JP3764133B2 - Adhesive tape for electronic components - Google Patents
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- JP3764133B2 JP3764133B2 JP2002241453A JP2002241453A JP3764133B2 JP 3764133 B2 JP3764133 B2 JP 3764133B2 JP 2002241453 A JP2002241453 A JP 2002241453A JP 2002241453 A JP2002241453 A JP 2002241453A JP 3764133 B2 JP3764133 B2 JP 3764133B2
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【０００１】
【発明の属する技術分野】
本発明は、半導体ウエハや電子基板等の電子部材をその裏面から安定的に保持し、ダイシング、バックグラインド又は搬送する際に用いられる電子部材用粘着テープに係り、特に、放射線照射後の粘着力低下速度が速いと共に電子部材の裏面に糊残りが生じ難い電子部材用粘着テープに関する。
【０００２】
【従来の技術】
従来、電子部材用粘着テープとしては、電子部材に糊残りが生じる問題を解決する手段としてポリマ側鎖に二重結合を有する粘着剤を用いるものが知られている（例えば特開平５−３２９４６号）。
【０００３】
【発明が解決しようとする課題】
しかし、かかる手段の電子部材用粘着テープにあっては、ポリマ側鎖の二重結合の光（紫外線）反応が低分子化合物及びオリゴマの二重結合の反応よりも遅く、電子部材を電子部材用粘着テープから剥離する際、紫外線照射に時間がかかること及び粘着力の低下が十分に行なえずチップのピックアップ不良を生じるという課題があった。
【０００４】
したがって、本発明の目的は、放射線照射後の粘着力低下速度が速く、十分に粘着力の低下ができ、チップのピックアップ性を向上させ、さらに電子部材の裏面に糊残りが生じ難い電子部材用粘着テープを提供することにある。
【０００５】
【課題を解決するための手段】
本発明者らは、上記に鑑み鋭意検討を行なった結果、シート状の支持体と、該支持体の片面に粘着剤層を有する電子部材用粘着テープにおいて、該粘着剤層を構成する組成物が、水酸基を有する粘着剤ベースポリマ、水酸基及び不飽和二重結合を有する化合物、多官能性ウレタンアクリレートオリゴマ、イソシアネート系硬化剤及び放射線重合開始剤を備え、さらに上記粘着剤ベースポリマの水酸基当量と上記水酸基及び不飽和二重結合を有する化合物の水酸基当量の和を、上記イソシアネート系硬化剤のイソシアネート基当量に対して１．０〜２．０倍の当量にすることで、上記課題を解決できることを見出し、本発明を完成した。
【０００６】
【発明の実施の形態】
本発明の電子部材用粘着テープに積層される粘着剤層を構成する組成物が、水酸基を有する粘着剤ベースポリマ、水酸基及び不飽和二重結合を有する化合物、多官能性ウレタンアクリレートオリゴマ、イソシアネート系硬化剤、放射線重合開始剤を備えたのは、放射線照射後の粘着力低下速度を速め、十分に粘着力を低下させ、チップのピックアップ性を向上させ、さらに電子部材の裏面に糊残りを生じさせないためである。
【０００７】
本発明において、放射線照射後の粘着力低下速度を速めること及び十分に粘着力を低下させることができたのは、前記放射線重合開始剤が放射線によって刺激を受けて多官能ウレタンアクリレートオリゴマと結合し、この多官能ウレタンアクリレートオリゴマが上記３種化合物（水酸基を有する粘着剤ベースポリマ、水酸基及び不飽和二重結合を有する化合物及びイソシアネート系硬化剤）の二重結合と結合することを見出したためである。また、他の効果としてのチップのピックアップ性向上及び電子部材の裏面に糊残りを生じさせないことができたのは、該粘着剤を上記支持体に塗工してから養生（例えば２０~６０℃の温度下で２~１０日間放置）することにより達成される。この養生の際の化学反応は、上記３種化合物を化学的に結合させるものであり、この結合によって、ポリマ側鎖に不飽和二重結合が導入されて凝集力が向上し、これにより、チップのピックアップ性向上及び電子部材の裏面に糊残りを生じさせないことが達成された。
【０００８】
上記粘着剤層を構成する組成物に配合する粘着剤ベースポリマとしては、水酸基を有する従来公知の粘着剤ベースポリマを採用できる。水酸基の比率は、一般のベースポリマとしての比率でよい。特に限定するわけではないが、この水酸基の比率が少ないと硬化剤との結合力が弱く粘着剤の低下が発生せず、この比率が高く未反応の水酸基が残ると耐水性がなくなりダイシング時に受ける水により糊残りが生じやすくなってしまうため、水酸基の比率は、好ましくは、３〜６０モル％が良い。
【０００９】
該水酸基を有する粘着剤ベースポリマとしては、例えば、従来公知のアクリル系粘着剤を使用でき、一般的には、アクリル酸エステル系を主たる構成単位とする共重合体から選ばれたアクリル共重合体がある。具体的には主モノマ、コモノマ、水酸基を有するモノマ等があり、主モノマとしてはエチルアクリレート、ブチルアクリレート、２−エチルヘキシルアクリレートがあり、コモノマとしては酢酸ビニル、アクリロニトリル、アクリルアマイド、スチレン、メチルメタアクリレート、メチルアクリレートがある。また、水酸基を有するモノマとしては、２−ヒドロキシエチル（メタ）アクリレート、２−ヒドロキシプロピール（メタ）アクリレート、メチロールアクリルアマイド、ビニルアルコール、エチレングリコールモノ（メタ）アクリレート等がある。
【００１０】
本発明における電子部材用粘着テープの粘着剤層を構成する組成物に配合する化合物として、水酸基及び不飽和二重結合を有するものに限定したのは、粘着剤の粘着力を養生する際、水酸基によって上記イソシアネート系硬化剤を介してベースポリマ中の水酸基と結合させ、放射線によってポリマ側鎖の不飽和二重結合と多官能ウレタンアクリレートオリゴマと結合させ，糊残りをなくすためである。
【００１１】
該「水酸基及び不飽和二重結合を有する化合物」の配合量は、ベースポリマの水酸基に対して１０〜１００モル％、好ましくは３０〜６０モル％であるのがよい。該化合物の配合量を特定したのは、該化合物の添加量が少ない場合には結合比率が低下してベースポリマ側鎖に不飽和２重結合が導入できず、放射線照射後、糊残りが生じやすくなり、多い場合には放射線照射前の粘着剤凝集力が低くなり、再貼り合せできないためばかりか、放射線照射後、糊残りが生じる。
【００１２】
該「水酸基及び不飽和二重結合を有する化合物」としては、２−ヒドロキシエチル（メタ）アクリレート、２−ヒドロキシプロピール（メタ）アクリレート、メチロールアクリルアマイド、ビニルアルコール、エチレングリコールモノ（メタ）アクリレート、ロジンエポキシアクリレート等がある。
【００１３】
本発明における電子部材用粘着テープの粘着剤層を構成する組成物に配合する多官能性ウレタンアクリレートオリゴマとしては、炭素−炭素二重結合を少なくとも二個以上有する化合物である。具体的には、ポリエステル型又はポリエーテル型等のポリオール化合物と、多価イソシアネート化合物（例えば２，４−トリレンジイソシアナート、２，６−トリレンジイソシアナート、１，３−キシリレンジイソシアナート、１，４−キシリレンジイソシアナート、ジフエニルメタン４，４−ジイソシアナート等）を反応させて得られる末端イソシアナートウレタンプレポリマに、ヒドロキシル基を有するアクリレートあるいはメタクリレート（例えば２−ヒドロキシエチルアクリレート、２−ヒドロキシエチルメタクリレート、２−ヒドロキシプロピルアクリレート、２−ヒドロキシプロピルメタクリレート、ポリエチレングリコールアクリレート、ポリエチレングリコールメタクリレート等）を反応させて得られるものがある。
【００１４】
該ウレタンアクリレートオリゴマの配合比は、あまりに少ないと粘着剤の粘着力低下速度が遅くなり、あまりに多いと粘着力低下が進み過ぎてしまうので、上記ベースポリマ１００重量部に対して１０〜２００重量部が好ましい。
【００１５】
また、ウレタンアクリレート系オリゴマを採用する場合、特に限定するわけではないが、分子量３００〜３００００のものを粘着剤層に用いると、半導体ウエハ等の裏面を研磨した後においても粘着剤が半導体ウエハ等に付着することがない。
【００１６】
本発明における電子部材用粘着テープの粘着剤層を構成する組成物にイソシアネート系硬化剤を配合したのは、ベースポリマ鎖中の水酸基と水酸基および不飽和二重結合を有する化合物の水酸基を養生で反応させ、粘着剤全体の凝集力を向上させるためである。このイソシアネート当量の方が多いと未反応の（結合しない）イソシアネートによって糊残りが生じ、水酸基当量があまりに多いと未反応の（結合しない）水酸基によって糊残りやピックアップ不良が生じるため、該イソシアネート系硬化剤のイソシアネート当量は、「水酸基及び不飽和二重結合を有する化合物の水酸基当量」と「粘着剤ベースポリマの水酸基当量」の和に対して１．０〜２．０倍であることが必要である。水酸基当量の方が２．０倍まで多くて良いのは、結合しない水酸基がその程度まであっても、粘着剤全体には影響を与えにくいためである。
【００１７】
上記イソシアネート系硬化剤としては、具体的には多価イソシアネート化合物、たとえば２，４−トリレンジイソシアネート、２，６−トリレンジイソシアネート、１，３−キシリレンジイソシアネート、１，４−キシレンジイソシアネート、ジフェニルメタン−４，４’−ジイソシアネート、ジフェニルメタン−２，４’−ジイソシアネート、３−メチルジフェニルメタンジイソシアネート、ヘキサメチレンジイソシアネート、イソホロンジイソシアネート、ジシクロヘキシルメタン−４，４’−ジイソシアネート、ジシクロヘキシルメタン−２，４’−ジイソシアネート、リジンイソシアネート等がある。
【００１８】
本発明における電子部材用粘着テープの粘着剤層を構成する組成物に放射線重合開始剤を配合したのは、放射線により粘着力低下を速めるためである。放射線重合開始剤としては、ベンゾイン、ベンゾインメチルエーテル、ベンゾインエチルエーテル、ベンゾインイソプロピルエーテル、ベンジルジフェニルサルファイド、テトラメチルチウラムモノサルファイド、アゾビスイソブチロニトリル、ジベンジル、ジアセチル、β−クロールアンスラキノンがあり、その他、公知の高分子放射線重合開始剤も使用できる。
【００１９】
該放射線重合開始剤の配合比は、あまりに少ないと反応速度が遅くなり、あまりに多いと貼り付け後の剥離の際、未反応の放射線重合開始剤が電子部材の背面に残ってしまうため、粘着剤ベースポリマ１００重量部に対して０．１〜２０重量部が好ましい。
【００２０】
また、これら組成物で形成される粘着剤には、従来公知の粘着付与樹脂、充填剤、老化防止剤、軟化剤、安定剤若しくは着色剤などを適宜選択して添加しても良いが、あまりにも多いと糊残りの発生につながる。なお、粘着剤の厚さは、一般的に採用されている５〜５０μｍから適宜選択して採用すればよい。
【００２１】
本発明における電子部材用粘着テープの支持体は、電子部材用粘着テープの支持体として採用される従来公知のものを採用できる。該支持体の厚さにあっては、素材の強度によって異なるが、あまりに薄いと、電子部材を電子部材用粘着テープに貼り付けたまま搬送する際に曲折して電子部材を破損してしまう。また、あまりに厚いと、エキスパンド性に劣り、ダイシング後のピックアップ工程でピックアップ出来ない不具合が発生する。このため、支持体の厚さにあっては、５０〜１５０μｍが良い。また、粘着テープの形状は、シート状、ラベル状等がある。
【００２２】
上記支持体として採用できる合成樹脂としては、従来公知のものを採用でき、紫外線硬化をする場合には紫外線透過性のものがよく、ポリエステル、ポリエチレン、ポリエチレンテレフタレート、ポリプロピレン、ポリブテン、ポリブタジエン、ポリ塩化ビニル樹脂、アイオノマ樹脂、エチレン−（メタ）アクリル酸共重合体、エチレン−（メタ）アクリル酸エステル共重合体、ポリスチレン、ポリカーボネート等、さらにはこれら樹脂製支持体表面にシリコーン樹脂等を塗布して剥離処理した支持体等がある。
【００２３】
前記支持体としては上記のような樹脂製フィルムを単独でも、また２種以上の積層フィルムでもよい。上記支持体の厚さは、通常１０〜３００μｍであり、好ましくは５０〜１５０μｍである。
【００２４】
なお、本発明にかかる電子部材用粘着テープは、必要に応じて粘着剤上にポリエチレンラミネート紙、剥離処理プラスチックフイルム等の剥離紙又は剥離シートを密着させて保存される。
【００２５】
【実施例】
以下、本発明の実施例について、比較例と対比しつつ、表１を参照しながら説明する。
【００２６】
【表１】
表１の粘着剤層の各組成物における各値は重量部であり、照射前及び照射後の粘着力の値はＮ／１０ｍｍであり、紫外線照射前後の値をＪＩＳ Ｚ ０２３７に準じて測定した。紫外線照射は、放射照度４ｍＷ／ｃｍ2（ディスコ社製ＵＶ照射機）の条件下で５０又は１５０ｍｊ／ｃｍ2になるよう照射した。その時の試験体は５インチミラーウエハミラー面に気泡の入らないように貼付し、２時間以内に照射して２４時間以内に剥がしたものである。
【００２８】
表１中の特性値における糊残りは、電子部材用粘着シート上に直径６インチ、厚さ４００μｍのシリコンウエハを貼り付けてから２０分後に３．８ｍｍ×７．０ｍｍ角チップへフルカットしてピックアップしたチップの裏面と側面を２００倍の顕微鏡で観察した際に、粘着剤を発見できなかった場合を○、そうでない場合を×とした。
【００２９】
表１中の特性値におけるダイシング性（チップ飛び）は、シリコンウエハ一枚に対して上記フルカットを行っても、チップ飛びが一つもないものを○、チップ飛びが一つでも発生したものを×とした。
【００３０】
表１中の特性値におけるピックアップ性は、シリコンウエハ一枚に対して上記ピックアップを行って、全て正確にピックアップされたものを○、一つでも正確にピックアップされなかったものを×とした。
【００３１】
本実施例の電子部材用粘着テープについて、説明する。この電子部材用粘着テープは、ポリエチレン樹脂製シート状支持体（支持体は、表１には開示を省略した。）厚さ９０μｍの片面に、厚さ２５μｍになるように粘着剤層を積層させたものである。ここで、粘着剤層は、粘着剤ベースポリマとしての２−ヒドロキシエチルメタアクリレート（２ＨＥＭＡ）を１０モル％備えたＢＡ−２ＨＥＭＡ水酸基及び不飽和二重結合を有する化合物としての２ＨＥＭＡ、多官能ウレタンアクリレートオリゴマとしてのウレタンアクリレート（荒川化学社製ビームセット５７５）、イソシアネート系硬化剤としてのイソシアネート（日本ポリウレタン社製Ｌ−４５）、放射線重合開始剤としての日本チバガイギー社製イルガキュアー６５１が配合されたものである。本実施例にあっては、粘着剤ベースポリマの水酸基当量と上記水酸基及び不飽和二重結合を有する化合物の水酸基当量の和が０．１６であり、上記イソシアネート系硬化剤のイソシアネート基当量が０．１２である。本実施例では、表１に示すように、次に説明する効果の全てが良好であった。なお、以下の比較例は特に記載しない限り、本実施例と同様のものである。
【００３２】
比較例１の電子部材用粘着テープは、実施例における水酸基及び不飽和二重結合を有する化合物を、配合しなかったものである。本比較例１は、これにより粘着剤ベースポリマの水酸基当量と上記水酸基及び不飽和二重結合を有する化合物の水酸基当量の和が、上記イソシアネート系硬化剤のイソシアネート基当量に対して約０．６７倍（０．０８／０．１２）としたものである。比較例１にあっては、糊残りが生じた。
【００３３】
比較例２の電子部材用粘着テープは、実施例における水酸基及び不飽和二重結合を有する化合物を、１００重量部に変更したものである。本比較例２は、これにより粘着剤ベースポリマの水酸基当量と上記水酸基及び不飽和二重結合を有する化合物の水酸基当量の和が、上記イソシアネート系硬化剤のイソシアネート基当量に対して約７．４倍（０．８９／０．１２）としたものである。比較例２にあっては糊残りが生じ、ピックアップ性も悪かった。
【００３４】
【発明の効果】
本発明にあっては、シート状の支持体と、該支持体の片面に粘着剤層を有する電子部材用粘着テープにおいて、該粘着剤層を構成する組成物が、水酸基を有する粘着剤ベースポリマ、水酸基及び不飽和二重結合を有する化合物、多官能性ウレタンアクリレートオリゴマ、イソシアネート系硬化剤及び放射線重合開始剤を備え、上記粘着剤ベースポリマの水酸基当量と上記水酸基及び不飽和二重結合を有する化合物の水酸基当量の和を、上記イソシアネート系硬化剤のイソシアネート基当量に対して１．０〜２．０倍の当量であることを特徴とし、これにより硬化後の凝集力が高く、粘着剤の粘着力低下速度が速いと共に電子部材の裏面に糊残りが生じ難くなった。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an adhesive tape for an electronic member that is used to stably hold an electronic member such as a semiconductor wafer or an electronic substrate from its back surface, and is used for dicing, back grinding, or transporting, and in particular, an adhesive strength after radiation irradiation. The present invention relates to a pressure-sensitive adhesive tape for electronic members that is fast in decreasing speed and hardly causes adhesive residue on the back surface of the electronic member.
[0002]
[Prior art]
Conventionally, as a pressure-sensitive adhesive tape for electronic members, one using a pressure-sensitive adhesive having a double bond in a polymer side chain is known as a means for solving the problem of adhesive residue on an electronic member (for example, JP-A-5-32946). ).
[0003]
[Problems to be solved by the invention]
However, in the adhesive tape for electronic member of such means, the light (ultraviolet) reaction of the double bond of the polymer side chain is slower than the reaction of the double bond of the low molecular weight compound and the oligomer, and the electronic member is used for the electronic member. When peeling from the pressure-sensitive adhesive tape, there are problems that it takes time to irradiate ultraviolet rays and the adhesive force cannot be sufficiently lowered, resulting in chip pickup failure.
[0004]
Therefore, an object of the present invention is for an electronic member that has a fast adhesive force reduction rate after radiation irradiation, can sufficiently reduce the adhesive force, improves the pick-up property of the chip, and does not easily cause adhesive residue on the back surface of the electronic member. It is to provide an adhesive tape.
[0005]
[Means for Solving the Problems]
As a result of intensive studies in view of the above, the inventors of the present invention have, as a result, a composition constituting the pressure-sensitive adhesive layer in a sheet-like support and a pressure-sensitive adhesive tape for an electronic member having a pressure-sensitive adhesive layer on one side of the support. Comprising a hydroxyl group-containing pressure-sensitive adhesive base polymer, a compound having a hydroxyl group and an unsaturated double bond, a polyfunctional urethane acrylate oligomer, an isocyanate curing agent, and a radiation polymerization initiator, and the pressure-sensitive adhesive base polymer having a hydroxyl group equivalent The above-mentioned problem can be solved by setting the sum of the hydroxyl group equivalents of the compound having a hydroxyl group and an unsaturated double bond to an equivalent of 1.0 to 2.0 times the isocyanate group equivalent of the isocyanate curing agent. The present invention has been completed.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
The composition constituting the pressure-sensitive adhesive layer laminated on the pressure-sensitive adhesive tape for electronic members of the present invention includes a pressure-sensitive adhesive base polymer having a hydroxyl group, a compound having a hydroxyl group and an unsaturated double bond, a polyfunctional urethane acrylate oligomer, and an isocyanate type. With a curing agent and radiation polymerization initiator, the speed of decreasing the adhesive strength after irradiation is increased, the adhesive strength is sufficiently reduced, the chip pick-up property is improved, and adhesive residue is generated on the back surface of the electronic member. This is to prevent it from happening.
[0007]
In the present invention, it was possible to increase the rate of decrease in adhesive strength after irradiation and sufficiently reduce the adhesive strength because the radiation polymerization initiator was stimulated by radiation and bonded to the polyfunctional urethane acrylate oligomer. This is because this polyfunctional urethane acrylate oligomer was found to bind to the double bond of the above-mentioned three kinds of compounds (a pressure-sensitive adhesive base polymer having a hydroxyl group, a compound having a hydroxyl group and an unsaturated double bond, and an isocyanate curing agent). . In addition, as another effect, the chip pick-up property was improved and no adhesive residue was formed on the back surface of the electronic member. The adhesive was applied to the support and then cured (for example, 20 to 60 ° C.). For 2 to 10 days). The chemical reaction during the curing is to chemically bond the above three kinds of compounds, and this bond introduces an unsaturated double bond into the polymer side chain, thereby improving the cohesive force. The improvement of the pick-up property and the generation of no adhesive residue on the back surface of the electronic member were achieved.
[0008]
As an adhesive base polymer mix | blended with the composition which comprises the said adhesive layer, the conventionally well-known adhesive base polymer which has a hydroxyl group is employable. The ratio of the hydroxyl group may be a ratio as a general base polymer. Although there is no particular limitation, if the ratio of the hydroxyl groups is small, the bonding force with the curing agent is weak and the pressure-sensitive adhesive does not decrease. If this ratio is high and unreacted hydroxyl groups remain, the water resistance is lost and it is received during dicing. Since water is likely to cause adhesive residue, the hydroxyl group ratio is preferably 3 to 60 mol%.
[0009]
As the pressure-sensitive adhesive base polymer having a hydroxyl group, for example, a conventionally known acrylic pressure-sensitive adhesive can be used, and in general, an acrylic copolymer selected from a copolymer having an acrylate ester as a main constituent unit. There is. Specifically, there are main monomers, comonomers, monomers having hydroxyl groups, etc., main monomers include ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, and comonomers include vinyl acetate, acrylonitrile, acrylamide, styrene, methyl methacrylate. And methyl acrylate. Examples of the monomer having a hydroxyl group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, methylol acrylate, vinyl alcohol, and ethylene glycol mono (meth) acrylate.
[0010]
The compound blended in the composition constituting the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape for electronic members in the present invention is limited to those having a hydroxyl group and an unsaturated double bond when curing the adhesive strength of the pressure-sensitive adhesive. This is to bond with the hydroxyl group in the base polymer via the isocyanate curing agent, and bond with the unsaturated double bond of the polymer side chain and the polyfunctional urethane acrylate oligomer by radiation to eliminate the adhesive residue.
[0011]
The amount of the "compound having a hydroxyl group and an unsaturated double bond" is 10 to 100 mol%, preferably 30 to 60 mol%, based on the hydroxyl group of the base polymer. The compounding amount of the compound was specified because when the addition amount of the compound is small, the bond ratio is lowered, and an unsaturated double bond cannot be introduced into the base polymer side chain, and an adhesive residue is generated after irradiation. In many cases, the adhesive cohesive force before radiation irradiation becomes low and the adhesive cannot be re-bonded, and adhesive residue remains after radiation irradiation.
[0012]
As the “compound having a hydroxyl group and an unsaturated double bond”, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, methylol acrylate, vinyl alcohol, ethylene glycol mono (meth) acrylate, Examples include rosin epoxy acrylate.
[0013]
The polyfunctional urethane acrylate oligomer blended in the composition constituting the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape for electronic members in the present invention is a compound having at least two carbon-carbon double bonds. Specifically, a polyol compound such as a polyester type or a polyether type and a polyvalent isocyanate compound (for example, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, A terminal isocyanate urethane prepolymer obtained by reacting 1,4-xylylene diisocyanate, diphenylmethane 4,4-diisocyanate, etc., with an acrylate or methacrylate having a hydroxyl group (for example, 2-hydroxyethyl acrylate, 2-hydroxy And hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, polyethylene glycol acrylate, polyethylene glycol methacrylate, and the like).
[0014]
If the blending ratio of the urethane acrylate oligomer is too small, the pressure reduction rate of the pressure-sensitive adhesive will be slow, and if it is too large, the pressure reduction will proceed excessively, so 10 to 200 parts by weight with respect to 100 parts by weight of the base polymer. Is preferred.
[0015]
In addition, when urethane acrylate oligomers are used, the adhesive is not particularly limited. However, when a layer having a molecular weight of 300 to 30,000 is used for the adhesive layer, the adhesive is not removed even after the back surface of the semiconductor wafer or the like is polished. It will not adhere to.
[0016]
The composition of the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape for electronic members in the present invention is blended with an isocyanate curing agent by curing the hydroxyl group in the base polymer chain and the hydroxyl group of the compound having a hydroxyl group and an unsaturated double bond. This is to cause the reaction to improve the cohesive force of the entire pressure-sensitive adhesive. If this isocyanate equivalent is larger, adhesive residue is generated by unreacted (unbonded) isocyanate, and if the hydroxyl equivalent is too much, unreacted (unbonded) hydroxyl group causes adhesive residue and pickup failure. The isocyanate equivalent of the agent should be 1.0 to 2.0 times the sum of the “hydroxyl equivalent of the compound having a hydroxyl group and an unsaturated double bond” and the “hydroxyl equivalent of the pressure-sensitive adhesive base polymer”. is there. The reason why the hydroxyl group equivalent may be as much as 2.0 times is that even if the hydroxyl group that is not bonded is up to that level, it does not easily affect the entire pressure-sensitive adhesive.
[0017]
Specific examples of the isocyanate curing agent include polyvalent isocyanate compounds such as 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylene diisocyanate, diphenylmethane. -4,4'-diisocyanate, diphenylmethane-2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, dicyclohexylmethane-2,4'-diisocyanate, Examples include lysine isocyanate.
[0018]
The reason why the radiation polymerization initiator is blended with the composition constituting the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape for electronic members in the present invention is to accelerate the decrease in pressure-sensitive adhesive force by radiation. Radiation polymerization initiators include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyldiphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, dibenzyl, diacetyl, β-chloranthraquinone, In addition, a known polymer radiation polymerization initiator can also be used.
[0019]
If the blending ratio of the radiation polymerization initiator is too small, the reaction rate becomes slow, and if it is too large, an unreacted radiation polymerization initiator remains on the back surface of the electronic member at the time of peeling after application. 0.1 to 20 parts by weight is preferable with respect to 100 parts by weight of the base polymer.
[0020]
In addition, to the pressure-sensitive adhesive formed with these compositions, conventionally known tackifying resins, fillers, anti-aging agents, softeners, stabilizers or colorants may be appropriately selected and added, but too much If there is too much, it will lead to generation of adhesive residue. In addition, what is necessary is just to select and employ | adopt suitably the thickness of an adhesive from 5-50 micrometers generally employ | adopted.
[0021]
The support body of the adhesive tape for electronic members in this invention can employ | adopt the conventionally well-known thing employ | adopted as a support body of the adhesive tape for electronic members. The thickness of the support varies depending on the strength of the material, but if it is too thin, the electronic member may be bent and damaged when transported while being attached to the adhesive tape for electronic member. On the other hand, if it is too thick, the expandability is inferior, and a problem that pickup cannot be performed in the pickup process after dicing occurs. For this reason, about the thickness of a support body, 50-150 micrometers is good. Moreover, the shape of an adhesive tape has a sheet form, a label form, etc.
[0022]
As the synthetic resin that can be used as the support, conventionally known resins can be used, and in the case of UV curing, those that are UV transmissive are preferable. Polyester, polyethylene, polyethylene terephthalate, polypropylene, polybutene, polybutadiene, polyvinyl chloride Resin, ionomer resin, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid ester copolymer, polystyrene, polycarbonate, etc., and silicone resin etc. applied to the surface of these resin supports There are treated supports and the like.
[0023]
The support may be a single resin film as described above, or two or more laminated films. The thickness of the said support body is 10-300 micrometers normally, Preferably it is 50-150 micrometers.
[0024]
The pressure-sensitive adhesive tape for electronic members according to the present invention is stored with a release paper or a release sheet such as polyethylene laminated paper or release-treated plastic film in contact with the adhesive as necessary.
[0025]
【Example】
Hereinafter, examples of the present invention will be described with reference to Table 1 in comparison with comparative examples.
[0026]
[Table 1]
Each value in each composition of the pressure-sensitive adhesive layer in Table 1 is parts by weight, the value of the adhesive strength before and after irradiation is N / 10 mm, and the value before and after ultraviolet irradiation was measured according to JIS Z 0237. . Irradiation with ultraviolet rays was performed so as to be 50 or 150 mj / cm 2 under the condition of irradiance of 4 mW / cm 2 (UV irradiation machine manufactured by Disco Corporation). The test specimen at that time was affixed to the 5-inch mirror wafer mirror surface so as not to contain bubbles, irradiated within 2 hours, and peeled off within 24 hours.
[0028]
The adhesive residue in the characteristic values in Table 1 is fully cut into a 3.8 mm × 7.0 mm square chip 20 minutes after a silicon wafer having a diameter of 6 inches and a thickness of 400 μm is pasted on the adhesive sheet for electronic members. When the back surface and the side surface of the picked-up chip were observed with a 200-fold microscope, the case where no adhesive was found was marked with ◯, and the case where it was not, was marked with x.
[0029]
The dicing property (chip skip) in the characteristic values in Table 1 indicates that even when the above-mentioned full cut is performed on one silicon wafer, there is no chip skipping, and one chip skipping occurs. X.
[0030]
The pick-up property in the characteristic values in Table 1 was evaluated as “◯” when the above pick-up was performed on one silicon wafer and all were picked up correctly, and “×” when none was picked up accurately.
[0031]
The electronic member pressure-sensitive adhesive tape of this example will be described. This pressure-sensitive adhesive tape for electronic members has a polyethylene resin sheet-like support (the support was not disclosed in Table 1). A pressure-sensitive adhesive layer was laminated to a thickness of 25 μm on one side of a thickness of 90 μm. It is a thing. Here, the pressure-sensitive adhesive layer comprises 2HEMA as a compound having a BA-2HEMA hydroxyl group and an unsaturated double bond comprising 10 mol% of 2-hydroxyethyl methacrylate (2HEMA) as a pressure-sensitive adhesive base polymer, and a polyfunctional urethane acrylate. A blend of urethane acrylate as an oligomer (Beamset 575 manufactured by Arakawa Chemical Co., Ltd.), isocyanate (L-45 manufactured by Nippon Polyurethane Co., Ltd.) as an isocyanate curing agent, and Irgacure 651 manufactured by Nippon Ciba Geigy Co., Ltd. as a radiation polymerization initiator. It is. In this example, the sum of the hydroxyl group equivalent of the pressure-sensitive adhesive base polymer and the hydroxyl group equivalent of the compound having a hydroxyl group and an unsaturated double bond is 0.16, and the isocyanate group equivalent of the isocyanate curing agent is 0. .12. In this example, as shown in Table 1, all the effects described below were good. The following comparative examples are the same as the present examples unless otherwise specified.
[0032]
The adhesive tape for electronic members of Comparative Example 1 is one in which the compound having a hydroxyl group and an unsaturated double bond in Examples was not blended. Thus, in Comparative Example 1, the sum of the hydroxyl group equivalent of the pressure-sensitive adhesive base polymer and the hydroxyl group equivalent of the compound having a hydroxyl group and an unsaturated double bond is about 0.67 with respect to the isocyanate group equivalent of the isocyanate curing agent. Double (0.08 / 0.12). In Comparative Example 1, adhesive residue was generated.
[0033]
The adhesive tape for electronic members of Comparative Example 2 is obtained by changing the compound having a hydroxyl group and an unsaturated double bond in Examples to 100 parts by weight. In this comparative example 2, the sum of the hydroxyl group equivalent of the pressure-sensitive adhesive base polymer and the hydroxyl group equivalent of the compound having the hydroxyl group and the unsaturated double bond is about 7.4 with respect to the isocyanate group equivalent of the isocyanate curing agent. Double (0.89 / 0.12). In Comparative Example 2, adhesive residue was generated and the pick-up property was poor.
[0034]
【The invention's effect】
In the present invention, in a pressure-sensitive adhesive tape for an electronic member having a sheet-like support and a pressure-sensitive adhesive layer on one side of the support, the composition constituting the pressure-sensitive adhesive layer is a pressure-sensitive adhesive base polymer having a hydroxyl group. , A compound having a hydroxyl group and an unsaturated double bond, a polyfunctional urethane acrylate oligomer, an isocyanate curing agent and a radiation polymerization initiator, and having a hydroxyl group equivalent of the pressure-sensitive adhesive base polymer and the hydroxyl group and unsaturated double bond The sum of the hydroxyl group equivalents of the compound is 1.0 to 2.0 times equivalent to the isocyanate group equivalent of the isocyanate-based curing agent, whereby the cohesive force after curing is high, Adhesive strength was reduced rapidly and adhesive residue was hardly generated on the back surface of the electronic member.
Claims (1)
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| JP2002241453A JP3764133B2 (en) | 2002-08-22 | 2002-08-22 | Adhesive tape for electronic components |
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| JP2002241453A JP3764133B2 (en) | 2002-08-22 | 2002-08-22 | Adhesive tape for electronic components |
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| JP2004075940A JP2004075940A (en) | 2004-03-11 |
| JP3764133B2 true JP3764133B2 (en) | 2006-04-05 |
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| JP2002241453A Expired - Lifetime JP3764133B2 (en) | 2002-08-22 | 2002-08-22 | Adhesive tape for electronic components |
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Cited By (2)
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| KR20170102327A (en) | 2015-05-18 | 2017-09-08 | 후지모리 고교 가부시키가이샤 | The adhesive resin layer and the adhesive resin film |
| KR20170104545A (en) | 2015-07-17 | 2017-09-15 | 후지모리 고교 가부시키가이샤 | The adhesive resin layer and the adhesive resin film |
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| JP2006286808A (en) * | 2005-03-31 | 2006-10-19 | Furukawa Electric Co Ltd:The | Wafer-working tape and method of working wafer using the same |
| JP4805765B2 (en) * | 2006-09-12 | 2011-11-02 | 電気化学工業株式会社 | An adhesive sheet for fixing an electronic component and a method for manufacturing an electronic component using the same. |
| KR100815383B1 (en) | 2006-12-28 | 2008-03-20 | 제일모직주식회사 | Photocuring composition for pressure sensitive adhesive layer and dicing die bonding film comprising the same |
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| CN102898958B (en) * | 2011-07-25 | 2016-11-02 | 汉高股份有限公司 | A kind of adhesive composition |
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| KR20170102327A (en) | 2015-05-18 | 2017-09-08 | 후지모리 고교 가부시키가이샤 | The adhesive resin layer and the adhesive resin film |
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| KR20170104545A (en) | 2015-07-17 | 2017-09-15 | 후지모리 고교 가부시키가이샤 | The adhesive resin layer and the adhesive resin film |
| KR20190053284A (en) | 2015-07-17 | 2019-05-17 | 후지모리 고교 가부시키가이샤 | Adhesive resin layer and adhesive resin film |
| US10544333B2 (en) | 2015-07-17 | 2020-01-28 | Fujimori Kogyo Co., Ltd. | Adhesive resin layer and adhesive resin film |
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