JP3767847B2 - リングフレームへの接着テープ貼着方法及び装置 - Google Patents

リングフレームへの接着テープ貼着方法及び装置 Download PDF

Info

Publication number
JP3767847B2
JP3767847B2 JP30222299A JP30222299A JP3767847B2 JP 3767847 B2 JP3767847 B2 JP 3767847B2 JP 30222299 A JP30222299 A JP 30222299A JP 30222299 A JP30222299 A JP 30222299A JP 3767847 B2 JP3767847 B2 JP 3767847B2
Authority
JP
Japan
Prior art keywords
tape
adhesive tape
ring frame
chuck
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP30222299A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001127075A5 (enExample
JP2001127075A (ja
Inventor
隆博 芦田
昌宏 森田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Takatori Corp
Original Assignee
Takatori Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Takatori Corp filed Critical Takatori Corp
Priority to JP30222299A priority Critical patent/JP3767847B2/ja
Publication of JP2001127075A publication Critical patent/JP2001127075A/ja
Publication of JP2001127075A5 publication Critical patent/JP2001127075A5/ja
Application granted granted Critical
Publication of JP3767847B2 publication Critical patent/JP3767847B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Dicing (AREA)
JP30222299A 1999-10-25 1999-10-25 リングフレームへの接着テープ貼着方法及び装置 Expired - Fee Related JP3767847B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30222299A JP3767847B2 (ja) 1999-10-25 1999-10-25 リングフレームへの接着テープ貼着方法及び装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30222299A JP3767847B2 (ja) 1999-10-25 1999-10-25 リングフレームへの接着テープ貼着方法及び装置

Publications (3)

Publication Number Publication Date
JP2001127075A JP2001127075A (ja) 2001-05-11
JP2001127075A5 JP2001127075A5 (enExample) 2005-04-21
JP3767847B2 true JP3767847B2 (ja) 2006-04-19

Family

ID=17906428

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30222299A Expired - Fee Related JP3767847B2 (ja) 1999-10-25 1999-10-25 リングフレームへの接着テープ貼着方法及び装置

Country Status (1)

Country Link
JP (1) JP3767847B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5151053B2 (ja) * 2006-03-30 2013-02-27 富士通セミコンダクター株式会社 半導体装置の製造方法
CN107859677B (zh) * 2017-10-31 2023-07-25 苏州奥卫川诚自动化科技有限公司 一种可调式贴胶工具
JP6954611B2 (ja) * 2017-11-13 2021-10-27 Uht株式会社 テープ貼付装置及びテープ貼付方法
KR102233318B1 (ko) * 2020-10-12 2021-03-29 제너셈(주) 테이프 마운터

Also Published As

Publication number Publication date
JP2001127075A (ja) 2001-05-11

Similar Documents

Publication Publication Date Title
JP3666820B2 (ja) 偏光板の貼り付け装置
KR100799899B1 (ko) 칩 캐리어 테이프
JP4119054B2 (ja) 半導体素子のダイ接着方法及び装置
US7074646B2 (en) In-line die attaching and curing apparatus for a multi-chip package
US5966903A (en) High speed flip-chip dispensing
JP4612453B2 (ja) ウエハへのテープ貼付方法と貼付装置
JP3956084B2 (ja) 半導体ウェーハへのダイボンドテープ貼り付け方法及び装置
CN114496872A (zh) 一种二极管Clip Bond的生产设备及方法
JP2004349435A (ja) 基板へのダイシング・ダイボンドテープの貼り付け装置
JP4417824B2 (ja) フィルム貼着装置およびフィルム貼着方法
JPWO1998012908A1 (ja) Ｉｃチップの実装方法、実装装置、及びそれに使用するテープ状支持体
JP4372486B2 (ja) 絶縁接着テープを使用するチップ接着装置
JP3767847B2 (ja) リングフレームへの接着テープ貼着方法及び装置
TWI511210B (zh) A lead connection device and a connection method, a semiconductor element, and a solar battery module
KR100819791B1 (ko) 반도체 패키지 제조용 테이프의 접착 장치 및 그 방법
JP4204221B2 (ja) 圧縮成形装置
KR200224075Y1 (ko) 아이.씨. 회로필름 접착장치
US20050204554A1 (en) Method for processing electrical components, especially semiconductor chips, and device for carrying out the method
TW201001566A (en) Jig and method for picking up a die
TWI753584B (zh) 半導體封裝多重夾片黏合裝置及同裝置製造的半導體封裝
JP2001217269A (ja) 樹脂封止装置及び樹脂封止方法
KR100914986B1 (ko) 칩 본딩 장비
JP2000091403A (ja) ダイピックアップ方法およびそれを用いた半導体製造装置ならびに半導体装置の製造方法
KR100419243B1 (ko) 고집적 박형 패키지용 회전식 테이프 부착장치
JPH10175064A (ja) 半田付け方法およびそれに使用される半田付け材

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040610

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040610

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20051109

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20051115

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20051222

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20060125

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20060127

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 3767847

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090210

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120210

Year of fee payment: 6

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130210

Year of fee payment: 7

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130210

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130210

Year of fee payment: 7

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees