KR101138796B1 - Acrylate-adhesive resin composition comprising and photocurable adhesive composition comprising the same - Google Patents

Abstract

The present invention relates to an acrylic pressure-sensitive adhesive composition and a photocurable pressure-sensitive adhesive composition comprising the same, and more particularly, a photocurable acrylic pressure-sensitive adhesive resin having a dimethylsiloxane resin in a main chain thereof is used in the photocurable pressure-sensitive adhesive composition, and then dimethyl after photocuring. The present invention relates to an acrylic pressure-sensitive adhesive composition and a photocurable pressure-sensitive adhesive composition comprising the same.

Adhesive resin, photocurable adhesive composition, dimethylsiloxane resin, pickup performance

Description

Acrylic adhesive resin composition and photocurable adhesive composition comprising the same {Acrylate-adhesive resin composition comprising and photocurable adhesive composition comprising the same}

The present invention relates to an acrylic adhesive resin composition and a photocurable adhesive composition including the same, and more particularly, to an acrylic adhesive resin composition having a dimethylsiloxane resin in a main chain and a photocurable adhesive composition including the same.

In a semiconductor manufacturing process, a circuit-designed wafer undergoes the following packaging process.

First, after backgrinding a wafer having a thickness of 700 μm or more, and then laminating a dicing tape or a dicing die-bonding tape, the chips are separated into small chips through dicing in a size having a large diameter, and the separated chips are each PCB It is subjected to a step-by-step process bonded to the substrate, such as a substrate or lead frame substrate through an adhesive process. That is, thinning the wafer (backgrinding step), mounting a dicing tape or dicing die-bonding tape on the back surface of the wafer (mounting step), cutting the mounted wafer to a certain size (dicing step), dicing The wafer is irradiated with ultraviolet rays (ultraviolet irradiation process), a step of picking up each individual chip (pick-up step), and a step of adhering the lifted chip to a support member (die bonding step). At this time, the dicing tape is attached to the back surface of the wafer during the mounting process to prevent the vibration of the wafer with strong adhesive force of the adhesive of the dicing tape during the dicing process, and to strongly support the crack. It prevents it from happening. In the die bonding process, the dicing film may be expanded to be easily picked up.

There are two types of dicing tapes such as pressure-sensitive adhesive type and ultraviolet irradiation type. However, ultraviolet irradiation dicing tapes are generally used for thinning wafers and picking up chips of various sizes.

When the dicing is completed, the ultraviolet-ray dicing tape is irradiated with ultraviolet rays from the rear surface to cure the adhesive layer, thereby reducing the interface peeling force with the wafer, thereby facilitating the pickup process of the individualized chip wafer. In order to package the electrical signal to the individualized chip after dicing, a process of adhering the chip to a substrate surface such as a PCB substrate or a lead frame substrate is required.In this case, a liquid epoxy resin is introduced onto the substrate and then the individualized chip is used. The chip is adhered to the substrate by adhering onto the introduced epoxy. As such, the two-stage continuous process of dicing using dicing tape and die bonding using liquid epoxy has a two-step process, which is problematic in terms of cost and yield. Many studies have been conducted to shorten.

In recent years, the use of dicing die-bonding film is increasing, which places the film-like epoxy on the upper surface of the film serving as the dicing tape and picks up between the adhesive of the dicing tape and the film-like epoxy. By reducing the conventional two step process in one step, it is more advantageous in terms of time and yield.

As the multi-layer structure and high integration of semiconductor processes are achieved, the wafers used are becoming thinner and thinner. Recently, wafers of 80 μm or less are used. When picking up such thin wafer chips, the warpage of the wafer may occur or the chip may be damaged by a small external impact. It is necessary to proceed with lower equipment adjustment parameters than with conventional thick film wafer pickup. Equipment adjustment parameters for pick-up of the pick-up / die-bonding equipment include expansion amount, pin number, pin lift height, pin lift speed, decompression pressure, collet type, and the like. Dual pin lift height and pin lift speed are key parameters for adjusting the pickup, and the thinner chip thickness reduces the adjustment of these two parameters significantly. Increasing the pin lift height to facilitate pickup will result in poor reliability, even after packaging, because thinner chips are easily cracked or damaged. Therefore, the dicing tape to be used for picking up the thin film wafer of 80 μm or less should significantly lower the peeling force on the wafer after UV curing than the dicing tape used for conventional thick film wafer pick-up.

There are two methods for producing the photocurable composition of the pressure-sensitive adhesive layer contained in the dicing tape or the dicing die-bonding tape. One method is to physically mix low molecules, oligomers, or acrylates with the polymer adhesive composition as a main ingredient, and the other is to introduce acrylate into the side chain of the adhesive polymer in an addition reaction to make one compound behave. As such, a photocurable composition (hereinafter referred to as an intrinsic adhesive binder or acrylic acrylate) in which a UV curable material, which is not a mixed form of the adhesive composition and the UV curable low molecular acrylate, is introduced into the side chain of the adhesive composition by chemical reaction It is preferable at the point of tack and peeling force reduction after irradiation. That is, the conventional mixed adhesive compositions are physically mixed with the low molecular type ultraviolet curable materials to the polymeric adhesive composition, so the pick-up performance is poor on the thin film wafer of 80 μm or less due to the basic tack of the adhesive composition even after UV irradiation, and the low molecular weight material. The transition was also concerned.

In order to improve the shortcomings of the existing mixed composition, a study to obtain more stable physical properties has been continuously conducted, and a method of integrating the adhesive binder portion and the photocuring portion has been developed. For example, after a binder composed of n-butyl acrylate, 2-ethylhexyl acrylate, methyl methacrylate and methacrylic acid was synthesized, 2-hydroxy ethyl methacrylate synthesized from methacrylic acid and ethylene glycol was added. A composition is disclosed. However, in the case of the composition, it is troublesome to react and synthesize methacrylic acid and 2-hydroxyethyl methacrylate by ester reaction, and 2-hydroxyethyl methacryl because of a condensation polymerization reaction by reacting at a high temperature. There was a problem that the rate double bond is likely to break during the addition condensation reaction. In addition, the moisture generated in the condensation polymerization has to be removed, which is very difficult in terms of processability, and has a very low productivity problem.

In order to solve the problems of the prior art as described above, an object of the present invention is to provide an acrylic adhesive resin composition having a dimethylsiloxane resin in the main chain and a photocurable adhesive composition comprising the same.

In addition, an object of the present invention is to provide an acrylic pressure-sensitive adhesive resin composition and a photocurable pressure-sensitive adhesive composition comprising the same after releasing the release property of the dimethylsiloxane resin after photocuring.

It is another object of the present invention to provide an adhesive tape having excellent pickup performance.

In order to achieve the above object, the present invention comprises 0.01 to 0.045 parts by weight of the dimethylsiloxane resin based on 100 parts by weight of the acrylic binder resin containing ethylhexyl acrylate, the dimethylsiloxane resin is introduced into the main chain of the acrylic binder resin It provides an acrylic pressure-sensitive adhesive composition characterized in that.

In another aspect, the present invention provides a photocurable pressure-sensitive adhesive composition comprising the acrylic pressure-sensitive adhesive composition.

Preferably, the photocurable pressure-sensitive adhesive composition includes the acrylic pressure-sensitive adhesive resin composition, an initiator and a photocuring agent.

In another aspect, the present invention provides a pressure-sensitive adhesive tape comprising the photocurable pressure-sensitive adhesive composition.

In the acrylic adhesive resin composition of the present invention, a dimethylsiloxane resin is introduced into the main chain of the acrylic adhesive resin, and after the photocuring, the release property of the dimethylsiloxane resin is exerted to have a better pick-up performance. It can be usefully applied to the adhesive tape for die bonding.

Hereinafter, the present invention will be described in detail.

The acrylic pressure-sensitive adhesive composition of the present invention is a pressure-sensitive adhesive resin composition containing a vinyl group, containing 0.01 to 0.045 parts by weight of a dimethylsiloxane resin based on 100 parts by weight of an acrylic binder resin containing ethylhexyl acrylate, wherein the dimethylsiloxane resin is It is characterized by introducing into the main chain of acrylic binder resin.

The acrylic binder resin is 50 to 80 parts by weight of 2-ethylhexyl acrylate, up to 20 parts by weight of isooctyl acrylate, up to 20 parts by weight of 2-hydroxymethyl methacrylate, and up to 20 parts by weight of 2-hydroxyethyl acrylate. And up to 10 parts by weight of glycidyl methacrylate monomer.

In the acrylic adhesive resin composition, nitrogen nitrogen double bonds of dimethylsiloxane resin are thermally decomposed during the synthesis of the acrylic adhesive resin to radically react with the carbon-carbon double bond portion of the remaining monomers to introduce dimethylsiloxane resin into the main chain of the acrylic adhesive resin. Can be .

Azopolydimethylsiloxane, polydimethyl peroxide, etc. can be used as said dimethylsiloxane resin.

In the present invention, azopolydimethylsiloxane (VPS-1001) represented by the following Formula 1 was used in the dimethylsiloxane resin.

The dimethylsiloxane resin is 100 parts by weight of the acrylic binder resin consisting of 2-ethylhexyl acrylate, isooctyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxy methacrylate and glycidyl methacrylate monomer It is preferably included in 0.01 to 0.04 parts by weight. If the content is less than 0.01 parts by weight, the releasability of the resin may be lowered. If the content exceeds 0.045 parts by weight, it is difficult to control the basic polymer properties such as viscosity, molecular weight, PDI value of the adhesive binder.

As described above, the acrylic adhesive resin in which the dimethylsiloxane resin is introduced into the main chain exhibits excellent releasing property, which is a characteristic of the dimethylsiloxane resin after photocuring, and thus has excellent peeling ability even at a weight average molecular weight of 150,000 to 1,000,000. It becomes possible. Preferably, the weight average molecular weight of the acrylic adhesive resin is 150,000 to 700,000. When the weight average molecular weight is less than 150,000, a problem occurs in the ability to form a coating film during coating, and even when the adhesive force is lost after the photocuring, the peeling force with the material may not be constant. In addition, when the weight average molecular weight exceeds 1,000,000, it may cause stability over time and uniformity of the polymer resin.

The present invention also provides a photocurable pressure-sensitive adhesive composition comprising the acrylic pressure-sensitive adhesive composition as described above.

Specifically, the photocurable pressure-sensitive adhesive composition may include a curing agent and a photoinitiator in addition to the acrylic pressure-sensitive adhesive composition.

It is preferable that the said acrylic adhesive resin composition used for the photocurable adhesive composition of this invention is contained by 90-97 weight part with respect to 100 weight part of solid content in a photocurable adhesive composition. If the content is less than 90 parts by weight, the coating property may be lowered, and if the content exceeds 97 parts by weight, sufficient curing ability to photocurability may not be obtained.

The curing agent used in the photocurable pressure-sensitive adhesive composition of the present invention may use a polyisocyanate-based, and when the curing agent is not used, adhesion to the polyolefin film, which is a base film, may be weakened.

Examples of the curing agent include 2,4-triylene diisocyanate, 2,6-triene diisocyanate, hydrogenated triylene diisocyanate, 1,3-xylene diisocyanate, 1,4-xylene diisocyanate, diphenyl methane-4, 4-diisocyanate, 1,3-bisisocyanatomethyl cyclohexane, tetra methyl xylene diisocyanate, 1,5-naphthalene diisocyanate, 2,2,4-trimethyl hexamethylene diisocyanate, 2,4,4-trimethyl hexa Methylene diisocyanate, triylene diisocyanate adduct of trimetholpropane, xylene diisocyanate adduct of trimetholpropane, toriphenylmethane toisocyanate, methylene bis triisocyanate, etc. may be used, but is not limited thereto. .

The curing agent is preferably included in 3 to 10 parts by weight based on 100 parts by weight of the solid content of the photocurable pressure-sensitive adhesive composition. If the content is less than 3 parts by weight, the adhesion between the polyolefin film as a base film is weak in physical properties before and after photocuring, so that the adhesion after the photocuring between the film and the adhesive coating layer is lowered and transferred to the adhesive film surface for wafer or die bonding. If there is a problem that exceeds 10 parts by weight, the peeling force with the die-bonding adhesive film is relatively heavy due to the unreacted isocyanate, so that pick-up property may be deteriorated.

The photoinitiator used in the photocurable pressure-sensitive adhesive composition of the present invention is activated by ultraviolet rays or electron beams to activate a carbon-carbon double bond of the pressure-sensitive adhesive layer to generate a radical reaction.

The photoinitiator may be an alpha-amino ketone type compound, a benzyldimethyl-ketal type compound, an alpha-hydroxy ketone type compound, or the like.

The photoinitiator is preferably included in 0.1 to 2 parts by weight based on 100 parts by weight of solids in the photocurable pressure-sensitive adhesive composition. If the content is less than 0.1 part by weight, the loss of adhesive strength after photocuring may be poor, and the pick-up may be worse. When the content is more than 2 parts by weight, the loss of adhesive force no longer occurs. After increasing the adhesive force, the pick-up property may be worse after photocuring.

In another aspect, the present invention provides a pressure-sensitive adhesive tape comprising a photocurable pressure-sensitive adhesive composition comprising the above components.

The adhesive tape of the present invention uses a photocurable pressure-sensitive adhesive composition containing an acrylic pressure-sensitive adhesive resin in which a dimethylsiloxane resin is introduced into the main chain, thereby demonstrating the release property of the dimethylsiloxane resin after photocuring, thereby having better pickup performance. Therefore, it can be usefully applied to the adhesive tape for dicing or dicing die bonding.

Hereinafter, the present invention will be described in more detail with reference to examples. These embodiments are for purposes of illustration only and are not intended to limit the scope of protection of the present invention.

Preparation Example 1 Preparation of Acrylic Adhesive Polyol Binder Resin

Into a 2 L four-necked flask, 500 g of an organic solvent, ethyl acetate, was added first, a reflux cooler was installed on one side, a thermometer was installed on the other side, and a dropping panel was installed on the other side. After raising the flask solution temperature to reflux (77 ~ 78 ℃), 390 parts by weight of 2-ethylhexyl acrylate, 60 parts by weight of isooctylacrylate, 60 parts by weight of 2-hydroxyethyl methacrylate, 2-hydroxy 60 parts by weight of methacrylate and 30 parts by weight of glycidyl methacrylate monomer were mixed with 600 g of binder resin and 0.10 g of azopolydimethylsiloxane to prepare a mixed solution, and then the mixture was 77-88 ° C. using a dropping panel. Was added dropwise for 3 hours. After the dropping, the stirring speed was 200 rpm. After completion of the dropping, the reactants were aged at 80 to 88 ° C. for 4 hours, and 150 g of ethyl acetate and 0.15 g of azobisisobutylonitrile were added for 20 minutes. After maintaining for 4 hours, ethyl acetate 130g, toluene 120g was added to measure the viscosity and solids, and the reaction was stopped to prepare an acrylic adhesive polyol binder resin which is an acrylic copolymer. At this time, the viscosity after the polymerization is 3000 ~ 4000cps / 25 ℃, the content of the solid content was corrected to 40%.

Preparation Example 2 Preparation of Acrylic Adhesive Polyol Binder Resin

The acrylic adhesive polyol binder resin having a viscosity of 1500-2500 cps / 25 ° C. after polymerization was carried out in the same manner as in Preparation Example 1, except that 0.25 g of azopolydimethylsiloxane was used in Preparation Example 1 as shown in Table 1 below. Prepared.

Comparative Production Example 1. Preparation of acrylic adhesive polyol binder resin

The acrylic adhesive polyol binder resin having a viscosity of 5000 to 6000 cps / 25 ° C. after polymerization was carried out in the same manner as in Preparation Example 1, except that 0.05 g of azopolydimethylsiloxane was used in Preparation Example 1 as shown in Table 1 below. Prepared.

Comparative Production Example 2 Preparation of Acrylic Adhesive Polyol Binder Resin

Except for using azopolydimethylsiloxane as 0.30g in Preparation Example 1 in the same manner as in Preparation Example 1 except that the acrylic adhesive polyol binder resin having a viscosity of 500 ~ 1500cps / 25 ℃ after polymerization Prepared.

Comparative Production Example 3 Preparation of Acrylic Adhesive Polyol Binder Resin

Except that 0.10 g of azobisisobutylonitrile was used in place of 0.10 g of azopolydimethylsiloxane in Preparation Example 1, except that 0.10 g of azobisisobutylonitrile was used in the same manner as Preparation Example 1 to obtain a viscosity of 4000 to 5000 cps. An acrylic adhesive polyol binder resin was prepared at / 25 ° C.

Comparative Production Example 4. Preparation of acrylic adhesive polyol binder resin

Except for using azobisisobutylonitrile 0.25g in place of 0.10g of azopolydimethylsiloxane as shown in Table 1 in the Preparation Example 1 was carried out in the same manner as in Preparation Example 1 after the polymerization viscosity of 1000 ~ 2000cps An acrylic adhesive polyol binder resin was prepared at / 25 ° C.

The unit of Table 1 below is g.

Example  1. Preparation of acrylic adhesive resin composition

In a 2-liter four-necked flask, 40 parts by weight of 2-isocyanato ethyl methacrylate and 30 ppm of dibutyl tin dilaurate were respectively added to 500 parts by weight of the acrylic adhesive polyol binder resin prepared in Preparation Example 1, at 300 rpm. The reaction was carried out at 50-55 ° C. for 8 hours with stirring. After completion of the reaction, the isocyanate group of the 2-isocyanate ethyl methacrylate monomer reacted with the hydroxyl group of the binder to terminate the reaction as an end point, and then the reaction was terminated with ethyl acetate, followed by cooling to obtain a solid content 45% photocurable acrylic adhesive binder. Prepared.

Example 2 and Comparative Examples 1-4. Acrylic Adhesive Resin Composition

Example 1 was carried out in the same manner as in Example 1, except that it was used in the components and compositions shown in Table 2.

Example  3. Preparation of Photocurable Adhesive Composition

70 g of an acrylic adhesive resin containing dimethylsiloxane prepared in Example 1, methyl ethyl ketone 47.6 g as a solvent, 2.2 g of isocyanate curing agent (AK-75, Aekyung Chemical) as a curing agent, and 2-hydroxy-2- as a photoinitiator 0.4 g of methyl propiophenone (2-hydroxy-2-methylpropiophenone, Darocur 1173, Ciba-chemical) was mixed and stirred for 1 hour or more to prepare a photocurable adhesive composition having a solid content of 25%.

Example 4. Preparation of Photocurable Adhesive Composition

Except for using the acrylic pressure-sensitive adhesive resin containing dimethylsiloxane prepared in Example 2 as the acrylic pressure-sensitive adhesive in Example 3 was carried out in the same manner as in Example 3.

Comparative Example 5. Preparation of Photocurable Adhesive Composition

Except for using the acrylic pressure-sensitive adhesive resin containing dimethylsiloxane prepared in Comparative Example 1 as the acrylic pressure-sensitive adhesive in Example 3 was carried out in the same manner as in Example 3.

Comparative Example 6. Preparation of Photocurable Adhesive Composition

Except for using the acrylic pressure-sensitive adhesive resin containing dimethylsiloxane prepared in Comparative Example 2 as the acrylic pressure-sensitive adhesive in Example 3 was carried out in the same manner as in Example 3.

Comparative Example 7. Preparation of Photocurable Adhesive Composition

Except for using the acrylic adhesive resin prepared in Comparative Example 3 as the acrylic adhesive resin in Example 3 was carried out in the same manner as in Example 3.

Comparative Example 8. Photocurable pressure-sensitive adhesive composition

Except for using the acrylic pressure-sensitive adhesive resin prepared in Comparative Example 4 as the acrylic pressure-sensitive adhesive in Example 3 was carried out in the same manner as in Example 3.

The photocurable pressure-sensitive adhesive compositions prepared in Examples 3 to 4 and Comparative Examples 5 to 8 were coated and dried on a polyethylene terephthalate film, coated to a thickness of 8 to 12 μm, and then transferred to a polyolefin film and 25 to 60 ° C. The adhesive film was prepared by aging for 1 to 15 days. The physical properties of the prepared pressure-sensitive adhesive film was measured in the following manner, and the results are shown in Table 3 below.

1. Peeling force: The test was conducted in accordance with Clause 8 of Korean Industrial Standard KS-A-01107 (Testing Method of Adhesive Tape and Adhesive Sheet). After attaching the adhesive film prepared by using the photocurable pressure-sensitive adhesive composition prepared in Examples 3 to 4 and Comparative Examples 5 to 8 of 25 mm and a length of 250 mm to the adhesive film for die bonding, respectively, the adhesive film surface for die bonding After attaching the adhesive tape to the sheet, the sheet was reciprocated once at a speed of 300 mm / min using a 2 kg load roller to be pressed. After 30 minutes after crimping, the folded part of the test piece was turned over to 180 ° and peeled off about 25 mm. Then, the test piece was fixed to the upper clip of the tensile strength tester and the die-bonding adhesive film was fixed to the lower test clip of the test plate. The load when peeling off at the speed was measured. The tensile tester used an Instron Series lX / s Automated materials Tester-3343, and after laminating with an organic adhesive film or a wafer and a photocurable adhesive film, and measured before and after irradiating a high-pressure mercury lamp at 100 ~ 300mJ / ㎠.

2. Tackiness: Tackiness with a probe tack tester (tacktoc-2000) using an adhesive film prepared by using the photocurable pressure-sensitive adhesive composition prepared in Examples 3 to 4 and Comparative Examples 5 to 8 (tackiness) was measured. According to ASTM D2979-71, the end of the clean probe was contacted with the adhesive for 1.0 + 0.01 seconds at a speed of 10 + 0.1 mm / sec and a contact load of 9.79 + 1.01 kPa, and then the maximum force required for release was measured. tackiness) value.

3. Surface energy: The adhesive film prepared using the photocurable adhesive composition prepared in Examples 3 to 4 and Comparative Examples 5 to 8 using a surface tension meter (CAM 200-Optical Surface Tension / Contact angle meter) Surface energy was measured. The measuring method was measured by the Sessile Drop Method, which is a method of measuring the contact angle of water droplets generated by dropping distilled water on the film surface. The greater the contact angle, the lower the surface energy, and the lower the surface energy, the better the peeling force after photocuring. In addition, before photocuring, the smaller the contact angle, the higher the surface energy, and the higher the surface energy, the better the adhesion with the wafer or die-bonding adhesive film.

4. Light curing degree by light amount: Light curing degree after photocuring at light quantity 100, 200, 300mJ / cm 2 using the adhesive film prepared using the photocurable adhesive composition prepared in Examples 3-4 and Comparative Examples 5-8 Was measured.

 5. Pick-up success rate: The chip pick-up process refers to a process of mounting a chipped wafer on a PCB or stacked chip after the wafer dicing process, and after the dicing die-bonding film is photocured, The lower the peel force of the better the success rate.

As shown in Table 3, in the case of the adhesive tapes of Examples 3 and 4 using the photocurable adhesive resin comprising an acrylic adhesive resin composition containing a dimethylsiloxane resin in the main chain according to the present invention Comparative Examples 5 to 8 and In comparison, the adhesion to the ring frame and the wafer is almost equal, but since the release force characteristics of the dimethylsiloxane in the polymer backbone are exhibited after photocuring, the peeling success is excellent and the pick-up success rate is increased. However, when the content of polydimethylsiloxane is too high (Comparative Example 5), the molecular weight of the adhesive binder becomes smaller and the PDI value becomes larger, resulting in weaker adhesion to the ring frame and wafer, and relatively high peeling force after photocuring. On the contrary, when the content of polydimethylsiloxane was too small (Comparative Example 6), the adhesion was excellent, but the properties after photocuring were poor, and thus it was confirmed that the pickup was disadvantageous. In addition, when polydimethylsiloxane and the same amount of azobisisobutylonitrile were used (Comparative Examples 7, 8), it was confirmed that they appeared disadvantageous in various aspects such as peeling force, adhesive force, and pickup after photocuring.

In addition, when comparing the peeling force according to the amount of light, Examples 3 and 4 were found to be 0.04 N / 25 mm or less in the 300 mm / min section, but Comparative Examples 5 to 8 showed high values of 0.056 N / 25 mm or more in all the sections. I could confirm it. In addition, there is no constant proportional value between the pickup success rate and the photocurability, but at least 80% of the photocuring efficiency is considered to be advantageous in the pickup success rate. In Examples 3 and 4 in the region of 100 ~ 300mJ / ㎠, the photocuring efficiency was found to be 80% or more, and thus has excellent curability even under photocuring conditions in which the amount of energy during UV curing is not constant. And it was found.

Through the above results, since the photocurable adhesive composition containing the acrylic adhesive resin composition containing the dimethylsiloxane resin in the main chain of the present invention also has excellent photocurability, a dicing adhesive tape having excellent peelability can be obtained. Could be predicted.

Although the present invention has been described as the preferred embodiment mentioned above, it is possible to make various modifications or variations without departing from the spirit and scope of the invention. The appended claims also cover such modifications and variations as fall within the spirit of the invention.

Claims (11)

An acrylic copolymer comprising 0.01 to 0.045 parts by weight of dimethylsiloxane based on 100 parts by weight of an acrylic monomer containing ethylhexyl acrylate, wherein the dimethylsiloxane is introduced into the main chain of the acrylic copolymer. . The method of claim 1, The acrylic copolymer is 50 to 80 parts by weight of 2-ethylhexyl acrylate, more than 0 to 20 parts by weight of isooctyl acrylate, more than 0 to 20 parts by weight of 2-hydroxymethyl methacrylate, 2-hydroxyethyl acrylate An acrylic copolymer comprising greater than 0 to 20 parts by weight and glycidyl methacrylate monomer greater than 0 to 10 parts by weight. The method of claim 1, The dimethylsiloxane is an acrylic copolymer, characterized in that selected from azopolydimethylsiloxane, polydimethyl peroxide and mixtures thereof. The method of claim 1, Acrylic copolymer, characterized in that the weight average molecular weight of the acrylic copolymer is 150,000 to 1,000,000. The photocurable pressure-sensitive adhesive composition comprising the acrylic copolymer of claim 1. The method of claim 5, The photocurable pressure-sensitive adhesive composition is a photocurable pressure-sensitive adhesive composition comprising an acrylic copolymer, a curing agent and a photoinitiator. The method of claim 6, The adhesive composition is based on 100 parts by weight of solids in the composition, a) 90 to 97 parts by weight of the acrylic copolymer; b) 3 to 10 parts by weight of the curing agent; And c) 0.1 to 2 parts by weight of photoinitiator; Photocurable pressure-sensitive adhesive composition comprising a. The method of claim 6, The hardener is 2,4-trilene diisocyanate, 2,6-triene diisocyanate, hydrogenated triylene diisocyanate, 1,3-xylene diisocyanate, 1,4-xylene diisocyanate, diphenyl methane-4,4 -Diisocyanate, 1,3-bisisocyanatomethyl cyclohexane, tetramethyl xylene diisocyanate, 1,5-naphthalene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, 2,4,4-trimethylhexamethylene Photocurable adhesive, characterized in that at least one selected from diisocyanate, triylene diisocyanate adduct of trimetholpropane, xylene diisocyanate adduct of trimethyrolpropane, toriphenylmethane toisocyanato and methylene bis triisocyanate Composition. The method of claim 6, The photoinitiator is a photo-curable pressure-sensitive adhesive composition, characterized in that any one or more selected from alpha-amino ketone type compound, benzyldimethyl- ketal type compound and alpha-hydroxy ketone type compound. A pressure-sensitive adhesive tape comprising the photocurable pressure-sensitive adhesive composition of claim 5. The method of claim 10, Adhesive tape, characterized in that the adhesive tape is for dicing or dicing die bonding.