JP3795317B2 - 基板把持装置及び研磨装置 - Google Patents

基板把持装置及び研磨装置 Download PDF

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Publication number
JP3795317B2
JP3795317B2 JP2000335866A JP2000335866A JP3795317B2 JP 3795317 B2 JP3795317 B2 JP 3795317B2 JP 2000335866 A JP2000335866 A JP 2000335866A JP 2000335866 A JP2000335866 A JP 2000335866A JP 3795317 B2 JP3795317 B2 JP 3795317B2
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Japan
Prior art keywords
plate
gripping
polishing
substrate
top ring
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Expired - Fee Related
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JP2000335866A
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Japanese (ja)
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JP2002144223A (ja
JP2002144223A5 (https=
Inventor
伸 大和田
俊市朗 皃嶋
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Ebara Corp
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Ebara Corp
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2000335866A 2000-11-02 2000-11-02 基板把持装置及び研磨装置 Expired - Fee Related JP3795317B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000335866A JP3795317B2 (ja) 2000-11-02 2000-11-02 基板把持装置及び研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000335866A JP3795317B2 (ja) 2000-11-02 2000-11-02 基板把持装置及び研磨装置

Publications (3)

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JP2002144223A JP2002144223A (ja) 2002-05-21
JP2002144223A5 JP2002144223A5 (https=) 2004-12-16
JP3795317B2 true JP3795317B2 (ja) 2006-07-12

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ID=18811537

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JP2000335866A Expired - Fee Related JP3795317B2 (ja) 2000-11-02 2000-11-02 基板把持装置及び研磨装置

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JP (1) JP3795317B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015171733A (ja) * 2012-07-13 2015-10-01 旭硝子株式会社 板状体の研磨装置及び板状体の研磨方法
CN110253439B (zh) * 2019-07-26 2023-04-18 浙江工业大学 一种具有域内材料均匀去除功能的梯度弹性研抛装置

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Publication number Publication date
JP2002144223A (ja) 2002-05-21

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