JP3830169B2 - コンピュータ - Google Patents

コンピュータ Download PDF

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Publication number
JP3830169B2
JP3830169B2 JP54711898A JP54711898A JP3830169B2 JP 3830169 B2 JP3830169 B2 JP 3830169B2 JP 54711898 A JP54711898 A JP 54711898A JP 54711898 A JP54711898 A JP 54711898A JP 3830169 B2 JP3830169 B2 JP 3830169B2
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JP
Japan
Prior art keywords
heat
thermal
computer
electrical
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP54711898A
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English (en)
Japanese (ja)
Other versions
JP2001524265A5 (enExample
JP2001524265A (ja
Inventor
バーシャ・ラケッシュ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
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Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of JP2001524265A publication Critical patent/JP2001524265A/ja
Publication of JP2001524265A5 publication Critical patent/JP2001524265A5/ja
Application granted granted Critical
Publication of JP3830169B2 publication Critical patent/JP3830169B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP54711898A 1997-04-25 1998-04-22 コンピュータ Expired - Fee Related JP3830169B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/846,113 US5898569A (en) 1997-04-25 1997-04-25 Power cable heat exchanger for a computing device
US08/846,113 1997-04-25
PCT/US1998/008162 WO1998049879A1 (en) 1997-04-25 1998-04-22 Power cable heat exchanger for computing device

Publications (3)

Publication Number Publication Date
JP2001524265A JP2001524265A (ja) 2001-11-27
JP2001524265A5 JP2001524265A5 (enExample) 2005-12-02
JP3830169B2 true JP3830169B2 (ja) 2006-10-04

Family

ID=25296982

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54711898A Expired - Fee Related JP3830169B2 (ja) 1997-04-25 1998-04-22 コンピュータ

Country Status (4)

Country Link
US (1) US5898569A (enExample)
JP (1) JP3830169B2 (enExample)
AU (1) AU7255098A (enExample)
WO (1) WO1998049879A1 (enExample)

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* Cited by examiner, † Cited by third party
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JPH11121666A (ja) * 1997-10-20 1999-04-30 Fujitsu Ltd マルチチップモジュールの冷却装置
AU3098399A (en) * 1998-03-20 1999-10-11 Speck Product Design Thermally efficient portable computer system and method incorporating thermal connection port and dock
JP4015754B2 (ja) * 1998-06-23 2007-11-28 株式会社東芝 冷却装置および冷却装置を有する電子機器
JP3076314B2 (ja) * 1998-11-04 2000-08-14 新潟日本電気株式会社 携帯型情報処理装置の冷却方式
KR100543440B1 (ko) * 1998-12-01 2006-03-23 삼성전자주식회사 교류/직류 전압 변환 장치 및 그것을 구비하는 휴대용 전자 시스템
JP2000172378A (ja) * 1998-12-04 2000-06-23 Sony Corp 冷却補助装置、冷却補助方法、電子機器、および情報処理装置
JP3330558B2 (ja) * 1999-02-25 2002-09-30 インターナショナル・ビジネス・マシーンズ・コーポレーション ケーブルおよび放熱装置
EP1162533A4 (en) * 1999-03-11 2007-10-17 Fujitsu Ltd ELECTRICAL DEVICE AND ELECTRICAL PART
US6172871B1 (en) * 1999-03-31 2001-01-09 International Business Machines Corporation Method and system in a data processing system for efficiently cooling a portable computer system
JP2000349481A (ja) * 1999-03-31 2000-12-15 Internatl Business Mach Corp <Ibm> コンピューター冷却装置、コンピューター、及びコンピューターアッセンブリ
US6229704B1 (en) * 1999-10-19 2001-05-08 Dell Usa, L.P. Thermal connection system for modular computer system components
US6307746B1 (en) * 1999-12-06 2001-10-23 Gateway, Inc. Power adapter having a thermal cooling assembly for a digital information appliance
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US6597569B1 (en) * 2000-06-29 2003-07-22 Intel Corporation Partitioned computer platform
US6657859B1 (en) * 2000-06-30 2003-12-02 Intel Corporation Device bay heat exchanger for a portable computing device
DE20013029U1 (de) * 2000-07-27 2000-12-14 Yu, Ming-Chuan, Taoyuan Kühlunterlage für Notebook
USD449048S1 (en) 2000-08-02 2001-10-09 Ming-Chuan Yu Cooling rack for notebook computer
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US6459575B1 (en) * 2001-05-15 2002-10-01 Hewlett-Packard Company Cooling module for portable computer
US6415612B1 (en) 2001-06-29 2002-07-09 Intel Corporation Method and apparatus for external cooling an electronic component of a mobile hardware product, particularly a notebook computer, at a docking station having a thermoelectric cooler
US6674640B2 (en) * 2001-07-02 2004-01-06 Intel Corporation Increased thermal capability of portable electronic device in stationary or docked mode
US6674643B2 (en) * 2001-08-09 2004-01-06 International Business Machines Corporation Thermal connector for transferring heat between removable printed circuit boards
JP4512296B2 (ja) * 2001-08-22 2010-07-28 株式会社日立製作所 可搬型情報処理装置の液冷システム
US6754072B2 (en) 2001-09-24 2004-06-22 International Business Machines Corporation Portable device for cooling a laptop computer
US6741465B2 (en) * 2002-03-29 2004-05-25 Intel Corporation Cooling method and apparatus for handheld devices
US6542370B1 (en) * 2002-05-02 2003-04-01 Waffer Technology Corporation Heat dissipating device for a CPU
TWI250203B (en) * 2002-12-31 2006-03-01 Hon Hai Prec Ind Co Ltd Thermal interface material
TW557119U (en) * 2003-01-24 2003-10-01 Delta Electronics Inc Casing structure capable of dissipating heat for electronic apparatus
TW200500838A (en) * 2003-02-19 2005-01-01 Nisvara Inc System and apparatus for heat removal
FR2855711B1 (fr) * 2003-05-26 2005-08-05 Canon Europa Nv Systeme et dispositif de dissipation de chaleur dans un equipement electronique
JP4311538B2 (ja) * 2003-06-27 2009-08-12 株式会社日立製作所 ディスク記憶装置の冷却構造
US20050168941A1 (en) * 2003-10-22 2005-08-04 Sokol John L. System and apparatus for heat removal
TWI260966B (en) * 2004-10-28 2006-08-21 Quanta Comp Inc Heat dissipation device
TWI265775B (en) * 2005-04-15 2006-11-01 High Tech Comp Corp Portable electronic device and heat dissipation method and cradle thereof
JP2007088282A (ja) * 2005-09-22 2007-04-05 Mitsubishi Electric Corp 周辺機器及び電子機器
US20080253082A1 (en) * 2007-04-12 2008-10-16 Lev Jeffrey A Cooling system with flexible heat transport element
US8198757B2 (en) * 2009-03-04 2012-06-12 International Business Machines Corporation Energy savings for a system powering a lower voltage device from a higher voltage power source, and wherein the system includes a power plug that outputs power to a converter, and a switch actuator
US8208250B2 (en) * 2009-04-08 2012-06-26 Intel Corporation External thermal solution for a mobile computing device
CN102231085A (zh) * 2009-10-22 2011-11-02 鸿富锦精密工业（深圳）有限公司 笔记本电脑外置散热装置
TWI381268B (zh) * 2009-12-04 2013-01-01 Wistron Neweb Corp 通用序列匯流排裝置
TWM391129U (en) * 2010-04-19 2010-10-21 Wistron Corp Power supply having heat dissipation function and its combination with an electronic device
US8405975B2 (en) * 2011-01-11 2013-03-26 Dell Products L.P. Dual mode portable information handling system cooling
CN102346530A (zh) * 2011-06-27 2012-02-08 苏州天擎电子通讯有限公司 一种带有风扇功能的笔记本电脑适配器
US8632354B2 (en) * 2011-08-16 2014-01-21 Micron Technology, Inc. Interconnection systems
US20130309899A1 (en) * 2012-05-15 2013-11-21 Motorola Mobility, Inc. Connector and system for cooling electronic devices
US8982560B2 (en) * 2012-12-28 2015-03-17 Intel Corporation Thermal management of an electronic device
US9060433B2 (en) 2013-01-04 2015-06-16 International Business Machines Corporation Thermal dissipative retractable flex assembly
US9268376B2 (en) * 2013-01-09 2016-02-23 Google Technology Holdings LLC Mobile computing device dock station with headset jack heat pipe interface
US8926360B2 (en) * 2013-01-17 2015-01-06 Cooper Technologies Company Active cooling of electrical connectors
US9093764B2 (en) 2013-01-17 2015-07-28 Cooper Technologies Company Electrical connectors with force increase features
CN103970309A (zh) * 2013-01-31 2014-08-06 鸿富锦精密电子(天津)有限公司 鼠标垫
DE102013207000A1 (de) * 2013-04-18 2014-10-23 Robert Bosch Gmbh Steuergerät für ein Kraftfahrzeug mit einem zum Wärmetransport ausgebildeten Steckanschluss
US9642289B2 (en) * 2013-09-19 2017-05-02 Infineon Technologies Austria Ag Power supply and method
US9414527B2 (en) 2014-11-06 2016-08-09 International Business Machines Corporation Thermal spreading for an externally pluggable electronic module
US20170049004A1 (en) * 2015-08-10 2017-02-16 Yu-Wen Tsai Heat Dissipation Device With Charging Function
CN206100746U (zh) * 2016-07-11 2017-04-12 嘉基电子科技(苏州)有限公司 散热器组合装置
US10928855B2 (en) 2018-12-20 2021-02-23 Dell Products, L.P. Dock with actively controlled heatsink for a multi-form factor Information Handling System (IHS)
CN109874279A (zh) * 2019-03-29 2019-06-11 联想(北京)有限公司 电子设备
US11665854B2 (en) * 2020-03-27 2023-05-30 Thales Defense & Security, Inc. Thermal mitigation device for application in radio batteries and/or adaptors and methods of use thereof
JP2022021539A (ja) * 2020-07-22 2022-02-03 キヤノン株式会社 電子機器および電子機器システム
JP7657645B2 (ja) * 2021-04-16 2025-04-07 キヤノン株式会社 電子機器
JP7693374B2 (ja) * 2021-04-16 2025-06-17 キヤノン株式会社 放熱装置
GB2639242A (en) * 2024-03-13 2025-09-17 Harting Int Innovation Ag Connector for cooling and energizing electronic devices

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US5077637A (en) * 1989-09-25 1991-12-31 The Charles Stark Draper Lab., Inc. Solid state directional thermal cable
US5007858A (en) * 1990-04-20 1991-04-16 Amp Incorporated Electrical connector for flat power cable
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US5255109A (en) * 1992-04-23 1993-10-19 Pc Tech Inc. Heat dissipating LCD display
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US5475563A (en) * 1994-10-27 1995-12-12 Compaq Computer Corporation PCMCIA card heat removal apparatus and methods
US5513070A (en) * 1994-12-16 1996-04-30 Intel Corporation Dissipation of heat through keyboard using a heat pipe
US5598320A (en) * 1995-03-06 1997-01-28 Ast Research, Inc. Rotable and slideble heat pipe apparatus for reducing heat build up in electronic devices
US5559675A (en) * 1995-03-28 1996-09-24 Twinhead International Corp. Computer CPU heat dissipating and protecting device

Also Published As

Publication number Publication date
US5898569A (en) 1999-04-27
AU7255098A (en) 1998-11-24
WO1998049879A1 (en) 1998-11-05
JP2001524265A (ja) 2001-11-27

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