JPH11102989A - Bga semiconductor device - Google Patents
Bga semiconductor deviceInfo
- Publication number
- JPH11102989A JPH11102989A JP26252097A JP26252097A JPH11102989A JP H11102989 A JPH11102989 A JP H11102989A JP 26252097 A JP26252097 A JP 26252097A JP 26252097 A JP26252097 A JP 26252097A JP H11102989 A JPH11102989 A JP H11102989A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- stiffener
- copper foil
- type semiconductor
- circuit pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/8518—Translational movements
- H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Landscapes
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はＢＧＡ（Ｂａｌｌ
Ｇｒｉｄ Ａｒｒａｙ）型半導体装置に関し、特に、Ｔ
ＡＢテープを補強するスティフナーを有したＢＧＡ型半
導体装置に関する。The present invention relates to a BGA (Ball).
(Grid Array) type semiconductor device.
The present invention relates to a BGA type semiconductor device having a stiffener for reinforcing an AB tape.
【０００２】[0002]
【従来の技術】近年のＬＳＩ素子の出入力数の増大にと
もなって、外部回路に接続される入出力用のリードとし
て機能する半田ボールをアレイ状に配置したＢＧＡ型半
導体装置の要求が高まっている。2. Description of the Related Art With the recent increase in the number of inputs and outputs of LSI elements, there is an increasing demand for BGA type semiconductor devices in which solder balls functioning as input / output leads connected to external circuits are arranged in an array. I have.
【０００３】図１５は従来のＢＧＡ型半導体装置を示
す。このＢＧＡ型半導体装置はポリイミドテープ１の片
面に銅箔回路パターン６を形成したＴＡＢテープを使用
することによりコストダウンを図るものである。ポリイ
ミドテープ１は他面に両面接着剤付きフィルム１７を介
してスティフナー１８が貼付されており、スティフナー
１８は接着剤４を介して半導体素子５が固着されてい
る。半導体素子５のパッド（図示せず）はボンディング
ワイヤ７によって銅箔回路パターン６に接続されてお
り、銅箔回路パターン６はソルダーレジスト９によって
保護されながら半田ボール１０に接続されている。半導
体素子５および銅箔回路パターン６のボンディングワイ
ヤ７との接続部はモールド樹脂８によって封止されてい
る。FIG. 15 shows a conventional BGA type semiconductor device. This BGA type semiconductor device is intended to reduce costs by using a TAB tape in which a copper foil circuit pattern 6 is formed on one surface of a polyimide tape 1. The stiffener 18 is attached to the other surface of the polyimide tape 1 via a film 17 with a double-sided adhesive, and the semiconductor element 5 is fixed to the stiffener 18 via an adhesive 4. A pad (not shown) of the semiconductor element 5 is connected to a copper foil circuit pattern 6 by a bonding wire 7, and the copper foil circuit pattern 6 is connected to a solder ball 10 while being protected by a solder resist 9. The connection between the semiconductor element 5 and the copper foil circuit pattern 6 with the bonding wire 7 is sealed with a mold resin 8.
【０００４】[0004]
【発明が解決しようとする課題】しかし、従来のＢＧＡ
型半導体装置によると、スティフナーを貼り付けると
き、両面接着剤付きテープの貼り付けと、スティフナー
の貼り付けの２回の貼り付け工程が必要になるため、生
産性が低下し、また、両面接着剤付きテープを使用して
いるため、材料費が大になり、更に、ポリイミドテープ
に接着剤で接着された銅箔回路パターンにワイヤボンデ
ィングを行うため、接着剤の特性によってワイヤボンデ
ィング性が大幅に左右される。従って、本発明の目的は
生産性を高くし、材料費を低下し、ワイヤボンディング
性の安定したＢＧＡ型半導体装置を提供することにあ
る。However, the conventional BGA
According to the type semiconductor device, when applying a stiffener, it is necessary to apply a tape with a double-sided adhesive and two steps of attaching a stiffener, so that the productivity is reduced and the double-sided adhesive is also used. The use of tape with adhesive increases the material cost. In addition, wire bonding is performed on the copper foil circuit pattern bonded to the polyimide tape with an adhesive. Is done. SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a BGA type semiconductor device having high productivity, low material cost, and stable wire bonding.
【０００５】[0005]
【課題を解決するための手段】本発明は、上記の目的を
実現するため、絶縁テープの片面に形成された銅箔回路
パターン上に半田ボールをアレイ状に配置し、前記絶縁
テープの他面に補強用のスティフナーを接着するととも
に前記スティフナー上に半導体素子を固定し、前記半導
体素子と銅箔回路パターンをボンディングワイヤで接続
したＢＧＡ型半導体装置において、前記スティフナー
は、前記絶縁テープの前記他面に接着剤を介して直接に
接着されるとともに所定の位置にアウターホールを有
し、前記絶縁テープは、前記スティフナーの前記アウタ
ーホールに対応する位置に前記銅箔回路パターンを前記
他面に露出するアウターホールを有し、前記ボンディン
グワイヤは、前記スティフナーの前記アウターホールと
前記絶縁テープの前記アウターホールを通って前記半導
体素子と前記銅箔回路パターンを接続する構成を有する
ことを特徴とするＢＧＡ型半導体装置を提供する。According to the present invention, in order to achieve the above object, solder balls are arranged in an array on a copper foil circuit pattern formed on one surface of an insulating tape, and the other surface of the insulating tape is provided. In a BGA type semiconductor device in which a reinforcing stiffener is adhered to the semiconductor element and the semiconductor element is fixed on the stiffener, and the semiconductor element and a copper foil circuit pattern are connected by bonding wires, the stiffener is the other surface of the insulating tape. And has an outer hole at a predetermined position, and the insulating tape exposes the copper foil circuit pattern on the other surface at a position corresponding to the outer hole of the stiffener. An outer hole is provided, and the bonding wire is provided between the outer hole of the stiffener and the insulating tape. Providing BGA type semiconductor device characterized by having a configuration of connecting the copper foil circuit pattern and the semiconductor element through the Utahoru.
【０００６】本発明のＢＧＡ型半導体装置において、ス
ティフナーは、少くともアウターホールの内周縁を含む
所定の領域が絶縁されていてもよく、また、絶縁テープ
は、厚さが１００μｍ以下のポリイミドテープであり、
銅箔回路パターンは、３５μｍ以下の厚さを有するとと
もに厚さが３５μｍ以下の熱硬化性接着剤によって絶縁
テープに接着されている。更に、スティフナーは、厚さ
が５０μｍ以下で軟化点が２５０℃以下の熱可塑性接着
剤によって前記絶縁テープに接着されているか、厚さが
５０μｍ以下の熱硬化性接着剤によって絶縁テープに接
着されており、ある場合には、ボンディングワイヤによ
ってグランド電位に接続されている。In the BGA type semiconductor device of the present invention, the stiffener may be insulated at least in a predetermined region including the inner peripheral edge of the outer hole, and the insulating tape is a polyimide tape having a thickness of 100 μm or less. Yes,
The copper foil circuit pattern has a thickness of 35 μm or less and is bonded to the insulating tape with a thermosetting adhesive having a thickness of 35 μm or less. Further, the stiffener is adhered to the insulating tape by a thermoplastic adhesive having a thickness of 50 μm or less and a softening point of 250 ° C. or less, or adhered to the insulating tape by a thermosetting adhesive having a thickness of 50 μm or less. In some cases, it is connected to the ground potential by a bonding wire.
【０００７】[0007]
【発明の実施の形態】以下、本発明のＢＧＡ型半導体装
置の形態を詳細に説明する。図１は本発明のＢＧＡ型半
導体装置の実施の形態を示し、厚さ５０μｍ以下のポリ
イミドフィルム（例えば「ユーピレックス」の商品名で
販売されているもの）１と、ポリイミドフィルム１の片
面に熱硬化性接着剤で接着されている銅箔回路パターン
６と、ポリイミドフィルム１の他面にポリイミド系熱可
塑性接着剤２で接着されているスティフナー３と、ステ
ィフナー３に接着剤４で接着されている半導体素子５
と、ソルダーレジスト９で保護されている銅箔回路パタ
ーン６に接続されている半田ボール１０と、所定の部分
を封止および補強するモールド樹脂８を備えている。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the BGA type semiconductor device of the present invention will be described in detail. FIG. 1 shows an embodiment of a BGA type semiconductor device according to the present invention, in which a polyimide film 1 having a thickness of 50 μm or less (for example, sold under the trade name of “UPILEX”) 1 and one side of the polyimide film 1 are thermoset. A copper foil circuit pattern 6 bonded with a non-conductive adhesive, a stiffener 3 bonded to the other surface of the polyimide film 1 with a polyimide thermoplastic adhesive 2, and a semiconductor bonded to the stiffener 3 with an adhesive 4. Element 5
And a solder ball 10 connected to the copper foil circuit pattern 6 protected by the solder resist 9 and a mold resin 8 for sealing and reinforcing a predetermined portion.
【０００８】ポリイミドテープ１はアウターホール１Ａ
を有し、スティフナー３はアウターホール３Ａを有し、
これによって銅箔回路パターン６はその部分で半導体素
子５の側で露出している。半導体素子５のパッド（図示
せず）はボンディングワイヤ７でアウターホール３Ａ、
１Ａを介して銅箔回路パターン６と接続されており、半
導体素子５およびアウターホール３Ａ、１Ａはボンディ
ングワイヤ７を封入する形でモールド樹脂８で封止され
ている。モールド樹脂８は銅箔回路パターン６にアウタ
ーホール３Ａ、１Ａの反対側でも施されており、銅箔回
路パターン６のこの部分を補強している。The polyimide tape 1 has an outer hole 1A.
And the stiffener 3 has an outer hole 3A,
As a result, the copper foil circuit pattern 6 is exposed at that portion on the side of the semiconductor element 5. Pads (not shown) of the semiconductor element 5 are bonded to the outer holes 3A by bonding wires 7,
The semiconductor element 5 and the outer holes 3A, 1A are sealed with a mold resin 8 so as to enclose a bonding wire 7 with the copper foil circuit pattern 6 via 1A. The mold resin 8 is also applied to the copper foil circuit pattern 6 on the side opposite to the outer holes 3A, 1A, and reinforces this portion of the copper foil circuit pattern 6.
【０００９】図２はスティフナー３のアウターホール３
Ａを介して半導体素子５のパッド５Ａと銅箔回路パター
ン６がボンディングワイヤ７で接続されている構造を示
す。FIG. 2 shows the outer hole 3 of the stiffener 3.
1 shows a structure in which a pad 5A of a semiconductor element 5 and a copper foil circuit pattern 6 are connected by a bonding wire 7 via A.
【００１０】図３より図１１は本発明のＢＧＡ型半導体
装置の製造工程を示す。［図３］アウターホール３Ａを
有する複数のスティフナー３を外枠３Ｂで一体化したも
のを準備する。外枠３Ｂは搬送用の孔３Ｃを有する。こ
の外枠３Ｂを通常のリードフレームと同じパターンにす
ると、ＴＡＢテープに貼り合わせた後の処理、例えば、
接着剤の塗布、ワイヤボンディング、樹脂のモールド、
半田ボールの固着等の後処理をリードフレームの後処理
装置を利用して行うことができる。FIG. 3 to FIG. 11 show a manufacturing process of the BGA type semiconductor device of the present invention. [FIG. 3] A plurality of stiffeners 3 having outer holes 3A integrated with an outer frame 3B are prepared. The outer frame 3B has a hole 3C for conveyance. If this outer frame 3B is formed in the same pattern as a normal lead frame, processing after pasting to a TAB tape, for example,
Application of adhesive, wire bonding, resin molding,
Post-processing such as fixing of solder balls can be performed using a post-processing device of the lead frame.
【００１１】［図４］ＴＡＢテープを準備する。ＴＡＢ
テープは、厚さ５０μｍのポリイミドテープ（ユーピレ
ックス）１と、その片面に厚さ２５μｍの熱硬化性接着
剤（図示せず）を介して接着された厚さ１８μｍのＳＬ
Ｐ銅箔６と、ポリイミドテープ１の他面に形成された厚
さ２０μｍの軟化点が２５０℃以下のポリイミド系熱可
塑性接着剤（あるいは熱硬化性接着剤）２によって構成
されている。ＳＬＰ銅箔６は通常のＴＡＢ工程を経て銅
箔回路パターン６にされる。銅箔回路パターン６は表面
にＰｂ，Ａｇ，あるいはＡｕがめっきされる。このＴＡ
Ｂテープはパンチングによってアウターホール１Ａを形
成され、また、搬送用の孔１Ｂを形成される。[FIG. 4] A TAB tape is prepared. TAB
The tape is a polyimide tape (upilex) 1 having a thickness of 50 μm, and a SL having a thickness of 18 μm adhered to one surface of the tape via a thermosetting adhesive (not shown) having a thickness of 25 μm.
It is composed of a P copper foil 6 and a polyimide-based thermoplastic adhesive (or thermosetting adhesive) 2 having a softening point of 20 μm and a softening point of 250 ° C. or less formed on the other surface of the polyimide tape 1. The SLP copper foil 6 is formed into a copper foil circuit pattern 6 through a normal TAB process. The copper foil circuit pattern 6 is plated with Pb, Ag, or Au on the surface. This TA
The B tape has an outer hole 1A formed by punching and a transport hole 1B.
【００１２】［図５］図３に示したスティフナー３に図
４のＴＡＢテープを位置合わせする。[FIG. 5] The TAB tape shown in FIG. 4 is aligned with the stiffener 3 shown in FIG.
【００１３】［図６］図５で位置合わせした後、スティ
フナー３に熱可塑性接着剤２を介してＴＡＢテープを接
着して一体化する。[FIG. 6] After alignment in FIG. 5, a TAB tape is adhered to the stiffener 3 via the thermoplastic adhesive 2 to be integrated.
【００１４】［図７］銅箔回路パターン６の所定の領域
に後の工程で半田ボール１０を搭載する前に所定の形状
のソルダーレジスト９を塗布あるいは貼り付ける。[FIG. 7] A solder resist 9 having a predetermined shape is applied or affixed to a predetermined area of the copper foil circuit pattern 6 before mounting the solder ball 10 in a later step.
【００１５】［図８］スティフナー３上に接着剤４を塗
布してスティフナー３に半導体素子５を固定する。[FIG. 8] An adhesive 4 is applied on the stiffener 3 to fix the semiconductor element 5 to the stiffener 3.
【００１６】［図９］ポリイミドテープ１のアウターホ
ール１Ａ、およびスティフナー３のアウターホール３Ａ
に対応する銅箔回路パターン６の部分にワイヤボンディ
ング加熱用のヒータ１１を直接に接触させる。次に、半
導体素子５のパッド（図２の５Ａ）と銅箔回路パターン
６をアウターホール３Ａ、１Ａを介しててボンディング
ワイヤ７で接続する。[FIG. 9] Outer hole 1A of polyimide tape 1 and outer hole 3A of stiffener 3
The heater 11 for wire bonding heating is brought into direct contact with the portion of the copper foil circuit pattern 6 corresponding to. Next, the pads (5A in FIG. 2) of the semiconductor element 5 and the copper foil circuit pattern 6 are connected by bonding wires 7 via the outer holes 3A and 1A.
【００１７】［図１０］ワイヤボンディングした後、全
体を上下のモールド金型１２Ａ、１２Ｂの内部に装填
し、樹脂注入孔１３よりモールド樹脂を注入する。図中
の矢印はモールド樹脂の流れを示す。[FIG. 10] After wire bonding, the whole is loaded into upper and lower mold dies 12A and 12B, and a mold resin is injected through a resin injection hole 13. Arrows in the figure indicate the flow of the mold resin.
【００１８】［図１１］モールド樹脂の注入後、冷却工
程を経て型抜きされる。次に、銅箔回路パターン６に半
田ボール１０を固着する。最後に、スティフナー３の不
要部分を切除する。その結果、図１に示したＢＧＡ型半
導体装置となる。[FIG. 11] After injection of the mold resin, the mold is removed through a cooling step. Next, the solder ball 10 is fixed to the copper foil circuit pattern 6. Finally, unnecessary portions of the stiffener 3 are cut off. As a result, the BGA type semiconductor device shown in FIG. 1 is obtained.
【００１９】図１２は完成前の状態でアウターホール３
Ａ、１Ａを介して銅箔回路パターン６に電気特性チェッ
クプローバ１５を接触させているところを示す。これに
よって、半導体素子５等の電気特性をチェックすること
ができる。FIG. 12 shows an outer hole 3 before completion.
3A shows a state in which the electrical property check prober 15 is in contact with the copper foil circuit pattern 6 via A and 1A. Thus, the electrical characteristics of the semiconductor element 5 and the like can be checked.
【００２０】図１３は本発明のＢＧＡ型半導体装置の他
の実施の形態を示し、ボンディングワイヤ７Ａによって
スティフナー３をグランド電位にする構成を有する。こ
の場合、スティフナー３の露出部を絶縁物で被覆してボ
ンディングワイヤ７が接地しないようにすることが望ま
しい。FIG. 13 shows another embodiment of the BGA type semiconductor device according to the present invention, in which the stiffener 3 is set to the ground potential by the bonding wire 7A. In this case, it is desirable to cover the exposed portion of the stiffener 3 with an insulator so that the bonding wire 7 is not grounded.
【００２１】図１４は本発明のＢＧＡ型半導体装置の他
の実施の形態を示し、スティフナー３の端部にポリイミ
ドワニス等の絶縁被覆１６を設けた構成を有する。これ
によって、ボンディングワイヤ７がショートする恐れを
避けることができる。この構成は、本発明のＢＧＡ型半
導体装置を安定的に量産するのに望ましい。FIG. 14 shows another embodiment of the BGA type semiconductor device according to the present invention, which has a structure in which an insulating coating 16 such as a polyimide varnish is provided on the end of the stiffener 3. Thus, the risk of short-circuiting of the bonding wire 7 can be avoided. This configuration is desirable for stably mass-producing the BGA type semiconductor device of the present invention.
【００２２】[0022]
【発明の効果】以上説明した通り、本発明のＢＧＡ型半
導体装置によると、スティフナーに直接半導体素子を固
定するため、材料費を下げるとともに生産性を高めるこ
とができ、また、ＴＡＢテープの絶縁テープとスティフ
ナーにアウターホールを設けて銅箔回路パターンを露出
するようにしたため、安定したワイヤボンディング性を
得ることができる。As described above, according to the BGA type semiconductor device of the present invention, since the semiconductor element is directly fixed to the stiffener, the material cost can be reduced and the productivity can be increased. The stiffener is provided with an outer hole to expose the copper foil circuit pattern, so that a stable wire bonding property can be obtained.
【図１】本発明のＢＧＡ型半導体装置の実施の形態を示
す断面図。FIG. 1 is a sectional view showing an embodiment of a BGA type semiconductor device of the present invention.
【図２】本発明のＢＧＡ型半導体装置の実施の形態を示
す平面図。FIG. 2 is a plan view showing an embodiment of a BGA type semiconductor device of the present invention.
【図３】本発明のＢＧＡ型半導体装置の製造工程を示す
断面図。FIG. 3 is a sectional view showing a manufacturing process of the BGA type semiconductor device of the present invention.
【図４】本発明のＢＧＡ型半導体装置の製造工程を示す
断面図。FIG. 4 is a sectional view showing a manufacturing process of the BGA type semiconductor device of the present invention.
【図５】本発明のＢＧＡ型半導体装置の製造工程を示す
断面図。FIG. 5 is a sectional view showing a manufacturing process of the BGA type semiconductor device of the present invention.
【図６】本発明のＢＧＡ型半導体装置の製造工程を示す
断面図。FIG. 6 is a sectional view showing a manufacturing process of the BGA type semiconductor device of the present invention.
【図７】本発明のＢＧＡ型半導体装置の製造工程を示す
断面図。FIG. 7 is a sectional view showing a manufacturing process of the BGA type semiconductor device of the present invention.
【図８】本発明のＢＧＡ型半導体装置の製造工程を示す
断面図。FIG. 8 is a sectional view showing a manufacturing process of the BGA type semiconductor device of the present invention.
【図９】本発明のＢＧＡ型半導体装置の製造工程を示す
断面図。FIG. 9 is a sectional view showing a manufacturing process of the BGA type semiconductor device of the present invention.
【図１０】本発明のＢＧＡ型半導体装置の製造工程を示
す断面図。FIG. 10 is a sectional view showing a manufacturing process of the BGA type semiconductor device of the present invention.
【図１１】本発明のＢＧＡ型半導体装置の製造工程を示
す断面図。FIG. 11 is a sectional view showing a manufacturing process of the BGA type semiconductor device of the present invention.
【図１２】本発明のＢＧＡ型半導体装置の完成前の電気
特性のチェックを示す断面図。FIG. 12 is a cross-sectional view showing a check of electrical characteristics before completion of the BGA type semiconductor device of the present invention.
【図１３】本発明のＢＧＡ型半導体装置の他の実施の形
態を示す断面図。FIG. 13 is a sectional view showing another embodiment of the BGA type semiconductor device of the present invention.
【図１４】本発明のＢＧＡ型半導体装置の他の実施の形
態を示す断面図。FIG. 14 is a sectional view showing another embodiment of the BGA type semiconductor device of the present invention.
【図１５】従来のＢＧＡ型半導体装置を示す断面図。FIG. 15 is a sectional view showing a conventional BGA type semiconductor device.
１ ポリイミドテープ １Ａ アウターホール ２ 熱可塑性接着剤 ３ スティフナー ３Ａ アウターホール ４ 接着剤 ５ 半導体素子 ６ 銅箔回路パターン ７ ボンディングワイヤ ８ モールド樹脂 ９ ソルダーレジスト １０ 半田ボール DESCRIPTION OF SYMBOLS 1 Polyimide tape 1A Outer hole 2 Thermoplastic adhesive 3 Stiffener 3A Outer hole 4 Adhesive 5 Semiconductor element 6 Copper foil circuit pattern 7 Bonding wire 8 Mold resin 9 Solder resist 10 Solder ball
フロントページの続き (72)発明者 御田 護 茨城県日立市助川町３丁目１番１号 日立 電線株式会社電線工場内 (72)発明者 米本 隆治 茨城県土浦市木田余町3550番地 日立電線 株式会社システムマテリアル研究所内Continuing from the front page (72) Inventor: Mamoru Mita 3-1-1, Sukekawa-cho, Hitachi-shi, Ibaraki Hitachi Cable Co., Ltd. Wire Plant (72) Inventor: Ryuji Yonemoto 3550 Kida Yomachi, Tsuchiura-shi, Ibaraki Hitachi Cable Company System Materials Laboratory
Claims (6)
パターン上に半田ボールをアレイ状に配置し、前記絶縁
テープの他面に補強用のスティフナーを接着するととも
に前記スティフナー上に半導体素子を固定し、前記半導
体素子と銅箔回路パターンをボンディングワイヤで接続
したＢＧＡ型半導体装置において、 前記スティフナーは、前記絶縁テープの前記他面に接着
剤を介して直接に接着されるとともに所定の位置にアウ
ターホールを有し、 前記絶縁テープは、前記スティフナーの前記アウターホ
ールに対応する位置に前記銅箔回路パターンを前記他面
に露出するアウターホールを有し、 前記ボンディングワイヤは、前記スティフナーの前記ア
ウターホールと前記絶縁テープの前記アウターホールを
通って前記半導体素子と前記銅箔回路パターンを接続す
る構成を有することを特徴とするＢＧＡ型半導体装置。1. A solder ball is arranged in an array on a copper foil circuit pattern formed on one surface of an insulating tape, a reinforcing stiffener is bonded to the other surface of the insulating tape, and a semiconductor element is mounted on the stiffener. In the BGA type semiconductor device in which the semiconductor element is fixed and the copper foil circuit pattern is connected by a bonding wire, the stiffener is directly adhered to the other surface of the insulating tape via an adhesive, and at a predetermined position. An outer hole, wherein the insulating tape has an outer hole exposing the copper foil circuit pattern on the other surface at a position corresponding to the outer hole of the stiffener, and the bonding wire is an outer member of the stiffener. The semiconductor element and the copper foil circuit through the hole and the outer hole of the insulating tape A BGA type semiconductor device having a structure for connecting patterns.
ターホールの内周縁を含む所定の領域が絶縁されている
構成の請求項１記載のＢＧＡ型半導体装置。2. The BGA type semiconductor device according to claim 1, wherein said stiffener is configured such that at least a predetermined region including an inner peripheral edge of said outer hole is insulated.
下のポリイミドテープであり、 前記銅箔回路パターンは、３５μｍ以下の厚さを有する
とともに厚さが３５μｍ以下の熱硬化性接着剤によって
前記絶縁テープに接着されている構成の請求項１記載の
ＢＧＡ型半導体装置。3. The insulating tape is a polyimide tape having a thickness of 100 μm or less, and the copper foil circuit pattern has a thickness of 35 μm or less and is insulated by a thermosetting adhesive having a thickness of 35 μm or less. 2. The BGA type semiconductor device according to claim 1, wherein said BGA type semiconductor device is bonded to a tape.
下で軟化点が２５０℃以下の熱可塑性接着剤によって前
記絶縁テープに接着されている構成の請求項１記載のＢ
ＧＡ型半導体装置。4. The stiffener according to claim 1, wherein said stiffener is bonded to said insulating tape by a thermoplastic adhesive having a thickness of 50 μm or less and a softening point of 250 ° C. or less.
GA type semiconductor device.
下の熱硬化性接着剤によって前記絶縁テープに接着され
ている構成の請求項１記載のＢＧＡ型半導体装置。5. The BGA type semiconductor device according to claim 1, wherein said stiffener is bonded to said insulating tape with a thermosetting adhesive having a thickness of 50 μm or less.
ヤによってグランド電位に接続されている構成の請求項
１記載のＢＧＡ型半導体装置。6. The BGA type semiconductor device according to claim 1, wherein said stiffener is connected to a ground potential by a bonding wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26252097A JP3460533B2 (en) | 1997-09-26 | 1997-09-26 | BGA type semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26252097A JP3460533B2 (en) | 1997-09-26 | 1997-09-26 | BGA type semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11102989A true JPH11102989A (en) | 1999-04-13 |
| JP3460533B2 JP3460533B2 (en) | 2003-10-27 |
Family
ID=17376955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26252097A Expired - Fee Related JP3460533B2 (en) | 1997-09-26 | 1997-09-26 | BGA type semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3460533B2 (en) |
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|---|---|---|---|---|
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|---|---|---|---|---|
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| US7859101B2 (en) * | 2000-12-22 | 2010-12-28 | Broadcom Corporation | Die-up ball grid array package with die-attached heat spreader |
| US6989593B2 (en) * | 2000-12-22 | 2006-01-24 | Broadcom Corporation | Die-up ball grid array package with patterned stiffener opening |
| US7005737B2 (en) * | 2000-12-22 | 2006-02-28 | Broadcom Corporation | Die-up ball grid array package with enhanced stiffener |
| US7038312B2 (en) * | 2000-12-22 | 2006-05-02 | Broadcom Corporation | Die-up ball grid array package with attached stiffener ring |
| US6879039B2 (en) | 2001-12-18 | 2005-04-12 | Broadcom Corporation | Ball grid array package substrates and method of making the same |
| EP1333491A2 (en) | 2002-02-01 | 2003-08-06 | Broadcom Corporation | Ball grid array package enhanced with a thermal and electrical connector |
| EP1361611A2 (en) * | 2002-02-01 | 2003-11-12 | Broadcom Corporation | Ball grid array package with stepped stiffener layer |
| EP1333491B1 (en) * | 2002-02-01 | 2017-04-26 | Broadcom Corporation | Ball grid array package enhanced with a thermal and electrical connector |
| EP1361611B1 (en) * | 2002-02-01 | 2017-04-26 | Broadcom Corporation | Ball grid array package with stepped stiffener layer |
| EP1351293A3 (en) * | 2002-03-21 | 2006-11-02 | Broadcom Corporation | Die-up ball grid array package with two substrates and method for making the same |
| US6876553B2 (en) | 2002-03-21 | 2005-04-05 | Broadcom Corporation | Enhanced die-up ball grid array package with two substrates |
| US7772107B2 (en) | 2006-10-03 | 2010-08-10 | Sandisk Corporation | Methods of forming a single layer substrate for high capacity memory cards |
| WO2008042657A3 (en) * | 2006-10-03 | 2008-05-22 | Sandisk Corp | Methods of formimg a single layer substrate for high capacity memory cards |
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| US7573131B2 (en) * | 2006-10-27 | 2009-08-11 | Compass Technology Co., Ltd. | Die-up integrated circuit package with grounded stiffener |
| JP2009135193A (en) * | 2007-11-29 | 2009-06-18 | Powertech Technology Inc | Semiconductor chip device with silicon through hole, and manufacturing method thereof |
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