KR101002089B1 - Photocuring Composition for Pressure Sensitive Adhesive and Dicing Die Bonding Film Comprising the Same - Google Patents

Abstract

The present invention relates to an acrylic adhesive binder including a vinyl group, an esterified quinonediazide compound, a thermosetting agent, a photocurable adhesive composition comprising a photopolymerization initiator, and an adhesive film, wherein the adhesive layer for bonding a ring frame, a wafer, or a die is bonded before photocuring. It has excellent adhesion and excellent pick-up property even under photocuring conditions where the amount of energy is not constant during UV curing, so it can be usefully used for dicing film and dicing die bonding film. It relates to the invention to make.

Semiconductor, adhesive tape, photocurable adhesive composition, esterified quinonediazide compound, epoxy group, thermosetting agent, photoinitiator, dicing, dicing die bonding

Description

Photocuring Composition for Pressure Sensitive Adhesive and Dicing Die Bonding Film Comprising the Same

The present invention relates to a photocurable pressure-sensitive adhesive composition and a dicing die-bonding film comprising the same, and more particularly, to an acrylic pressure-sensitive adhesive binder including a vinyl group, an esterified quinonediazide compound, a thermosetting agent, and a photocuring agent including a photopolymerization initiator. It relates to an adhesive composition and a dicing die-bonding film comprising the same.

In the semiconductor manufacturing process, a wafer in which a circuit is designed is divided into small chips through dicing in a size having a large diameter, and each separated chip is die-bonded by bonding to a supporting member such as a PCB substrate or a lead frame substrate. Go through

Conventionally, a dicing film is attached to the back surface of a wafer in a dicing process to prevent chips from scattering or moving during dicing. Without the dicing film, the chip is scattered or moved by the blades rotating at high speed, causing cracks and damage to the chip. Thus, a dicing film with appropriate adhesion was used to facilitate the individualization process of the chip.

In the case where the dicing film is an ultraviolet curable composition, after the completion of the dicing, the back surface is irradiated with ultraviolet rays to cure the composition to lower the interfacial peeling force with the wafer, thereby facilitating the pickup process of the individualized chip wafer.

According to the conventional method as described above, a die bonding process is required in which a chip is bonded to a supporting member such as a PCB substrate or a lead frame substrate in a packaging process for delivering electrical signals to individual chips after dicing. In this process, the chip is bonded to the PCB substrate or the lead frame by using a liquid epoxy adhesive. However, in a multi chip package (MCP) requiring high density and high integration, two or more layers are bonded by adhering the chips and chips bonded on the substrate to each other. Since the lamination technology is applied, it is difficult to apply a uniform thickness when the liquid epoxy adhesive is used, as well as a fillet phenomenon due to the overflow of the adhesive, or insufficient adhesive strength may occur.

In order to solve the above problems, Korean Patent Laid-Open Publication No. 2004-30979 proposes a technique in which an ultraviolet curable pressure-sensitive adhesive composition and an epoxy resin composition are mixed in a one-component form on a substrate. However, the above technique requires a 30-minute or more hardening process of curing an epoxy resin in addition to the hardening process by ultraviolet irradiation, and thus requires a long time. In addition, in the wafer dicing step, the wafer must be fixed to the ring frame for expansion, and since a separate adhesive tape for fixing to the ring frame needs to be manufactured, the dicing die can be used as a pre-cut sample. When manufacturing a bonding film, the process of manufacturing this double-sided adhesive film for ring frame attachment, etc. is complicated, and a cost problem arises.

In addition, since the one-component UV-curable composition is used, it is difficult to smoothly separate from the substrate at the time of die pickup due to the uncured and remaining epoxy resin composition. In addition, the adhesive strength between the chip and the chip is also weak, there is a problem that voids easily occur. When voids are generated, packaging is carried out through molding process after chip mounting, which causes a critical problem in reliability and causes short circuits or cracks in electrical signals.

Therefore, the conventional method as described above has a problem in terms of cost and yield because it undergoes a multi-step process, many studies have been conducted to shorten the process. In recent years, the method of attaching the chip on the back surface of the wafer is gradually increasing, and this method is conventionally performed by placing the film-like epoxy on the upper surface of the film serving as the dicing film and picking it up between the adhesive of the dicing film and the film-like epoxy. By reducing the two-stage process to one step, it is more advantageous in terms of time and yield.

In Korean Patent Laid-Open Publication No. 2004-29939, a UV-curable adhesive layer is formed on a substrate, and an adhesive layer is attached on the substrate again, and when dicing is completed, the adhesive layer and the adhesive layer are picked up by separating the adhesive layer and the adhesive layer. The attached chip is die bonded on the substrate. However, the above technique causes the UV-curable low molecular materials in the adhesive layer to be moved and diffused to the adhesive layer substantially before the ultraviolet irradiation, so that the adhesive force does not significantly decrease during the actual ultraviolet irradiation, or the adhesive force increases when the transition is severe.

In particular, when the chip size is small or the wafer thickness is large, the pick-up range can be adjusted by adjusting the parameters of the pick-up machine. The adhesion between the adhesive layer and the adhesive layer is not reduced, which causes a problem in die pickup.

The present invention is to solve the above problems, one object of the present invention is to improve the pickup properties by generating nitrogen gas between the adhesive layer and the adhesive layer during UV curing in order to reduce the sufficient adhesive strength after ultraviolet curing. It is to provide a photocurable pressure-sensitive adhesive composition.

Another object of the present invention includes the above photocurable adhesive composition to prevent the chip from scattering or moving during dicing during the semiconductor process and to easily peel off the chip with an adhesive from the adhesive layer when picking up It is possible to use, and to provide a dicing film or a dicing die-bonding film having sufficient adhesiveness during die bonding operations on a PCB substrate or a lead frame substrate.

The photocurable pressure-sensitive adhesive composition according to the present invention for achieving the above object is 1 to 30 parts by weight of esterified quinone diazide compound, 0.5 to 5 parts by weight of thermosetting agent and 0.1 to photoinitiator based on 100 parts by weight of the acrylic adhesive binder solids 3 parts by weight.

In addition, the dicing film according to the present invention includes a base film and a photocurable adhesive layer formed on the base film, wherein the adhesive layer generates a nitrogen gas during photocuring, thereby laminating the upper portion of the adhesive layer It is characterized by including a foamable composition which increases the pickup success rate.

In addition, the dicing die bonding film according to the present invention includes a base film and a photocurable adhesive layer formed on the base film and an adhesive layer formed on the adhesive layer, wherein the adhesive layer generates nitrogen gas during photocuring. By doing so, characterized in that it comprises a foamable composition for increasing the pickup success rate of the adhesive layer formed on the adhesive layer.

The photocurable adhesive composition and the dicing die bonding film including the same according to the present invention include an acrylic adhesive binder containing a vinyl group and an esterified quinonediazide compound, thereby preventing chips from scattering or moving when dicing. In addition, during photocuring, nitrogen gas is generated between the adhesive layer and the adhesive layer to provide an effect of easily peeling the chip with the adhesive layer from the adhesive layer. Therefore, sufficient adhesiveness can be maintained when die bonding to a PCB substrate or a lead frame substrate, and the dicing process and the die bonding process can be performed in one process, thereby increasing the manufacturing yield.

The present invention provides a photocurable pressure-sensitive adhesive composition for forming a pressure-sensitive adhesive layer comprising an acrylic pressure-sensitive adhesive binder containing a vinyl group and an esterified quinonediazide compound.

The photocurable pressure-sensitive adhesive composition of the present invention comprises 1 to 30 parts by weight of esterified quinonediazide compound, 0.5 to 5 parts by weight of thermosetting agent and 0.1 to 3 parts by weight of photopolymerization initiator, based on 100 parts by weight of the acrylic adhesive binder solid content. do.

Hereinafter, each composition of the present invention will be described in more detail.

(1) acrylic adhesive binder containing a vinyl group

Acrylic adhesive binder containing a vinyl group is synthesized through a two-step process. First, an acrylic monomer capable of imparting adhesive force is selected as a main monomer, and a functional acrylic monomer is added thereto, and the acrylic adhesive binder is polymerized, and then a vinyl group-introducing monomer is applied to the urethane addition reaction at low temperature, thereby producing a vinyl group. The photocurable acrylic adhesive binder which has can be synthesize | combined.

Preferably, the monomer having an isocyanate and vinyl group with the acrylic polyol adhesive binder resin obtained in the first polymerization reaction and the first polymerization reaction in which the acrylic monomer, the functional acrylic monomer and the polymerization initiator are polymerized to prepare the acrylic polyol adhesive binder resin is urethane. An acrylic adhesive binder may be prepared by the second polymerization reaction in which the addition reaction is performed.

The functional acrylic monomer in the first polymerization reaction may be a hydroxy monomer, an epoxy group monomer or a reactive monomer, of which a hydroxy monomer and an epoxy group monomer should be used.

More preferably, 50 to 85% by weight of the acrylic monomer, 10 to 35% by weight of the hydroxy monomer, and 2 to 15% by weight of the epoxy group monomer may be used in the total monomers of the first polymerization reaction, and a reactive monomer may be further used.

Here, it is preferable that the glass transition temperature of an acrylic monomer is -50 degrees C or less, More preferably, 60-80 weight% can be used.

The acrylic monomer functions to impart adhesion to the base film, but there is no particular limitation as the acrylic monomer, but 2-ethylhexyl methacrylate, iso-oxyl acrylate, 2-ethylhexyl acrylate, ethyl acrylate, n-butyl Preference is given to using at least one member selected from the group consisting of acrylates, iso-butyl acrylates and octadecyl methacrylates.

Although there is no particular limitation as the hydroxy monomer, from the group consisting of 2-hydroxy ethyl methacrylate, hydroxy ethyl acrylate, 4-hydroxy butyl acrylate, hydroxy propyl (meth) acrylate and vinyl caprolactam Preference is given to using at least one selected.

As for the content of the hydroxy monomer, as described above, 10 to 35% by weight of the monomer used in the first polymerization reaction may be used, more preferably 15 to 25% by weight. If the content is less than 10% by weight, the content of hydroxyl groups reacted with the isocyanate, which is a thermosetting agent, is reduced after introduction of the monomer having a vinyl group, thereby making the adhesion with the base film very weak. When the content is more than 35% by weight, the adhesion with the adhesive layer for wafer or die adhesion is increased. May increase after lamination (also called a mounting process).

As the epoxy group monomer, glycidyl methacrylate or glycidyl acrylate can be used.

As described above, the content of the epoxy group monomer may be 2 to 15% by weight of the monomers used in the first polymerization reaction, more preferably 2 to 8% by weight. The larger the difference in the surface energy before and after UV curing, the better the pick-up property. Especially, in the above range, the surface energy is greatly reduced during UV curing. In addition, when the content is less than 2% by weight, the adhesion to the ring frame is lowered, and when the content is greater than 15% by weight, the photocuring rate due to the epoxy group deteriorates during photocuring, thereby increasing the peeling force with the material.

In addition, the epoxy group monomer remains at the end of the acrylic adhesive binder after the polymerization and does not participate in the reaction after photocuring and affects the surface properties. That is, it is related to surface energy and serves to reduce surface energy after photocuring.

Next, reactive monomers that can be used as functional acrylic monomers include lauryl acrylate, lauryl methacrylate, styrie methacrylate, cetyl acrylate, octadecyl acrylate and octadecyl methacrylate, more preferably. Preferably, single or mixed use of monomers having 12 or more carbon atoms is more preferable.

The reactive monomer is preferably added by the remainder except for the content of the acrylic monomer, the hydroxy monomer and the epoxy group monomer in the total monomer of the first polymerization reaction, more preferably 1 to 10% by weight can be used.

In the second polymerization reaction, the monomer having an isocyanate and a vinyl group may be reacted at a ratio of 0.4 to 0.9 with respect to the hydroxyl equivalent of the acrylic polyol adhesive binder resin. When the ratio is less than 0.4, the number of double bonds that can be reacted at the time of photocuring is small, and thus the loss of adhesion is not large. Therefore, the peeling force with the adhesive layer for bonding the wafer or die is increased. There are fewer sites that can reduce the adhesion with the base film.

By such a second polymerization reaction, a monomer or oligomer having an isocyanate group at one end of the acrylic adhesive binder and a vinyl group at the other end thereof is introduced.

The vinyl introduction monomers are not necessarily limited, but α, α-dimethyl-m-isopropenylbenzyl isocyanate and 2-isocyanatoethyl methacrylate ( 2-Isocyanatoethyl Methacrylate), 2-Isocyanatoethyl 2-propenoate, 1,1-bis (acryloyloxy methylethylisocyanate) (1,1-bis (acryloyloxy methyl ethyl) isocyanate)) may be used alone or in combination of one or more selected from the group consisting of.

The content of the vinyl group-introducing monomer should be 10 to 25 parts by weight, more preferably 15 to 20 parts by weight, based on 100 parts by weight of the solids of the polyol adhesive binder resin prepared in the first polymerization reaction. If the content is less than 10 parts by weight, the loss of adhesive force after photocuring is not large, and the peeling force with the wafer or die bonding adhesive layer is increased. If the content is more than 25 parts by weight, the adhesive layer is deteriorated in fluidity. Rather, the peel force is increased to increase.

The acrylic adhesive binder formed as described above has a hydroxyl group as a result of applying a hydroxy monomer, and the hydroxyl value is preferably 15 to 30. If the hydroxyl value of the acrylic pressure-sensitive adhesive binder is less than 15, the content of isocyanate, which is a thermosetting agent, becomes small, and the adhesion force with the base film is very weak. If the hydroxyl value is more than 30, the adhesion force with the wafer or die bonding adhesive layer increases after lamination. do.

Moreover, 1 or less of the acid value of an acrylic adhesive binder is preferable. If the acid value is greater than 1, the gel is likely to be generated during the synthesis when acrylic acid and the monomer having an epoxy group are introduced at the same time, and the change over time after lamination with the adhesive layer for wafer or die bonding may be very large. .

The acrylic adhesive binder has a glass transition temperature of -80 to -40 ° C, preferably a glass transition temperature of -70 to -50 ° C in order to obtain an appropriate initial adhesive force after thermosetting. When the glass transition temperature exceeds about -40 ℃, the initial adhesion is low, when dicing, the adhesion to the ring frame is low, falling off from the ring frame, or the adhesion to the wafer may be low, chip scattering may occur, -80 If it is less than ℃, there is a problem that a large amount of tack remains after the photocuring due to the high adhesive force before the photocuring to increase the peel force with the wafer or the adhesive layer.

The weight average molecular weight of the acrylic adhesive binder of this invention is 150,000-400,000. Conventional acrylic resins composed of only acrylic polyols could exhibit low peeling strength after UV curing only when the acrylic resins contained an acrylic polyol having a molecular weight of 500,000 or more.However, the photocurable acrylic adhesive binder according to the present invention introduces an epoxy group to the ring frame. It is possible to improve the adhesion to the, it is possible to retain excellent peeling force even in the molecular weight of about 150,000 to 400,000.

When the molecular weight of the binder is less than 150,000, a problem occurs in coating film forming ability, and even when the adhesive force is lost after photocuring, a constant physical property does not come out, thereby causing a problem in that the peeling force with the material is not kept constant.

In the synthesis of the acrylic pressure-sensitive adhesive binder of the present invention, as the organic solvent in the case of copolymerization by solution polymerization, a ketone series, an ester series, an alcohol series or an aromatic group can be used. Preferably, toluene, ethyl acetate, acetone, methyl Ethyl ketone and the like can be used. And it is preferable that the boiling point of an organic solvent is 60-120 degreeC. In this case, as the polymerization initiator, a radical generator including an azobis system such as α, α'-azobisisobutylnitrile and an organic peroxide system such as benzoyl peroxide is usually used. If necessary, a catalyst or a polymerization inhibitor may be used in combination, and the content thereof is preferably 0.1 to 0.5 parts by weight based on 100 parts by weight of the charged monomer.

In addition, the molecular weight may be adjusted at a polymerization temperature of 80 to 120 ° C. for a polymerization time of 1 to 75 hours, preferably 5 to 15 hours.

The acrylic polyol pressure-sensitive adhesive binder resin obtained in the first step of the polymerization reaction, a monomer having an isocyanate group and a vinyl group and a catalyst are put in a urethane addition reaction at 30 to 55 ℃ for 7 to 15 hours, an acrylic copolymer can be synthesized.

(2) esterified quinonediazide compounds

The adhesive composition according to the present invention comprises an esterified quinonediazide compound. By mixing the esterified quinonediazide compound with the acrylic adhesive binder containing the vinyl group described in (1) above, nitrogen gas is generated between the adhesive layer and the wafer or the adhesive layer and the adhesive layer after UV irradiation, thereby reducing the adhesive force. (See Scheme 1 below).

Here, the esterified quinone diazide compound is a compound acting as a photo active compound (PAC), and a compound having a 1,2-benzoquinone diazide structure or a 1,2-naphthoquinone diazide structure can be used. Can be.

Preferred esterified quinonediazide compounds in the present invention are compounds represented by any one selected from the following [Formula 1] to [Formula 3].

[Formula 1]

[Formula 2]

(3)

(The Z ₁ and Z ₂ are each independently hydrogen or a C1 to C6 alkyl group,

M is an integer of 0 to 3,

또는

이며, 여기서 수소의 비율은 0 내지 90%이다.)Q is hydrogen,

or

Wherein the proportion of hydrogen is 0 to 90%.)

Scheme 1

It is preferable to apply 1-30 weight part with respect to 100 weight part of acrylic adhesive binder solids containing a vinyl group, and, as for such esterified quinonediazide compound, 5-20 weight part is more preferable. If the added amount of the esterified quinonediazide compound is less than 1 part by weight, the absolute amount of nitrogen gas generated by the ultraviolet ray is small, so that the decrease in adhesion is relatively small. When irradiated, the adhesive force may be increased by decreasing the curing rate of the acrylic adhesive binder including a vinyl group.

(3) thermosetting agent

Thermosetting agents that can be used to make photocurable adhesive films include 2,4-trilene diisocyanate, 2,6-triene diisocyanate, hydrogenated triylene diisocyanate, 1,3-xylene diisocyanate, 1,4-xylene di Isocyanate, diphenyl methane-4,4-diisocyanate, 1,3-bisisocyanatomethyl cyclohexane, tetra methyl xylene diisocyanate, 1,5-naphthalene diisocyanate, 2,2,4-trimethyl hexamethylene diisocyanate, Consisting of 2,4,4-trimethyl hexamethylene diisocyanate, triylene diisocyanate adduct of trimetholpropane, xylene diisocyanate adduct of trimetholpropane, toriphenylmethanetoriisocyanate, methylene bistri isocyanate, etc. One or more selected from the group can be used, but is not limited thereto.

Such a curing agent reacts with the functional group of the adhesive binder to act as a crosslinking agent and has a three-dimensional network structure as a result of the crosslinking reaction.

Therefore, it is preferable to apply 0.5-5 weight part of thermosetting agents with respect to 100 weight part of acrylic adhesive binder solids containing a vinyl group. If it is less than 0.5 parts by weight, the degree of crosslinking reaction is low, resulting in poor adhesion to the base film, resulting in detachment of the coating layer after coating, or low adhesion after photocuring between the base film and the adhesive layer. Problems that can be transferred may occur, and if it exceeds 5 parts by weight, the peeling force with the die-bonding adhesive layer is relatively increased by unreacted isocyanate or the crosslinking reaction loses the tack before UV irradiation, thereby causing This is because deterioration of adhesion force causes a problem of detachment of the dicing die-bonding film and the wafer from the ring frame during expansion.

(4) photopolymerization initiator

The adhesive composition of this invention contains a photoinitiator. The photoinitiator contained in a photocurable composition has a special limitation, and can use what is known conventionally. Specifically, benzophenones such as benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-diethylaminobenzophenone, 4,4'dichlorobenzophenone, acetone such as acetophenone and diethoxyacetophenone Anthraquinones, such as phenone, 2-ethyl anthraquinone, and t-butyl anthraquinone, can be used individually or in mixture of 2 or more types.

The content of such a photopolymerization initiator is preferably 0.1 to 3 parts by weight based on 100 parts by weight of the acrylic adhesive binder solids containing a vinyl group. When the content of the photopolymerization initiator is less than 0.1 part by weight, the radical generation efficiency is lowered by ultraviolet irradiation, and thus, sufficient adhesive force is not reduced between the adhesive layer and the adhesive layer interface after the ultraviolet irradiation. Thus, regardless of chip size, the desired pickup performance is not achieved. On the contrary, if the amount is more than 3 parts by weight, the generated radical concentration is excessive, and the molecular weight of the ultraviolet curable acrylate reacted by the ultraviolet rays becomes small, resulting in odor problems of the unreacted initiator and the transition of the unreacted initiator to the adhesive layer without forming a sufficient network structure. Is generated to degrade the reliability in the packaging of the adhesive layer.

Another aspect of the invention relates to a dicing film and a dicing die-bonding film comprising an adhesive layer formed using the above-described composition.

First, an acrylic adhesive binder, an esterified quinonediazide compound, a thermosetting agent, and a photopolymerization initiator are dissolved in a solvent such as methyl ethyl ketone in the above-described composition to prepare a photocurable adhesive composition of the present invention.

Next, the remaining amount of solvent is volatilized by hot air drying and other methods with respect to the prepared pressure-sensitive adhesive composition to form a photocurable pressure-sensitive adhesive layer.

Next, a photocurable adhesive layer is applied to a dicing film or a dicing die bonding film.

Here, the dicing film is a form in which an adhesive layer is applied on a base film, the dicing die bonding film is a form in which an adhesive layer is coated on a base film, and an epoxy adhesive layer is laminated on each other. At this time, the release film for protecting the adhesive layer may have a structure laminated on the adhesive layer. However, it is not limited thereto.

In addition, the pressure-sensitive adhesive layer included in the dicing die bonding film according to the present invention has a thickness of 3 to 40㎛, in the pressure-sensitive adhesive layer of less than 3㎛ the coating film cohesive strength after UV curing is weak, the desirable adhesion between the interface with the upper adhesive layer It does not bring a reduction effect, in the case of more than 40㎛ there is a problem that the beard-shaped cutting chips, etc. occur during the dicing process.

Hereinafter, the dicing die-bonding film according to the present invention will be described in detail with reference to the drawings.

1A to 1E are schematic cross-sectional views illustrating a dicing die-bonding film and a wafer chip pick-up process using the same according to an embodiment of the present invention.

Referring to FIG. 1A, the adhesive layer 120 is coated on the expandable base film 100 such as a polyolefin film, and the adhesive layer 130 may adhere between the chip and the chip on the adhesive layer 120. Is formed. At this time, the adhesive layer 120 is preferably formed of the photocurable adhesive compositions of (1) to (4) described above so that nitrogen gas may be generated in the adhesive layer 120 in a subsequent photocuring process.

When only up to the structure of the base film 100 and the adhesive layer 120 is used as a dicing film, when used up to the structure of the adhesive layer 130 is a dicing die bonding film. At this time, the release film 140 to protect the adhesive layer 130 is formed on the adhesive layer 130, it will be described below with reference to the example of the dicing die bonding film.

Referring to FIG. 1B, after the release film 140 is peeled off, the wafer 150 is laminated on the adhesive layer 130.

Referring to FIG. 1C, after the lamination of the adhesive layer 130 and the wafer 150, a dicing process of cutting a chip to a size of a designed circuit is performed.

The dicing process is performed to the depth of the base film 100 under the adhesive layer 120 including the adhesive layer 130. As a result, the individualized chip 155, the adhesion pattern 135, and the adhesion pattern 125 are formed.

Subsequently, the adhesive pattern 125 is photocured by irradiating ultraviolet (UV) under the base film 100 for pickup, thereby reducing the interfacial peeling force with the adhesive pattern 135. At this time, the nitrogen gas is generated in the adhesive layer 120, the adhesive pattern 125 is cured into a foam pattern, the adhesion with the adhesive pattern 135 is significantly reduced.

Referring to FIG. 1D, the individualized chip 155 to which the adhesive pattern 135 is attached is picked up with a constant force by using a pickup called a collet. In this case, an expansion process of expanding the base film 100 is performed to facilitate pickup, and since the adhesive pattern 125 is cured into a foam pattern, separation of the adhesive pattern 125 and the adhesive pattern 135 is easy. Can be performed.

Referring to FIG. 1E, the picked-up chip 155 is attached to a supporting member 200 such as a PCB substrate or a lead frame.

Here, the base film 100 supports the adhesive layer 120, which serves to hold the wafer so as not to shake during the dicing, and also to facilitate picking up individualized chips when dicing is completed. It is preferable to use a film that can be stretched at room temperature so as to allow an expansion process, which is a process of increasing the interval therebetween.

Various polymer films may be used as the base film 100 constituting the dicing die-bonding film according to the present invention. Among them, thermoplastic plastic films are generally used. This is because the thermoplastic film must be used to expand the pickup after the dicing process, and the chips remaining after the expansion can be picked up again over time. Because.

The base film 100 should not only be expandable but also preferably UV-permeable, and in particular, when the pressure-sensitive adhesive is an ultraviolet curable pressure-sensitive adhesive composition, it is preferable that the base film 100 is a film excellent in transmittance to ultraviolet rays of a wavelength at which the pressure-sensitive adhesive composition can be cured. Therefore, the base film 100 should not contain an ultraviolet absorber or the like.

Examples of polymer films that can be used as such substrates include polyethylene, polypropylene, ethylene / propylene copolymers, polybutene-1, ethylene / vinyl acetate copolymers, mixtures of polyethylene / styrenebutadiene rubbers, polyolefins such as polyvinylchloride films Type films and the like can be mainly used. In addition, polymers such as polyethylene terephthalate, polycarbonate, poly (methyl methacrylate), thermoplastic elastomers such as polyurethane and polyamide-polyol copolymers, and mixtures thereof can be used, and these base films 100 are die It may have a multi-layered structure in order to improve cutting or expandability at the time of cutting. Such a film may be mainly melted by blending polyolefin chips to form a film by extrusion, or may be formed by blowing. The heat resistance and mechanical properties of the film to be formed are determined according to the type of chips to be blended, and the film to be manufactured should have a value of HAZE 85 or more. Emboss effect to give haze by scattering of light.

If the haze is less than 85, the film may fail to recognize the position of the film when laminating to the mirror surface of the wafer in the pre-cut state during the semiconductor process, and continuous operation may be impossible. Therefore, the back surface of the base film 100 must exhibit a value of haze 85 or more, which is a recognizable level by embossing the surface.

The embossing process of the base film 100 not only recognizes, but also prevents blocking during manufacturing of the base film 100, and thus serves to enable winding. Since the adhesive layer 120 is formed on the embossed back surface of the base film 100, it is preferable that the opposite side of the embossed surface is surface modified to increase the adhesive force with the adhesive layer 120 formed.

Surface modification can be performed by both physical and chemical methods. The physical method can be corona treatment or plasma treatment, and the chemical method can be a method such as in-line coating or primer treatment, and can be adhered by corona discharge treatment. Forming layer 120 is preferred in terms of manufacturing processability.

The thickness of the base film 100 is preferably 30 to 300 µm, more preferably 50 to 200 µm in view of strong elongation, workability, UV transmittance and the like. When the base film 100 is 30 μm or less, workability becomes poor in a pre-cut state, and deformation of the film easily occurs due to heat generated during ultraviolet irradiation. In addition, when the base film 100 is 300 μm or more, the force for expanding on a facility is excessively required, which is not preferable in terms of cost.

Next, the adhesive layer 120 should maintain a strong adhesive force with the adhesive layer 130 or the ring frame before the ultraviolet irradiation, when dicing if the adhesive strength of the interface between the adhesive layer 120 and the adhesive layer 130 is not large before ultraviolet irradiation Peeling easily occurs between the chip with the adhesive and the adhesive layer 120, so that partial lifting occurs, and the chip is shaken during dicing, causing chip damage such as chip cracks. In addition, if the adhesive force between the adhesive layer 120 and the ring frame is not large, the ring frame is fixed during expansion and expands by applying a constant tension to the film, so that desorption occurs at the adhesive layer 120 and the ring frame. It may cause a defect. Therefore, after the ultraviolet ray irradiation, the coating layer in the adhesive layer 120 is hardened by ultraviolet curing crosslinking, and the cohesion force becomes large, and the interface peeling force with the adhesive layer 130 formed on the adhesive layer 120 is increased. This should be significantly lower, and the greater the peel force reduction width, the easier the pick-up of the chip attached to the adhesive layer 130. That is, the adhesive layer 120 should have a large adhesive force enough to hold the chip strongly from the dicing step to the drying step, while the adhesive force is significantly reduced in the pick-up step so that the chip can be safely moved to the die bonding step. The two opposing properties, which should have low adhesion, should be before and after UV irradiation.

The pressure-sensitive adhesive layer 120 used for the dicing die-bonding film 160 according to the present invention is formed using the photocurable pressure-sensitive adhesive composition, and the method of forming the photocurable pressure-sensitive adhesive composition is mainly performed by coating.

The method of forming the adhesive layer 120 on the base film 100 may be directly coated, or may be transferred by a transfer method after completion of drying after coating on a release film or the like. The former or the latter is not limited as long as the coating method for forming the adhesive layer 120 can form a uniform coating layer, but mainly bar coating, gravure coating, comma coating, reverse roll coating, applicator coating, spray coating And lip coating are used.

After coating, the drying method for forming the coating layer is mainly a thermosetting method, the coating method may form a coating layer directly on the surface of the polyolefin film, the adhesive layer 120 is formed on a film such as the release film 140 After this, the coating layer may be transferred to a polyolefin film or the like to form a coating layer.

The thickness of the adhesion layer 120 is 3-40 micrometers, More preferably, it is 5-30 micrometers in thickness. If the thickness is less than 3 μm, the cohesive strength of the coating film is weak after UV curing, which does not bring about a desirable effect of reducing the adhesive force between the interface with the adhesive layer 130 on the upper side. Because there is.

The pressure-sensitive adhesive layer 120 may be aged at a constant temperature for a certain time. Generally, since the pressure-sensitive adhesive proceeds to harden the coating layer until a certain time even after thermal curing, the pressure-sensitive adhesive layer 120 may be stabilized and minimized over time. It is preferable to mature.

The adhesive layer 120 used in the dicing die-bonding film 160 according to the present invention is formed by using the photocurable pressure-sensitive adhesive composition as described above. Maintaining strong adhesive force, and also has a strong adhesive strength with the ring frame, after the ultraviolet irradiation, the adhesive layer 120 increases the coating cohesion force by the crosslinking reaction and shrinks, thereby significantly reducing the adhesive force at the interface with the adhesive layer 130 If the chip 155 having the adhesive layer 130 attached thereto is easily picked up and die-bonded to the support member 200, any one may be used.

In particular, any composition may be used as long as it is a composition which is cured by ultraviolet irradiation, and the adhesive force is significantly reduced between the interface with the adhesive layer 130 before and after the energy is added by heat curing or other external energy rather than ultraviolet irradiation.

Since the base film 100 used in the present invention is a non-polar material such as a polyolefin film, in order for the adhesive layer 120 to have adhesion to the film, the adhesive film 120 may be modified to increase the affinity for the adhesive layer 120 by modifying the film surface. Adhesion may be enhanced by introducing a polar group into the layer 120 component itself and crosslinking with the curing agent.

As described above, since the acrylic adhesive binder containing a vinyl group and the curing agent are mixed to form a coating film in the adhesive binder during the aging process when applied on the base film 100, the adhesive layer 130 even before UV irradiation. There is no transition to, resulting in a sufficient adhesive force reduction effect after ultraviolet irradiation.

By adding a thermosetting agent, the acrylic pressure-sensitive adhesive binder and the ultraviolet curing acrylate containing a vinyl group form a hard coating film on the surface of the base film 100, and coating film desorption does not occur by dicing or ultraviolet irradiation. As mentioned above, since the polyolefin film, which is the base film 100 used in the present invention, contains no polar group in the molecule, it is difficult to attach an external material having no polarity to the surface. Therefore, in order to increase the polarity of the film surface to increase the surface tension by corona treatment or primer treatment, etc. This is limited, so it is common to control the polarity of the basic resin to form a coating film.

The adhesive layer 120 included in the dicing film and the dicing die-bonding film according to the present invention is a case in which an acrylic adhesive binder containing a vinyl group and an ultraviolet curable acrylate are mixed, and no transition of low molecular acrylate occurs. After ultraviolet irradiation, the adhesive force at the interface between the adhesive layer 120 and the adhesive layer 130 is significantly reduced, so that it is possible to pick up even a chip having a large size of 10 mm x 10 mm or more.

As the components of the adhesive layer 120, an organic adhesive, an inorganic filler, an adhesive agent, a surfactant, an antistatic agent and the like may be used, in addition to an acrylic adhesive binder including a vinyl group, an ultraviolet curing acrylate, a thermosetting agent, a photopolymerization initiator, and the like. It is possible to add.

Next, the adhesive layer 130 is made of a thermosetting composition in the form of a film and should have excellent adhesion to the mirror surface of the wafer, and the outermost release film 140 protects the adhesive layer 130 from foreign matter and rolls. It is used to facilitate winding up.

The dicing die bonding film 160 according to the present invention has a structure in which the adhesive layer 130 is coated on the base film 100 as described above, and the adhesive layer 130 is laminated on the upper side. The adhesive layer 130 is attached to the surface of the support member 200 in a state where the semiconductor chip is attached to the small size and then individualized to a small size and easily peeled off from the lower adhesive layer 130 when attached to the chip back surface. do.

The adhesive layer 130 is attached to the mirror surface (glass surface) of the wafer on which the circuit is designed at a temperature near 60 ° C. and then diced into a support member 200 such as a lead frame or a PCB substrate at a temperature of about 100 ° C. Bonding In addition, since the adhesive layer 130 is attached to the chip and enters the packaging and remains inside the packaging even after epoxy molding, reliability such as ionic or foreign matter and process stability over time is important.

The adhesive layer 130 of the dicing die bonding film 160 which concerns on this invention consists of a high molecular weight acrylic copolymer which has film forming capability, and thermosetting resins, such as an epoxy resin. Examples of the acrylic copolymer include acrylic rubber which is a copolymer such as acrylic acid ester, methacrylic acid ester, and acrylonitrile. The epoxy resin is not particularly limited as long as the epoxy resin is cured to exhibit adhesive strength. However, in order to perform the curing reaction, the functional group must have two or more functional groups. Therefore, bisphenol A type epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin, etc. are used. It is desirable to.

In addition, a curing accelerator for curing the epoxy resin may be used for the adhesive layer 130, and as the curing accelerator, an imidazole series, an amine series, or the like may be used. In addition, in the adhesive layer 130, various silane coupling agents may be used in one kind or a mixture of two or more kinds to increase adhesion to the wafer, and inorganic particles such as silica may be added to improve the dimensional stability and heat resistance of the adhesive layer. Can be.

The coating thickness of the adhesive layer 130 is preferably 5 to 100㎛, more preferably 10 to 80㎛. This is less than 5㎛ does not show the proper adhesion on the back of the wafer, if it exceeds 100㎛ contrary to the recent trend of thin and short semiconductor packaging, the larger the thickness, the adhesive layer when bonding between the chip and the chip, the chip and the substrate This is because the fillet phenomenon, such as when using a liquid adhesive, occurs due to the fluidity of the, causing problems in reliability during packaging.

In addition, as the component of the adhesive layer, it is possible to mix an organic filler, an inorganic filler, a tackifier, a surfactant, an antistatic agent and the like as necessary, and the coating method of the adhesive layer may also form a uniform coating film thickness as in the adhesive layer. There is no special limitation as long as it can.

The dicing die-bonding film according to the present invention is made of one film by laminating the adhesive layer 120 and the adhesive layer 130 prepared as described above, but both pre-cut and roll forms are possible. In case of manufacturing in roll form, it is necessary to separately process the film part other than wafer during the semiconductor process, and in case of manufacturing in pre-cut form, it is suitable for wafer size. The removal process is not necessary. However, since the dicing die-bonding film according to the present invention is formed by cutting the adhesive layer 120 and the adhesive layer 130 to a certain size, the dicing die-bonding film according to the present invention is very important for controlling roll pressure, temperature dimension, and precision during lamination. Becomes

The invention can be better understood by the following examples, which are intended to illustrate the invention and are not intended to limit the scope of protection defined by the appended claims.

[Production of Adhesive Layer]

Acrylic resin KLS-1046DR (hydroxyl value 13 mgKOH / g, acid value 63 mgKOH / g, Tg 38 ° C, average molecular weight 690,000, manufacturer: Fujikura Corporation) 400 g, WS-023 (hydroxyl value or acid value 20 mgKOH / g, Tg -5 ° C) , Average molecular weight 500,000, hydroxyl or carboxyl group content 20, manufacturer: Nagase Chemtech) 60 g, cresol novolac-based epoxy resin YDCN-500-4P (manufactured by Kukdo Chemical, molecular weight 10,000 or less) 60 g, cresol novolac-based curing agent MEH-7800SS (Manufacturer: Meiwa Plastic Industries) 40g, imidazole series curing catalyst 2P4MZ (manufacturer: Shukuk Chemical) 0.1g, mercuryto silane coupling agent KBM-803 (manufacturer: Shin-Etsu Co., Ltd.) 0.5g, epoxy silane coupling agent KBM- 0.5 g of 303 (manufactured by Shin-Etsu Co., Ltd.) and 20 g of amorphous silica filler (OX-50, manufactured by Daegu Co., Ltd.) were mixed, followed by primary dispersion at 500 rpm for about 2 hours.

Milling was performed after the first dispersion. Milling mainly used bead milling method using inorganic particles. After the milling was completed, the coating was applied to one side of the polyethylene terephthalate release film having a thickness of 38 μm and then to a thickness of 20 μm.

In order to protect the coated surface, a first adhesive layer was prepared by laminating a polyethylene terephthalate film on the upper surface of the coating layer.

[Preparation of acrylic adhesive binder containing vinyl group]

The reagent was added to a 2 L four-necked flask under the mixing conditions of the following Preparation Example, and the reaction process was as follows. 300 g of ethyl acetate, 240 g of toluene, which was an organic solvent, were added first, a reflux cooling tube was installed on one side, and a thermometer was installed on the other side, and a dropping panel was installed on the other side.

After raising the flask solution temperature to 80 to 90 ℃, 2-ethylhexyl acrylate (JUNSEI, 7A2150), hydroxyethyl methacrylate (SAMCHUN, 03120), hydroxy as in Preparation Example 1 of [Table 1] Ethyl acrylate (JUNSEI, 10132-0480), glycidyl methacrylate (SAMCHUN, E10780), iso-oxyl acrylate monomer (SARTOMER, 437425, etc.) lauryl methacrylate monomer (Aldrich, 291811) 0.12 g of benzoyl peroxide was prepared and a mixed solution was added dropwise at 80 to 100 ° C. for 3 hours using a dropping panel. At this time, the stirring speed of the dropwise addition was 250rpm, after the completion of dropping to mature the reaction at the same temperature for 4 hours, and then 30g of ethyl acetate, 1.2g of azobisisobutylonitrile was added and maintained for 4 hours The viscosity and solids were measured and the reaction was stopped to prepare an acrylic adhesive polyol binder resin, which is an acrylic copolymer. The viscosity after polymerization was 300 to 500 cps, and the content of solids was corrected to 40%.

7 parts by weight of 2-Isocyanatoethyl Methacrylate (trade name: Karenz MOI, Japan) to 100 parts by weight of the acrylic adhesive polyol binder resin synthesized above in a 2 L four-necked flask and dibutyl tin dilaurate , DBTDL, Aldrich Co., Ltd., 291234) 20ppm was added and reacted for 8 hours at a temperature of 60 ° C. The ethyl acetate was used as the end point of the reaction, where the isocyanate group of the 2-Isocyanatoethyl Methacrylate monomer disappeared on the FT-IR by reacting with the hydroxyl group of the binder. Was added and cooled, and the acrylic adhesive binder of 40% of solid content was synthesize | combined.

TABLE 1

[Production of Photocurable Adhesive Composition and Dicing Die Bonding Film]

Example 1

250 g of an acrylic adhesive binder containing a vinyl group of 40% of the solid content prepared in Preparation Example 1 and 10 g of an esterified quinonediazide compound PAC-THPE-20 (Miwon Corporation, Chemical Formula 1) was added to a 1 L beaker, followed by mixing. Photocurable adhesive composition was prepared by adding 0.2 g of photoinitiator (Irgacure 651, Ciba-chemical) and 1.8 g of isocyanate curing agent (AK-75, Aekyung Chemical).

The photocurable adhesive composition thus prepared is mixed and coated on one side of the polyolefin film to prepare a first adhesive film having a thickness of 10 μm after drying, and then laminated with a first adhesive layer to form a dicing die bonding film 160 as shown in FIG. 1A. ) Was prepared.

Example 2

250 g of an acrylic adhesive binder containing a vinyl group of 40% of the solid content prepared in Preparation Example 1 and 10 g of an esterified quinonediazide compound PAC-TPPA-20 (Miwon Corporation, formula 2 structure) were added to a 1 L beaker, followed by mixing. A photocurable adhesive composition was prepared by adding 0.2 g of photoinitiator (Irgacure 651, Ciba-chemical) and 1.8 g of isocyanate curing agent (AK-75, Aekyung Chemical).

The photocurable adhesive composition thus prepared is mixed and coated on one side of the polyolefin film to prepare a second adhesive film having a thickness of 10 μm after drying, and then laminated with a first adhesive layer to form a dicing die bonding film 160 as shown in FIG. 1A. ) Was prepared.

Example 3

250 g of an acrylic adhesive binder containing a vinyl group of 40% of the solid content prepared in Preparation Example 1 and 10 g of an esterified quinonediazide compound PAC-MTPC (3MTC) (Miwon Corporation, formula 3 structure, m = 1) were added to a 1 L beaker. After mixing the mixture, 0.2 g of photoinitiator (Irgacure 651, Ciba-chemical) and 1.8 g of isocyanate curing agent (AK-75, Aekyung Chemical) were added to prepare a photocurable adhesive composition.

The photocurable adhesive composition thus prepared is mixed, coated on one side of the polyolefin film, dried to prepare a third adhesive film having a thickness of 10 μm, and then laminated with a first adhesive layer to form a dicing die bonding film 160 as shown in FIG. 1A. ) Was prepared.

Comparative Example 1

250 g of an acrylic adhesive binder containing a vinyl group having a solid content of 40% prepared in Preparation Example 1, 0.2 g (Irgacure 651, Ciba-chemical) and an isocyanate curing agent 1.8 g (AK-75, Aekyung Chemical) were added to a 1 L beaker. A chemical adhesive composition was prepared.

The photocurable adhesive composition thus prepared is mixed and coated on one side of the polyolefin film to prepare a fourth adhesive film having a thickness of 10 μm after drying, and then laminated with a first adhesive layer to form a dicing die bonding film 160 as shown in FIG. 1A. ) Was prepared.

Example 4

A dicing film was prepared by laminating a PET cover film on the first adhesive film prepared in Example 1.

Example 5

A dicing film was prepared by laminating a PET cover film on the second adhesive film prepared in Example 2.

Example 6

A dicing film was manufactured by laminating a PET cover film on the third adhesive film prepared in Example 3.

Comparative Example 2

A dicing film was prepared by laminating a PET cover film on the fifth adhesive film prepared in Comparative Example 2.

[Property evaluation method]

Test Example 1 Adhesive Layer-Adhesion Layer Interfacial Peeling Force

Adhesion measurement was tested in accordance with Clause 8 of Korean Industrial Standard KS-A-01107 (Test Method of Adhesive Tape and Adhesive Sheet). A sample having a width of 25 mm and a length of 250 mm was attached to the die bonding adhesive layer, and then an adhesive tape was attached to the die bonding adhesive layer, and then reciprocated once using a 2 kg load pressing roller for compression. After 30 minutes of pressing, turn the folded part of the test piece to 180 ㅀ and peel it off about 25mm. Then, in 10N Load Cell, fix the test piece to the upper clip of tensile strength and fix the die-bonding adhesive layer to the lower test clip of 300mm / min. The load when peeled off at the tensile speed was measured.

 Tensile tester used "Instron Series lX / s Automated materials Tester-3343", UV irradiation was carried out for 3 seconds in a high-pressure mercury lamp with 70mW / ㎠ illuminance for 200mJ / ㎠, each sample before and after ultraviolet irradiation The average value was measured by measuring 10 pieces, and is shown in the following [Table 2].

Test Example 2: Measurement of the tackiness of the adhesive layer

Only the adhesive layer in the dicing die-bonding film 160 prepared by Examples 1 to 3 and Comparative Example 1 was measured before and after UV curing using a "probe tack tester (Chemilab Tack Tester)". This method uses ASTM D2979-71 to determine the maximum force required when a clean probe tip is brought into contact with the adhesive surface for 1.0 + 0.01 sec at a rate of 10 + 0.1 mm / sec and a contact load of 9.79 + 1.01 kPa and then released. One result is shown in the following [Table 2].

At this time, the ultraviolet irradiation was irradiated with an exposure dose of 200mJ / ㎠ for 3 seconds in a high-pressure mercury lamp having an illuminance of 70mW / ㎠, each sample was measured before and after the ultraviolet irradiation each measured 5 average values.

Test Example 3: Measurement of the base film adhesion of the adhesive layer

In the dicing die-bonding film 160 prepared by Examples 1 to 3 and Comparative Example 1, the adhesive layer was cross cut tested, but the coating film was sharply cut at 11 mm horizontally and vertically at 11 mm intervals. A total of 100 check boards were made by drawing lines, and the result of measuring the adhesive force by attaching an adhesive tape to the prepared check board and pulling it momentarily is shown in [Table 2]. Here, 100/100 indicates a test result that all the 100 check boards are attached well.

Test Example 4: Measurement of the amount of nitrogen gas generated by the adhesive layer-adhesive layer

After the silicon wafer having a thickness of 50 μm was thermally compressed at 60 ° C. for 10 seconds to the dicing die bonding film 160 prepared according to Examples 1 to 3 and Comparative Example 1, DFD-650 (DISCO) was used. Dicing to a size of 50mm x 50mm by using.

Thereafter, the film was irradiated with a high-pressure mercury lamp having an illuminance of 70 mW / cm 2 for 3 seconds to irradiate with an exposure dose of 200 mJ / cm 2. After the irradiation is completed, the results of measuring the peeling area of the adhesive layer and the adhesive layer according to the generation of nitrogen gas on the silicon wafer back surface (film surface) are shown in the following [Table 2].

Test Example 5: Measurement of the success rate of dicing die-bonding film pick-up

After the silicon wafer having a thickness of 50 μm was thermally compressed at 60 ° C. for 10 seconds to the dicing die bonding film 160 prepared according to Examples 1 to 3 and Comparative Example 1, DFD-650 (DISCO) was used. Dicing was carried out to the size of 16mm x 9mm.

Thereafter, the film was irradiated with a high-pressure mercury lamp having an illuminance of 70 mW / cm 2 for 3 seconds to irradiate with an exposure dose of 200 mJ / cm 2. After the irradiation was completed, the pick-up test was carried out using a die bonder (SDB-10M, Mechatronics) for 200 chips in the center of the silicon wafer, and the success rate (%) was measured. .

[Table 2] Dicing die bonding film physical property evaluation results

Test Example 6 Wafer-Adhesive Layer Interfacial Peeling Force

Adhesion measurement was tested in accordance with Clause 8 of Korean Industrial Standard KS-A-01107 (Test Method of Adhesive Tape and Adhesive Sheet). After attaching a dimming film sample of 25 mm and a length of 250 mm to the wafer, it was compressed by reciprocating once using a 2 kg load roller. Thirty minutes after pressing, the folded part of the test piece is turned over to 180 ㅀ and peeled off about 25mm. Then, in 10N Load Cell, the test piece is fixed to the clip on the lower side of the test plate with the clip on the upper clip of the tensile strength tester, and at the tensile speed of 300mm / min. The load at the time of pulling off was measured.

 Tensile tester used "Instron Series lX / s Automated materials Tester-3343", UV irradiation was carried out for 3 seconds in a high-pressure mercury lamp with 70mW / ㎠ illuminance for 200mJ / ㎠, each sample before and after ultraviolet irradiation The average value was measured by measuring 10 pieces, and is shown in the following [Table 3].

Test Example 7: Measurement of the amount of nitrogen gas generated at the wafer-adhesive layer

The silicon wafer having a thickness of 50 μm was thermally compressed at 60 ° C. for 10 seconds to the dicing films prepared according to Examples 4 to 6 and Comparative Example 2, and then 50 mm x using DFD-650 (DISCO). Dicing to the size of 50mm.

Thereafter, the film was irradiated with a high-pressure mercury lamp having an illuminance of 70 mW / cm 2 for 3 seconds to irradiate with an exposure dose of 200 mJ / cm 2. After the irradiation is completed, the results of measuring the peeling area of the adhesive layer and the adhesive layer according to the generation of nitrogen gas on the silicon wafer back surface (film surface) are shown in Table 3 below.

Test Example 8 Measurement of Dicing Film Pick-up Success Rate

After thermally compressing a silicon wafer having a thickness of 50 μm on a dicing film prepared by Examples 4 to 6 and Comparative Example 2 for 60 ° C. for 10 seconds, using a DFD-650 (DISCO Co., Ltd.) Dicing to a size of 9 mm.

Thereafter, the film was irradiated with a high-pressure mercury lamp having an illuminance of 70 mW / cm 2 for 3 seconds to irradiate with an exposure dose of 200 mJ / cm 2. After the irradiation was completed, the pick-up test was carried out using a die bonder (SDB-10M, Mechatronics) for 200 chips in the center of the silicon wafer, and the success rate (%) was measured. .

[Table 3] Dicing film property evaluation results

As shown in [Table 2] and [Table 3], as the photocurable pressure-sensitive adhesive composition using a quinone diazide compound esterified in an acrylic pressure-sensitive adhesive binder containing a vinyl group as in Examples 1 to 3 and Examples 4 to 6 The prepared dicing die-bonding film and dicing film achieved 100% pick-up success rate even in a 50 mm-thick wafer 16 mm x 9 mm chip size.

On the other hand, Comparative Example 1 and Comparative Example 2 does not contain an esterified quinonediazide compound, there is no nitrogen gas generated by the ultraviolet irradiation, thereby resulting in the interface peeling force between the adhesive layer and the adhesive layer and the wafer and the adhesive layer It could not be lowered, and the tack value was relatively high compared to Examples 1 to 3, which did not achieve 100% pick-up success rate in the 16mm x 9mm chip size.

Here, when photocuring due to ultraviolet irradiation is insufficient, the interfacial peeling force between the adhesive layer and the adhesive layer is increased, so that pickup errors may occur in Comparative Examples 1 and 2. However, in the case of the present invention, since interfacial peeling is facilitated by nitrogen gas generated in the middle, pickup can be improved regardless of lack of photocuring by ultraviolet irradiation.

As described above, the adhesive layer according to the present invention contains an acrylic adhesive binder containing a vinyl group and an esterified quinonediazide compound, and when dicing, prevents chips from scattering or moving, and during photocuring The nitrogen gas can be generated between the adhesive layer, the adhesive layer, and the adhesive layer and the wafer so that the chip can be easily peeled from the adhesive layer.

1A to 1E are cross-sectional schematic diagrams illustrating a dicing die-bonding film and a wafer chip pick-up process using the same according to an embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

100: base film 120: adhesive layer

130: adhesive layer 140: release film

150 wafer 200 support member

Claims (10)

Base film; And A photocurable adhesive layer formed on the base film, wherein the photocurable adhesive layer generates nitrogen gas during photocuring, thereby increasing a pickup success rate of the wafer laminated on the photocurable adhesive layer. As a dicing film containing, The photocurable pressure-sensitive adhesive composition comprises an acrylic pressure-sensitive adhesive binder containing a vinyl group, an esterified quinonediazide compound, a thermosetting agent and a photopolymerization initiator, The esterified quinonediazide compound includes a compound represented by any one selected from the following [Formula 1] to [Formula 3], [Formula 1]

[Formula 2]

(3)

(The Z ₁ and Z ₂ are each independently hydrogen or a C1 to C6 alkyl group, M is an integer of 0 to 3, Q is hydrogen,

or

Wherein the proportion of hydrogen is 0 to 90%.) The esterified quinone diazide compound is a dicing film, characterized in that contained in 1 to 30 parts by weight based on 100 parts by weight of the acrylic adhesive binder solids containing the vinyl group. delete The method of claim 1, The photocurable pressure-sensitive adhesive layer is a dicing film, characterized in that formed in a thickness of 3 to 40㎛. delete delete delete The dicing film of claim 1, wherein the photocurable adhesive composition comprises 0.5 to 5 parts by weight of a thermosetting agent and 0.1 to 3 parts by weight of a photopolymerization initiator based on 100 parts by weight of the acrylic adhesive binder solid content including the vinyl group. . delete The dicing film of claim 1, wherein the esterified quinonediazide compound is included in an amount of 5 to 20 parts by weight. The dicing film of any one of claims 1, 3, 7, or 9; And Dicing die bonding film comprising an adhesive layer formed on the dicing film.

Images