GB1168312A - Method and apparatus for Removing Small Laminar Objects capable of being Stacked - Google Patents

Method and apparatus for Removing Small Laminar Objects capable of being Stacked

Info

Publication number
GB1168312A
GB1168312A GB1471567A GB1471567A GB1168312A GB 1168312 A GB1168312 A GB 1168312A GB 1471567 A GB1471567 A GB 1471567A GB 1471567 A GB1471567 A GB 1471567A GB 1168312 A GB1168312 A GB 1168312A
Authority
GB
United Kingdom
Prior art keywords
discs
pipes
container
stacked
suction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1471567A
Inventor
Siegfried Kreher
Arno Grass
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Elektromat VEB
Original Assignee
Elektromat VEB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Elektromat VEB filed Critical Elektromat VEB
Priority to GB1471567A priority Critical patent/GB1168312A/en
Publication of GB1168312A publication Critical patent/GB1168312A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0478—Simultaneously mounting of different components
    • H05K13/0482—Simultaneously mounting of different components using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrostatic Separation (AREA)

Abstract

1,168,312. Manufacturing semi-conductor devices. ELEKTROMAT VEB. 31 March, 1967, No. 14715/67. Heading H1K. During the manufacture of semi-conductor components laminar discs 2 are removed from a container 1 in which they are stacked, either in an ordered or a disordered manner, by means of a suction pipe 3 to which is imparted a shaking motion. Any discs which adhere to the selected disc, e.g. by electrostatic force, are thrown back into the container 1 by this motion. The selected disc may then be transferred to an alloying mould where it is deposited, e.g. by means of compressed air. In a modification several vacuum pipes are mounted on a single vacuum head for selection of a number of discs arranged in a regular array within a magazine. Vibration is imparted to the pipes from a common source, and the pipes are mounted within the head so as to yield axially to a certain extent, thereby minimizing the risk of breakage. It is stated to be known to select discs by suction from a tiltable container, the inside wall of which is provided with suction arms.
GB1471567A 1967-03-31 1967-03-31 Method and apparatus for Removing Small Laminar Objects capable of being Stacked Expired GB1168312A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB1471567A GB1168312A (en) 1967-03-31 1967-03-31 Method and apparatus for Removing Small Laminar Objects capable of being Stacked

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1471567A GB1168312A (en) 1967-03-31 1967-03-31 Method and apparatus for Removing Small Laminar Objects capable of being Stacked

Publications (1)

Publication Number Publication Date
GB1168312A true GB1168312A (en) 1969-10-22

Family

ID=10046229

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1471567A Expired GB1168312A (en) 1967-03-31 1967-03-31 Method and apparatus for Removing Small Laminar Objects capable of being Stacked

Country Status (1)

Country Link
GB (1) GB1168312A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2507522A1 (en) * 1981-06-16 1982-12-17 Sony Corp METHOD AND APPARATUS FOR DISTRIBUTING PARTS INTENDED TO BE AUTOMATICALLY ASSEMBLED ON A CHASSIS OF AN AUTOMATIC ASSEMBLY MACHINE
US4703925A (en) * 1985-02-08 1987-11-03 Strippit/Di-Acro-Houdaille, Inc. Semi-rigid sheet separation device and method
CN1754796B (en) * 2004-09-30 2010-08-18 东京毅力科创株式会社 Base board delivery device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2507522A1 (en) * 1981-06-16 1982-12-17 Sony Corp METHOD AND APPARATUS FOR DISTRIBUTING PARTS INTENDED TO BE AUTOMATICALLY ASSEMBLED ON A CHASSIS OF AN AUTOMATIC ASSEMBLY MACHINE
US4703925A (en) * 1985-02-08 1987-11-03 Strippit/Di-Acro-Houdaille, Inc. Semi-rigid sheet separation device and method
CN1754796B (en) * 2004-09-30 2010-08-18 东京毅力科创株式会社 Base board delivery device

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees