JP3813134B2 - Ball forming apparatus in wire bonding apparatus - Google Patents

Ball forming apparatus in wire bonding apparatus Download PDF

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Publication number
JP3813134B2
JP3813134B2 JP2003111616A JP2003111616A JP3813134B2 JP 3813134 B2 JP3813134 B2 JP 3813134B2 JP 2003111616 A JP2003111616 A JP 2003111616A JP 2003111616 A JP2003111616 A JP 2003111616A JP 3813134 B2 JP3813134 B2 JP 3813134B2
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circuit
voltage
current
command pulse
transformer
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JP2004319756A (en
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邦行 高橋
一正 笹倉
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Shinkawa Ltd
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Shinkawa Ltd
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Priority to TW093103740A priority patent/TW200428544A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]

Description

【０００１】
【発明の属する技術分野】
本発明は、ワイヤボンディング装置におけるボール形成装置に関する。
【０００２】
【従来の技術】
従来のワイヤボンディング装置におけるボール形成装置は、商用電源を変圧整流する変圧整流回路と、直列接続され自励パルス発振器の出力によりオンオフするトランジスタ素子と、このトランジスタ素子がオンオフした出力から高電圧出力を得るパルス変圧器と、前記自励パルス発振器を内蔵し、発振パルス幅を連続的に制御するように高電圧出力端子（放電電極）と接地（ワイヤ）間の電気信号が帰還されるパルス変調波発生回路とを備えている。例えば、特許文献１及び２参照。
【０００３】
【特許文献１】
特開平５−２３５０７８号公報
【特許文献２】
特開平７−１８３３２２号公報
【０００４】
【発明が解決しようとする課題】
上記従来技術は、トランジスタ素子を繰り返しオンオフさせてパルス変圧器より高電圧出力を得るので、放電電極とワイヤ先端間には、図３（ａ）（ｂ）に示すように、ギザギザの放電電圧及び放電電流が出力される。このため、放電を停止させる位置が山部又は谷部になり、形成されるボール径が安定しなくバラツキが生じる。即ち、放電毎の放電時間と放電電流の安定性が悪い。特に、例えばワイヤ径の１．５倍以下のボール径を形成する場合には、その影響が顕著に表れる。
【０００５】
本発明の課題は、均一なボール径を安定して形成することができるワイヤボンディング装置におけるボール形成装置を提供することにある。
【０００６】
【課題を解決するための手段】
上記課題を解決するための本発明の請求項１は、キャピラリに挿通されたワイヤの先端と放電電極間に高電圧を印加して放電を行い、ワイヤの先端にボールを形成するワイヤボンディング装置におけるボール形成装置において、電圧指令パルスを出力する電圧指令パルス回路と、電流指令パルスを予め設定された時間出力する電流指令パルス回路と、前記電圧指令パルスが入力されて昇圧する昇圧トランスと、この昇圧トランスの放電電圧をフィードバックして定電圧制御する定電圧回路と、放電時の電流を検出した時に前記電流指令パルスを前記昇圧トランスに入力するように切り替えるスイッチ回路と、前記放電電流を前記電流指令パルス時間出力する定電流回路とを備えたことを特徴とする。
【０００７】
上記課題を解決するための本発明の請求項２は、上記請求項１において、前記昇圧トランスは、定電圧機能及び定電流機能の両機能を有するリニア出力型トランスであることを特徴とする。
【０００８】
【発明の実施の形態】
本発明のワイヤボンディング装置におけるボール形成装置の一実施の形態を図１及び図２により説明する。図１に示すように、キャピラリ１に挿通されたワイヤ２の先端にボール２ａを形成するための放電電極３は、昇圧トランス４の出力側の一方の端子に接続されている。昇圧トランス４の出力側の他方の端子は、電流検出抵抗Ｒ１を有する電流検出回路５に接続されている。昇圧トランス４の入力側の一方の端子には、一定の電圧Ｖｃｃ、例えばＤＣ２０Ｖの電圧が印加されており、昇圧トランス４の入力側の他方の端子には、後記する回路を介して電圧指令パルス回路１０及び電流指令パルス回路１１が接続されている。
【０００９】
電圧指令パルス回路１０は、昇圧トランス４より高電圧を発生させるための電圧指令パルス１０ａを出力する。電流指令パルス回路１１は、昇圧トランス４より一定の定電流が出力した後に、この定電流を一定時間維持するための電流指令パルス１１ａを出力する。この電流指令パルス１１ａの出力時間、即ちパルス幅は、パルス幅設定回路１２により設定される。パルス幅の設定は、予めワイヤ２の径、ワイヤ２の材質、形成するボール径２ａ等によって予め実験により設定する。
【００１０】
電圧指令パルス回路１０は、定電圧回路１３の＋側に接続され、定電圧回路１３の−側には、前記放電電極３に印加された高電圧を検出する放電電圧検出回路１４の分圧抵抗Ｒ２と分圧抵抗Ｒ３で分圧された分圧電圧が入力される。電流指令パルス回路１１は、定電流回路１５の＋側に接続され、定電流回路１５の−側には、前記電流検出回路５で検出された電流が入力される。
【００１１】
定電圧回路１３の出力端子はスイッチ回路２０の一方の入力端子２０ａに接続され、定電流回路１５の入力端子はスイッチ回路２０の他方の入力端子２０ｂに接続されている。スイッチ回路２０の出力端子２０ｃは、ドライバ２１を介して前記昇圧トランス４の入力側の他方の端子に接続されている。スイッチ回路２０の切り換えは、放電電流検出回路２２の出力によって切り換えられる。
【００１２】
放電電流検出回路２２の＋側には、放電電流検出レベル設定回路２３が接続されており、放電電流検出レベル設定回路２３は、予め設定された放電電流を出力する。放電電流検出回路２２の−側には、電流検出回路５で検出された電流が入力される。前記スイッチ回路２０は、ボール形成前は入力端子２０ａが出力端子２０ｃに接続されており、放電電流検出回路２２の出力によって入力端子２０ｂが出力端子２０ｃに接続される。
【００１３】
次に作用について説明する。ワイヤ２の先端にボール２ａを形成する時は、電圧指令パルス回路１０より図２（ａ）に示す例えば５Ｖの電圧指令パルス１０ａが定電圧回路１３に入力される。これにより、定電圧回路１３の出力は、スイッチ回路２０の入力端子２０ａと出力端子２０ｃよりドライバ２１を通して昇圧トランス４に入力され、昇圧トランス４によって昇圧される。この昇圧された高電圧が放電電圧検出回路１４の分圧抵抗Ｒ２と分圧抵抗Ｒ３で分圧された電圧は、定電圧回路１３の−側にフィードバックされて定電圧制御して昇圧トランス４により放電電極３とワイヤ２の先端に図２（ｂ）に示す例えば５，０００Ｖの高電圧を印加する。
【００１４】
前記高電圧の印加によって放電電極３とワイヤ２の先端との絶縁が破壊して電流検出回路５に電流が流れる。この電流検出回路５に流れる電流は、放電電流検出回路２２の−側に入力され、この電流が放電電流検出レベル設定回路２３により予め設定された設定電流になると、即座に放電電流検出回路２２より出力信号がスイッチ回路２０に入力され、スイッチ回路２０の入力端子２０ｂが出力端子２０ｃに接続させる。これにより、電流指令パルス回路１１より定電流回路１５に入力されている図２（ｃ）に示す電流指令パルス１１ａが一定時間、スイッチ回路２０、ドライバ２１を通して昇圧トランス４に入力される。そこで、放電電極３よりワイヤ２に定電流が流れ、ワイヤ２の先端に所定のボール２ａが形成される。
【００１５】
このように、電圧指令パルス１０ａを昇圧トランス４に入力し、昇圧トランス４の放電電圧をフィードバックして定電圧回路１３で定電圧制御された高電圧を放電電極３とワイヤ２の先端間に印加する。そして、放電電極３とワイヤ２の先端との絶縁が破壊して設定電流が流れると、即座に電流指令パルス１１ａが昇圧トランス４に入力して一定時間定電流が放電電極３よりワイヤ２に流れてボール２ａを形成するので、常に均一な所定の大きさのボール２ａが得られる。この場合、図２（ｂ）に示す放電電圧の波高値（電圧値）を電圧指令パルス１０ａで与え、予め設定された放電電流が流れた後は、定電流を流す時間を電流指令パルス１１ａの入力時間を制御することにより、ボール２ａ径を自由に制御できる。特に、本実施の形態においては、小ボールを形成する場合に効果的である。
【００１６】
なお、昇圧トランス４としては、定電圧機能及び定電流機能の両機能を有するリニア出力型トランスを使用する。これは、指令に対する出力特性が非常にリニアであり、再現性も良いため、放電毎におけるボール径の安定性が良く好ましい。
【００１７】
【発明の効果】
本発明は、キャピラリに挿通されたワイヤの先端と放電電極間に高電圧を印加して放電を行い、ワイヤの先端にボールを形成するワイヤボンディング装置におけるボール形成装置において、電圧指令パルスを出力する電圧指令パルス回路と、電流指令パルスを予め設定された時間出力する電流指令パルス回路と、前記電圧指令パルスが入力されて昇圧する昇圧トランスと、この昇圧トランスの放電電圧をフィードバックして定電圧制御する定電圧回路と、放電時の電流を検出した時に前記電流指令パルスを前記昇圧トランスに入力するように切り替えるスイッチ回路と、前記放電電流を前記電流指令パルス時間出力する定電流回路とを備えた構成よりなるので、均一なボール径を安定して形成することができる。
【図面の簡単な説明】
【図１】本発明のワイヤボンディング装置におけるボール形成装置の一実施の形態を示すブロック図である。
【図２】電圧指令パルス、放電電圧、電流指令パルス、放電電流の波形及び出力タイミング図である。
【図３】従来のワイヤボンディング装置におけるボール形成装置の放電電圧及び放電電流の波形の説明図である。
【符号の説明】
１ キャピラリ
２ ワイヤ
２ａ ボール
３ 放電電極
４ 昇圧トランス
５ 電流検出回路
１０ 電圧指令パルス回路
１０ａ 電圧指令パルス
１１ 電流指令パルス回路
１１ａ 電流指令パルス
１２ パルス幅設定回路
１３ 定電圧回路
１４ 放電電圧検出回路
１５ 定電流回路
２０ スイッチ回路
２１ ドライバ
２２ 放電電流検出回路
２３ 放電電流検出レベル設定回路[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a ball forming apparatus in a wire bonding apparatus.
[0002]
[Prior art]
A ball forming apparatus in a conventional wire bonding apparatus includes a transformer rectifier circuit that transforms and rectifies a commercial power supply, a transistor element that is connected in series and turned on and off by the output of a self-excited pulse oscillator, and a high voltage output from the output that the transistor element is turned on and off. A pulse modulated wave that incorporates the pulse transformer to be obtained and the self-excited pulse oscillator, and that feeds back an electric signal between the high voltage output terminal (discharge electrode) and the ground (wire) so as to continuously control the oscillation pulse width. And a generation circuit. For example, see Patent Documents 1 and 2.
[0003]
[Patent Document 1]
JP-A-5-235078 [Patent Document 2]
JP-A-7-183322 [0004]
[Problems to be solved by the invention]
In the above prior art, the transistor element is repeatedly turned on and off to obtain a high voltage output from the pulse transformer. Therefore, as shown in FIGS. 3 (a) and 3 (b), a jagged discharge voltage and A discharge current is output. For this reason, the position where the discharge is stopped becomes a peak or a valley, and the diameter of the formed ball is not stable and varies. That is, the stability of the discharge time and discharge current for each discharge is poor. In particular, for example, when a ball diameter of 1.5 times or less of the wire diameter is formed, the influence appears remarkably.
[0005]
An object of the present invention is to provide a ball forming apparatus in a wire bonding apparatus that can stably form a uniform ball diameter.
[0006]
[Means for Solving the Problems]
According to a first aspect of the present invention for solving the above-mentioned problems, a wire bonding apparatus for performing discharge by applying a high voltage between a tip of a wire inserted through a capillary and a discharge electrode to form a ball at the tip of the wire. In the ball forming device, a voltage command pulse circuit that outputs a voltage command pulse, a current command pulse circuit that outputs a current command pulse for a preset time, a step-up transformer that boosts the voltage command pulse when input, and the step-up transformer A constant voltage circuit for controlling the constant voltage by feeding back the discharge voltage of the transformer, a switch circuit for switching the current command pulse to be input to the step-up transformer when a current during discharge is detected, and the discharge current to the current command And a constant current circuit for outputting a pulse time.
[0007]
A second aspect of the present invention for solving the above-described problems is characterized in that, in the first aspect, the step-up transformer is a linear output type transformer having both a constant voltage function and a constant current function.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of a ball forming apparatus in a wire bonding apparatus of the present invention will be described with reference to FIGS. As shown in FIG. 1, a discharge electrode 3 for forming a ball 2 a at the tip of a wire 2 inserted through a capillary 1 is connected to one terminal on the output side of a step-up transformer 4. The other terminal on the output side of the step-up transformer 4 is connected to a current detection circuit 5 having a current detection resistor R1. A constant voltage Vcc, for example, a DC 20V voltage is applied to one terminal on the input side of the step-up transformer 4, and a voltage command pulse is applied to the other terminal on the input side of the step-up transformer 4 via a circuit described later. A circuit 10 and a current command pulse circuit 11 are connected.
[0009]
The voltage command pulse circuit 10 outputs a voltage command pulse 10 a for generating a higher voltage than the step-up transformer 4. The current command pulse circuit 11 outputs a current command pulse 11a for maintaining this constant current for a certain period of time after outputting a constant current from the step-up transformer 4. The output time of the current command pulse 11a, that is, the pulse width is set by the pulse width setting circuit 12. The setting of the pulse width is set in advance by an experiment according to the diameter of the wire 2, the material of the wire 2, the ball diameter 2a to be formed, and the like.
[0010]
The voltage command pulse circuit 10 is connected to the + side of the constant voltage circuit 13, and the voltage dividing resistor of the discharge voltage detection circuit 14 that detects the high voltage applied to the discharge electrode 3 is connected to the − side of the constant voltage circuit 13. A divided voltage divided by R2 and voltage dividing resistor R3 is input. The current command pulse circuit 11 is connected to the + side of the constant current circuit 15, and the current detected by the current detection circuit 5 is input to the − side of the constant current circuit 15.
[0011]
The output terminal of the constant voltage circuit 13 is connected to one input terminal 20 a of the switch circuit 20, and the input terminal of the constant current circuit 15 is connected to the other input terminal 20 b of the switch circuit 20. The output terminal 20 c of the switch circuit 20 is connected to the other terminal on the input side of the step-up transformer 4 via the driver 21. Switching of the switch circuit 20 is switched by the output of the discharge current detection circuit 22.
[0012]
A discharge current detection level setting circuit 23 is connected to the + side of the discharge current detection circuit 22, and the discharge current detection level setting circuit 23 outputs a preset discharge current. The current detected by the current detection circuit 5 is input to the negative side of the discharge current detection circuit 22. In the switch circuit 20, the input terminal 20a is connected to the output terminal 20c before the ball is formed, and the input terminal 20b is connected to the output terminal 20c by the output of the discharge current detection circuit 22.
[0013]
Next, the operation will be described. When the ball 2 a is formed at the tip of the wire 2, for example, a voltage command pulse 10 a of 5 V shown in FIG. 2A is input to the constant voltage circuit 13 from the voltage command pulse circuit 10. As a result, the output of the constant voltage circuit 13 is input to the step-up transformer 4 through the driver 21 from the input terminal 20a and the output terminal 20c of the switch circuit 20, and is boosted by the step-up transformer 4. The voltage obtained by dividing the boosted high voltage by the voltage dividing resistor R2 and the voltage dividing resistor R3 of the discharge voltage detecting circuit 14 is fed back to the negative side of the constant voltage circuit 13 to be controlled by the step-up transformer 4. For example, a high voltage of 5,000 V shown in FIG. 2B is applied to the tips of the discharge electrode 3 and the wire 2.
[0014]
By applying the high voltage, the insulation between the discharge electrode 3 and the tip of the wire 2 is broken, and a current flows through the current detection circuit 5. The current flowing through the current detection circuit 5 is input to the negative side of the discharge current detection circuit 22, and when this current becomes a preset current preset by the discharge current detection level setting circuit 23, the discharge current detection circuit 22 immediately An output signal is input to the switch circuit 20, and the input terminal 20b of the switch circuit 20 is connected to the output terminal 20c. As a result, the current command pulse 11a shown in FIG. 2C input from the current command pulse circuit 11 to the constant current circuit 15 is input to the step-up transformer 4 through the switch circuit 20 and the driver 21 for a predetermined time. Therefore, a constant current flows from the discharge electrode 3 to the wire 2, and a predetermined ball 2 a is formed at the tip of the wire 2.
[0015]
In this way, the voltage command pulse 10 a is input to the step-up transformer 4, the discharge voltage of the step-up transformer 4 is fed back, and the high voltage controlled by the constant voltage circuit 13 is applied between the discharge electrode 3 and the tip of the wire 2. To do. When the insulation between the discharge electrode 3 and the tip of the wire 2 breaks and a set current flows, the current command pulse 11a is immediately input to the step-up transformer 4 and a constant current flows from the discharge electrode 3 to the wire 2 for a certain time. Since the ball 2a is formed, the ball 2a having a uniform and predetermined size is always obtained. In this case, the peak value (voltage value) of the discharge voltage shown in FIG. 2B is given by the voltage command pulse 10a, and after a preset discharge current flows, the time for the constant current to flow is set to the current command pulse 11a. By controlling the input time, the diameter of the ball 2a can be freely controlled. In particular, this embodiment is effective when a small ball is formed.
[0016]
As the step-up transformer 4, a linear output transformer having both a constant voltage function and a constant current function is used. This is preferable because the output characteristic with respect to the command is very linear and the reproducibility is good, and the stability of the ball diameter at each discharge is good.
[0017]
【The invention's effect】
The present invention outputs a voltage command pulse in a ball forming apparatus in a wire bonding apparatus that discharges by applying a high voltage between a tip of a wire inserted into a capillary and a discharge electrode, and forms a ball on the tip of the wire. A voltage command pulse circuit, a current command pulse circuit that outputs a current command pulse for a preset time, a step-up transformer that boosts the voltage command pulse as input, and a constant voltage control by feeding back the discharge voltage of the step-up transformer A constant voltage circuit for switching, a switch circuit for switching the current command pulse to be input to the step-up transformer when a current during discharge is detected, and a constant current circuit for outputting the discharge current for the current command pulse time. Since it consists of composition, a uniform ball diameter can be formed stably.
[Brief description of the drawings]
FIG. 1 is a block diagram showing an embodiment of a ball forming apparatus in a wire bonding apparatus of the present invention.
FIG. 2 is a waveform of a voltage command pulse, a discharge voltage, a current command pulse, a discharge current, and an output timing diagram.
FIG. 3 is an explanatory diagram of waveforms of a discharge voltage and a discharge current of a ball forming apparatus in a conventional wire bonding apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Capillary 2 Wire 2a Ball 3 Discharge electrode 4 Step-up transformer 5 Current detection circuit 10 Voltage command pulse circuit 10a Voltage command pulse 11 Current command pulse circuit 11a Current command pulse 12 Pulse width setting circuit 13 Constant voltage circuit 14 Discharge voltage detection circuit 15 Constant Current circuit 20 Switch circuit 21 Driver 22 Discharge current detection circuit 23 Discharge current detection level setting circuit

Claims (2)

キャピラリに挿通されたワイヤの先端と放電電極間に高電圧を印加して放電を行い、ワイヤの先端にボールを形成するワイヤボンディング装置におけるボール形成装置において、電圧指令パルスを出力する電圧指令パルス回路と、電流指令パルスを予め設定された時間出力する電流指令パルス回路と、前記電圧指令パルスが入力されて昇圧する昇圧トランスと、この昇圧トランスの放電電圧をフィードバックして定電圧制御する定電圧回路と、放電時の電流を検出した時に前記電流指令パルスを前記昇圧トランスに入力するように切り替えるスイッチ回路と、前記放電電流を前記電流指令パルス時間出力する定電流回路とを備えたことを特徴とするワイヤボンディング装置におけるボール形成装置。A voltage command pulse circuit that outputs a voltage command pulse in a ball forming apparatus in a wire bonding apparatus that discharges by applying a high voltage between the tip of a wire inserted through a capillary and a discharge electrode to form a ball on the tip of the wire A current command pulse circuit that outputs a current command pulse for a preset time, a step-up transformer that boosts the voltage command pulse when input, and a constant voltage circuit that performs constant voltage control by feeding back the discharge voltage of the step-up transformer And a switch circuit that switches the current command pulse to be input to the step-up transformer when a current during discharge is detected, and a constant current circuit that outputs the discharge current for the current command pulse time. A ball forming apparatus in a wire bonding apparatus. 前記昇圧トランスは、定電圧機能及び定電流機能の両機能を有するリニア出力型トランスであることを特徴とする請求項１記載のワイヤボンディング装置におけるボール形成装置。2. The ball forming apparatus according to claim 1, wherein the step-up transformer is a linear output type transformer having both a constant voltage function and a constant current function.
JP2003111616A 2003-04-16 2003-04-16 Ball forming apparatus in wire bonding apparatus Expired - Lifetime JP3813134B2 (en)

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JP2003111616A JP3813134B2 (en) 2003-04-16 2003-04-16 Ball forming apparatus in wire bonding apparatus
TW093103740A TW200428544A (en) 2003-04-16 2004-02-17 Ball forming device for wire-bonding device
KR1020040016365A KR100546476B1 (en) 2003-04-16 2004-03-11 Ball forming device in wire bonding apparatus

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US7896218B2 (en) * 2007-06-28 2011-03-01 Western Digital Technologies, Inc. Apparatus and method for conductive metal ball bonding with electrostatic discharge detection
JP5069631B2 (en) * 2008-07-31 2012-11-07 株式会社フォーエム技術研究所 Ball forming apparatus in wire bonder
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TWI309866B (en) 2009-05-11

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