JP3768472B2 - テープ搬送装置 - Google Patents

テープ搬送装置 Download PDF

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Publication number
JP3768472B2
JP3768472B2 JP2002356113A JP2002356113A JP3768472B2 JP 3768472 B2 JP3768472 B2 JP 3768472B2 JP 2002356113 A JP2002356113 A JP 2002356113A JP 2002356113 A JP2002356113 A JP 2002356113A JP 3768472 B2 JP3768472 B2 JP 3768472B2
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JP
Japan
Prior art keywords
tape
clamper
opening
closing
closing mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002356113A
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English (en)
Japanese (ja)
Other versions
JP2004193182A (ja
Inventor
宏 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2002356113A priority Critical patent/JP3768472B2/ja
Priority to TW092128783A priority patent/TW200416907A/zh
Priority to KR10-2003-0078613A priority patent/KR100539214B1/ko
Publication of JP2004193182A publication Critical patent/JP2004193182A/ja
Application granted granted Critical
Publication of JP3768472B2 publication Critical patent/JP3768472B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames

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  • Advancing Webs (AREA)
  • Wire Bonding (AREA)
JP2002356113A 2002-12-09 2002-12-09 テープ搬送装置 Expired - Fee Related JP3768472B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2002356113A JP3768472B2 (ja) 2002-12-09 2002-12-09 テープ搬送装置
TW092128783A TW200416907A (en) 2002-12-09 2003-10-17 Carrying belt conveying apparatus
KR10-2003-0078613A KR100539214B1 (ko) 2002-12-09 2003-11-07 테이프 반송장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002356113A JP3768472B2 (ja) 2002-12-09 2002-12-09 テープ搬送装置

Publications (2)

Publication Number Publication Date
JP2004193182A JP2004193182A (ja) 2004-07-08
JP3768472B2 true JP3768472B2 (ja) 2006-04-19

Family

ID=32756535

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002356113A Expired - Fee Related JP3768472B2 (ja) 2002-12-09 2002-12-09 テープ搬送装置

Country Status (3)

Country Link
JP (1) JP3768472B2 (2)
KR (1) KR100539214B1 (2)
TW (1) TW200416907A (2)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100700618B1 (ko) * 2005-12-02 2007-03-28 합명회사 서우테크 티씨피/씨오에프 외관검사기의 필름규격에 의한 폭조절구조
JP4648257B2 (ja) * 2006-06-28 2011-03-09 芝浦メカトロニクス株式会社 被搬送部材の搬送装置及び電子部品の実装装置
CN112147145A (zh) * 2020-10-10 2020-12-29 昆山晋基精密机械模具有限公司 一种基于视觉检测的料带检测设备
KR102731954B1 (ko) * 2022-11-21 2024-11-18 스테코 주식회사 Cof 패키지 용 필름 이송 장치

Also Published As

Publication number Publication date
KR20040050839A (ko) 2004-06-17
KR100539214B1 (ko) 2005-12-27
JP2004193182A (ja) 2004-07-08
TW200416907A (en) 2004-09-01
TWI298184B (2) 2008-06-21

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