FR2855711B1 - Systeme et dispositif de dissipation de chaleur dans un equipement electronique - Google Patents

Systeme et dispositif de dissipation de chaleur dans un equipement electronique

Info

Publication number
FR2855711B1
FR2855711B1 FR0306382A FR0306382A FR2855711B1 FR 2855711 B1 FR2855711 B1 FR 2855711B1 FR 0306382 A FR0306382 A FR 0306382A FR 0306382 A FR0306382 A FR 0306382A FR 2855711 B1 FR2855711 B1 FR 2855711B1
Authority
FR
France
Prior art keywords
electronic equipment
dissipating heat
dissipating
heat
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0306382A
Other languages
English (en)
Other versions
FR2855711A1 (fr
Inventor
Herve Merlet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Europa NV
Original Assignee
Canon Europa NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Europa NV filed Critical Canon Europa NV
Priority to FR0306382A priority Critical patent/FR2855711B1/fr
Publication of FR2855711A1 publication Critical patent/FR2855711A1/fr
Priority to US11/058,089 priority patent/US7027301B2/en
Application granted granted Critical
Publication of FR2855711B1 publication Critical patent/FR2855711B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/02—Details
    • H02G3/04—Protective tubing or conduits, e.g. cable ladders or cable troughs
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/02—Details
    • H02G3/08—Distribution boxes; Connection or junction boxes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FR0306382A 2003-05-26 2003-05-26 Systeme et dispositif de dissipation de chaleur dans un equipement electronique Expired - Fee Related FR2855711B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR0306382A FR2855711B1 (fr) 2003-05-26 2003-05-26 Systeme et dispositif de dissipation de chaleur dans un equipement electronique
US11/058,089 US7027301B2 (en) 2003-05-26 2005-02-14 System and apparatus for heat dissipation in an electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0306382A FR2855711B1 (fr) 2003-05-26 2003-05-26 Systeme et dispositif de dissipation de chaleur dans un equipement electronique

Publications (2)

Publication Number Publication Date
FR2855711A1 FR2855711A1 (fr) 2004-12-03
FR2855711B1 true FR2855711B1 (fr) 2005-08-05

Family

ID=33427454

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0306382A Expired - Fee Related FR2855711B1 (fr) 2003-05-26 2003-05-26 Systeme et dispositif de dissipation de chaleur dans un equipement electronique

Country Status (2)

Country Link
US (1) US7027301B2 (fr)
FR (1) FR2855711B1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7466042B2 (en) * 2005-04-06 2008-12-16 Flexsil, Inc. Universal DC power
US20070029879A1 (en) * 2005-08-04 2007-02-08 Eldredge James G Distribution of universal DC power in buildings
US7379298B2 (en) * 2006-03-17 2008-05-27 Kell Systems Noise proofed ventilated air intake chamber for electronics equipment enclosure
US7379299B2 (en) * 2006-03-17 2008-05-27 Kell Systems Noiseproofed and ventilated enclosure for electronics equipment
US8755187B2 (en) * 2006-06-02 2014-06-17 Siemens Industry, Inc. Systems, devices, and methods, including a basepan comprising a banding stud for increasing current carrying capacity
US20090210813A1 (en) * 2008-02-15 2009-08-20 Sawczak Stephen D Systems and methods for computer equipment management
FR2934906B1 (fr) * 2008-08-05 2010-09-03 Thales Sa Calculateur embarque equipe d'un dispositif de refroidissement aeraulique autonome
US10993353B2 (en) * 2014-09-29 2021-04-27 Hewlett Packard Enterprise Development Lp Fan controlled ambient air cooling of equipment in a controlled airflow environment
CN105828577B (zh) * 2016-03-28 2019-03-08 联想(北京)有限公司 电子设备及其控制方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3735020A (en) * 1971-09-29 1973-05-22 Lutron Electronics Co Heat sink wall plate with off-center mounting openings
JPH01264513A (ja) * 1988-04-12 1989-10-20 Toshiba Lighting & Technol Corp 調光器
DE3828627A1 (de) * 1988-08-19 1990-02-22 Herbst Donald Elektroanschlussdose
JPH03242996A (ja) * 1990-02-21 1991-10-29 Hitachi Cable Ltd 導体埋設型配線部品
US5898569A (en) * 1997-04-25 1999-04-27 Intel Corporation Power cable heat exchanger for a computing device
US6172871B1 (en) * 1999-03-31 2001-01-09 International Business Machines Corporation Method and system in a data processing system for efficiently cooling a portable computer system
US6307746B1 (en) * 1999-12-06 2001-10-23 Gateway, Inc. Power adapter having a thermal cooling assembly for a digital information appliance
US6855881B2 (en) * 2002-06-26 2005-02-15 Bahman Khoshnood Combined communication and power cable with air cooling for network systems

Also Published As

Publication number Publication date
US20050174736A1 (en) 2005-08-11
FR2855711A1 (fr) 2004-12-03
US7027301B2 (en) 2006-04-11

Similar Documents

Publication Publication Date Title
GB0700542D0 (en) Cooling electronic devices in computer systems
EP1691286A4 (fr) Procédé de gestion des tâches, dispositif de gestion des tâches, circuit intégré semi-conducteur, dispositif électronique, et système de gestion des tâches
FR2861894B1 (fr) Dispositif de refroidissement d'une electronique de puissance
TW558033U (en) Protection and heat sink device for computer data access equipment
GB2392251B (en) Automatic integrated circuit testing system and device using an integrative computer and method for the same
TW536135U (en) Heat dissipation apparatus used in electronic device
TW545875U (en) Heat dissipating device of circuit board
GB2404977B (en) An electronic device cooling system and method of use
FR2855711B1 (fr) Systeme et dispositif de dissipation de chaleur dans un equipement electronique
EP1498798A4 (fr) Dispositif serveur et systeme de gestion de programme
ITTO20020416A0 (it) Struttura di contenimento e dissipazione termica per apparecchiature elettroniche.
FI20021027A0 (fi) Jäähdytinelementti elektroniikkalaitteeseen
FR2858435B1 (fr) Dispositif de refroidissement d'elements d'ordinateur degageant de la chaleur
FR2865888B1 (fr) Systeme de refroidissement d'un boitier electronique
FR2862424B1 (fr) Dispositif de refroidissement d'un composant electrique et procede de fabrication de ce dispositif
FR2862629B1 (fr) Dispositif de refroidissement d'un circuit integre
FR2872336B1 (fr) Dispositif de refroidissement passif pour un appareillage electrique et appareillage electrique comprenant ce dispositif
FR2838235B1 (fr) Dispositif de refroidissement d'un tube electronique
FR2838914B1 (fr) Dispositif de protection de composants electroniques
FR2879033B1 (fr) Dispositif de protection d'une installation electrique, procede et utilisation correspondants
NL1027729A1 (nl) Werkwijze en systeem voor het autoriseren van elektronische diensten zoals via computernetwerk (-en) verschafte diensten.
FR2870371B1 (fr) Dispositif de circuit possedant une fonction de base et une fonction de surveillance
FR2967763B1 (fr) Dispositif de dissipation de chaleur et carte electronique correspondante
FR2860947B1 (fr) Dispositif de refroidissement de circuits imprimes electronique et mode realisation.
TW572577U (en) Heat dissipating device for electronic components

Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20090119