TW200610723A - Substrate transfer apparatus - Google Patents

Substrate transfer apparatus

Info

Publication number
TW200610723A
TW200610723A TW094124764A TW94124764A TW200610723A TW 200610723 A TW200610723 A TW 200610723A TW 094124764 A TW094124764 A TW 094124764A TW 94124764 A TW94124764 A TW 94124764A TW 200610723 A TW200610723 A TW 200610723A
Authority
TW
Taiwan
Prior art keywords
transfer apparatus
oscillating
substrate transfer
adsorption pad
substrate
Prior art date
Application number
TW094124764A
Other languages
Chinese (zh)
Other versions
TWI309223B (en
Inventor
Shinya Tanoue
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200610723A publication Critical patent/TW200610723A/en
Application granted granted Critical
Publication of TWI309223B publication Critical patent/TWI309223B/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Jigging Conveyors (AREA)

Abstract

In the substrate transfer apparatus 41 which is equipped with the arm component 51 which has two or more adsorption pads 56, lays the processed substrate G on the adsorption pad 56, and performs carrying in appearance of the processed substrate G to a substrate processing part. The substrate transfer apparatus 41 has an oscillating means to vibrate the adsorption pad 56, an oscillating drive means 57 to drive the oscillating means, and a control means 58 to perform control of the oscillating drive means 57 of operation. When the processed substrate G is laid on the adsorption pad 56, the control means 58 drives the oscillating drive means 57, and the adsorption pad 56 is vibrated.
TW094124764A 2004-09-30 2005-07-21 Substrate transfer apparatus TWI309223B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004288507A JP4282018B2 (en) 2004-09-30 2004-09-30 Substrate transfer device

Publications (2)

Publication Number Publication Date
TW200610723A true TW200610723A (en) 2006-04-01
TWI309223B TWI309223B (en) 2009-05-01

Family

ID=36377542

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094124764A TWI309223B (en) 2004-09-30 2005-07-21 Substrate transfer apparatus

Country Status (4)

Country Link
JP (1) JP4282018B2 (en)
KR (1) KR100999729B1 (en)
CN (1) CN1754796B (en)
TW (1) TWI309223B (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4770663B2 (en) * 2006-09-20 2011-09-14 株式会社安川電機 Substrate adsorption device and substrate transfer robot using the same
CN101259920B (en) * 2007-03-05 2011-11-09 京元电子股份有限公司 Chip suction nozzle structure with elastic pad and manufacturing method thereof
JP4740188B2 (en) * 2007-05-08 2011-08-03 三菱電線工業株式会社 Transfer arm pad
JP5245999B2 (en) * 2009-04-09 2013-07-24 株式会社Ｉｈｉ Robot hand and transfer robot
CN102795502B (en) * 2012-09-06 2016-01-20 东莞市威力固电路板设备有限公司 Substrate conveying picks and places method
JP2015153970A (en) * 2014-02-18 2015-08-24 キヤノン株式会社 Substrate holding mechanism, substrate transport apparatus and substrate transport method
CN105072820B (en) * 2015-08-31 2018-03-20 广州超音速自动化科技股份有限公司 Automatic loading and unloading device
CN109644563B (en) * 2016-12-31 2021-08-17 深圳市综科食品智能装备有限公司 Sand blasting assembly line system of flexible circuit board and discharging equipment thereof
CN109205305B (en) * 2018-08-07 2020-05-12 河北盛世天昕电子科技有限公司 Control method of object suction manipulator
US11156924B2 (en) * 2018-08-23 2021-10-26 Asml Netherlands B.V. Substrate support, lithographic apparatus, substrate inspection apparatus, device manufacturing method
JP7057337B2 (en) * 2019-10-29 2022-04-19 キヤノントッキ株式会社 Board peeling device, board processing device, and board peeling method
JP7057336B2 (en) * 2019-10-29 2022-04-19 キヤノントッキ株式会社 Substrate holding member, substrate holding device, substrate processing device, substrate holding method, film forming method, and manufacturing method of electronic device
JP7057335B2 (en) * 2019-10-29 2022-04-19 キヤノントッキ株式会社 Substrate holding device, substrate processing device, substrate holding method, film forming method, and manufacturing method of electronic device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1168312A (en) * 1967-03-31 1969-10-22 Elektromat Veb Method and apparatus for Removing Small Laminar Objects capable of being Stacked
JP3099254B2 (en) * 1994-02-28 2000-10-16 安藤電気株式会社 Suction hand with floating mechanism and transfer contact mechanism
JP3400929B2 (en) * 1997-07-01 2003-04-28 アルプス電気株式会社 Chip component mounting device
DE10108369A1 (en) * 2001-02-21 2002-08-29 B L E Lab Equipment Gmbh Method and device for detaching a semiconductor wafer from a carrier
TW550651B (en) * 2001-08-08 2003-09-01 Tokyo Electron Ltd Substrate conveying apparatus, substrate processing system, and substrate conveying method

Also Published As

Publication number Publication date
CN1754796B (en) 2010-08-18
JP4282018B2 (en) 2009-06-17
KR100999729B1 (en) 2010-12-08
TWI309223B (en) 2009-05-01
JP2006108133A (en) 2006-04-20
CN1754796A (en) 2006-04-05
KR20060051419A (en) 2006-05-19

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees