JP3752231B2 - フロントエンドモジュール - Google Patents

フロントエンドモジュール Download PDF

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Publication number
JP3752231B2
JP3752231B2 JP2003037473A JP2003037473A JP3752231B2 JP 3752231 B2 JP3752231 B2 JP 3752231B2 JP 2003037473 A JP2003037473 A JP 2003037473A JP 2003037473 A JP2003037473 A JP 2003037473A JP 3752231 B2 JP3752231 B2 JP 3752231B2
Authority
JP
Japan
Prior art keywords
terminal
signal
frequency
integration
end module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003037473A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004032673A (ja
JP2004032673A5 (enExample
Inventor
信也 中井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP2003037473A priority Critical patent/JP3752231B2/ja
Publication of JP2004032673A publication Critical patent/JP2004032673A/ja
Priority to US10/774,607 priority patent/US7373171B2/en
Publication of JP2004032673A5 publication Critical patent/JP2004032673A5/ja
Application granted granted Critical
Publication of JP3752231B2 publication Critical patent/JP3752231B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16235—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a via metallisation of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15313—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a land array, e.g. LGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16251—Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate

Landscapes

  • Transceivers (AREA)
JP2003037473A 2002-03-27 2003-02-14 フロントエンドモジュール Expired - Fee Related JP3752231B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2003037473A JP3752231B2 (ja) 2002-03-27 2003-02-14 フロントエンドモジュール
US10/774,607 US7373171B2 (en) 2003-02-14 2004-02-10 Front end module

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002089726 2002-03-27
JP2002130372 2002-05-02
JP2003037473A JP3752231B2 (ja) 2002-03-27 2003-02-14 フロントエンドモジュール

Publications (3)

Publication Number Publication Date
JP2004032673A JP2004032673A (ja) 2004-01-29
JP2004032673A5 JP2004032673A5 (enExample) 2005-08-11
JP3752231B2 true JP3752231B2 (ja) 2006-03-08

Family

ID=31191846

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003037473A Expired - Fee Related JP3752231B2 (ja) 2002-03-27 2003-02-14 フロントエンドモジュール

Country Status (1)

Country Link
JP (1) JP3752231B2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006186596A (ja) 2004-12-27 2006-07-13 Hitachi Media Electoronics Co Ltd アンテナ共用装置およびそれを用いた無線通信端末
WO2007034231A1 (en) * 2005-09-26 2007-03-29 Glonav Limited Multistage resonant amplifier system and method
US20070161358A1 (en) * 2006-01-12 2007-07-12 Sony Ericsson Mobile Communications Ab Multiband radio module
DE102007019082B4 (de) 2007-04-23 2018-04-05 Snaptrack Inc. Frontendmodul
DE112010001932B4 (de) * 2009-06-19 2018-08-02 Murata Manufacturing Co., Ltd. Hochfrequenzmodul
JP5620812B2 (ja) * 2010-12-27 2014-11-05 ルネサスエレクトロニクス株式会社 高周波モジュールおよび無線通信システム
EP2693648A1 (en) * 2012-08-03 2014-02-05 BlackBerry Limited Mobile wireless communications device with rf lte switches and related methods
JP2016208484A (ja) * 2015-04-27 2016-12-08 太陽誘電株式会社 フロントエンド回路、モジュールおよび通信装置
WO2016194923A1 (ja) * 2015-06-03 2016-12-08 株式会社村田製作所 高周波フロントエンド回路
CN114008928B (zh) * 2019-07-03 2024-03-12 株式会社村田制作所 高频模块以及通信装置
JPWO2023248823A1 (enExample) * 2022-06-21 2023-12-28

Also Published As

Publication number Publication date
JP2004032673A (ja) 2004-01-29

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