JP2001092936A - Radio frequency tag and production thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an extremely thin radio frequency tag, which facilitates the reduction of the production cost, and production thereof. SOLUTION: Between first and second substrates 20 and 80 having electric insulation, an antenna pattern 30 integrated with the first substrate 20 while having first and second connecting terminals 31 and 32, an integrated circuit chip 40 having first and second electrode pads 41 and 42 on an active surface and a connecting lead 60 for respectively connecting the first connecting terminal 31 and the first electrode pad 41 and connecting the second connecting terminal 32 and the second electrode pad 42 are provided and the connecting lead 60 is formed while using a conductive resin material or conductive paste for connecting the first connecting terminal 31 and the second connecting terminal 32 and connecting the first electrode pad 41 and the second electrode pad 42.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a radio frequency tag and a method for manufacturing the same, and more particularly, to a radio frequency tag in which an electrically connected antenna circuit pattern and an integrated circuit chip are sealed and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, as a method of sorting and managing articles such as mail and cargo, an RF (radio frequency) circuit,
A radio frequency tag having a built-in integrated circuit chip in which a logic circuit and a memory circuit are integrated is attached to an article, and information specific to the article is input and stored in the radio frequency tag in advance, and the stored data is stored. Is read from the outside with a non-contact type detection device to extract information on the article. Generally, such a radio frequency tag is formed by forming a spiral antenna circuit pattern on one surface of a flexible substrate such as an epoxy or polyimide substrate, and mounting an integrated circuit chip on the same plane as the antenna circuit pattern. The first of the integrated circuit chips
One of the electrode pads and the second electrode pads and the first connection terminal on the inner peripheral side end of the antenna circuit pattern and the second connection terminal on the outer peripheral side end of the bonding wire cross the antenna circuit pattern. Are electrically connected via
Also, an antenna circuit pattern and an integrated circuit chip provided on the same plane inside the antenna circuit pattern are mounted on the upper surface of the substrate, and a wiring pattern having relay terminals is formed on the lower surface, and the electrode pads of the integrated circuit chip are formed. There is a type in which one between the first connection terminal and the second connection terminal of the antenna circuit pattern is electrically connected by a bonding wire via a through hole provided in a relay terminal of the wiring pattern.

[0003]

However, in the former method, when the number of turns of the coil of the antenna circuit pattern is large, it is necessary to bond over a wide antenna circuit pattern. However, there is a problem that the wire becomes longer and comes into contact with the antenna circuit pattern. In the latter method, the first and second connection terminals and the first and second electrode pads are electrically connected by bonding wires via the relay terminals of the wiring pattern provided on the lower surface, respectively. There has been a problem that the package of the frequency tag becomes thick and hinders the reduction in thickness. In addition, since the relay terminal of the wiring pattern formed on the lower surface of the substrate is connected to the antenna circuit pattern and the integrated circuit chip provided on the upper surface via through holes, much time is required for manufacturing the substrate. The present invention has been made in view of such circumstances, and it is an object of the present invention to provide an extremely thin radio frequency tag which facilitates reduction in manufacturing cost without using a through-hole or a wire bonding method, and a method for manufacturing the same. And

[0004]

According to the first aspect of the present invention, there is provided a radio frequency tag having an electrically insulating property.
An antenna circuit pattern having a first connection terminal and a second connection terminal between a first substrate and a second substrate; an integrated circuit chip having a first electrode pad and a second electrode pad on an active surface; And a connection lead connecting between the second connection terminal and the first electrode pad and between the second connection terminal and the second electrode pad, respectively. Terminal and the second connection terminal and the first connection terminal.
Is formed using a conductive resin material or a conductive paste for connecting between the first electrode pad and the second electrode pad. As a result, the connection leads are formed extremely thin on the antenna circuit pattern and the integrated circuit chip, and can be made much thinner than a radio frequency tag using the connection leads formed by bonding wires, and sag and contact are eliminated. In addition, since the connection leads are only applied with a conductive resin material or a conductive paste, they do not apply a high temperature such as that generated in a wire bonding process, so that the heat influence on an insulator such as a substrate is small, and For example, an inexpensive material can be used.

In the radio frequency tag according to the first invention, the antenna circuit pattern may be formed by etching or pressing a copper-based strip. In this case, mass production and man-hour reduction are possible. In the radio frequency tag according to the first invention, the connection lead has an opening for exposing the first and second connection terminals and the first and second electrode pads, and further includes an antenna circuit pattern and an integrated circuit chip. It may be formed on a lower insulating layer made of an electrical insulating material for embedding irregularities. Thereby, when the conductive resin material or the conductive paste is applied, the thickness can be made uniform, and the quality of the connection lead is stabilized. In the radio frequency tag according to the first invention, the lower insulating layer may cover at least a lower surface of the connection lead crossing the antenna circuit pattern and a region of the integrated circuit chip. This can prevent an electrical short between the connection lead and the antenna circuit pattern. In the radio frequency tag according to the first aspect, the integrated circuit chip may be mounted in a region adjacent to the antenna circuit pattern. Thus, the length of the connection lead can be extremely reduced.

According to a second aspect of the present invention, there is provided a method of manufacturing a radio frequency tag, comprising: attaching an antenna circuit pattern having a first connection terminal and a second connection terminal on a first substrate; An integrated circuit chip having a first electrode pad and a second electrode pad is mounted on a first substrate or an antenna circuit pattern, and is provided between the first connection terminal and the first electrode pad and between the first connection terminal and the second connection terminal. In a method of manufacturing a radio frequency tag in which a connection lead is formed between a second electrode pad and an antenna circuit pattern, the first and second antenna circuit patterns are embedded with irregularities of the antenna circuit pattern.
Forming a lower insulating layer provided with openings through which the connection terminals and the first and second electrode pads are respectively exposed, and applying a conductive resin material or a conductive paste on the lower insulating layer to pass through the respective openings. Thus, connection leads for electrically connecting the first connection terminal to the first electrode pad and the second connection terminal to the second electrode pad are formed. In this case, since the connection lead can be formed only by applying the conductive resin material or the conductive paste, the manufacturing time can be significantly reduced, and the manufacturing cost can be reduced.

According to a third aspect of the present invention, there is provided a method of manufacturing a radio frequency tag, comprising the steps of: integrally attaching an antenna circuit pattern having a first connection terminal and a second connection terminal on a first substrate; An integrated circuit chip having a first electrode pad and a second electrode pad is mounted on a first substrate or an antenna circuit pattern, and is provided between the first connection terminal and the first electrode pad and between the first connection terminal and the second connection terminal. In a method of manufacturing a radio frequency tag in which a connection lead is formed between a second electrode pad and an antenna circuit pattern, the first and second antenna circuit patterns are embedded with irregularities of the antenna circuit pattern.
Forming a lower insulating layer provided with openings for exposing the connection terminals and the first and second electrode pads, respectively. The first connection terminal and the first electrode of the upper insulating layer formed on the surface of the second substrate are formed. A conductive resin material or a conductive paste is applied to the positions corresponding to the pads and between the second connection terminal and the second electrode pad, and the upper insulating layer is superimposed on the lower insulating layer to form a connection lead. To form In this case, the antenna circuit pattern and the integrated circuit chip are bonded on the first substrate, and the first and second connection terminals and the first and second electrode pads are each provided with an opening for exposing the electrical insulation. The process up to forming the lower insulating layer having the property and the process up to applying the conductive resin material or the conductive paste on the surface of the upper insulating layer applied to the second substrate can be performed in parallel.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention. Here, FIG. 1A shows the first embodiment of the present invention.
FIG. 2B is a cross-sectional view of the radio frequency tag according to the embodiment taken along line AA in FIG. 2B, FIG. 2B is a plan view of the radio frequency tag, FIG. FIG.
FIG. 4A is a side cross-sectional view illustrating a process of manufacturing a radio frequency tag according to a second embodiment of the present invention, and FIG. 4A shows a radio frequency tag according to a third embodiment of the present invention ( B)
3 is a sectional view taken along the line BB in FIG.

As shown in FIGS. 1A and 1B, a radio frequency tag 10 according to a first embodiment of the present invention is a flexible and electrically insulating epoxy-based or polyimide-based tag. An antenna circuit pattern 3 formed on a substrate 20 on which a spiral strip is integrally formed by etching or pressing from a copper-based strip material, for example, by bonding.
0 is attached. The antenna circuit pattern 30 has a first connection terminal 31 at an inner end thereof, and a second connection terminal 32 at an outer end thereof. An integrated circuit chip 40 is attached to a region adjacent to the inside of the antenna circuit pattern 30 by bonding, and a first electrode pad 41 and a second electrode pad are provided on a surface on which the semiconductor element is subjected to wiring patterning, that is, on an active surface. 42. On the antenna circuit pattern 30 and the integrated circuit chip 40, a lower layer made of an electrically insulating material such as a polyimide resin or a polyester resin, which buries the respective surfaces of the antenna circuit pattern 30 and the integrated circuit chip 40 and irregularities between them. The insulating layer 50 is applied so that the upper surface is flat. The lower connection layer 50 includes a first connection terminal 31 and a second connection terminal 32.
An opening 51 for exposing the first electrode pad 41 and the second electrode pad 42 is provided.

On the lower insulating layer 50, an antenna circuit pattern 30 between the first connection terminal 31 and the first electrode pad 41 and between the second connection terminal 32 and the second electrode pad 42 are formed. Apply a liquid conductive resin material or a paste-like conductive paste in which a conductive material such as copper powder is mixed into an adhesive resin such as an acrylic resin or a polyester resin so as to cross the The connection lead 60 is formed by being cured in a state (generally also referred to as a B stage), and further heated and completely cured. Thus, the first connection terminal 31 and the first electrode pad 41 and the second connection terminal 32 and the second electrode pad 42 are electrically connected through the opening 51. The lower insulating layer 50 covers the lower surface of the connection lead 60 crossing the antenna circuit pattern 30 and the area occupied by the integrated circuit chip 40. Further, an upper insulating layer 70 is applied so as to cover the connection leads 60 and the upper surfaces of the lower insulating layer 50, and furthermore, the upper surface of the upper insulating layer 70 is formed so as to be flat, and has electrical insulation thereon. The antenna circuit pattern 30, the integrated circuit chip 40, and the connection leads 60 are sealed by bonding the second substrate 80.

Here, a manufacturing process of the radio frequency tag 10 according to the first embodiment will be described. (1) An antenna circuit pattern 30 having a first connection terminal 31 and a second connection terminal 32 is formed from a copper-based strip by etching or pressing (pattern forming step). After the antenna circuit pattern 30 is formed, a plurality of portions of the antenna circuit pattern 30 may be fixed with an adhesive tape or the like so that the antenna circuit pattern 30 is not deformed until the antenna circuit pattern 30 is adhered on the first substrate 20. (2) The antenna circuit pattern 30 is bonded on the first substrate 20 having electrical insulation (bonding step). (3) The integrated circuit chip 40 is mounted on the first substrate 20 in a region adjacent to the inside of the antenna circuit pattern 30 (chip mounting step). (4) Antenna circuit pattern 30 and integrated circuit chip 4
0, and a lower layer having an opening 51 in which the first connection terminal 31, the second connection terminal 32, the first electrode pad 41, and the second electrode pad 42 are respectively exposed, in which the surface and the unevenness between them are buried. The insulating layer 50 is applied so that the upper surface is flat and dried (coating step). (5) A conductive resin material or conductive paste is applied between the first connection terminal 31 and the first electrode pad 41 and between the second connection terminal 32 and the second electrode pad 42 to form a half. After being dried to a hardened state, the first connection terminal 31, the first electrode pad 41, and the second connection terminal
A connection lead 60 for electrically connecting the second and second electrode pads 42 is formed (connection lead forming step). (6) As shown in FIG. 2, the upper insulating layer 70 is applied and dried on the second substrate 80, and the upper insulating layer 70 is placed on the connection lead 60 and the lower insulating layer 50 with the upper insulating layer 70 facing downward. The substrate 80 is heated and pressed to form the upper insulating layer 70 and the lower insulating layer 5.
0 is adhered. As a result, the connection lead 60 is completely cured, and the antenna circuit pattern 30 and the integrated circuit chip 4 are hardened.
0, the electrical conduction state is stabilized, and the antenna circuit pattern 3
0, the integrated circuit chip 40 and the connection lead 60 are sealed (sealing step).

As described above, a radio wave of a specific radio frequency from the outside is received by the antenna circuit pattern 30, and the first connection terminal 31, the second connection terminal 32, the first electrode pad 41, and the second electrode pad are received. 42, and the output of the integrated circuit chip 40 is output through the first electrode pad 41, the second electrode pad 42, the first connection terminal 31, and the second connection terminal 32. Can be transmitted from the antenna circuit pattern 30. The connection lead 60 is extremely thin on the antenna circuit pattern 30 and the integrated circuit chip 40, for example, several μm to several 1 μm.
It is formed to a thickness of about 0 μm, and can be made much thinner than one using connection leads formed by conventional bonding wires. Further, since the connection lead 60 is merely heated by applying a conductive resin material or conductive paste and heating the resin at a temperature at which the resin is hardened, the connection lead 60 does not reach a high temperature unlike the wire bonding method, and does not insulate the substrate or the like. The effect of heat on objects can be reduced.

As shown in FIG. 3, a radio frequency tag 11 according to a second embodiment of the present invention has substantially the same configuration as the radio frequency tag 10 according to the first embodiment, but has a connection lead 60. Are different from each other. That is, it has the following manufacturing process. (1) An antenna circuit pattern 30 having a first connection terminal 31 and a second connection terminal 32 is formed from a copper-based strip by etching or pressing (pattern forming step). (2) The antenna circuit pattern 30 is bonded on the first substrate 20 having electrical insulation (bonding step). (3) The first adjacent to the inside of the antenna circuit pattern 30
The integrated circuit chip 40 on the substrate 20 (chip mounting step). (4) Antenna circuit pattern 30 and integrated circuit chip 4
0, the first connection terminal 31, the second connection terminal 32, and the first electrode pad 4
Openings 5 from which first and second electrode pads 42 are respectively exposed
1 is formed by applying and drying the lower insulating layer 50 (coating step).

Up to now, the manufacturing process is the same as the manufacturing process of the radio frequency tag 10 according to the first embodiment, and the next process follows. (5) Upper insulating layer 70 formed on second substrate surface 80
A conductive resin material or a conductive paste is applied to positions corresponding to between the first connection terminal 31 and the first electrode pad 41 and between the second connection terminal 32 and the second electrode pad 42. And dried (lead forming step). (6) The upper insulating layer 70 is overlaid on the lower insulating layer 50 and heated and pressed. Therefore, a part of the conductive resin material or the conductive paste enters the opening portion 51, and the first resin material or the conductive paste respectively enters the first portion.
The connection lead 60 that electrically contacts the connection terminal 31, the second connection terminal 32, the first electrode pad 41, and the second electrode pad 42 is formed (lamination step). As a result, the antenna circuit pattern 30 and the integrated circuit chip 40 are bonded on the first substrate 20, and the first and second connection terminals 31, 32 and the first and second electrode pads 41, 4
A step of forming an electrically insulating lower insulating layer 50 having an opening 51 through which each of them 2 is exposed;
The process up to the application of the conductive resin material or the conductive paste to the surface of the upper insulating layer 70 applied to the substrate 80 can be performed in parallel.

As shown in FIGS. 4A and 4B, a radio frequency tag 100 according to a third embodiment of the present invention is formed on a first substrate 200 having electrical insulation, for example. The spirally formed antenna circuit pattern 300 is attached integrally by bonding. Antenna circuit pattern 3
00 has a first connection terminal 310 at an inner end thereof, and a second connection terminal 320 at an outer end thereof. The integrated circuit chip 400 has a first electrode pad 410 and a second electrode pad 420 on its active surface. The above configuration is substantially the same as the radio frequency tag 10 according to the first embodiment. The radio frequency tag 100 differs from the radio frequency tag 10 in the following points. That is, the lower insulating layer 500 made of an insulating resin is applied so as to bury the irregularities on the surface of the antenna circuit pattern 300. An opening 510 exposing the first connection terminal 310 is provided in the lower insulating layer 500. The integrated circuit chip 400 has a first
The lower insulating layer 500 extends over the antenna circuit pattern 300 between the connection terminal 310 and the second connection terminal 320 of FIG.
Is placed on top. Between the first connection terminal 310 and the first electrode pad 410 and between the second connection terminal 320 and the second
A conductive resin material or a conductive paste is applied between the first electrode pad 420 and the first electrode pad 420 through the opening 510, and cured to cure the first connection terminal 310, the first electrode pad 410, and the second connection terminal. A connection lead 600 for electrically connecting the second electrode pad 320 to the second electrode pad 420 is formed. An upper insulating layer 700 is applied to a region covering the integrated circuit chip 400 and the connection lead 600 so that the upper surface is flat. On the upper insulating layer 700 and the lower insulating layer 500 that is not covered by the upper insulating layer 700, a second substrate 800 having electrical insulation is bonded to form the antenna circuit pattern 30.
0, the integrated circuit chip 400 and the connection leads 600 are sealed.

Here, the manufacturing process of the radio frequency tag 100 according to the third embodiment will be described. (1) First connection terminal 310 and second connection terminal 320
Is formed from a copper-based strip by etching or pressing (pattern forming step). After the antenna circuit pattern 300 is formed, the antenna circuit pattern 300 may be fixed at a plurality of positions with an adhesive tape or the like so that the antenna circuit pattern 300 is not deformed until the antenna circuit pattern 300 is adhered on the first substrate 200. (2) The antenna circuit pattern 300 is bonded on the first substrate 200 having electrical insulation (bonding step). (3) Asperities on the surface of the antenna circuit pattern 300 are embedded, and the first connection terminal 310 and the second connection terminal 32
A lower insulating layer 500 having an opening 510 from which each 0 is exposed is formed by coating and drying (coating step). (4) The integrated circuit chip 400 is mounted on the lower insulating layer 500 so as to straddle the antenna circuit pattern 300 (chip mounting step). (5) First connection terminal 310 and first electrode pad 410
And between the second connection terminal 320 and the second electrode pad 4
Apply a conductive resin material or conductive paste between
After drying, connection leads 600 for electrically connecting the first connection terminal 310 and the first electrode pad 410 and the second connection terminal 320 and the second electrode pad 420 through the opening 510 are formed. (Connection lead forming step). (6) An upper insulating layer 700 covering the connection leads 600, the integrated circuit chip 400 and the lower insulating layer 500 is applied, and adhered so as to cover the upper insulating layer 700 with a second substrate 800 made of an insulating flexible tape or the like. By heating and pressurizing, the electrical conduction between the antenna circuit pattern 300 and the integrated circuit chip 400 is stabilized, and the antenna circuit pattern 300, the integrated circuit chip 400 and the connection lead 60 are connected.
0 is sealed (sealing step).

In this case, since the integrated circuit chip 400 is mounted on the antenna circuit pattern 300, the inner diameter of the spiral of the antenna circuit pattern 300 is reduced, and thus the size of the entire radio frequency tag 100 is reduced. The length of the connection lead 600 can be reduced. Even if the integrated circuit chip 400 and the connection lead 600 overlap with each other on the antenna circuit pattern 300, each of them has a thickness of about several tens of μm. Is possible. In the connection lead forming step of the method of manufacturing the radio frequency tag 100 according to the third embodiment, the first connection terminal 310 and the first electrode pad 4 are formed.
10 and between the second connection terminal 320 and the second electrode pad 420, a conductive resin material or a conductive paste is applied.
Although the method for covering the upper insulating layer 7 has been described, the opening 510 is provided in the lower insulating layer 500 as in the method of manufacturing the radio frequency tag 11 according to the second embodiment.
After applying and drying a conductive resin material or a conductive paste to the first connection terminal 310 through the opening 510, the upper insulating layer 700 is placed on the lower insulating layer 500 and heated and pressed. A connection lead 600 for electrically connecting the first electrode pad 410 and the second connection terminal 320 to the second electrode pad 420 may be formed.

[0018]

According to the radio frequency tag of the present invention, an antenna circuit pattern having a first connection terminal and a second connection terminal between a first and a second substrate having electrical insulation. An integrated circuit chip having a first electrode pad and a second electrode pad; a first connection terminal;
Connection leads for connecting between the first connection terminal and the second connection terminal, and between the second connection terminal and the second electrode pad. The connection lead includes a first connection terminal, a second connection terminal, and a first connection terminal.
Since the connection lead is formed using a conductive resin material or a conductive paste for connecting between the electrode pad and the second electrode pad, the connection lead is formed extremely thin on the antenna circuit pattern and the integrated circuit chip, It can be much thinner than a radio frequency tag using connection leads formed by bonding wires, eliminating slack and contact,
A radio frequency tag with stable quality can be provided. Further, since the connection leads are only applied with a conductive resin material or a conductive paste, the quality of the substrate can be stabilized without being affected by the temperature due to the wire bonding.

In particular, in the radio frequency tag according to the second aspect, since the antenna circuit pattern is formed by etching or pressing from a copper-based strip, mass production and man-hours can be reduced. Further, in the radio frequency tag according to claim 3, the connection lead has an opening for exposing the first and second connection terminals and the first and second electrode pads, the antenna circuit pattern and the integrated circuit chip. Is formed on the lower insulating layer in which the irregularities are buried, the thickness becomes uniform when a conductive resin material or a conductive paste is applied, and the quality of the connection lead is stabilized. In the radio frequency tag according to the fourth aspect, the lower insulating layer covers at least the lower surface of the connection lead crossing the antenna circuit pattern and the area of the integrated circuit chip, so that the connection lead and the antenna circuit pattern are electrically short-circuited. Can be prevented. In the radio frequency tag according to the fifth aspect, since the integrated circuit chip is mounted in a region adjacent to the antenna circuit pattern, the length of the connection lead can be extremely reduced, and the processing time can be reduced. Can be done.

In the method of manufacturing a radio frequency tag according to the present invention, a conductive resin material or a conductive paste is applied on the lower insulating layer, and the first connection terminal and the first electrode are respectively formed through the openings. Since the connection lead for electrically connecting the pad and the second connection terminal to the second electrode pad is formed, the connection lead can be formed only by applying a conductive resin material or a conductive paste, and the manufacturing time is reduced. It can be greatly reduced, and the manufacturing cost can be reduced. In the method of manufacturing a radio frequency tag according to claim 7, between the first connection terminal of the upper insulating layer formed on the surface of the second substrate and the first electrode pad and between the second connection terminal and the second connection terminal. A conductive resin material or conductive paste is applied to the position corresponding to the electrode pad, and the upper insulating layer is superimposed on the lower insulating layer to form connection leads, so that the antenna circuit pattern and the integrated circuit are formed on the substrate. Bonding a chip and forming an electrically insulating lower insulating layer having openings through which the first and second connection terminals and the first and second electrode pads are respectively exposed; Since the steps up to the application of the conductive resin material or the conductive paste to the surface of the upper insulating layer applied to the second substrate can be performed in parallel, the manufacturing time can be greatly reduced.

[Brief description of the drawings]

FIG. 1A is a cross-sectional view taken along the line AA in FIG. 1B, showing a radio frequency tag according to a first embodiment of the present invention;
(B) is a cutaway plan view of the same part.

FIG. 2 is a side sectional view for explaining a process in the course of manufacturing the radio frequency tag.

FIG. 3 is a side cross-sectional view illustrating a process in a manufacturing process of a radio frequency tag according to a second embodiment of the present invention.

FIG. 4A is a sectional view taken along line BB in FIG. 4B, showing a radio frequency tag according to a third embodiment of the present invention;
(B) is a plan sectional view of the same.

[Explanation of symbols]

10, 11: radio frequency tag, 20: first substrate, 3
0: antenna circuit pattern, 31: first connection terminal, 3
2: second connection terminal, 40: integrated circuit chip, 41: first electrode pad, 42: second electrode pad, 50: lower insulating layer, 51: opening, 60: connection lead, 70: upper insulating layer Layer, 80: second substrate, 100: radio frequency tag,
200: substrate, 300: antenna circuit pattern, 31
0: first connection terminal, 320: second connection terminal, 40
0: integrated circuit chip, 410: first electrode pad, 42
0: second electrode pad, 500: lower insulating layer, 510:
Opening, 600: connection lead, 700: upper insulating layer, 8
00: second substrate

Claims (7)

[Claims] An antenna circuit pattern having a first connection terminal and a second connection terminal between a first and a second substrate having electrical insulation, a first electrode pad and a first electrode pad on an active surface. An integrated circuit chip having two electrode pads, and connection leads for connecting between the first connection terminal and the first electrode pad and between the second connection terminal and the second electrode pad, respectively. Wherein the connection lead is a conductive resin material that connects between the first connection terminal and the second connection terminal and the first electrode pad and the second electrode pad. A radio frequency tag formed using a conductive paste. 2. The radio frequency tag according to claim 1, wherein the antenna circuit pattern is formed by etching or pressing a copper-based strip. 3. The radio frequency tag according to claim 1, wherein the connection lead has an opening exposing the first and second connection terminals and the first and second electrode pads.
And a radio frequency tag formed on a lower insulating layer for embedding irregularities of the antenna circuit pattern and the integrated circuit chip. 4. The radio frequency tag according to claim 3, wherein the lower insulating layer covers at least a lower surface of the connection lead crossing the antenna circuit pattern and a region of the integrated circuit chip. Radio frequency tag. 5. The radio frequency tag according to claim 1, wherein the integrated circuit chip is mounted in a region adjacent to the antenna circuit pattern. tag. 6. A first connection terminal and a second connection terminal on a first substrate.
An integrated circuit chip having a first electrode pad and a second electrode pad is mounted on the first substrate or the antenna circuit pattern; Connection terminal and the first
Between the second connection terminal and the second connection terminal.
A method of manufacturing a radio frequency tag in which connection leads are formed between the antenna circuit pattern and the electrode pads of the first and second connection terminals. And forming a lower insulating layer provided with openings through which the first and second electrode pads are exposed, and applying a conductive resin material or a conductive paste on the lower insulating layer, respectively, through the openings. A method for manufacturing a radio frequency tag, comprising: forming the connection lead for electrically connecting the first connection terminal to the first electrode pad and the second connection terminal to the second electrode pad. 7. A first connection terminal and a second connection terminal on a first substrate.
An integrated circuit chip having a first electrode pad and a second electrode pad is mounted on the first substrate or the antenna circuit pattern; Connection terminal and the first
Between the second connection terminal and the second connection terminal.
A method of manufacturing a radio frequency tag in which connection leads are formed between the antenna circuit pattern and the electrode pads of the first and second connection terminals. Forming a lower insulating layer provided with openings through which the first and second electrode pads are respectively exposed, wherein the first connection terminal and the first electrode pad of the upper insulating layer formed on the surface of the second substrate are formed; And a conductive resin material or a conductive paste is applied to a position corresponding to between the second connection terminal and the second electrode pad, and the upper insulating layer is stacked on the lower insulating layer. Forming the connection lead by using the above method.