JP2002144223A5 - - Google Patents

Download PDF

Info

Publication number
JP2002144223A5
JP2002144223A5 JP2000335866A JP2000335866A JP2002144223A5 JP 2002144223 A5 JP2002144223 A5 JP 2002144223A5 JP 2000335866 A JP2000335866 A JP 2000335866A JP 2000335866 A JP2000335866 A JP 2000335866A JP 2002144223 A5 JP2002144223 A5 JP 2002144223A5
Authority
JP
Japan
Prior art keywords
plate
gripping
substrate
holding device
substrate holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000335866A
Other languages
English (en)
Japanese (ja)
Other versions
JP3795317B2 (ja
JP2002144223A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000335866A priority Critical patent/JP3795317B2/ja
Priority claimed from JP2000335866A external-priority patent/JP3795317B2/ja
Publication of JP2002144223A publication Critical patent/JP2002144223A/ja
Publication of JP2002144223A5 publication Critical patent/JP2002144223A5/ja
Application granted granted Critical
Publication of JP3795317B2 publication Critical patent/JP3795317B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2000335866A 2000-11-02 2000-11-02 基板把持装置及び研磨装置 Expired - Fee Related JP3795317B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000335866A JP3795317B2 (ja) 2000-11-02 2000-11-02 基板把持装置及び研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000335866A JP3795317B2 (ja) 2000-11-02 2000-11-02 基板把持装置及び研磨装置

Publications (3)

Publication Number Publication Date
JP2002144223A JP2002144223A (ja) 2002-05-21
JP2002144223A5 true JP2002144223A5 (https=) 2004-12-16
JP3795317B2 JP3795317B2 (ja) 2006-07-12

Family

ID=18811537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000335866A Expired - Fee Related JP3795317B2 (ja) 2000-11-02 2000-11-02 基板把持装置及び研磨装置

Country Status (1)

Country Link
JP (1) JP3795317B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015171733A (ja) * 2012-07-13 2015-10-01 旭硝子株式会社 板状体の研磨装置及び板状体の研磨方法
CN110253439B (zh) * 2019-07-26 2023-04-18 浙江工业大学 一种具有域内材料均匀去除功能的梯度弹性研抛装置

Similar Documents

Publication Publication Date Title
JP2006119263A5 (https=)
USD560094S1 (en) Combination gripping device and trivet
USD618203S1 (en) Media device
JP2002187060A5 (https=)
USD571192S1 (en) Rigging plate
USD551352S1 (en) Textile bandage for immobilizing support of the thumb
JP2010153490A5 (https=)
USD547069S1 (en) Polisher device
JP2009302347A5 (https=)
JP2001282126A5 (https=)
JP2009202259A5 (https=)
TW353205B (en) Polishing pad and apparatus for polishing a semiconductor wafer
USD596587S1 (en) Control panel
WO2007121135A3 (en) Laminated flexible resilient abrasive article
WO2008129989A1 (ja) 基板保持機構およびこれを備えた基板組立装置
EP2085302A3 (en) Saddle assembly and venting device thereof
JP2009531080A5 (https=)
USD577977S1 (en) Bonding device clamp
WO2008081561A1 (ja) 孔あきサポートプレート
WO2007107885A3 (en) Device for contact by adhesion to a glass or semiconductor plate (wafer) surface of the like, and system for gripping such a plate comprising such a device
JP2002144223A5 (https=)
USD548786S1 (en) Square-shaped writing instrument with abrasive surface on upper portion
TW200610723A (en) Substrate transfer apparatus
JP2009016544A5 (https=)
JP2010109093A5 (ja) シーズニングプレート、半導体研磨装置、研磨パッドのシーズニング方法