through hole and the fourth through hole in the insulating resin thin film body to expose both electrode terminals of the semiconductor element disposed on the other surface of the insulating resin thin film body on one surface side of the insulating resin thin film body When,
A semiconductor element affixing step of adhering and fixing a semiconductor element having bumps formed on both electrode terminals to the other surface of the insulating resin thin film body so that each bump is located in the third through hole and the fourth through hole When,
A step of arranging an insulator so as to cover the planar coil at a portion where a wiring pattern crossing the planar coil is formed;
A portion of the insulating resin thin film body passes through the surface of the insulator so as to form a wiring pattern for electrically connecting between the terminal portion of the planar coil and the electrode terminal of the semiconductor element, and at a portion crossing the planar coil. Applying a conductive paste on one surface and filling the conductive paste in the third through hole and the fourth through hole;
A paste drying step for drying the conductive paste;
A method of manufacturing a non-contact type IC card, comprising: a step of forming a card on the insulating resin thin film body in which a planar coil and a semiconductor element are arranged, and mounting a resin oversheet from both sides thereof.   2. The method of manufacturing a non-contact type IC card according to claim 1, wherein the planar coil is formed by etching a metal foil attached to one surface of an insulating resin thin film body. After performing the drilling step,
4. The non-contact type IC card according to claim 3, wherein a surface treatment step of forming a gold plating film on the surfaces of both terminal portions of the planar coil exposed from the first through hole and the second through hole is performed. Production method.   3. The method of manufacturing a non-contact type IC card according to claim 2, wherein the planar coil is formed by etching a metal foil attached to one surface of an insulating resin thin film body. After performing the drilling step,
6. The method for manufacturing a non-contact type IC card according to claim 5, wherein a surface treatment step of forming a gold plating film on the surfaces of both terminal portions of the planar coil is executed. 3. The method of manufacturing a non-contact type IC card according to claim 1, wherein the planar coil is formed by printing a conductive paste on one surface of an insulating resin thin film body .

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