JP2004133952A - Method for manufacturing non-contact ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a small non-contact IC card on which a semiconductor device with a narrow gap between electrode terminals can be mounted, even without forming a wiring pattern on the rear side of a formation face of a planar coil made of an insulated resin thin film body. <P>SOLUTION: This method comprises a process for forming a planar coil 52 on one face of an insulated resin thin film body 54, and a process for piercing respective through holes 14a and 14b for exposing both terminal parts 52a of the planar coil 52 to the other face side of the insulated resin thin film body 54, and respective through holes 14c and 14d for exposing both electrode terminals 58 of the semiconductor device 56 to the other face side of the insulated resin thin film body 54. Furthermore, the method comprises a process for sticking the semiconductor device 56 to the one face of the insulated resin thin film body 54 so that a bump 16 of the electrode terminals 58 can be located in the third and fourth through holes 14c and 14d, a process for applying conductive paste to the other face of the insulated resin thin film body 54 to connect the terminal parts 52a of the planar coil 52 and the electrode terminals 58 of the semiconductor device 56, a process for drying the conductive paste, and a process for attaching an oversheet 62 made of resin to the thin film body from both sides of the insulated thin film body 54. <P>COPYRIGHT: (C)2004,JPO

Description

The present invention is directed to the manufacture of a non-contact type IC card including a planar coil and a semiconductor element, wherein the terminal portion of the plane coil and the electrode terminal of the semiconductor element are electrically connected. About the method.

The configuration of a conventional non-contact type IC card 50 will be described with reference to FIG.
The planar coil 52 is formed in a rectangular shape by performing etching or the like on a metal foil (for example, copper foil) formed on one surface of an insulating resin thin film 54 such as a resin film, or by forming an insulating resin thin film. It is manufactured by printing a conductive paste on one surface of 54 and drying it to form a spiral. Both ends of the planar coil 52 become terminal portions 52a.
The semiconductor element 56 is formed on one surface thereof with two protruding electrode terminals 58 connected to the terminal portions 52 a of the planar coil 52.

As shown in FIG. 7, the semiconductor element 56 has an insulating resin thin film such that two electrode terminals 58 straddle a part of the planar coil 52 and each electrode terminal 58 is located on each terminal 52 a of the planar coil 52. It is positioned and attached to one surface of the body 54.
Specifically, as shown in FIG. 8, the semiconductor element 56 is fixed to the insulating resin thin film 54 by pressure bonding via the anisotropic conductive film 60. Thus, a conductive path is formed between the protruding electrode terminal 58 and the terminal portion 52a facing the electrode terminal 58, and the electrode terminal 58 of the semiconductor element 56 and the terminal portion 52a of the planar coil 52 are electrically connected. You.

Then, a resin oversheet 62 having an adhesive layer 61 formed on one side is mounted on both sides of the insulating resin thin film body 54 on which the planar coil 52 and the semiconductor element 56 are arranged, and the oversheet 62 is heated and heated. The non-contact type IC card 50 having the structure shown in FIG.

Further, in recent years, the size of the semiconductor element 56 has been reduced, and accordingly, the distance between a pair of electrode terminals 58 formed on the semiconductor element 56 has been reduced. In this case, as described above, The semiconductor element 56 cannot be placed over the planar coil 52 so that the electrode terminals 58 are located inside and outside the planar coil 52.
For this reason, as shown in FIGS. 9 and 10, one terminal 52 a (for example, the inner terminal 52 a) of the planar coil 52 is connected to the outside of the planar coil 52 via the other surface of the insulating resin thin film 54. A structure has been proposed in which the terminal is pulled out to be close to the other terminal 52a.
With this, even if the semiconductor element 56 has a narrow distance between the electrode terminals 58, the semiconductor element 56 is arranged on one surface of the insulating resin thin film body 54 at a position that does not overlap with the plane coil 52, and the plane coil 52 is The electrode terminal 58 can be electrically connected to the terminal portion 52a of the planar coil 52 using the same mounting structure as in the above-described example without straddling.

However, in the structure shown in FIGS. 9 and 10, it is necessary to form a metal foil on both sides of the insulating resin thin film body 54 and to etch the wiring pattern 64 other than the planar coil 52 to form a drawing wiring pattern 64. It is also necessary to form a through hole 66 for electrically connecting the planar coil 52 formed on the surface and the lead-out wiring pattern 64 formed on the other surface, so that the number of manufacturing steps is increased, and metal foil is formed on both surfaces. Since it is necessary to use the attached insulating resin thin film, there is a problem that the material cost is increased and the product cost is increased.

Therefore, the present invention has been made to solve the above-mentioned problem, and an object of the present invention is to provide a small-sized gap between electrode terminals without forming a wiring pattern on the back side of a plane coil forming surface of an insulating resin thin film body. It is an object of the present invention to provide a method for manufacturing a non-contact type IC card to which a semiconductor element having a small width can be attached.

According to the method for manufacturing a non-contact type IC card according to the present invention, the planar coil and the semiconductor element are arranged on one surface of the insulating resin thin film, and the terminal portion of the planar coil and the electrode terminal of the semiconductor element are connected to each other. In a method of manufacturing a non-contact type IC card for manufacturing an electrically connected non-contact type IC card, a flat coil forming step of forming a flat coil on one surface of an insulating resin thin film, and both terminal portions of the flat coil Are exposed on the other surface side of the insulating resin thin film body, and both electrode terminals of the semiconductor element arranged on one surface of the insulating resin thin film body are connected to the other side of the insulating resin thin film body. Forming a third through hole and a fourth through hole exposed on the surface side in an insulating resin thin film body; and forming a semiconductor element having bumps formed on both electrode terminals in each of the third through hole and the fourth through hole. In through hole A semiconductor element attaching step of attaching and fixing to one surface of the insulating resin thin film so as to be located, and forming a wiring pattern for electrically connecting a terminal portion of the planar coil and an electrode terminal of the semiconductor element. As described above, a step of applying a conductive paste to the other surface of the edge resin thin film body, a paste drying step of drying the conductive paste, and an insulating resin thin film body in which a planar coil and a semiconductor element are arranged are provided on both sides thereof. And a carding step of mounting a resin overseat.

According to a second aspect of the present invention, the planar coil is disposed on one surface of the insulating resin thin film, and the semiconductor element is disposed on the other surface of the insulating resin thin film. In a non-contact type IC card manufacturing method for manufacturing a non-contact type IC card in which a terminal portion of a planar coil and an electrode terminal of the semiconductor element are electrically connected, a flat coil is formed on one surface of an insulating resin thin film. Forming a planar coil and forming a third through-hole and a fourth through-hole for exposing both electrode terminals of the semiconductor element disposed on the other surface of the insulating resin thin film to one surface of the insulating resin thin film, Drilling a hole in the insulating resin thin film body, and placing the semiconductor element having bumps formed on both electrode terminals on the other surface of the insulating resin thin film body such that the bumps are located in the third through hole and the fourth through hole. Paste and fix A step of attaching a semiconductor element, a step of arranging an insulator so as to cover the plane coil at a portion where a wiring pattern crossing the plane coil is formed, and an electric connection between a terminal portion of the plane coil and an electrode terminal of the semiconductor element. Applying a conductive paste to one surface of the insulating resin thin film via a surface of the insulator so as to form a wiring pattern to be electrically connected and crossing the plane coil; And a carding step of mounting a resin oversheet from both sides of the insulating resin thin film body on which the planar coil and the semiconductor element are arranged.
Specifically, the surface of the planar coil traversed by the wiring pattern is covered with an insulator, and the wiring pattern is formed on the insulator.

Further, the planar coil may be formed by etching a metal foil attached to one surface of the insulating resin thin film.
Further, after performing the drilling step, a surface treatment step of forming a gold plating film on surfaces of both terminal portions of the planar coil exposed from the first through hole and the second through hole may be performed. . Thereby, the adhesion of the conductive paste to the terminal portion is improved.

The method of manufacturing a non-contact type IC card according to claim 2, wherein the planar coil is formed by etching a metal foil attached to one surface of an insulating resin thin film.
Further, in the method for manufacturing a non-contact type IC card according to claim 5, after performing the drilling step, a surface treatment step of forming a gold plating film on surfaces of both terminal portions of the planar coil is performed. Is also good. Thereby, the adhesion of the conductive paste to the terminal portion is improved.

Further, the planar coil may be formed by printing a conductive paste on one surface of an insulating resin thin film.
In the step of applying the conductive paste, the conductive paste may be filled in each of the through holes. Thereby, the conductive paste adheres well to the electrode terminals and the terminal portions.

ADVANTAGE OF THE INVENTION According to the manufacturing method of the non-contact type IC card which concerns on this invention, even if it does not form a wiring pattern in the back side of the formation surface of the planar coil of an insulating resin thin film body, it is small and the clearance gap between electrode terminals is small. Can be attached. For this reason, for example, it is not necessary to use an insulating resin thin film body having copper foils adhered to both sides, so that manufacturing cost can be reduced and product cost can be reduced.

Hereinafter, preferred embodiments of a method for manufacturing a non-contact type IC card according to the present invention will be described in detail with reference to the accompanying drawings. The same components as those in the conventional example are denoted by the same reference numerals, and detailed description thereof will be omitted.
(First Embodiment)
The structure of the non-contact type IC card 10 will be described. The same components as those in the conventional example are denoted by the same reference numerals, and detailed description thereof will be omitted.
First, of the configuration of the non-contact type IC card 10, the same configuration as the non-contact type IC card 50 described in the conventional example will be outlined with reference to FIG.
The planar coil 52 is formed on the surface of the insulating resin thin film 54, and the semiconductor element 56 is also electrically connected to the electrode terminal 58 and the terminal portion 52 a of the planar coil 52 on the surface of the insulating resin thin film 54. In this configuration, the semiconductor element 56, the planar coil 52, and the insulating resin thin film 54 are integrally formed by being covered with oversheets 62 attached from both sides of the insulating resin thin film 54.

Next, an electrical connection structure between the planar coil 52 and the semiconductor element 56, which is a characteristic part of the non-contact type IC card 10 according to the present invention and is different from the conventional example, will be described.
In the present embodiment, as shown in FIGS. 1 and 2, the planar coil 52 and the semiconductor element 56 are arranged on the same surface of the insulating resin thin film 54.
More specifically, the planar coil 52 is disposed on one surface (the lower surface in FIGS. 1 and 2) of the insulating resin thin film 54, and the semiconductor element 56 is also disposed on one surface of the insulating resin thin film 54. .

The connection structure between the terminal portion 52a of the planar coil 52 and the electrode terminal 58 of the semiconductor element 56 is such that the terminal portion 52a of the planar coil 52 and the electrode terminal 58 of the semiconductor element 56 are provided on the other surface of the insulating resin thin film member 54. Through holes (14a and 14b, 14c and 14d) are formed on the other side (the upper surface in FIGS. 1 and 2) of the insulating resin thin film member 54, and both ends are formed in the through holes 14a to 14d. The two connection wiring patterns 12a and 12b formed by using a conductive paste that is filled and formed between the terminal portion 52a of the planar coil 52 and the electrode terminal 58 of the semiconductor element 56 are formed. Each terminal 52a of the planar coil 52 is electrically connected to each electrode terminal 58 of the semiconductor element 56.
This eliminates the need to form the lead-out wiring pattern 64 by etching the metal foil in advance on the back side of the surface of the insulating resin thin film body 54 on which the planar coil 52 is formed. Since it is not necessary to use the insulating resin thin film body 54 to which the foil is attached, the product cost can be reduced.

Further, in order to improve the electrical connection with the conductive paste filled in the through holes 14c and 14d, in the case of the electrode terminal 58 of the semiconductor element 56, for example, as shown in FIG. The gold bumps 16 may be protrudingly provided on the surface. Similarly, also in the case of the terminal portion 52a of the planar coil 52, a surface treatment such as applying gold plating to the surface of the terminal portion 52a exposed from the through holes 14a and 14b is performed so that the gold plating film 18 is formed. Is also good.

Next, a method for manufacturing the non-contact type IC card 10 will be described with reference to FIG.
First, the gold bump 16 is formed on the surface of the electrode terminal 58 on the semiconductor element 56 side. Also, an insulating resin thin film (for example, a PET substrate) 54 having a metal foil, for example, a copper foil adhered to one surface (one surface) is prepared.
Next, the metal foil of the insulating resin thin film body 54 is etched to form the planar coil 52 (a planar coil forming step).

Next, through holes 14a to 14e are formed in the insulating resin thin film 54 using a laser or the like (drilling step). As described above, the first through hole 14a and the second through hole 14b that expose the terminal portion 52a of the planar coil 52 to the other surface of the insulating resin thin film 54 are formed in the through hole. There is a third through-hole 14c and a fourth through-hole 14d for exposing the electrode terminal 58 of the semiconductor element 56 disposed on one surface to the other surface of the insulating resin thin film member 54. The fifth through hole 14e is provided in a region of the semiconductor element 56 arranged on one surface of the insulating resin thin film 54, and is used for injecting a fixing resin.

Next, the gold plating film 18 is formed on the surface of the terminal portion 52a of the planar coil 52 exposed from the first through hole 14a and the second through hole 14b (surface treatment process of the terminal portion of the planar coil).
Thereby, the adhesion of the conductive paste to the terminal portion 52a is improved.
Next, the semiconductor element 56 having the bumps 16 formed on the electrode terminals 58 is attached to one surface of the insulating resin thin film 54 so that the bumps 16 are located in the third through holes 14c and the fourth through holes 14d. And fixing (semiconductor element attaching step). In the attaching operation, in a state where the semiconductor element 56 is in close contact with the insulating resin thin film 54, an adhesive is poured from the fifth through hole 14e to adhere the semiconductor element 56 to the insulating resin thin film 54.

Next, on the other surface of the insulating resin thin film body 54, a conductive paste (for example, epoxy resin containing silver filler) is applied between the first through hole 14a and the third through hole 14c. It is preferably applied at the shortest distance between the second through hole 14b and the fourth through hole 14d (conductive paste printing step). At this time, a conductive paste is filled into each of the through holes 14a to 14d so that the conductive paste adheres well to the electrode terminals 58 and the terminal portions 52a. Thus, the conductive paste extends between the first through hole 14a and the third through hole 14c and between the second through hole 14b and the fourth through hole 14d.

Next, the conductive paste is dried to form the wiring patterns 12 (12a and 12b). Thereby, the terminal portion 52a of the planar coil 52 and the electrode terminal 58 of the semiconductor element 56 are electrically connected (paste drying step).
Next, in the same manner as in the conventional example, a resin oversheet 62 having an adhesive layer 61 formed on one side is attached to the insulating resin thin film 54 on which the planar coil 52 and the semiconductor element 56 are arranged, from both sides thereof. Is attached to the insulating resin thin-film body 54 side, and the oversheet 62 is integrally formed by heating and pressing to obtain the non-contact type IC card 10 as shown in FIG. 6 (card forming step). .

(Second embodiment)
In the present embodiment, as shown in FIGS. 3 and 4, the planar coil 52 and the semiconductor element 56 are arranged on different surfaces of the insulating resin thin film 54.
More specifically, the planar coil 52 is disposed on one surface (the upper surface in FIGS. 3 and 4) of the insulating resin thin film 54, and the semiconductor element 56 is disposed on the other surface (the surface of FIGS. 3 and 4) of the insulating resin thin film 54. (Lower surface).

The connection structure between the terminal portion 52a of the planar coil 52 and the electrode terminal 58 of the semiconductor element 56 includes a third through hole 14c that exposes the electrode terminal 58 of the semiconductor element 56 on one surface in the insulating resin thin film 54. One end of the insulating resin thin film 54 is filled in the through holes 14 c and 14 d, and the other end overlaps the terminal 52 a of the planar coil 52 on one surface of the insulating resin thin film 54. By forming two wiring patterns 12 (12a, 12b) formed using a conductive paste extending between the terminal portion 52a of the coil 52 and the electrode terminal 58 of the semiconductor element 56, the planar coil 52 The terminal part 52a and the electrode terminal 58 of the semiconductor element 56 are electrically connected.

Further, in the present embodiment, since wiring pattern 12 is formed on the same surface of insulating resin thin film body 54 on which plane coil 52 is formed, one wiring pattern 12 b crosses plane coil 52. .
Therefore, it is necessary to electrically insulate the planar coil 52 and the wiring pattern 12b crossing the planar coil 52 so as not to short-circuit. Therefore, as shown in FIGS. 3 and 4, an insulator 20 made of an insulating paste or an insulating resin sheet is interposed between the wiring pattern 12b and the planar coil 52, and the wiring is formed on the insulator 20. The configuration is such that a pattern 12b is formed.

Thus, even in the case of the non-contact type IC card of the present embodiment, the wiring pattern is formed by etching the metal foil in advance on the back side of the surface on which the planar coil 52 of the insulating resin thin film 54 is formed as in the conventional case. It is not necessary to form the insulating resin thin film 54 with copper foil adhered on both sides. For this reason, the product cost can be reduced.

Next, a method of manufacturing the non-contact type IC card 10 will be described. Since the basic flow of the manufacturing process is the same as that of the first embodiment, only different steps will be described with reference to FIG.
The plane coil forming step is the same as that of the first embodiment.
In the drilling step, only the third through hole 14c and the fourth through hole 14d for exposing the electrode terminal 58 of the semiconductor element 56, and the fifth through hole 14e for fixing the semiconductor element 56 are formed.
In the surface treatment step of the terminal portion of the planar coil, the gold plating film 18 is formed on the entire surface of the terminal portion 52a of the planar coil 52.
In the semiconductor element attaching step, the semiconductor element 56 having the bumps 16 formed on the electrode terminals 58 is placed on the other side of the insulating resin thin film 54 so that the bumps 16 are located in the third through holes 14c and the fourth through holes 14d. Paste on the surface of and fix.

Then, after the semiconductor element attaching step and before the conductive paste printing step, the insulator 20 is disposed at the portion of the plane coil 52 crossed by the wiring pattern 12b so as to cover the plane coil 52. As an example, an insulating paste is applied and dried to form the insulator 20 (insulating paste printing step). It is also possible to bond the insulating sheet to the planar coil 52 to form the insulator 20.
Other steps from the conductive paste printing step to the carding step are the same as those in the first embodiment. In the conductive paste printing step, the conductive paste that becomes the wiring pattern 12b extends between the fourth through hole 14d and the terminal portion 52a of the planar coil 52 via the surface of the insulator 20. .

Further, in the first and second embodiments described above, the planar coil 52 can be formed by printing a conductive paste.
In this case, since the wiring patterns 12a and 12b for electrically connecting the planar coil 52 and the semiconductor element 56 are also formed of a conductive paste, the surface of the terminal portion 52a of the planar coil 52 that contacts the wiring patterns 12a and 12b. Even if the treatment (gold plating treatment) is not performed, it is possible to sufficiently secure the electrical connection between them. Therefore, the surface treatment step of the terminal portion 52a of the planar coil 52 shown in FIG. 5 is not required.

In each of the above-described embodiments, the semiconductor element 56 is positioned so as to be positioned outside the planar coil 52 that does not overlap the planar coil 52. However, the outer shape of the non-contact type IC card 10 can be reduced. As described above, it is also possible to arrange in the area inside the planar coil 52.
Further, as the planar coil 52, a coil formed by pressing or etching a thin metal plate and bonded to an insulating resin thin film 54 may be used.

FIG. 3 is an explanatory diagram (main part plan view) for describing the structure of the first embodiment of the non-contact type IC card. It is WW sectional drawing of FIG. It is an explanatory view (main part top view) for explaining the structure of the second embodiment of the non-contact type IC card. FIG. 4 is a sectional view taken along line WW of FIG. 3. FIG. 2 is a process chart for explaining the manufacturing method of FIG. 1. (A) is a plan view for explaining a configuration of a non-contact type IC card, and (b) is a WW sectional view thereof. FIG. 10 is a plan view for explaining a configuration of an example of a conventional non-contact type IC card. It is WW sectional drawing of FIG. FIG. 11 is a plan view for explaining the configuration of another example of the conventional non-contact type IC card. It is WW sectional drawing of FIG.

Explanation of reference numerals

DESCRIPTION OF SYMBOLS 10 Non-contact type IC card 12 Wiring pattern 14a-14e Through-hole 52 Planar coil 52a Terminal part of planar coil 54 Insulating resin thin film 56 Semiconductor element 58 Electrode terminal

Claims (8)

A non-contact type IC card in which a planar coil and a semiconductor element are arranged on one surface of an insulating resin thin film body and a terminal portion of the planar coil is electrically connected to an electrode terminal of the semiconductor element. In the method for manufacturing a type IC card,
A planar coil forming step of forming a planar coil on one surface of the insulating resin thin film,
A first through hole and a second through hole for exposing both terminal portions of the planar coil to the other surface side of the insulating resin thin film body, and insulating both electrode terminals of a semiconductor element disposed on one surface of the insulating resin thin film body. Forming a third through hole and a fourth through hole exposed on the other surface side of the resin thin film body in the insulating resin thin film body;
A semiconductor element attaching step of attaching and fixing a semiconductor element having bumps formed on both electrode terminals to one surface of an insulating resin thin film so that each bump is located in the third through hole and the fourth through hole. When,
Applying a conductive paste to the other surface of the edge resin thin film so as to form a wiring pattern for electrically connecting the terminal portion of the planar coil and the electrode terminal of the semiconductor element;
A paste drying step of drying the conductive paste,
A method for manufacturing a non-contact type IC card, comprising a step of mounting a resin oversheet from both sides of an insulating resin thin film body on which a planar coil and a semiconductor element are arranged. A planar coil is disposed on one surface of the insulating resin thin film, a semiconductor element is disposed on the other surface of the insulating resin thin film, and a terminal portion of the planar coil is electrically connected to an electrode terminal of the semiconductor element. A non-contact type IC card manufacturing method for manufacturing a non-contact type IC card,
A planar coil forming step of forming a planar coil on one surface of the insulating resin thin film,
Drilling a third through hole and a fourth through hole that expose both electrode terminals of the semiconductor element disposed on the other surface of the insulating resin thin film on one surface side of the insulating resin thin film in the insulating resin thin film. When,
A semiconductor element attaching step of attaching and fixing a semiconductor element having bumps formed on both electrode terminals to the other surface of the insulating resin thin film body such that the bumps are located in the third through hole and the fourth through hole. When,
A step of arranging an insulator so as to cover the plane coil in a portion where a wiring pattern that crosses the plane coil is formed;
In order to form a wiring pattern that electrically connects between the terminal portion of the planar coil and the electrode terminal of the semiconductor element, and at a portion crossing the planar coil, via the surface of the insulator, A step of applying a conductive paste to one surface,
A paste drying step of drying the conductive paste,
A method for manufacturing a non-contact type IC card, comprising a step of mounting a resin oversheet from both sides of an insulating resin thin film body on which a planar coil and a semiconductor element are arranged. 2. The method for manufacturing a non-contact type IC card according to claim 1, wherein the planar coil is formed by etching a metal foil attached to one surface of the insulating resin thin film. After performing the drilling step,
4. The non-contact type IC card according to claim 3, wherein a surface treatment step of forming a gold plating film on surfaces of both terminal portions of the planar coil exposed from the first through hole and the second through hole is performed. Production method. 3. The method for manufacturing a non-contact type IC card according to claim 2, wherein the planar coil is formed by etching a metal foil attached to one surface of the insulating resin thin film. After performing the drilling step,
6. The method for manufacturing a non-contact type IC card according to claim 5, wherein a surface treatment step of forming a gold plating film on surfaces of both terminal portions of the planar coil is performed. 3. The method for manufacturing a non-contact type IC card according to claim 1, wherein the planar coil is formed by printing a conductive paste on one surface of an insulating resin thin film body. The non-contact type IC card according to any one of claims 1 to 7, wherein a conductive paste is filled in each of the through holes during a step of applying a conductive paste. Production method.

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