JP3813134B2 - ワイヤボンディング装置におけるボール形成装置 - Google Patents

ワイヤボンディング装置におけるボール形成装置 Download PDF

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Publication number
JP3813134B2
JP3813134B2 JP2003111616A JP2003111616A JP3813134B2 JP 3813134 B2 JP3813134 B2 JP 3813134B2 JP 2003111616 A JP2003111616 A JP 2003111616A JP 2003111616 A JP2003111616 A JP 2003111616A JP 3813134 B2 JP3813134 B2 JP 3813134B2
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JP
Japan
Prior art keywords
circuit
voltage
current
command pulse
transformer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2003111616A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004319756A (ja
Inventor
邦行 高橋
一正 笹倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2003111616A priority Critical patent/JP3813134B2/ja
Priority to TW093103740A priority patent/TW200428544A/zh
Priority to KR1020040016365A priority patent/KR100546476B1/ko
Publication of JP2004319756A publication Critical patent/JP2004319756A/ja
Application granted granted Critical
Publication of JP3813134B2 publication Critical patent/JP3813134B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
JP2003111616A 2003-04-16 2003-04-16 ワイヤボンディング装置におけるボール形成装置 Expired - Lifetime JP3813134B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003111616A JP3813134B2 (ja) 2003-04-16 2003-04-16 ワイヤボンディング装置におけるボール形成装置
TW093103740A TW200428544A (en) 2003-04-16 2004-02-17 Ball forming device for wire-bonding device
KR1020040016365A KR100546476B1 (ko) 2003-04-16 2004-03-11 와이어본딩 장치에서의 볼 형성 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003111616A JP3813134B2 (ja) 2003-04-16 2003-04-16 ワイヤボンディング装置におけるボール形成装置

Publications (2)

Publication Number Publication Date
JP2004319756A JP2004319756A (ja) 2004-11-11
JP3813134B2 true JP3813134B2 (ja) 2006-08-23

Family

ID=33472112

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003111616A Expired - Lifetime JP3813134B2 (ja) 2003-04-16 2003-04-16 ワイヤボンディング装置におけるボール形成装置

Country Status (3)

Country Link
JP (1) JP3813134B2 (cg-RX-API-DMAC7.html)
KR (1) KR100546476B1 (cg-RX-API-DMAC7.html)
TW (1) TW200428544A (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7896218B2 (en) * 2007-06-28 2011-03-01 Western Digital Technologies, Inc. Apparatus and method for conductive metal ball bonding with electrostatic discharge detection
JP5069631B2 (ja) * 2008-07-31 2012-11-07 株式会社フォーエム技術研究所 ワイヤボンダーにおけるボール形成装置
TWI528481B (zh) * 2014-02-13 2016-04-01 新川股份有限公司 球形成裝置、打線裝置以及球形成方法

Also Published As

Publication number Publication date
JP2004319756A (ja) 2004-11-11
KR20040090408A (ko) 2004-10-22
KR100546476B1 (ko) 2006-01-26
TWI309866B (cg-RX-API-DMAC7.html) 2009-05-11
TW200428544A (en) 2004-12-16

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