JP3726035B2 - セラミック積層体の製法 - Google Patents
セラミック積層体の製法 Download PDFInfo
- Publication number
- JP3726035B2 JP3726035B2 JP2001157699A JP2001157699A JP3726035B2 JP 3726035 B2 JP3726035 B2 JP 3726035B2 JP 2001157699 A JP2001157699 A JP 2001157699A JP 2001157699 A JP2001157699 A JP 2001157699A JP 3726035 B2 JP3726035 B2 JP 3726035B2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- pattern
- conductor pattern
- conductor
- green sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001157699A JP3726035B2 (ja) | 2001-05-25 | 2001-05-25 | セラミック積層体の製法 |
GB0419635A GB2402103B (en) | 2001-05-25 | 2002-05-24 | Method of producing ceramic laminates, laminated electronic parts and method of producing the same. |
GB0419632A GB2402102B (en) | 2001-05-25 | 2002-05-24 | Laminated electronic parts and method of producing the same |
GB0212030A GB2376207B (en) | 2001-05-25 | 2002-05-24 | Method of producing ceramic laminates,laminated electronic parts and method of producing the same |
US10/155,702 US7089659B2 (en) | 2001-05-25 | 2002-05-24 | Method of producing ceramic laminates |
CNB021303932A CN1308978C (zh) | 2001-05-25 | 2002-05-25 | 制造陶瓷叠层制品的方法,叠层电子元件及其制造方法 |
CNB200610005980XA CN100378879C (zh) | 2001-05-25 | 2002-05-25 | 制造陶瓷叠层制品的方法、叠层电子元件及其制造方法 |
CN2006100069267A CN1949420B (zh) | 2001-05-25 | 2002-05-25 | 叠层电子元件及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001157699A JP3726035B2 (ja) | 2001-05-25 | 2001-05-25 | セラミック積層体の製法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2002353625A JP2002353625A (ja) | 2002-12-06 |
JP3726035B2 true JP3726035B2 (ja) | 2005-12-14 |
Family
ID=19001524
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001157699A Expired - Fee Related JP3726035B2 (ja) | 2001-05-25 | 2001-05-25 | セラミック積層体の製法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP3726035B2 (zh) |
CN (1) | CN100378879C (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117677061A (zh) * | 2024-01-29 | 2024-03-08 | 深圳特新界面科技有限公司 | 一种环保水性导电浆料印刷电子标签的制备方法及系统 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4420182B2 (ja) * | 2003-07-29 | 2010-02-24 | Tdk株式会社 | セラミック電子部品の製造方法 |
JP5006510B2 (ja) * | 2004-09-30 | 2012-08-22 | 株式会社村田製作所 | 積層セラミック電子部品の製造方法 |
KR100896601B1 (ko) | 2007-11-05 | 2009-05-08 | 삼성전기주식회사 | 무수축 세라믹 기판의 제조방법 및 이를 이용한 무수축세라믹 기판 |
JP4760857B2 (ja) * | 2008-05-29 | 2011-08-31 | Tdk株式会社 | 積層型電子部品の製造方法 |
JP5300527B2 (ja) * | 2009-02-26 | 2013-09-25 | 京セラ株式会社 | 多層基板およびその製造方法 |
CN104813418B (zh) * | 2012-11-15 | 2017-08-25 | 株式会社村田制作所 | 正特性热敏电阻及其制造方法 |
DE102012113014A1 (de) | 2012-12-21 | 2014-06-26 | Epcos Ag | Bauelementträger und Bauelementträgeranordnung |
DE102012113018A1 (de) * | 2012-12-21 | 2014-06-26 | Epcos Ag | Verfahren zur Herstellung eines Mehrschichtträgerkörpers |
CN103606448B (zh) * | 2013-11-28 | 2016-09-28 | 深圳顺络电子股份有限公司 | 一种电子元件及其制造方法 |
JP7079736B2 (ja) * | 2016-06-21 | 2022-06-02 | アモセンス・カンパニー・リミテッド | セラミック基板及びその製造方法 |
CN108002865B (zh) * | 2017-11-29 | 2020-05-29 | 歌尔股份有限公司 | 功能陶瓷元件及在功能陶瓷层上形成电极的方法 |
JP7356207B2 (ja) | 2017-12-22 | 2023-10-04 | 太陽誘電株式会社 | 積層セラミック電子部品、積層セラミック電子部品実装基板及び積層セラミック電子部品包装体 |
JP7510741B2 (ja) * | 2018-08-23 | 2024-07-04 | 太陽誘電株式会社 | 積層セラミック電子部品の製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3470812B2 (ja) * | 1992-02-05 | 2003-11-25 | 株式会社村田製作所 | セラミック積層電子部品の製造方法 |
JP3758442B2 (ja) * | 1999-02-23 | 2006-03-22 | 株式会社村田製作所 | 積層セラミックコンデンサの製造方法 |
-
2001
- 2001-05-25 JP JP2001157699A patent/JP3726035B2/ja not_active Expired - Fee Related
-
2002
- 2002-05-25 CN CNB200610005980XA patent/CN100378879C/zh not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117677061A (zh) * | 2024-01-29 | 2024-03-08 | 深圳特新界面科技有限公司 | 一种环保水性导电浆料印刷电子标签的制备方法及系统 |
CN117677061B (zh) * | 2024-01-29 | 2024-04-09 | 深圳特新界面科技有限公司 | 一种环保水性导电浆料印刷电子标签的制备方法及系统 |
Also Published As
Publication number | Publication date |
---|---|
JP2002353625A (ja) | 2002-12-06 |
CN1837135A (zh) | 2006-09-27 |
CN100378879C (zh) | 2008-04-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7089659B2 (en) | Method of producing ceramic laminates | |
JP3726035B2 (ja) | セラミック積層体の製法 | |
US20100038120A1 (en) | Layered ceramic electronic component and manufacturing method therefor | |
JP3785966B2 (ja) | 積層セラミック電子部品の製造方法および積層セラミック電子部品 | |
JP2003017356A (ja) | 積層型電子部品およびその製法 | |
JP2003276017A (ja) | セラミックグリーンシート及びその製法並びにセラミック積層体の製法 | |
JP4688326B2 (ja) | セラミック積層体およびその製法 | |
JP2002075771A (ja) | 積層型電子部品および導電性ペースト | |
JP3784293B2 (ja) | セラミック積層体の製法 | |
JP2002299145A (ja) | セラミック積層体およびその製法 | |
JP2004179348A (ja) | セラミック積層体の製法 | |
JP2004165375A (ja) | セラミック積層体の製法 | |
JP2003197459A (ja) | 積層型電子部品の製法 | |
JP2007258643A (ja) | 積層型電子部品の製造方法 | |
JP4720245B2 (ja) | 積層セラミック電子部品の製造方法 | |
JP2003115416A (ja) | 導電性ペースト、積層セラミック電子部品の製造方法および積層セラミック電子部品 | |
JP4663173B2 (ja) | セラミック積層体の製法 | |
JP4150246B2 (ja) | セラミック積層体の製法 | |
JP2003017362A (ja) | セラミック積層体の製法 | |
JP2008198655A (ja) | 積層セラミック電子部品とその製造方法 | |
JP2004179527A (ja) | セラミック積層体の製法 | |
JP4626455B2 (ja) | 積層型電子部品の製造方法 | |
JP2007294886A (ja) | 積層型電子部品の製造方法 | |
JP2004186343A (ja) | セラミック積層体及びその製法 | |
JP2004186342A (ja) | セラミック積層体及びその製法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20040624 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20041221 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20050221 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20050809 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20050830 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20050920 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20050926 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080930 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090930 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090930 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100930 Year of fee payment: 5 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110930 Year of fee payment: 6 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120930 Year of fee payment: 7 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130930 Year of fee payment: 8 |
|
LAPS | Cancellation because of no payment of annual fees |