KR100945638B1 - Photocuring Composition for Pressure Sensitive Adhesive Layer and Dicing Die Bonding Film Comprising the Same - Google Patents

Abstract

The present invention relates to an acrylic adhesive binder including a vinyl group, a UV curable urethane acrylate oligomer, a thermosetting agent, a photocurable adhesive composition and a pressure-sensitive adhesive film comprising a photopolymerization initiator, and according to the present invention, a ring frame, a wafer, or a die It shows excellent adhesion with the adhesive adhesive film for adhesion, and has excellent curability even under photocuring conditions in which the amount of energy is not constant during UV curing, and thus it can be usefully used for dicing films and dicing die-bonding films.

Semiconductor, adhesive tape, photocurable adhesive composition, urethane acrylate oligomer, epoxy group, thermosetting agent, photoinitiator, dicing, dicing die bonding

Description

Photocuring Composition for Pressure Sensitive Adhesive Layer and Dicing Die Bonding Film Comprising the Same

The present invention relates to a photocurable pressure-sensitive adhesive composition and a dicing die-bonding film comprising the same, and more particularly, to a photocurable pressure-sensitive adhesive composition comprising an acrylic adhesive binder including a vinyl group, a UV curable urethane acrylate oligomer, a thermosetting agent, and a photopolymerization initiator. And a dicing die bonding film comprising the same.

In the semiconductor manufacturing process, a wafer in which a circuit is designed is divided into small chips through dicing in a size having a large diameter, and each separated chip is die-bonded by bonding to a supporting member such as a PCB substrate or a lead frame substrate. Go through

Conventionally, a dicing film is attached to the back surface of a wafer in a dicing process to prevent chips from scattering or moving during dicing. If the dicing film is not used, the chip may be scattered or moved by the blades rotating at high speed, causing the chip to be damaged. Thus, a dicing film with appropriate adhesion was used to facilitate the individualization process of the chip.

In the case where the dicing film is an ultraviolet curable composition, after the completion of the dicing, the back surface is irradiated with ultraviolet rays to cure the composition to lower the interfacial peeling force with the wafer, thereby facilitating the pickup process of the individualized chip wafer.

According to the conventional method as described above, in the packaging process for delivering electrical signals to individual chips after dicing, a die bonding process for adhering the chip to a supporting member such as a PCB substrate or a lead frame substrate is required. Chip is bonded to PCB board or leadframe using epoxy adhesive of MCP (Multi Chip Package), which requires high density and high integration. Therefore, when a liquid epoxy adhesive is used, it is difficult to apply a uniform thickness, and when the adhesive is excessive or insufficient, problems such as fillet phenomenon and lack of adhesive strength have occurred.

In order to solve the above problems, Korean Patent Laid-Open Publication No. 2004-30979 proposes a technique in which an ultraviolet curable pressure-sensitive adhesive composition and an epoxy resin composition are mixed in a one-component form on a substrate. However, since the above technique requires an additional 30 minutes or more of a curing process for curing an epoxy resin in addition to a curing process by ultraviolet irradiation, it takes a long time, and in the wafer dicing step, it is necessary to fix the ring frame in order to expand the expansion. In order to manufacture a dicing die-bonding film with a pre-cut sample, a double-sided adhesive film for attaching the ring frame should be manufactured. The process is complicated, and the cost also arises.

In addition, since the one-component UV-curable composition is used, the remaining uncured epoxy resin composition is difficult to separate from the substrate at the time of die pick-up, and even if it is difficult to pick-up, the adhesive strength between the chip and the chip is weak, so that voids and the like tend to occur. have. On the other hand, when the voids are generated after packaging the chip through the molding process, a critical problem in reliability occurs, the short circuit or crack of the electrical signal occurs.

Therefore, the conventional method as described above has a problem in terms of cost and yield because it undergoes a multi-step process, many studies have been conducted to shorten the process. In recent years, the method of attaching the chip on the back surface of the wafer is gradually increasing, and this method is conventionally performed by placing the film-like epoxy on the upper surface of the film serving as the dicing film and picking it up between the adhesive of the dicing film and the film-like epoxy. By reducing the two-stage process to one step, it is more advantageous in terms of time and yield.

In Korean Patent Laid-Open Publication No. 2004-29939, an ultraviolet curable adhesive layer is formed on a substrate, and an adhesive film is attached on the substrate again, and when dicing is completed, the adhesive layer and the adhesive layer are separated to pick up chips, and then the adhesive layer The attached chip is die bonded on the substrate. However, in the above technique, the UV-curable low molecular materials in the adhesive layer move and diffuse substantially to the adhesive layer before UV irradiation, so that the adhesion strength does not significantly decrease during the actual UV irradiation, or the adhesion increases when the transition is severe. .

In particular, when the chip size is small or the wafer thickness is large, the pick-up range can be adjusted by adjusting the parameters of the pick-up machine. The adhesion between the adhesive layer and the adhesive layer is not reduced, which causes a problem in die pickup. In addition, due to the poor compatibility by mixing a high molecular weight adhesive binder and a low molecular weight ultraviolet curable material, the surface of the coating forms a separate domain between the acrylic binder and the low molecular weight material, resulting in high surface roughness and high surface roughness. The surface energy is also high, there is a problem that does not bring sufficient adhesive force reduction effect after ultraviolet irradiation.

The present invention is to solve the above problems, one object of the present invention is to provide a light-curable composition for forming a pressure-sensitive adhesive film excellent in pick-up properties bringing a sufficient decrease in adhesive strength after UV curing.

Another object of the present invention includes the above-mentioned photocurable composition for forming an adhesive film, which prevents the chip from scattering or moving during dicing during the semiconductor process, and easily removes the chip with the adhesive from the adhesive layer when picking up. It can be used to peel off, and to provide a dicing die-bonding film having sufficient adhesiveness during die bonding operation to the PCB substrate or lead frame substrate,

One aspect of the present invention for achieving the above object is 10 to 150 parts by weight of a UV curable urethane acrylate oligomer (B) having a viscosity of 10,000 cps or more at 40 ° C relative to 100 parts by weight of an acrylic adhesive binder (A), a thermosetting agent (C) 0.5 to 5 parts by weight, and 0.1 to 3 parts by weight of the photopolymerization initiator (D),

The acrylic adhesive binder (A)

(1) an acrylic monomer, a hydroxy monomer, an epoxy monomer and a polymerization initiator are polymerized to produce an acrylic polyol tackifying binder resin, and (2) the acrylic polyol tackifying binder resin and the vinyl group-introducing monomer obtained in the reaction are urethane addition reactions. It is produced and relates to the photocurable adhesive composition containing 2-10 mol% of epoxy groups.

Another aspect of the present invention for achieving the above object relates to a pressure-sensitive adhesive film formed using the photocurable composition for pressure-sensitive adhesive film formation and a dicing die bonding film comprising the same.

The adhesive film according to the present invention includes an acrylic adhesive binder containing a vinyl group and a UV-curable urethane acrylate oligomer, and when dicing, prevents chips from scattering or moving, and when picking up the adhesive-attached chip It can be easily peeled off from the adhesive layer and has sufficient adhesiveness when die bonding to a PCB substrate or a lead frame substrate, so that the dicing process and the die bonding process can be performed in one step on the support member.

The present invention relates to a photocurable composition for forming an adhesive film comprising an acrylic adhesive binder containing a vinyl group and a UV curable urethane acrylate oligomer.

The photocurable pressure-sensitive adhesive composition of the present invention is 10 to 150 parts by weight of a UV curable urethane acrylate oligomer (B) having a viscosity of 10,000 cps or more at 40 ° C relative to 100 parts by weight of the acrylic adhesive binder (A), 0.5 to 5 parts by weight of a thermosetting agent (C). Part, and 0.1 to 3 parts by weight of the photopolymerization initiator (D),

The acrylic adhesive binder (A)

(1) an acrylic monomer, a hydroxy monomer, an epoxy monomer and a polymerization initiator are polymerized to produce an acrylic polyol tackifying binder resin, and (2) the acrylic polyol tackifying binder resin and the vinyl group-introducing monomer obtained in the reaction are urethane addition reactions. It is prepared and characterized by containing 2 to 10 mol% epoxy group.

Hereinafter, each composition of the present invention will be described in more detail.

(A) Acrylic adhesive binder containing a vinyl group

The acrylic adhesive binder including the vinyl group is synthesized through a two step process. First of all, an acrylic monomer capable of imparting adhesive strength is selected as a main monomer, and a functional acrylic monomer is added thereto, and the acrylic adhesive binder is polymerized, and then a vinyl group-introducing monomer is applied thereto to perform urethane addition reaction at low temperature. A photocurable acrylic adhesive binder having a group can be synthesized.

Preferably, (1) an acrylic monomer, a functional acrylic monomer, and a polymerization initiator are polymerized to produce an acrylic polyol adhesive binder resin, and (2) the monomer having an isocyanate and vinyl group with an acrylic polyol adhesive binder resin obtained in the reaction is a urethane. The addition reaction may be prepared the acrylic adhesive binder (A).

The functional monomer in the above (1) polymerization reaction includes a hydroxy monomer, an epoxy group monomer or a reactive monomer, of which a hydroxy monomer and an epoxy group monomer are preferably used.

50 to 85% by weight of the acrylic monomer, 10 to 35% by weight of the hydroxy monomer, and 2 to 15% by weight of the epoxy group monomer may be used in the entire monomer of the above (1) polymerization reaction.

In the polymerization reaction (1), 1 to 10% by weight of the reactive monomer may be further used.

In the reaction (2), the monomer having an isocyanate and a vinyl group may be reacted at a ratio of 0.4 to 0.9 with respect to the hydroxyl equivalent of the acrylic polyol adhesive binder resin.

The acrylic monomer functions to impart adhesion to the film, but there is no particular limitation as the acrylic monomer, but 2-ethylhexyl methacrylate, iso-oxyl acrylate, 2-ethylhexyl acrylate, ethyl acrylate, n- Preference is given to using at least one member selected from the group consisting of butyl acrylate, iso-butyl acrylate and octadecyl methacrylate.

It is preferable that the glass transition temperature of the said acrylic monomer is -50 degrees C or less.

The content of the acrylic monomer may be 50 to 85% by weight, preferably 60 to 80% by weight of the total monomers.

Although there is no particular limitation as the hydroxy monomer, a group consisting of 2-hydroxy ethyl methacrylate, hydroxy ethyl acrylate, 4-hydroxy butyl acrylate, hydroxy propyl (meth) acrylate and vinyl caprolactam Preference is given to using one or more selected from.

The content of the hydroxy monomer (1) may be 10 to 35% by weight, preferably 15 to 25% by weight of the monomer used in the polymerization reaction. If the content is less than 10% by weight, the content of hydroxyl groups reacted with the isocyanate, which is a thermosetting agent after introduction of the monomer having a vinyl group, becomes small, so that the adhesion with the base film is very weak. When the content exceeds 35% by weight, the adhesive film for bonding wafers or dies This is because the adhesion with the layer increases after lamination.

Glycidyl methacrylate or glycidyl acrylate may be used as the epoxy group monomer.

The content of the epoxy group monomer (1) may be 2 to 15, preferably 2 to 8% by weight of the monomer used in the polymerization reaction. In the above range, in particular, the surface energy during UV curing is greatly reduced, and the greater the difference in surface energy before and after UV curing, the better the pickup performance. If the content is less than 2%, the adhesion to the ring frame is lowered, and if the content is more than 15%, the photocurability by the epoxy group is deteriorated when the photocuring is a heavy peel force with the material.

The epoxy group monomer remains at the end of the acrylic adhesive binder (A) after polymerization and does not participate in the reaction after photocuring and affects surface properties. That is, it is related to surface energy and plays a role of reducing surface energy after photocuring.

As the reactive monomer which can be used as the functional monomer, lauryl acrylate, lauryl methacrylate, styrie methacrylate, cetyl acrylate, octadecyl acrylate, octadecyl methacrylate and the like are preferable, and more preferably More preferably, a single or mixed use of a monomer having 12 or more carbon atoms is used.

The content of the reactive monomer may be suitably used in the range of 1 to 10% by weight of the monomer (1) used in the polymerization reaction.

As the vinyl group introduction monomer, a monomer or oligomer having an isocyanate group at one end and a vinyl group at the other end may be used, for the purpose of introducing the vinyl group into the acrylic adhesive binder.

The vinyl group-introducing monomer is not necessarily limited, but α, α-dimethyl-m-isopropenylbenzyl isocyanate (α, α-dimethyl-m-isopropenylbenzyl isocyanate) and 2-isocyanatoethyl methacrylate (2-Isocyanatoethyl Methacrylate), 2-Isocyanatoethyl 2-propenoate, 1,1-bis (acryloyloxymethylethylisocyanate) (1,1-bis (acryloyloxy methyl ethyl isocyanate)) may be used alone or in combination.

The vinyl group introduction monomer is preferably used at 0.4 to 0.9 to 1 equivalent to the hydroxyl equivalent of the acrylic polyol adhesive binder resin.

It is less than 0.4 compared to 1 equivalent of hydroxyl group, and the number of double bonds that can react during photocuring is small, so that the loss of adhesive strength is not great, and the peeling force with the adhesive film for wafer or die bonding is heavy. This is because there are fewer sites which can react with the adhesive force with the base film.

When the content of the vinyl group-introduced monomer is (1) 10 to 25 parts by weight, preferably 15 to 20 parts by weight, based on 100 parts by weight of the solid content of the polyol adhesive binder resin prepared in the polymerization reaction, the content is less than 10 parts by weight After the photocuring, the loss of adhesive force is not large, and the peeling force with the wafer or the die-bonding adhesive film becomes heavy, and when it exceeds 25 parts by weight, the adhesive film layer becomes poor in fluidity and the adhesion to the substrate is rather increased, resulting in peeling. This is because the force becomes heavy.

The acrylic pressure-sensitive adhesive (A) has a hydroxyl group as a result of applying a hydroxy monomer, it is preferable that the hydroxyl value is 15 to 30. If the hydroxyl value of the acrylic pressure-sensitive adhesive (A) is less than 15, the content of isocyanate as a thermosetting agent is small, the adhesion to the base film is very weak, if the hydroxyl value is more than 30, the adhesive film layer for wafer or die adhesion This is because the adhesion force to and after is increased after lamination.

As for the acid value of the said acrylic adhesive binder (A), 1 or less is preferable. If the acid value is greater than 1, it is very likely that a gel is generated during the synthesis when the acrylic acid and the monomer having an epoxy group are introduced at the same time, and the change over time after lamination with the adhesive film layer for wafer or die bonding is very large.

The acrylic adhesive binder (A) has a glass transition temperature of -80 to -40 ° C, preferably -70 to -50 ° C, in order to obtain an appropriate initial adhesive strength after thermal curing, but the glass transition temperature is about When the temperature exceeds -40 ℃, the initial adhesion is low, and when dicing, the adhesion to the ring frame is low, so that the chip may be separated from the ring frame or the chip may be scattered due to the low adhesion to the wafer. Due to the high adhesive strength, even after photocuring, a large number of tacks remain, causing a problem of heavy peeling force with a wafer or adhesive film.

The weight average molecular weight of the acrylic adhesive binder (A) is 150,000 to 400,000. Conventional acrylic resins composed of only acrylic polyols could exhibit low peeling strength after UV curing only when the acrylic resins contained an acrylic polyol having a molecular weight of 500,000 or more.However, the photocurable acrylic adhesive binder according to the present invention introduces an epoxy group to the ring frame. It is possible to improve the adhesion to the, it is possible to retain the excellent peeling force even in the molecular weight of about 150,000 ~ 400,000.

When the molecular weight of the binder is less than 150,000, a problem occurs in coating film forming ability during coating, and even after the photocuring, even when the adhesive force is reduced, a certain physical property does not come out, resulting in a problem that the peeling force with the material is not constant.

In the synthesis of the acrylic adhesive binder (A), as the organic solvent in the case of performing copolymerization by solution polymerization, a ketone series, an ester series, an alcohol series or an aromatic group can be used, and preferably toluene, ethyl acetate, acetone It is preferable to use methyl ethyl ketone and the like, and a solvent having a boiling point of 60 to 120 ° C. is particularly preferable.

As a polymerization initiator, radical generators, such as azobis type | system | groups, such as (alpha), (alpha) '-azobisisobutyl nitrile, and organic peroxides, such as benzoyl peroxide, are used normally. At this time, if necessary, a catalyst and a polymerization inhibitor may be used in combination, and the content thereof is preferably 0.1 to 0.5 parts by weight based on 100 parts by weight of the monomer charged.

The polymerization reaction may control the molecular weight in the range of polymerization temperature 80 to 120 ℃ and polymerization time 1 to 75hr, preferably 5 to 15hr.

The acrylic polyol adhesive binder resin obtained in the above-described polymerization reaction, a monomer having an isocyanate group and a vinyl group, and a catalyst are added thereto, and a urethane addition reaction is carried out at 30 to 55 ° C. for 7 to 15 hrs to synthesize an acrylic copolymer. .

(B) UV curing urethane acrylate oligomer

The composition comprises (B) UV curable urethane acrylate oligomer. The (B) UV curable urethane acrylate oligomer is mixed with the acrylic adhesive binder (A) containing the vinyl group to induce a crosslinking reaction between the adhesive binder and the acrylate, resulting in a significant reduction in adhesion after UV irradiation. .

(B) The UV curable urethane acrylate oligomer can be produced by reacting a acrylate having a hydroxyl group with a terminal isocyanate urethane prepolymer obtained by reacting a polyol compound such as a polyester type or a polyether type with a polyisocyanate compound.

The UV curable urethane acrylate oligomer (B) included in the photocurable composition for forming an adhesive film according to the present invention has a very high viscosity, and thus, viscosity measurement at room temperature is impossible, and the viscosity is 10,000 cps or more at 40 ° C. It is preferable that the weight average molecular weights are 1,000-10,000.

As the (B) UV-curable urethane acrylate oligomer, U-324A (Shin-Nakamura Co., Ltd.), QU-1000 (Kyuen-Top Co., Ltd.), Ebecryl 270 (SK Cytec), etc. may be used.

The UV-curable urethane acrylate oligomer (B) is preferably applied to 10 to 150 parts by weight based on 100 parts by weight of the acrylic adhesive binder (A) containing a vinyl group. If the amount is less than 10 parts by weight, the absolute amount of curing by ultraviolet light is small, so that the decrease in adhesion is relatively small. If the UV-curable acrylate oligomer (B) is more than 150 parts by weight, the cohesion of the coating film before UV irradiation is insufficient to form a film. Because it is not.

(C) thermosetting agent

Thermosetting agents that can be used to make photocurable adhesive films include 2,4-trilene diisocyanate, 2,6-triene diisocyanate, hydrogenated triylene diisocyanate, 1,3-xylene diisocyanate, 1,4-xylene di Isocyanate, diphenyl methane-4,4-diisocyanate, 1,3-bisisocyanatomethyl cyclohexane, tetra methyl xylene diisocyanate, 1,5-naphthalene diisocyanate, 2,2,4-trimethyl hexamethylene diisocyanate, Consisting of 2,4,4-trimethyl hexamethylene diisocyanate, triylene diisocyanate adduct of trimetholpropane, xylene diisocyanate adduct of trimetholpropane, toriphenylmethanetoriisocyanate, methylene bistri isocyanate, etc. One or more selected from the group can be used, but is not limited thereto. The curing agent (C) reacts with the functional group of the adhesive binder to act as a crosslinking agent and has a three-dimensional network structure as a result of the crosslinking reaction.

It is preferable to apply 0.5-5 weight part of the said thermosetting agents with respect to 100 weight part of acrylic adhesive binders (A) containing a vinyl group. If it is less than 0.5, the degree of crosslinking reaction is low, resulting in poor adhesion to the base film, resulting in detachment of the coating layer after coating, or low adhesion after photocuring between the base film and the adhesive layer. The problem that can be transferred occurs, and if it is more than 5, the peeling force with the die-bonding adhesive film becomes relatively heavy due to unreacted isocyanate or the UV irradiation tack is lost due to excessive crosslinking reaction. This is because deterioration of the dicing die-bonding film and the wafer occurs in the ring frame during the expansion.

(D) photoinitiator

The adhesive composition of this invention contains a photoinitiator (D). The photoinitiator (D) contained in the said photocurable composition has a special limitation, and can use what is known conventionally. Specifically, benzophenones such as benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-diethylaminobenzophenone, 4,4'dichlorobenzophenone, acetone such as acetophenone and diethoxyacetophenone Anthraquinones, such as phenone, 2-ethyl anthraquinone, and t-butyl anthraquinone, etc. can be used individually or in mixture of 2 or more types.

As for content of a photoinitiator (D), 0.1-3 weight part is preferable with respect to 100 weight part of acrylic adhesive binders (A) containing a vinyl group. When the content of the photopolymerization initiator (D) is less than 0.1 part by weight, the radical generation efficiency is lowered by the ultraviolet irradiation, which does not bring about a sufficient decrease of the adhesive force between the adhesive layer 4 and the adhesive layer 3 interface after the ultraviolet irradiation. Thus, regardless of chip size, the desired pickup performance is not achieved. On the contrary, if the amount is more than 3 parts by weight, the resulting radical concentration is excessive, the molecular weight of the UV-curable acrylate reacted by UV decreases, and thus does not form a sufficient network structure, causing odor problems of the unreacted initiator and transition of the unreacted initiator to the adhesive layer. Is generated to degrade the reliability in the packaging of the adhesive layer.

Another aspect of the present invention relates to a dicing film and a dicing die-bonding film including an adhesive layer formed by using the photocurable composition for forming an adhesive film.

The composition of (A), (B), (C) and (D) can be dissolved in a solvent such as methyl ethyl ketone to prepare the photocurable pressure-sensitive adhesive composition of the present invention, and hot air drying and other methods for the prepared composition. The remaining amount of solvent may be volatilized to form a photocurable pressure-sensitive adhesive film. In addition, the photocurable adhesive film obtained in this way can be usefully applied to the dicing adhesive tape which has a dicing or adhesive adhesive film layer.

The dicing film is a form in which the adhesive layer is applied on the base film, the dicing die bonding film is the adhesive layer is applied on the base film, the adhesive layer is laminated with the adhesive layer of the film-like epoxy, Release film for protecting the adhesive layer may have a structure laminated on the adhesive layer. However, it is not limited thereto.

In addition, the pressure-sensitive adhesive layer included in the dicing die-bonding film according to the present invention has a thickness of 3 to 30 microns, but in the pressure-sensitive adhesive layer of less than 3 microns, the cohesive strength of the coating film after UV curing is weak and the interface with the adhesive layer 3 on the upper side. It does not bring about a desirable adhesive force reduction effect, and in the case of more than 30 microns there is a problem that the beard shape cutting debris during the dicing process occurs.

Hereinafter, the dicing die-bonding film according to the present invention will be described in detail with reference to the drawings.

1 is a cross-sectional schematic view of a dicing die-bonding film according to an embodiment of the present invention, the pressure-sensitive adhesive and the adhesive is introduced at the same time and has a structure capable of up to die bonding after pickup.

The adhesive layer 4 is coated on one side of the expandable base film 5 such as a polyolefin film, and an adhesive layer 3 capable of adhering the chip to the chip is formed on the adhesive layer 4. It consists of a release film (2) to protect the adhesive layer (3).

The film 5, which is used as the base film, supports the adhesive layer 4, which holds the wafer so as not to shake the wafer during dicing, and also makes it easy to pick up the individualized chip when the dicing is completed. A film that can be stretched at room temperature is used to allow an expansion process, which is a process of increasing the gap between chips.

The adhesive layer 4 should maintain a strong adhesive force with the adhesive layer 3 or the ring frame before the ultraviolet irradiation, if the adhesive force of the interface between the adhesive layer 4 and the adhesive layer 3 before the ultraviolet irradiation is not large adhesive Peeling easily occurs between the attached chip and the adhesive layer 4, so that the chip is shaken during dicing due to partial lifting and there is a risk of chip damage such as chip crack, and the adhesion between the adhesive layer 4 and the ring frame. If it is not large, the ring frame is fixed during expansion and expands by applying a constant tension to the film, so that desorption occurs at the adhesive portion between the adhesive layer 4 and the ring frame, causing defects in the entire wafer.

After the ultraviolet ray irradiation, the coating layer in the adhesive layer is hardened by ultraviolet curing crosslinking and the cohesive force is increased, so that the interfacial peeling force with the adhesive layer 3 which is the upper portion of the adhesive layer 4 should be significantly lowered. In addition, the greater the peel strength reduction range, the easier the pick-up of the chip with the adhesive layer. That is, the adhesive layer 4 should have a large adhesive force enough to hold the chip strongly from the dicing step to the drying step, while the adhesive force is significantly reduced in the pick-up step so that the chip can be safely moved to the die bonding step. Two opposing properties, which should have low adhesion, should be before and after UV irradiation.

The adhesive layer 3 is made of a thermosetting composition in the form of a film and should have excellent adhesion to the mirror surface of the wafer, and the outermost release film 2 protects the adhesive layer 3 from external foreign substances and is wound into a roll. It is used to make it easier.

EMBODIMENT OF THE INVENTION Hereinafter, the structure of the dicing die bonding film by this invention is demonstrated in detail.

(A) base film

Various polymer films may be used as the base film 5 constituting the dicing die-bonding film 1 according to the present invention. Among them, thermoplastic plastic films are generally used. This is because thermoplastic films must be used to expand the pickup after the dicing process, and in some cases the chips remaining after the expansion can be picked up again over time. Because.

The base film 5 should not only be expandable, but also preferably UV-permeable, and in particular, when the pressure-sensitive adhesive is an ultraviolet curable pressure-sensitive adhesive composition, it is preferable that the base film 5 is a film having excellent transmittance to ultraviolet rays of a wavelength at which the pressure-sensitive adhesive composition can be cured. . Therefore, the base film should not contain ultraviolet absorbers and the like.

Examples of polymer films that can be used as such substrates include polyethylene, polypropylene, ethylene / propylene copolymers, polybutene-1, ethylene / vinyl acetate copolymers, mixtures of polyethylene / styrenebutadiene rubbers, polyolefins such as polyvinylchloride films Type films and the like can be mainly used. In addition, polymers such as polyethylene terephthalate, polycarbonate, poly (methyl methacrylate), thermoplastic elastomers such as polyurethane and polyamide-polyol copolymers, and mixtures thereof can be used. In order to improve machinability and expandability, a multilayer structure may be provided.

The film and the like may be mainly formed by blending and melting a polyolefin chip to form a film by an extrusion method, or may form a film by a blowing method. The heat resistance and mechanical properties of the film to be formed are determined according to the type of chips to be blended, and the film to be manufactured should have a value of HAZE 85 or more. Embossing should give a haze by scattering of light.

If the haze is less than 85, the film may fail to recognize the position of the film when laminating to the mirror surface of the wafer in the pre-cut state during the semiconductor process, and continuous operation may be impossible. Therefore, the base film must exhibit a haze value of 85 or more, which is a recognizable level by embossing the surface.

The embossing process of the base film not only recognizes, but also prevents blocking during manufacturing of the base film, thereby serving to enable winding. Since the adhesive layer 4 is formed on the embossed back surface of the base film 5, it is preferable that the opposite surface of the embossed surface is subjected to surface modification in order to increase the adhesive force with the adhesive layer 4 to be formed.

Surface modification can be performed by both physical and chemical methods. The physical method can be corona treatment or plasma treatment, and the chemical method can be a method such as in-line coating or primer treatment, and can be adhered by corona discharge treatment. It is preferable to form the layer 4 in terms of manufacturing processability.

The thickness of the base film 5 is preferably 30 to 300 μm, more preferably 50 to 200 μm in view of strong elongation, workability, UV transmittance, and the like. The workability is poor in the pre-cut state, and the film is easily deformed by heat generated during ultraviolet irradiation. In addition, when the base film is 300㎛ or more, the force for expanding on a facility is excessively demanded, which is not preferable in terms of cost.

(B) adhesive layer

The adhesive layer 4 used for the dicing die-bonding film 1 by this invention is formed using the photocuring composition for adhesion layers mentioned above, The method of forming an adhesion layer using the said photocuring composition is mainly apply | coated Is done by.

The method of forming the adhesive layer 4 on the base film 5 may be directly coated, or may be transferred by a transfer method after completion of drying after coating on a release film or the like. The coating method for forming the adhesive layer, whether the former or the latter is not limited as long as it can form a uniform coating layer, but mainly bar coating, gravure coating, comma coating, reverse roll coating, applicator coating, spray coating, lip Methods such as coating are used.

After coating, the drying method for forming the coating layer is mainly a thermosetting method, the coating method may form a coating layer directly on the surface of the polyolefin film, and after forming an adhesive layer on a base film such as a release film (2) And a polyolefin film or the like may be transferred to form a coating layer.

The thickness of the adhesion layer 4 is 3-30 micrometers, More preferably, the thickness of 5-30 micrometers is preferable. If the thickness is less than 3 μm, the cohesive force of the coating film is weak after UV curing, which does not bring about a desirable effect of reducing the adhesive force between the interface with the adhesive layer 3 on the upper side. have.

The resulting pressure-sensitive adhesive layer 4 may be aged at a constant temperature for a certain time. Generally, since the pressure-sensitive adhesive proceeds to harden the coating layer up to a predetermined time even after thermal curing, the pressure-sensitive adhesive layer 4 is aged within a range that minimizes stability of the coating film and changes over time. It is preferable to make it.

The adhesive layer 4 used for the dicing die-bonding film 1 according to the present invention is formed by using the above-mentioned photocurable composition for pressure-sensitive adhesive layers. Maintains strong adhesion to the ring frame, and also has strong adhesion to the ring frame, and after ultraviolet irradiation, the adhesion layer 4 increases and contracts due to the crosslinking reaction, and the adhesion decreases significantly at the interface with the adhesion layer 3. As a result, any of the chips 6 with the adhesive layer 3 can be easily picked up and die-bonded to the support member 7.

In particular, any composition may be used as long as the composition is cured by ultraviolet irradiation, and the adhesive force is significantly reduced between the interface with the adhesive layer 3 before and after energy addition by heat curing or other external energy rather than ultraviolet irradiation.

Since the base film 5 used in the present invention is a nonpolar material such as a polyolefin film, in order for the adhesive layer to have adhesion to the film, the adhesive film may be modified to improve the affinity for the adhesive layer, but the polar group may be used in the adhesive layer component itself. It can be introduced and crosslinked with the curing agent to enhance adhesion.

Since the acrylic adhesive binder (A) containing a vinyl group and a curing agent are mixed to form a coating film in the adhesive binder during the aging process when the coating is applied on the base film, the transition to the adhesive layer 3 is performed even before UV irradiation. It does not occur, resulting in a sufficient adhesive force reduction effect after ultraviolet irradiation.

The acrylic pressure-sensitive adhesive binder (A) and the UV-curable acrylate (B) containing a vinyl group by the addition of the thermosetting agent (C) form a hard coating film on the surface of the base film 5, and the coating film desorption is performed by dicing or ultraviolet irradiation. Does not occur. As mentioned above, since the polyolefin film, which is the base film 5 used in the present invention, contains no polar group in the molecule, it is difficult to attach an external substance having no polarity to the surface. Therefore, in order to increase the polarity of the film surface to increase the surface tension by corona treatment or primer treatment, etc. This is limited, so it is common to control the polarity of the basic resin to form a coating film.

The adhesive layer 4 included in the dicing film and the dicing die-bonding film according to the present invention is a case where an acrylic adhesive binder containing a vinyl group is mixed with a UV curable acrylate, and no transition of low molecular acrylate occurs. After ultraviolet irradiation, the adhesive force at the interface between the adhesive layer 4 and the adhesive layer 3 is significantly reduced, so that it is possible to pick up even a chip having a large size of 10 mm x 10 mm or more.

As the component of the adhesion layer 4, an organic filler and an inorganic filler, if necessary, other than the acrylic adhesive binder (A) containing a vinyl group, UV-curable acrylate (B), a thermosetting agent (C), and a photoinitiator (D). , Tackifiers, surfactants, antistatic agents and the like can be added.

(C) adhesive layer

The dicing die-bonding film 1 according to the present invention has a structure in which the adhesive layer 4 is coated on the base film 5 as described above, and the adhesive layer 3 is laminated on the upper side. The adhesive layer 3 is attached to the surface of the support member 7 in a state in which the semiconductor chip is attached to the small size and then individualized to a small size and then easily peeled off from the lower adhesive layer 4 and attached to the back surface of the chip when picking up the chip. Done.

The adhesive layer 3 is attached to the mirror surface (glass surface) of the circuit on which the circuit is designed at a temperature near 60 ° C. and then diced into a supporting member 7 such as a lead frame or a PCB substrate at a temperature of about 100 ° C. Bonding In addition, since the adhesive layer 3 adheres to the chip and enters the packaging, and remains in the packaging even after epoxy molding, reliability such as ionic or foreign matter and process stability over time is important.

The adhesive layer 3 of the dicing die bonding film 1 which concerns on this invention consists of a high molecular weight acrylic copolymer which has film forming ability, and thermosetting resins, such as an epoxy resin. Examples of the acrylic copolymer include acrylic rubber which is a copolymer such as acrylic acid ester, methacrylic acid ester, and acrylonitrile. The epoxy resin is not particularly limited as long as the epoxy resin is cured to exhibit adhesive strength. However, in order to perform the curing reaction, the functional group must have two or more functional groups. Therefore, bisphenol A type epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin, etc. are used. It is desirable to.

In addition, a curing accelerator for curing the epoxy resin may be used for the adhesive layer 3, but an imidazole series, an amine series, or the like may be used as the curing accelerator. In addition, various silane coupling agents may be used in one or two or more kinds of mixtures to increase adhesion to the wafer, and inorganic particles such as silica may be added to the adhesive layer to improve dimensional stability and heat resistance. .

The coating thickness of the adhesive layer 3 is preferably 5 to 100 μm, more preferably 10 to 80 μm. This does not show a suitable adhesion to the back surface of the wafer below 5 μm, and contrary to the recent trend of thin and short semiconductor packaging in the case of more than 100 μm, the larger the thickness, the adhesive layer when bonding between the chip and the chip, the chip and the substrate. This is because the fillet phenomenon, such as when using a liquid adhesive, occurs due to the fluidity of the, causing problems in reliability during packaging.

In addition, as the component of the adhesive layer, it is possible to mix an organic filler, an inorganic filler, a tackifier, a surfactant, an antistatic agent and the like as necessary. There is no special limitation as long as it can.

During the semiconductor process, after the release film 2 is peeled off, as shown in FIG. 2, the adhesive layer is laminated on the wafer chip 6 (also called a mounting process).

After laminating the adhesive layer (3) and the wafer chip (6) is subjected to a dicing process to cut the chip to the size of the designed circuit, as shown in Figure 3, generally the chip (6), the adhesive (3) Dicing to a partial depth of the lower polyolefin film 2 below the adhesive layer 4, and then picking up the individualized chips 6 and applying ultraviolet rays from the lower part of the film to attach to the support member 7. Irradiation reduces the peel force between the adhesive layer 4 and the adhesive layer 3 interface. That is, as shown in FIG. 4, the individualized chip 6 having the adhesive layer 3 attached thereto is picked up with a constant force by using a pickup called a collet, and then a supporting member such as a PCB substrate or a lead frame as shown in FIG. 5. Attached to (7).

The dicing die-bonding film according to the present invention is made of one film by laminating the adhesive layer 4, the adhesive layer 3 and the like prepared as described above, both pre-cut form and roll form is possible However, when manufactured in roll form, the process of scraping film portions other than the wafer during the semiconductor process is required separately. In the case of manufacturing in pre-cut form, the film is suitable for the wafer size. Eliminating the need for However, since the dicing die-bonding film 1 according to the present invention is formed by laminating the adhesive layer 4 and the adhesive layer 3 and cutting them to a certain size, the roll pressure, temperature dimension, and precision control at the time of lamination, etc. It is a very important factor.

The invention can be better understood by the following examples, which are intended to illustrate the invention and are not intended to limit the scope of protection defined by the appended claims.

[Production of Adhesive Layer 3 and Adhesive Film (3-a)]

Acrylic resin KLS-1046DR (hydroxyl value 13 mgKOH / g, acid value 63 mgKOH / g, Tg 38 ° C, average molecular weight 690,000, manufacturer: Fujikura Corporation) 400 g, WS-023 (hydroxyl value or acid value 20 mgKOH / g, Tg -5 ℃, average molecular weight 500,000, hydroxyl group or carboxyl group content 20, manufacturer: Nagase Chemtech) 60 g, cresol novolac-based epoxy resin YDCN-500-4P (manufactured by Kukdo Chemical, molecular weight 10,000 or less) 60 g, cresol novolac-based curing agent MEH- 7800SS (manufactured by Meiwa Plastic Industries) 40g, imidazole series curing catalyst 2P4MZ (manufactured by Sukkuk Chemical) 0.1g, mercanto silane coupling agent KBM-803 (manufactured by Shin-Etsu Co., Ltd.) 0.5g, epoxy silane coupling agent 0.5 g of KBM-303 (manufactured by Shin-Etsu Co., Ltd.) and 20 g of amorphous silica filler (OX-50, manufactured by Daegu) were mixed, followed by primary dispersion at 500 rpm for about 2 hours.

Milling was performed after the first dispersion. Milling mainly used bead milling method using inorganic particles. After milling was completed, coating was performed on one side of the polyethylene terephthalate release film having a thickness of 38 μm and then having a thickness of 20 μm.

In order to protect the coated surface, an adhesive film (3-a) was prepared by laminating a polyethylene terephthalate film on the upper surface of the coating layer.

Preparation Example 1 Preparation of Acrylic Adhesive Binder Including Vinyl Group (1)

The reagent was added to a 2 L four-necked flask under the mixing conditions of the following example, and the reaction process was as follows. An organic solvent, 300 g of ethyl acetate and 240 g of toluene was added first, a reflux cooler was installed on one side, a thermometer was installed on the other side, and a dropping panel was installed on the other side.

After raising the flask solution temperature to 80-90 degreeC, 2-ethylhexyl acrylate (JUNSEI company, 7A2150), hydroxyethyl methacrylate (SAMCHUN company, 03120), hydroxyethyl acryl like Example 1 of Table 1, Latex (JUNSEI, 10132-0480), glycidyl methacrylate (SAMCHUN, E10780), iso-oxyl acrylate monomer (SARTOMER, 437425, etc.) lauryl methacrylate monomer (Aldrich, 291811) and benzoyl fur 0.12 g of oxide and a mixed solution were prepared, and the mixed solution was added dropwise at 80 to 100 ° C. using a dropping panel for 3 hours.

The stirring speed at the dropwise addition was 250rpm, and after completion of the dropwise addition, the reaction product was aged at the same temperature for 4 hours, then 30g of ethyl acetate and 1.2g of azobisisobutylonitrile were added and maintained for 4 hours, followed by viscosity. And the solid content was measured and the reaction was stopped to prepare an acrylic adhesive polyol binder resin that is an acrylic copolymer. The viscosity after polymerization was 300 to 500 cps, and the content of solids was corrected to 40%.

7 parts by weight of 2-Isocyanatoethyl Methacrylate (trade name: Karenz MOI, Japan) to 100 parts by weight of the acrylic adhesive polyol binder resin synthesized above in a 2 L four-necked flask and dibutyl tin dilaurate , DBTDL, Aldrich, 291234) 20ppm was added and reacted at 60 ° C × 8hr to remove the isocyanate groups of the 2-Isocyanatoethyl Methacrylate monomer from the hydroxyl group of the binder and disappear on the FT-IR. And an acrylic pressure-sensitive adhesive binder having a solid content of 40% were synthesized.

Preparation Example 2 Preparation of Acrylic Adhesive Binder Containing Vinyl Group (2)

The reagent was added to a 2 L four-necked flask under the mixing conditions of the following example, and the reaction process was as follows. An organic solvent, 300 g of ethyl acetate and 240 g of toluene was added first, a reflux cooler was installed on one side, a thermometer was installed on the other side, and a dropping panel was installed on the other side.

After raising the flask solution temperature to 80 ~ 90 ℃, to prepare a mixed solution with a monomer 600g and 0.12g of benzoyl peroxide as in Example 2 of Table 1, the acrylic adhesive polyol binder resin of the acrylic copolymer in the same manner as in Example 1 Was prepared.

Into a 2 L four-necked flask, 10 parts by weight of 2-Isocyanatoethyl Methacrylate (trade name: Karenz MOI, Japan Density) and 100 ppm of DBTDL were added to 100 parts by weight of the acrylic adhesive polyol binder resin synthesized above. When the isocyanate group of the 2-Isocyanatoethyl Methacrylate monomer reacts with the hydroxyl group of the binder and disappears on the FT-IR, an ethyl acetate was added and cooled to prepare an acrylic adhesive binder containing vinyl groups having a solid content of 40%.

Comparative Production Example 1 Manufacture of Acrylic Adhesive Binder Without Vinyl Group (3)

The reagent was added to a 2 L four-necked flask under the mixing conditions of the following example, and the reaction process was as follows. An organic solvent, 300 g of ethyl acetate and 240 g of toluene was added first, a reflux cooler was installed on one side, a thermometer was installed on the other side, and a dropping panel was installed on the other side.

After raising the flask solution temperature to 80 ~ 90 ℃, to prepare a mixed solution with 600g of monomer composition and 0.12g of benzoyl peroxide as in Comparative Example 1 of Table 1, and then in the same manner as in Example 1 acrylic adhesive polyol binder Resin was prepared.

Comparative Production Example 2: Preparation of an acrylic adhesive binder containing a vinyl group but not containing glycidyl methacrylate (4)

Into a 2 L four-necked flask, the reagents were added as in the following Example 1 mixing conditions, and the reaction process was as follows. An organic solvent, 300 g of ethyl acetate and 240 g of toluene was added first, a reflux cooler was installed on one side, a thermometer was installed on the other side, and a dropping panel was installed on the other side.

After raising the flask solution temperature to 80 ~ 90 ℃, as shown in Table 1 Comparative Example 2 to prepare a mixed solution of the monomer 600g and 0.12g of benzoyl peroxide removed from the glycidyl methacrylate in the monomer composition, the same method as in Example 1 An acrylic adhesive polyol binder resin, which is an acrylic copolymer, was prepared.

Into a 2 L four-necked flask, 7 parts by weight of 2-Isocyanatoethyl Methacrylate (trade name: Karenz MOI, Japan Density) and DBTDL 20 ppm were added to 100 parts by weight of the acrylic adhesive polyol binder resin synthesized above. When the isocyanate group of the 2-Isocyanatoethyl Methacrylate monomer reacts with the hydroxyl group of the binder and disappears on the FT-IR, an ethyl acetate was added and cooled to prepare an acrylic adhesive binder containing vinyl groups having a solid content of 40%.

Example 1 Preparation of Photocurable Composition for Adhesive Film Formation (1)

250 g of an acrylic adhesive binder containing a vinyl group of 40% of the solid content prepared in Preparation Example 1 and 60 g of U-324A (Shin-Nakamura) having a viscosity of 20,000 cps at 40 ° C. were mixed in a 1 L beaker. Thereafter, 0.2 g of photoinitiator (Irgacure 651, Ciba-chemical) and 1.8 g of isocyanate curing agent (AK-75, Aekyung Chemical) were added to prepare a photocurable composition for forming an adhesive film.

The photocurable composition for pressure-sensitive adhesive layer prepared in the above embodiment was mixed and coated on one side of the polyolefin film, and after drying, a pressure-sensitive adhesive film (4-a) having a thickness of 10 μm was manufactured and laminated with the adhesive film (3-a). The same dicing die bonding film 1 was produced.

Example 2 Preparation of Photocurable Composition for Adhesive Film Formation (2)

250 g of an acrylic pressure-sensitive adhesive binder containing a vinyl group of 40% of the solid content prepared in Preparation Example 2 and 60 g of U-324A (Shin-Nakamura) having a viscosity of 20,000 cps at 40 ° C. were mixed in a 1 L beaker. Thereafter, 0.2 g of photoinitiator (Irgacure 651, Ciba-chemical) and 1.8 g of isocyanate curing agent (AK-75, Aekyung Chemical) were added to prepare a photocurable composition for forming an adhesive film.

After mixing the photocurable composition for the pressure-sensitive adhesive layer prepared in the above embodiment and coating it on one side of the polyolefin film and drying the adhesive film (4-b) having a thickness of 10 ㎛ and then laminated with an adhesive film (3-a) Figure 1 The same dicing die bonding film 1 was produced.

Example 3 Preparation of Photocurable Composition for Adhesive Film Formation (3)

250 g of an acrylic pressure-sensitive adhesive binder containing a vinyl group of 40% of the solid content prepared in Preparation Example 1 and 100 g of U-324A (Shin-Nakamura Co., Ltd.) having a viscosity of 20,000 cps at 40 ° C. were mixed and mixed in a 1 L beaker. Thereafter, 0.2 g of photoinitiator (Irgacure 651, Ciba-chemical) and 1.8 g of isocyanate curing agent (AK-75, Aekyung Chemical) were added to prepare a photocurable composition for forming an adhesive film.

After mixing the photocurable composition for the pressure-sensitive adhesive layer prepared in the above embodiment and coating it on one side of the polyolefin film and drying the adhesive film (4-c) having a thickness of 10 ㎛ and then laminated with an adhesive film (3-a) Figure 1 The same dicing die bonding film 1 was produced.

Comparative Example 1: Preparation of Photocurable Composition for Adhesive Film Formation (4)

250 g of an acrylic adhesive binder containing a vinyl group of 40% solids prepared in Preparation Example 1, 0.2 g of a photoinitiator (Irgacure 651, Ciba-chemical), and an isocyanate curing agent 1.8 g (AK-75, Aekyung Chemical) were added to a 1 L beaker. A photocurable composition for film formation was prepared.

After mixing the photocurable composition for the pressure-sensitive adhesive layer prepared in the above practice and coating it on one side of the polyolefin film and drying the adhesive film (4-d) having a thickness of 10 ㎛ and then laminated with an adhesive film (3-a) Figure 1 The same dicing die bonding film 1 was produced.

Comparative Example 2: Preparation of Photocurable Composition for Adhesive Film Formation (5)

250 g of an acrylic adhesive binder containing no vinyl group of 40% of the solid content prepared in Comparative Preparation Example 1 and 60 g of U-324A (Shinkakamura) having a viscosity of 20,000 cps at 40 ° C. were added to a 1 L beaker. After mixing, 0.2 g of photoinitiator (Irgacure 651, Ciba-chemical) and 1.8 g of isocyanate curing agent (AK-75, Aekyung Chemical) were added to prepare a photocurable composition for forming an adhesive film.

After mixing the photocurable composition for the pressure-sensitive adhesive layer prepared in the above embodiment and coating it on one side of the polyolefin film and drying the adhesive film (4-e) having a thickness of 10 ㎛ and then laminated with an adhesive film (3-a) Figure 1 The same dicing die bonding film 1 was produced.

Comparative Example 3: Preparation of Photocurable Composition for Adhesive Film Formation (6)

250 g of an acrylic pressure-sensitive adhesive binder containing 40% of the solid group prepared in Comparative Preparation Example 2 but not containing glycidyl methacrylate in a 1L beaker and a viscosity at room temperature, and having a viscosity of 20,000 cps at 40 ° C. (Shin Nakamura Co., Ltd.) 60 g was added and mixed, followed by adding 0.2 g of photoinitiator (Irgacure 651, Ciba-chemical) and 1.8 g of isocyanate curing agent (AK-75, Aekyung Chemical) to prepare a photocurable composition for forming an adhesive film. .

After mixing the photocurable composition for the pressure-sensitive adhesive layer prepared in the above practice and coating it on one side of the polyolefin film and drying the adhesive film (4-f) having a thickness of 10 ㎛ and then laminated with an adhesive film (3-a) Figure 1 The same dicing die bonding film 1 was produced.

[Property evaluation method]

Test Example 1 Measurement of Photocurable Adhesive Composition and Peeling Force

Adhesion measurement was tested in accordance with Clause 8 of Korean Industrial Standard KS-A-01107 (Test Method of Adhesive Tape and Adhesive Sheet). After attaching a sample having a thickness of 25 mm and a length of 250 mm to the die-bonding adhesive film, the adhesive tape was attached to the die-bonding adhesive film surface, and then reciprocated once at a speed of 300 mm / min using a 2 kg load roller for compression. After 30 minutes after crimping, turn the folded part of the test piece to 180 ° and peel it off about 25mm.In the 10N Load Cell, fix the test piece to the upper clip of the tensile strength device and fix the die-bonding adhesive film to the lower clip of the test plate. The load at the time of pulling off at the tensile speed of was measured.

 Tensile tester used Instron Series lX / s Automated materials Tester-3343, UV irradiation was carried out for 3 seconds in a high-pressure mercury lamp with 70mW / cm2 illuminance at 200mJ / cm2, 10 samples each before and after UV irradiation The average value was measured and shown in Table 2.

Test Example 2 Measurement of Tackiness of Photocurable Adhesive Composition

Only the adhesive layer of the dicing die-bonding film prepared above was measured with a probe tack tester (Chemilab Tack Tester) before and after UV curing. This method uses ASTM D2979-71 to determine the maximum force required when a clean probe tip is brought into contact with the adhesive surface for 1.0 + 0.01 sec at a rate of 10 + 0.1 mm / sec and a contact load of 9.79 + 1.01 kPa and then released. One result is shown in Table 2 below.

At this time, the UV irradiation was irradiated with an exposure dose of 200mJ / cm 2 for 3 seconds in a high-pressure mercury lamp having an illuminance of 70mW / cm 2, and the sample was measured by five before and after the UV irradiation each measured the average value.

Test Example 3 Measurement of Adhesion of Photocurable Adhesive Composition

In the dicing die-bonding film prepared as described above, a total of 100 checker boards were made by drawing 11 lines at 1 mm intervals horizontally and vertically with a knife sharpening the coating film using a cross cut tester. Attached to the adhesive tape and pulled out instantaneously measured the adhesion strength is shown in Table 2 above.

Test Example 4: Pick-up success rate measurement

The silicon wafer having a thickness of 80 μm was thermally pressed for 60 seconds at a dicing die-bonding film prepared above, and then diced into a size of 16 mm × 9 mm using DFD-650 (DISCO).

Thereafter, the film was irradiated with a high-pressure mercury lamp having an illuminance of 70 mW / cm 2 for 3 seconds to irradiate with an exposure dose of 200 mJ / cm 2. After the irradiation was completed, the pick-up test was carried out using a die bonder device (SDB-10M, Mechatronics) for 200 chips in the center of the silicon wafer, and the results of measuring the success rate (%) are shown in Table 2 below.

As shown in Table 2, using the photocurable composition for the pressure-sensitive adhesive layer using a UV-curable urethane acrylate oligomer (B) in the acrylic pressure-sensitive adhesive (A) containing a vinyl group, as in Examples 1, 2 and 3 The dicing die-bonding film achieved 100% pick-up success even with a 16mm x 9mm chip size.

On the other hand, Comparative Example 1 did not include a UV curable urethane acrylate oligomer (B), Comparative Example 2 does not contain a vinyl group in the acrylic adhesive binder (A), Comparative Example 3 includes glycidyl methacrylate Since the UV curing degree after UV exposure is relatively low, the Peel value and the tack value are relatively higher than those of Examples 1 to 3, thereby failing to achieve a 100% pickup success rate even in a 16mm x 9mm chip size.

1 is a schematic cross-sectional view of a dicing die bonding film according to an embodiment of the present invention;

2 is a cross-sectional schematic diagram illustrating a wafer mounting process during a semiconductor process;

3 is a cross-sectional schematic diagram showing a wafer dicing step in a semiconductor step;

4 is a cross-sectional schematic diagram showing a wafer chip pick-up step in a semiconductor step;

5 is a cross-sectional schematic diagram illustrating die bonding during a semiconductor process.

<Description of the symbols for the main parts of the drawings>

1: dicing die-bonding film, 2: release film

3: adhesive layer, 4: adhesive layer

5: base film, 6: wafer

7: support member

Claims (10)

10 to 150 parts by weight of a UV curable urethane acrylate oligomer (B) having a viscosity of 10,000 cps to 100,000 cps at 40 ° C relative to 100 parts by weight of an acrylic adhesive binder (A), 0.5 to 5 parts by weight of a thermosetting agent (C), and a photopolymerization initiator (D) 0.1 to 3 parts by weight, The acrylic adhesive binder (A) is (1) an acrylic monomer, a hydroxy monomer, an epoxy monomer and a polymerization initiator are polymerized to produce an acrylic polyol adhesive binder resin, and (2) an acrylic polyol adhesive binder resin obtained in the reaction. A photocurable pressure-sensitive adhesive composition, wherein the vinyl group-introducing monomer is prepared by urethane addition reaction and contains 2 to 10 mol% of an epoxy group. The method according to claim 1, wherein (1) 50 to 85% by weight of the acrylic monomer, 10 to 35% by weight of the hydroxy monomer, and 2 to 15% by weight of the epoxy group monomer are reacted in the monomer of the polymerization reaction. Flame adhesive composition. The photocurable pressure-sensitive adhesive composition of claim 1, wherein 1 to 10% by weight of the reactive monomer is further used in the polymerization reaction (1). The photocurable pressure-sensitive adhesive composition of claim 1, wherein the content of the vinyl group-introducing monomer is 10 to 25 parts by weight based on 100 parts by weight of the solid content of the polyol adhesive binder resin prepared in the polymerization reaction (1). The photocurable pressure-sensitive adhesive composition of claim 1, wherein in the reaction (2), the vinyl group-introducing monomer is reacted at a ratio of 0.4 to 0.9 to 1 equivalent to the hydroxyl equivalent of the acrylic polyol adhesive binder resin. The photocurable pressure-sensitive adhesive composition of claim 1, wherein a glass transition temperature of the acrylic adhesive binder (A) is -80 to -40 ° C. The photocurable pressure-sensitive adhesive composition of claim 1, wherein a weight average molecular weight of the acrylic adhesive binder (A) is 150,000 to 400,000. 2. The UV curable urethane acrylate oligomer (B) is a acrylate having a hydroxyl group in a terminal isocyanate urethane prepolymer obtained by reacting a polyol compound of a polyester type or a polyether type with a polyisocyanate compound. Photocurable pressure-sensitive adhesive composition characterized in that it is prepared by. The photocurable adhesive film by the photocurable adhesive composition of any one of Claims 1-8. A dicing die bonding film comprising a base film, a photocurable adhesive film according to claim 9, and an adhesive layer.

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