JP3738603B2 - Ａｃｆ貼着装置 - Google Patents

Ａｃｆ貼着装置 Download PDF

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Publication number
JP3738603B2
JP3738603B2 JP15138099A JP15138099A JP3738603B2 JP 3738603 B2 JP3738603 B2 JP 3738603B2 JP 15138099 A JP15138099 A JP 15138099A JP 15138099 A JP15138099 A JP 15138099A JP 3738603 B2 JP3738603 B2 JP 3738603B2
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JP
Japan
Prior art keywords
acf
tape
roller
peeling
mount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP15138099A
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English (en)
Japanese (ja)
Other versions
JP2000340616A (ja
JP2000340616A5 (OSRAM
Inventor
秀明 片保
弘司 平迫
則之 岩崎
Original Assignee
日立ハイテク電子エンジニアリング株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立ハイテク電子エンジニアリング株式会社 filed Critical 日立ハイテク電子エンジニアリング株式会社
Priority to JP15138099A priority Critical patent/JP3738603B2/ja
Publication of JP2000340616A publication Critical patent/JP2000340616A/ja
Publication of JP2000340616A5 publication Critical patent/JP2000340616A5/ja
Application granted granted Critical
Publication of JP3738603B2 publication Critical patent/JP3738603B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29499—Shape or distribution of the fillers

Landscapes

  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP15138099A 1999-05-31 1999-05-31 Ａｃｆ貼着装置 Expired - Fee Related JP3738603B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15138099A JP3738603B2 (ja) 1999-05-31 1999-05-31 Ａｃｆ貼着装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15138099A JP3738603B2 (ja) 1999-05-31 1999-05-31 Ａｃｆ貼着装置

Publications (3)

Publication Number Publication Date
JP2000340616A JP2000340616A (ja) 2000-12-08
JP2000340616A5 JP2000340616A5 (OSRAM) 2005-06-16
JP3738603B2 true JP3738603B2 (ja) 2006-01-25

Family

ID=15517316

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15138099A Expired - Fee Related JP3738603B2 (ja) 1999-05-31 1999-05-31 Ａｃｆ貼着装置

Country Status (1)

Country Link
JP (1) JP3738603B2 (OSRAM)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3852378B2 (ja) 2002-07-09 2006-11-29 株式会社日立ハイテクノロジーズ Ａｃｆ供給装置及びａｃｆ供給方法
JP4597061B2 (ja) * 2006-02-09 2010-12-15 株式会社ディスコ 保護テープの剥離方法
JP5838305B2 (ja) * 2012-05-31 2016-01-06 パナソニックＩｐマネジメント株式会社 Ａｃｆ貼着装置及びａｃｆ貼着方法
JP6778293B2 (ja) 2019-03-14 2020-10-28 株式会社スクウェア・エニックス リズムゲームプログラム及びゲームシステム

Also Published As

Publication number Publication date
JP2000340616A (ja) 2000-12-08

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