JP3729001B2 - 発光装置、砲弾型発光ダイオード、チップタイプｌｅｄ - Google Patents

発光装置、砲弾型発光ダイオード、チップタイプｌｅｄ Download PDF

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Publication number
JP3729001B2
JP3729001B2 JP32193099A JP32193099A JP3729001B2 JP 3729001 B2 JP3729001 B2 JP 3729001B2 JP 32193099 A JP32193099 A JP 32193099A JP 32193099 A JP32193099 A JP 32193099A JP 3729001 B2 JP3729001 B2 JP 3729001B2
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Japan
Prior art keywords
light
led chip
coating portion
coating
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP32193099A
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English (en)
Japanese (ja)
Other versions
JP2000216434A (ja
JP2000216434A5 (enrdf_load_stackoverflow
Inventor
邦浩 永峰
訓宏 泉野
勇一 藤原
勇人 竹内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP8350253A external-priority patent/JP3065263B2/ja
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP32193099A priority Critical patent/JP3729001B2/ja
Publication of JP2000216434A publication Critical patent/JP2000216434A/ja
Publication of JP2000216434A5 publication Critical patent/JP2000216434A5/ja
Application granted granted Critical
Publication of JP3729001B2 publication Critical patent/JP3729001B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP32193099A 1996-12-27 1999-11-12 発光装置、砲弾型発光ダイオード、チップタイプｌｅｄ Expired - Fee Related JP3729001B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32193099A JP3729001B2 (ja) 1996-12-27 1999-11-12 発光装置、砲弾型発光ダイオード、チップタイプｌｅｄ

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8350253A JP3065263B2 (ja) 1996-12-27 1996-12-27 発光装置及びそれを用いたｌｅｄ表示器
JP32193099A JP3729001B2 (ja) 1996-12-27 1999-11-12 発光装置、砲弾型発光ダイオード、チップタイプｌｅｄ

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP8350253A Division JP3065263B2 (ja) 1996-12-27 1996-12-27 発光装置及びそれを用いたｌｅｄ表示器

Publications (3)

Publication Number Publication Date
JP2000216434A JP2000216434A (ja) 2000-08-04
JP2000216434A5 JP2000216434A5 (enrdf_load_stackoverflow) 2005-01-06
JP3729001B2 true JP3729001B2 (ja) 2005-12-21

Family

ID=18138015

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32193099A Expired - Fee Related JP3729001B2 (ja) 1996-12-27 1999-11-12 発光装置、砲弾型発光ダイオード、チップタイプｌｅｄ

Country Status (1)

Country Link
JP (1) JP3729001B2 (enrdf_load_stackoverflow)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002280607A (ja) 2001-01-10 2002-09-27 Toyoda Gosei Co Ltd 発光装置
TW552726B (en) * 2001-07-26 2003-09-11 Matsushita Electric Works Ltd Light emitting device in use of LED
JP4193446B2 (ja) * 2001-08-22 2008-12-10 日亜化学工業株式会社 発光装置
JP2003163369A (ja) * 2001-11-27 2003-06-06 Toyota Central Res & Dev Lab Inc 半導体発光素子及び光伝送装置
JP3813509B2 (ja) * 2001-12-28 2006-08-23 株式会社東芝 レンズ一体型発光素子及び航空障害灯
US6841802B2 (en) 2002-06-26 2005-01-11 Oriol, Inc. Thin film light emitting diode
KR20040021951A (ko) * 2002-09-06 2004-03-11 럭스피아 주식회사 백색 발광다이오드
DE10245930A1 (de) 2002-09-30 2004-04-08 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Bauelement-Modul
JP2004288760A (ja) * 2003-03-20 2004-10-14 Stanley Electric Co Ltd 多層ｌｅｄ
JP4606000B2 (ja) * 2003-07-17 2011-01-05 三洋電機株式会社 発光ダイオード及びその製造方法
JP2005191420A (ja) * 2003-12-26 2005-07-14 Stanley Electric Co Ltd 波長変換層を有する半導体発光装置およびその製造方法
TWI286393B (en) * 2004-03-24 2007-09-01 Toshiba Lighting & Technology Lighting apparatus
JP2006049814A (ja) * 2004-06-28 2006-02-16 Kyocera Corp 発光装置および照明装置
JP2006114854A (ja) 2004-10-18 2006-04-27 Sharp Corp 半導体発光装置、液晶表示装置用のバックライト装置
JP5703180B2 (ja) * 2011-09-20 2015-04-15 株式会社沖データ レンズ光学素子及び表示装置
JP5706299B2 (ja) * 2011-11-28 2015-04-22 株式会社東芝 発光装置の製造方法
WO2014103021A1 (ja) * 2012-12-28 2014-07-03 パイオニア株式会社 発光装置
JP2015060995A (ja) 2013-09-19 2015-03-30 株式会社東芝 発光装置
KR101785493B1 (ko) * 2016-04-27 2017-11-15 루미마이크로 주식회사 광손실 방지형 발광소자 패키지

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Publication number Publication date
JP2000216434A (ja) 2000-08-04

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