JP3724467B2 - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Electronic component mounting apparatus and electronic component mounting method Download PDF

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Publication number
JP3724467B2
JP3724467B2 JP2002265096A JP2002265096A JP3724467B2 JP 3724467 B2 JP3724467 B2 JP 3724467B2 JP 2002265096 A JP2002265096 A JP 2002265096A JP 2002265096 A JP2002265096 A JP 2002265096A JP 3724467 B2 JP3724467 B2 JP 3724467B2
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electronic component
substrate
resin
ultrasonic
component mounting
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JP2004103896A (en
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和宏 野田
隆稔 石川
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、薄板状の樹脂基板に電子部品を実装する電子部品実装装置および電子部品実装方法に関するものである。
【０００２】
【従来の技術】
フレキシブル基板などの薄板状の樹脂基板へ半導体チップを実装する方法として、超音波ボンディングを用いる方法が知られている。この超音波ボンディングでは、半導体チップに設けられた接続用の端子を樹脂基板の電極上に押圧して超音波振動を加えることによってこの端子を電極表面に接合する。この超音波ボンディングにおいて、実装後の接合強度を向上させることを目的として、樹脂による接着を併用する場合が多く、超音波ボンディングに先立って、ボンディング位置に予め接着用樹脂が塗布される（例えば特許文献１参照）。
【０００３】
【特許文献１】
特開平１０−３３５３７３号公報
【０００４】
【発明が解決しようとする課題】
薄板状の樹脂基板は撓みやすく位置決めや姿勢保持が難しいため、超音波ボンディングに際しては、樹脂基板を治具に保持させて上下から挟み込むことにより撓みを矯正する必要がある。このため、従来より超音波ボンディングを行う実装工程の前後には、樹脂基板を治具に装着しまた実装後の基板を治具から取り外す作業を必要としていた。この治具への樹脂基板の装着・取り外しは、樹脂基板を上下から挟み込む押さえ部材をねじなどによって脱着する煩瑣な作業であることから、このような樹脂基板への電子部品実装作業を簡便に行う方策が望まれていた。
【０００５】
そこで本発明は、薄板状の樹脂基板への電子部品実装作業を簡便に行うことができる電子部品実装装置および電子部品実装方法を提供することを目的とする。
【０００６】
【課題を解決するための手段】
請求項１記載の電子部品実装装置は、薄板状の樹脂基板に電子部品を接着用樹脂にて接着するとともにこの樹脂基板に形成された電極に前記電子部品の端子を接合する電子部品実装装置であって、接着用樹脂が塗布された樹脂基板の上面に当接する基板押さえ部材とこの樹脂基板の下面を支持するバックアップ部材とで上下から挟み込むことにより樹脂基板の撓みを矯正する基板撓み矯正部と、前記基板撓み矯正部で矯正された樹脂基板の電極に電子部品の端子を接触させ且つ電子部品の下面を前記接着用樹脂に接触させた状態で電子部品の裏面から超音波振動を加えることにより前記電極と前記端子を接合する超音波ツールを備えた超音波ヘッドと、前記超音波ヘッドによって前記電極に端子が接合された電子部品の裏面に当接して加熱することにより前記接着用樹脂を硬化させる加熱ツールを備えた加熱ヘッドと、少なくとも前記超音波ヘッドによる接合から前記加熱ヘッドによる硬化が完了するまでの間、前記基板撓み矯正部による前記樹脂基板の挟み込みを解除することなく継続させる制御部とを備えた。
【０００７】
請求項２記載の電子部品実装装置は、請求項１記載の電子部品実装装置であって、前記超音波ヘッドの作業位置と前記加熱ヘッドの作業位置が同一位置であり、前記超音波ヘッドと前記加熱ヘッドとを前記作業位置に対して進退させる進退手段とを備えた。
【０００８】
請求項３記載の電子部品実装装置は、請求項１記載の電子部品実装装置であって、前記作業位置に対して前記基板撓み矯正部を相対的に位置決めする位置決め手段を備えた。
【０００９】
請求項４記載の電子部品実装装置は、請求項１記載の電子部品実装装置であって、前記超音波ヘッドの作業位置と前記加熱ヘッドの作業位置が異なる位置であり、これらの作業位置に対して前記基板撓み矯正部を相対的に位置決めする位置決め手段を備えた。
【００１０】
請求項５記載の電子部品実装方法は、薄板状の樹脂基板と電子部品を接着用樹脂にて接着するとともにこの樹脂基板に形成された電極に電子部品の端子を接合する電子部品実装方法であって、接着用樹脂が塗布された樹脂基板を基板押さえ部材とバックアップ部材とで上下から挟み込むことにより樹脂基板の撓みを矯正するステップと、前記撓みが矯正された樹脂基板の電極に電子部品の端子を接触させ且つ電子部品の下面を前記接着用樹脂に接触させた状態で電子部品の裏面から超音波ツールで超音波振動を加えることにより、前記電極と前記端子とを接合するステップと、前記超音波ツールによって前記電極に端子が接合された電子部品の裏面から加熱ツールにより前記接着用樹脂を加熱して硬化させるステップと、前記基板押さえ部材と前記バックアップ部材で前記樹脂基板を挟み込んだ状態を解除するステップとを含み、少なくとも前記超音波ツールによる接合から前記加熱ツールによる接着用樹脂の硬化が完了するまでの間、前記挟み込みを解除することなく継続する。
【００１１】
本発明によれば、接着用樹脂が塗布された樹脂基板を基板押さえ部材とバックアップ部材とで上下から挟み込むことにより樹脂基板の撓みを矯正した状態で超音波ツールによる接合および加熱ツールによる接着用樹脂の硬化を行い、超音波ツールによる接合から加熱ツールによる接着用樹脂の硬化が完了するまでの間、樹脂基板の挟み込みを解除することなく継続することにより、基板毎に専用の治具を用いる必要がなく、薄板状の樹脂基板への電子部品実装作業を簡便に行うことができる。
【００１２】
【発明の実施の形態】
（実施の形態１）
図１は本発明の実施の形態１の電子部品実装装置の斜視図、図２は本発明の実施の形態１の電子部品実装装置の基板保持部の側断面図、図３、図４，図５は本発明の実施の形態１の電子部品実装方法の工程説明図である。
【００１３】
まず図１、図２を参照して、電子部品実装装置１について説明する。電子部品実装装置１は、予め前工程にて接着用樹脂４が塗布された薄板状の樹脂基板２に対して電子部品７を搭載し、電子部品７を接着用樹脂４にて接着するとともに、樹脂基板２に形成された電極２ａ（図３参照）に電子部品７の下面に形成された接続用の端子であるバンプ７ａ（図３参照）を接合する。
【００１４】
図１に示すように電子部品実装装置１は、基板搬送機構３によって搬入される樹脂基板２を保持する基板保持部５，基板保持部５を水平移動させるＸＹテーブル１０、電子部品７を供給する部品供給部６および電子部品７を樹脂基板２に搭載して接合する作業を行うヘッド機構部８より構成される。樹脂基板２は複数箇所の部品実装位置を有する細長形状の矩形基板であり、薄板状であることから剛性が小さくて撓みやすく、撓み変形を生じた状態で前工程から供給され、基板保持部５に搬入される。
【００１５】
基板保持部５の構成について説明する。ＸＹテーブル１０上には基板保持部５の基部であるベーステーブル１１が配設されており、ベーステーブル１１上には２枚の側板１２が立設されている。側板１２の上部には水平な基板押さえ部材１５が配設されており、基板押さえ部材１５には樹脂基板２の部品実装位置に対応して複数の開口部１５ａが設けられている。
【００１６】
側板１２の内面には、樹脂基板２の搬送をガイドする基板搬送ガイド１４が設けられており、基板押さえ部材１５の下方には、基板搬送機構３によってＸ方向に搬送された樹脂基板２の下面を支持して下受けするバックアップ部材１３が配設されている。図２（ａ）に示すように、バックアップ部材１３はバックアップ部昇降機構２４によって昇降自在となっている。バックアップ部材１３として、内部に加熱手段を備え樹脂基板２を下面側から加熱する機能を有するものを用いてもよい。
【００１７】
樹脂基板２が基板押さえ部材１５の下方に搬入された状態で、バックアップ部昇降機構２４を駆動することにより、バックアップ部材１３はガイド部２３によってガイドされて上昇する。これにより、図２（ｂ）に示すように、樹脂基板２はバックアップ部材１３に下面を支持されて持ち上げられる。そして基板押さえ部材１５が樹脂基板２の上面に当接して樹脂基板２が基板押さえ部材１５とバックアップ部材１３とで上下から挟み込まれた状態では、樹脂基板２はバックアップ部材１３の上面にならって押し付けられ、撓みが矯正される。
【００１８】
すなわち、上記構成の基板保持部５のうち、基板押さえ部材１５，バックアップ部材１３およびバックアップ部昇降機構２４は、接着用樹脂４が塗布された樹脂基板２の上面に当接する基板押さえ部材１５とこの樹脂基板２の下面を支持するバックアップ部材１３とで上下から挟み込むことにより樹脂基板２の撓みを矯正する基板撓み矯正部となっている。そしてこのようにして撓みが矯正された樹脂基板２の部品実装位置は、基板押さえ部材１５の各開口部１５ａ内に位置する。
【００１９】
基板保持部５の先端側（基板搬送方向の下流側）には、ヘッド機構部８が配設されている。ヘッド機構部８はＹ方向に配設されたヘッド移動テーブル１６を備えており、ヘッド移動テーブル１６には、超音波ヘッド１７および加熱ヘッド１８が装着されている。超音波ヘッド１７、加熱ヘッド１８は、それぞれ超音波振動付与機構を有する超音波ツール２１、加熱機構を内蔵した加熱ツール２２を備えており、超音波ツール２１、加熱ツール２２は、それぞれ昇降機構１９，２０によって昇降自在となっている。
【００２０】
ヘッド移動テーブル１６を駆動することにより、超音波ヘッド１７、加熱ヘッド１８はＹ方向に移動する。この移動経路上には、超音波ヘッド１７、加熱ヘッド１８の共通の作業位置Ａが設定されており、この作業位置Ａに対して超音波ツール２１、加熱ツール２２のいずれかを下降させることにより、作業位置Ａにおいて、後述する超音波接合作業、加熱作業が行われる。
【００２１】
すなわち、超音波ヘッド１７の作業位置と加熱ヘッド１８の作業位置は同一位置であり、ヘッド移動テーブル１６は、超音波ヘッド１７と加熱ヘッド１８とを作業位置Ａに対して進退させる進退手段となっている。なお、進退手段として、超音波ツール２１、加熱ツール２２にそれぞれ専用の移動テーブルを設けるようにしてもよい。
【００２２】
超音波ヘッド１７による超音波接合作業について説明する。超音波ツール２１は、電子部品７の裏面（バンプ形成面の反対面）を吸着して保持する吸着面を備えており、部品供給部６に収容された電子部品７をピックアップして作業位置Ａに位置合わせされた開口部１５ａ内の樹脂基板２の部品搭載位置に搭載して実装する。すなわち、基板保持部５によって撓みが矯正された樹脂基板２の電極２ａに電子部品７のバンプ７ａを接触させ、且つ電子部品７の下面を接着用樹脂４に接触させた状態で電子部品７の裏面から超音波振動を加えることにより電極２ａとバンプ７ａとを接合する。
【００２３】
加熱ヘッド１８による加熱作業について説明する。加熱ツール２２は、電子部品７の裏面に当接して加熱する加熱面を備えており、超音波ツール２１によって電極２ａにバンプ７ａが接合された電子部品７の裏面に対して加熱ツール２２を下降させて加熱面を当接させることにより、接着用樹脂４を電子部品７を介して加熱して硬化させる。
【００２４】
ヘッド移動テーブル１６を駆動することにより、超音波ヘッド１７および加熱ヘッド１８はＹ方向に水平移動し、これにより、超音波ツール２１、加熱ツール２２のいずれかを、作業位置Ａ上に位置させることができるようになっている。ここで、ＸＹテーブル１０を駆動して基板保持部５を水平移動させることにより、複数の開口部１５ａのうちの任意の開口部１５ａを作業位置Ａに位置合わせすることができる。ＸＹテーブル１０は、作業位置Ａに対して基板撓み矯正部としての基板保持部５を位置決めする位置決め手段となっている。
【００２５】
図２（ａ）に示すように、バックアップ部昇降機構２４，ヘッド移動テーブル１６，超音波ヘッド１７および加熱ヘッド１８は、それぞれ制御部２５によって制御される。制御部２５によって上記各部の動作を制御することにより、少なくとも超音波ヘッド１７による電極とバンプの接合から、加熱ヘッド１８による接着用樹脂４の硬化が完了するまでの間、基板保持部５のバックアップ部材１３および基板押さえ部材１５による樹脂基板２の挟み込みを解除することなく継続させることができるようになっている。
【００２６】
次に、図３，図４，図５を参照して、電子部品実装方法について説明する。図３〜図５は、基板保持部５の断面を示している。まず図３（ａ）に示すように、接着用樹脂４が予め塗布された樹脂基板２が基板ガイド１４のコンベア１４ａによって基板押さえ部材１５の下方に搬入される。搬入時においては、樹脂基板２は上下方向に撓みを生じた状態となっている。次いでバックアップ部昇降機構２４を駆動してバックアップ部材１３を上昇させ、接着用樹脂４が塗布された樹脂基板２を、基板押さえ部材１５とバックアップ部材１３とで上下から挟み込む。これにより、樹脂基板２の撓みが矯正される。
【００２７】
次いで、電子部品７の超音波接合が行われる。まず部品供給部６から電子部品７をピックアップした超音波ヘッド１７を作業位置Ａまで移動させるとともに、作業対象となる開口部１５ａを図１に示す作業位置Ａに位置合わせする。そして図４（ａ）に示すように、超音波ツール２１に吸着保持された電子部品７のバンプ７ａを樹脂基板２の電極２ａに位置合わせし、図４（ｂ）に示すように超音波ツール２１を下降させて、撓みが矯正された樹脂基板２の電極２ａに電子部品７のバンプ７ａを接触させ、所定の圧着荷重でバンプ７ａを電極２ａに対して押圧する。
【００２８】
そして電子部品７の下面（バンプ形成面）を接着用樹脂４に接触させた状態で、電子部品７の裏面から超音波ツール２１で超音波振動を加えることにより、電極２ａとバンプ７ａとを超音波振動と押圧力によって金属接合する。この超音波接合作業は極めて短い時間（約０．５秒）で完了することから、超音波接合が完了した時点では、接着用樹脂４はほとんど硬化していない状態にある。したがって、接着用樹脂４が電子部品７を樹脂基板２に固定する接着力は弱く、この状態で樹脂基板２の挟み込みを解除すると、樹脂基板２の撓み変形の復元力によってバンプ７ａと電極２ａとの金属接合面に応力が集中して剥離などの不具合を招くため、樹脂基板２の挟み込みをこのまま継続する。
【００２９】
この後、接着用樹脂４の熱硬化が行われる。図５（ａ）に示すように、加熱ツール２２を開口部１５ａ内に下降させて、電極２ａにバンプ７ａが接合された電子部品７の裏面に当接させ、裏面から加熱ツール２２により接着用樹脂４を加熱して熱硬化を促進させる。そして、電子部品７が樹脂基板２に十分な固着力で接着された状態、すなわち樹脂基板２の撓み復元力に抗して電子部品７を接着用樹脂４のみで樹脂基板２に固着保持できる状態に至るまでに必要とされる接着用樹脂４の熱硬化が完了したならば、図５（ｂ）に示すように、バックアップ部材１３を下降させて、基板押さえ部材１５とバックアップ部材１３で樹脂基板２を挟み込んだ状態を解除する。
【００３０】
すなわち上記電子部品実装方法においては、少なくとも超音波ツール２１による接合から樹脂基板２が前述の状態に至るための加熱ツール２２による熱硬化が完了するまでの間、樹脂基板２の挟み込みを解除することなく継続するようにしている。これにより、バックアップ部材１３を下降させた状態においては、接着用樹脂４の熱硬化が進行して、電子部品７を樹脂基板２に十分な固着力で接着している。したがって、樹脂基板２の撓み復元力によってバンプ７ａと電極２ａとの金属接合面が剥離する不具合が防止される。
【００３１】
（実施の形態２）
図６は本発明の実施の形態２の電子部品実装装置の斜視図である。図６において、電子部品実装装置１Ａは、実施の形態１に示すものと同様の基板保持部５を備えている。基板保持部５には、実施の形態１と同様に、接着用樹脂４が塗布された樹脂基板２が搬入される。ここで基板保持部５は固定配置となっており、基板保持部５の上方には、実施の形態１と同様の構成の超音波ヘッド１７，加熱ヘッド１８が、移動テーブル２６によってＸ方向およびＹ方向に水平移動自在に配設されている。
【００３２】
移動テーブル２６を駆動することにより、超音波ヘッド１７，加熱ヘッド１８は固定配置された基板保持部５の各開口部１５ａに対して進退し、それぞれ超音波ツール２１，加熱ツール２２によって超音波接合作業および加熱作業を行うことができるようになっている。ここでは、移動テーブル２６が、超音波ヘッド１７による作業位置，加熱ヘッド１８による作業位置に対して、基板保持部５の基板撓み矯正部を相対的に位置決めする位置決め手段となっている。
【００３３】
（実施の形態３）
図７は本発明の実施の形態３の電子部品実装装置の斜視図である。図７において、電子部品実装装置１Ｂは、実施の形態１と同様に、基板保持部５をＸＹテーブル１０Ａ上に配置した構成となっている。基板保持部５には、実施の形態１と同様に、接着用樹脂４が塗布された樹脂基板２が搬入される。基板保持部５の上方には、実施の形態１と同様の構成の超音波ヘッド１７，加熱ヘッド１８が配設されている。ここで超音波ヘッド１７は移動テーブル１６ＡによってＹ方向に移動自在となっており、移動テーブル１６Ａを駆動することにより、超音波ヘッド１７は部品供給部６から電子部品７をピックアップし、作業位置Ｂにて基板保持部５に保持され撓みが矯正された樹脂基板２に対して超音波接合作業を行う。
【００３４】
加熱ヘッド１８は固定配置となっており、超音波ヘッド１７によって超音波接合された電子部品７を対象として、破線で示す作業位置Ｃにて接着用樹脂４の加熱作業を行う。基板保持部５の作業位置Ｃへの位置合わせは、ＸＹテーブル１０Ａを駆動して基板保持部５をＹ方向に移動させることによって行う。
【００３５】
すなわち、本実施の形態３においては、超音波ヘッド１７の作業位置Ｂと加熱ヘッド１８の作業位置Ｃが異なる位置に設定されており、ＸＹテーブル１０Ａは、これらの作業位置Ｂ，Ｃに対して基板保持部５に設けられた基板撓み矯正部を相対的に位置決めする位置決め手段となっている。
【００３６】
（実施の形態４）
図８は本発明の実施の形態４の電子部品実装方法における樹脂基板の搬送用キャリアの斜視図、図９は本発明の実施の形態４の電子部品実装方法の工程説明図である。実施の形態１，２，３においては、複数の電子部品が実装される樹脂基板２自体をそのまま基板保持部５に搬入するようにしているが、以下に説明するように、１つの電子部品のみが実装される樹脂基板を搬送用キャリアに保持させたものを対象とする場合においても、本発明を適用することができる。
【００３７】
図８において、細長矩形形状の搬送用キャリア３０には、複数のバックアップ用開口部３０ａが設けられており、バックアップ用開口部３０ａの周縁には位置合わせピン３１が立設されている。３２は、実施の形態１に示す樹脂基板２と同様材質の薄板状の樹脂基板である。樹脂基板３２には、基準穴３２ａが設けられており、基準穴３２ａに位置合わせピン３１を嵌合させることにより、樹脂基板３２は搬送用キャリア３０に位置決めされた状態で保持される。樹脂基板３２には、実施の形態１と同様の電子部品７を接着するための接着用樹脂４が塗布される。
【００３８】
図９は、複数の樹脂基板３２を保持した搬送用キャリア３０を基板保持部５に搬入した状態を示している。図９（ａ）に示すように、搬送用キャリア３０はコンベア１４ａによって搬入され、各樹脂基板３２が基板押さえ部材１５の開口部１５ａに位置合わせされる。そしてこの状態で、バックアップ部材１３Ａをバックアップ用開口部３０ａを介して上昇させ、樹脂基板３２を下面から支持して押し上げ、樹脂基板３２の上面を基板押さえ部材１５の下面に当接させる。これにより、実施の形態１と同様に樹脂基板３２の撓みが矯正される。
【００３９】
上記各実施の形態に示すように、本発明の電子部品実装装置によれば、撓み変形を生じやすい薄板状の樹脂基板を対象とする場合にあっても、基板毎に専用の治具を用意して基板の脱着を行う必要がなく、薄板状の樹脂基板への電子部品実装作業を簡便に行うことができる。
【００４０】
【発明の効果】
本発明によれば、接着用樹脂が塗布された樹脂基板を基板押さえ部材とバックアップ部材とで上下から挟み込むことにより樹脂基板の撓みを矯正した状態で超音波ツールによる接合および加熱ツールによる接着用樹脂の硬化を行い、超音波ツールによる接合から加熱ツールによる接着用樹脂の硬化が完了するまでの間、樹脂基板の挟み込みを解除することなく継続するようにしたので、基板毎に専用の治具を用いる必要がなく、薄膜状の樹脂基板への電子部品実装作業を簡便に行うことができる。
【図面の簡単な説明】
【図１】本発明の実施の形態１の電子部品実装装置の斜視図
【図２】本発明の実施の形態１の電子部品実装装置の基板保持部の側断面図
【図３】本発明の実施の形態１の電子部品実装方法の工程説明図
【図４】本発明の実施の形態１の電子部品実装方法の工程説明図
【図５】本発明の実施の形態１の電子部品実装方法の工程説明図
【図６】本発明の実施の形態２の電子部品実装装置の斜視図
【図７】本発明の実施の形態３の電子部品実装装置の斜視図
【図８】本発明の実施の形態４の電子部品実装方法における樹脂基板の搬送用キャリアの斜視図
【図９】本発明の実施の形態４の電子部品実装方法の工程説明図
【符号の説明】
１，１Ａ，１Ｂ 電子部品実装装置
２ 樹脂基板
４ 接着用樹脂
５ 基板保持部
７ 電子部品
７ａ バンプ
８ ヘッド機構部
１０，１０Ａ ＸＹテーブル
１３ バックアップ部材
１５ 基板押さえ部材
１６ 移動テーブル
１７ 超音波ヘッド
１８ 加熱ヘッド
２１ 超音波ツール
２２ 加熱ツール
２４ バックアップ部昇降機構
２５ 制御部[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting an electronic component on a thin plate-like resin substrate.
[0002]
[Prior art]
As a method for mounting a semiconductor chip on a thin plate-like resin substrate such as a flexible substrate, a method using ultrasonic bonding is known. In this ultrasonic bonding, the terminal for connection provided on the semiconductor chip is pressed onto the electrode of the resin substrate to apply ultrasonic vibration to bond the terminal to the electrode surface. In this ultrasonic bonding, bonding with a resin is often used together for the purpose of improving the bonding strength after mounting, and a bonding resin is applied in advance to the bonding position prior to ultrasonic bonding (for example, a patent) Reference 1).
[0003]
[Patent Document 1]
Japanese Patent Laid-Open No. 10-335373
[Problems to be solved by the invention]
Since a thin resin substrate is easily bent and difficult to position and hold, it is necessary to correct the bending by ultrasonic bonding by holding the resin substrate on a jig and sandwiching the resin substrate from above and below. For this reason, conventionally, before and after the mounting process for performing ultrasonic bonding, it is necessary to attach the resin substrate to the jig and to remove the mounted substrate from the jig. Mounting / removing the resin substrate to / from the jig is a cumbersome operation of attaching / detaching a pressing member that sandwiches the resin substrate from above and below with a screw or the like, and thus mounting the electronic component on the resin substrate is easily performed. A strategy was desired.
[0005]
Then, an object of this invention is to provide the electronic component mounting apparatus and electronic component mounting method which can perform the electronic component mounting operation | work to a thin-plate-shaped resin substrate simply.
[0006]
[Means for Solving the Problems]
The electronic component mounting apparatus according to claim 1 is an electronic component mounting apparatus for bonding an electronic component to a thin resin substrate with an adhesive resin and bonding a terminal of the electronic component to an electrode formed on the resin substrate. A substrate bending correction portion that corrects the deflection of the resin substrate by sandwiching the substrate pressing member from above and below between the substrate pressing member that contacts the upper surface of the resin substrate coated with the adhesive resin and the lower surface of the resin substrate; By applying ultrasonic vibration from the back surface of the electronic component in a state where the terminal of the electronic component is brought into contact with the electrode of the resin substrate corrected by the substrate deflection correcting portion and the lower surface of the electronic component is in contact with the adhesive resin An ultrasonic head provided with an ultrasonic tool for bonding the electrode and the terminal, and a back surface of the electronic component having the terminal bonded to the electrode by the ultrasonic head to be heated. A heating head having a heating tool for curing the adhesive resin, and sandwiching the resin substrate by the substrate deflection correction unit at least from the time when the ultrasonic head is bonded to the time when the heating head is cured. And a control unit that continues without being released.
[0007]
The electronic component mounting apparatus according to claim 2 is the electronic component mounting apparatus according to claim 1, wherein an operation position of the ultrasonic head and an operation position of the heating head are the same position, and the ultrasonic head and the electronic head And an advancing / retreating means for advancing and retracting the heating head relative to the working position.
[0008]
An electronic component mounting apparatus according to a third aspect is the electronic component mounting apparatus according to the first aspect, further comprising positioning means for positioning the substrate deflection correcting portion relative to the work position.
[0009]
The electronic component mounting apparatus according to claim 4 is the electronic component mounting apparatus according to claim 1, wherein a work position of the ultrasonic head and a work position of the heating head are different from each other. Positioning means for relatively positioning the substrate deflection correcting portion.
[0010]
The electronic component mounting method according to claim 5 is an electronic component mounting method in which a thin plate-like resin substrate and an electronic component are bonded with an adhesive resin, and terminals of the electronic component are bonded to electrodes formed on the resin substrate. The step of correcting the bending of the resin substrate by sandwiching the resin substrate coated with the adhesive resin from above and below between the substrate pressing member and the backup member, and the terminal of the electronic component on the electrode of the resin substrate where the bending is corrected And joining the electrode and the terminal by applying ultrasonic vibration with an ultrasonic tool from the back surface of the electronic component in a state where the lower surface of the electronic component is in contact with the adhesive resin; and A step of heating and curing the adhesive resin with a heating tool from a back surface of an electronic component having terminals connected to the electrodes by a sonic tool; and the substrate pressing member. A step of releasing the state in which the resin substrate is sandwiched by the backup member, and at least during the period from the joining by the ultrasonic tool to the completion of the curing of the adhesive resin by the heating tool without releasing the sandwiching continue.
[0011]
According to the present invention, the bonding resin by the ultrasonic tool and the bonding resin by the heating tool in a state where the bending of the resin substrate is corrected by sandwiching the resin substrate coated with the bonding resin from above and below by the substrate pressing member and the backup member. It is necessary to use a dedicated jig for each board by continuing the curing without releasing the pinching of the resin board from the joining with the ultrasonic tool until the hardening of the adhesive resin with the heating tool is completed. Therefore, the electronic component mounting work on the thin resin substrate can be easily performed.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
(Embodiment 1)
1 is a perspective view of an electronic component mounting apparatus according to a first embodiment of the present invention. FIG. 2 is a side sectional view of a substrate holding portion of the electronic component mounting apparatus according to the first embodiment of the present invention. FIG. 5 is a process explanatory diagram of the electronic component mounting method according to the first embodiment of the present invention.
[0013]
First, the electronic component mounting apparatus 1 will be described with reference to FIGS. The electronic component mounting apparatus 1 mounts the electronic component 7 on the thin plate-like resin substrate 2 to which the adhesive resin 4 is previously applied in the previous process, and adheres the electronic component 7 with the adhesive resin 4. Bumps 7a (see FIG. 3) which are connection terminals formed on the lower surface of the electronic component 7 are joined to the electrodes 2a (see FIG. 3) formed on the resin substrate 2.
[0014]
As shown in FIG. 1, the electronic component mounting apparatus 1 supplies an XY table 10 and an electronic component 7 that horizontally move the substrate holding unit 5 and the substrate holding unit 5 that hold the resin substrate 2 carried in by the substrate transfer mechanism 3. The component supplying unit 6 and the electronic component 7 are configured by a head mechanism unit 8 that performs an operation of mounting and joining the resin substrate 2 to the resin substrate 2. The resin substrate 2 is an elongated rectangular substrate having a plurality of component mounting positions. Since the resin substrate 2 has a thin plate shape, the resin substrate 2 has a small rigidity and is easily bent. It is carried in.
[0015]
The configuration of the substrate holding unit 5 will be described. A base table 11 that is a base portion of the substrate holding unit 5 is disposed on the XY table 10, and two side plates 12 are erected on the base table 11. A horizontal board pressing member 15 is disposed on the side plate 12, and the board pressing member 15 has a plurality of openings 15 a corresponding to the component mounting positions of the resin board 2.
[0016]
A substrate transport guide 14 for guiding the transport of the resin substrate 2 is provided on the inner surface of the side plate 12, and the lower surface of the resin substrate 2 transported in the X direction by the substrate transport mechanism 3 below the substrate pressing member 15. A backup member 13 is provided for supporting and receiving. As shown in FIG. 2A, the backup member 13 can be moved up and down by a backup unit lifting mechanism 24. As the backup member 13, a member having a heating means inside and having a function of heating the resin substrate 2 from the lower surface side may be used.
[0017]
By driving the backup unit lifting mechanism 24 in a state where the resin substrate 2 is carried below the substrate pressing member 15, the backup member 13 is guided and raised by the guide unit 23. As a result, as shown in FIG. 2B, the resin substrate 2 is lifted with the lower surface supported by the backup member 13. When the substrate pressing member 15 is in contact with the upper surface of the resin substrate 2 and the resin substrate 2 is sandwiched from above and below by the substrate pressing member 15 and the backup member 13, the resin substrate 2 is pressed along the upper surface of the backup member 13. And the deflection is corrected.
[0018]
That is, in the substrate holding part 5 configured as described above, the substrate pressing member 15, the backup member 13, and the backup unit elevating mechanism 24 include the substrate pressing member 15 that contacts the upper surface of the resin substrate 2 coated with the adhesive resin 4, It is a substrate deflection correcting part that corrects the deflection of the resin substrate 2 by sandwiching it from above and below with the backup member 13 that supports the lower surface of the resin substrate 2. The component mounting position of the resin board 2 whose deflection is corrected in this way is located in each opening 15 a of the board pressing member 15.
[0019]
A head mechanism unit 8 is disposed on the front end side (downstream side in the substrate transport direction) of the substrate holding unit 5. The head mechanism unit 8 includes a head moving table 16 disposed in the Y direction, and an ultrasonic head 17 and a heating head 18 are attached to the head moving table 16. The ultrasonic head 17 and the heating head 18 are each provided with an ultrasonic tool 21 having an ultrasonic vibration applying mechanism and a heating tool 22 having a built-in heating mechanism. , 20 can be raised and lowered.
[0020]
By driving the head moving table 16, the ultrasonic head 17 and the heating head 18 move in the Y direction. A common work position A for the ultrasonic head 17 and the heating head 18 is set on the movement path, and either the ultrasonic tool 21 or the heating tool 22 is lowered with respect to the work position A. In the operation position A, an ultrasonic bonding operation and a heating operation described later are performed.
[0021]
That is, the work position of the ultrasonic head 17 and the work position of the heating head 18 are the same position, and the head moving table 16 is an advance / retreat means for moving the ultrasonic head 17 and the heating head 18 back and forth with respect to the work position A. ing. In addition, as the advancing / retreating means, a dedicated moving table may be provided for each of the ultrasonic tool 21 and the heating tool 22.
[0022]
An ultrasonic bonding operation by the ultrasonic head 17 will be described. The ultrasonic tool 21 includes a suction surface that sucks and holds the back surface (opposite surface of the bump formation surface) of the electronic component 7, picks up the electronic component 7 accommodated in the component supply unit 6, and operates the work position A. And mounted on the component mounting position of the resin substrate 2 in the opening 15a aligned with the mounting position. That is, the bump 7a of the electronic component 7 is brought into contact with the electrode 2a of the resin substrate 2 whose deflection has been corrected by the substrate holding unit 5 and the lower surface of the electronic component 7 is brought into contact with the adhesive resin 4. The electrode 2a and the bump 7a are joined by applying ultrasonic vibration from the back surface.
[0023]
A heating operation by the heating head 18 will be described. The heating tool 22 has a heating surface that contacts and heats the back surface of the electronic component 7, and the heating tool 22 is lowered with respect to the back surface of the electronic component 7 in which the bump 7 a is bonded to the electrode 2 a by the ultrasonic tool 21. Then, the adhesive resin 4 is heated and cured through the electronic component 7 by bringing the heating surface into contact therewith.
[0024]
By driving the head moving table 16, the ultrasonic head 17 and the heating head 18 move horizontally in the Y direction, thereby positioning either the ultrasonic tool 21 or the heating tool 22 on the work position A. Can be done. Here, by driving the XY table 10 and moving the substrate holding part 5 horizontally, an arbitrary opening 15a among the plurality of openings 15a can be aligned with the work position A. The XY table 10 serves as positioning means for positioning the substrate holding unit 5 as a substrate deflection correcting unit with respect to the work position A.
[0025]
As shown in FIG. 2A, the backup unit elevating mechanism 24, the head moving table 16, the ultrasonic head 17 and the heating head 18 are controlled by the control unit 25. By controlling the operation of each of the above parts by the control unit 25, at least from the bonding of the electrodes and bumps by the ultrasonic head 17 to the completion of the curing of the adhesive resin 4 by the heating head 18, the backup of the substrate holding unit 5 is performed. The sandwiching of the resin substrate 2 by the member 13 and the substrate pressing member 15 can be continued without releasing.
[0026]
Next, an electronic component mounting method will be described with reference to FIGS. 3 to 5 show a cross section of the substrate holding part 5. First, as shown in FIG. 3A, the resin substrate 2 to which the adhesive resin 4 has been applied in advance is carried below the substrate pressing member 15 by the conveyor 14 a of the substrate guide 14. At the time of carry-in, the resin substrate 2 is in a state of being bent in the vertical direction. Next, the backup unit elevating mechanism 24 is driven to raise the backup member 13, and the resin substrate 2 coated with the adhesive resin 4 is sandwiched between the substrate pressing member 15 and the backup member 13 from above and below. Thereby, the bending of the resin substrate 2 is corrected.
[0027]
Next, ultrasonic bonding of the electronic component 7 is performed. First, the ultrasonic head 17 picking up the electronic component 7 from the component supply unit 6 is moved to the work position A, and the opening 15a to be worked is aligned with the work position A shown in FIG. Then, as shown in FIG. 4A, the bump 7a of the electronic component 7 attracted and held by the ultrasonic tool 21 is aligned with the electrode 2a of the resin substrate 2, and the ultrasonic tool is shown in FIG. 4B. 21 is lowered, the bump 7a of the electronic component 7 is brought into contact with the electrode 2a of the resin substrate 2 whose bending has been corrected, and the bump 7a is pressed against the electrode 2a with a predetermined pressure load.
[0028]
Then, with the lower surface (bump forming surface) of the electronic component 7 in contact with the adhesive resin 4, ultrasonic vibration is applied from the back surface of the electronic component 7 with the ultrasonic tool 21, thereby superimposing the electrodes 2 a and the bumps 7 a. Metal bonding is performed by sonic vibration and pressing force. Since this ultrasonic bonding operation is completed in an extremely short time (about 0.5 seconds), the adhesive resin 4 is hardly cured when the ultrasonic bonding is completed. Accordingly, the adhesive resin 4 has a weak adhesive force for fixing the electronic component 7 to the resin substrate 2. When the sandwiching of the resin substrate 2 is released in this state, the bump 7 a and the electrode 2 a Since stress concentrates on the metal joint surface of this metal and causes problems such as peeling, the sandwiching of the resin substrate 2 is continued as it is.
[0029]
Thereafter, the adhesive resin 4 is thermally cured. As shown in FIG. 5A, the heating tool 22 is lowered into the opening 15a and brought into contact with the back surface of the electronic component 7 having the bump 7a bonded to the electrode 2a. Resin 4 is heated to promote thermosetting. The electronic component 7 is bonded to the resin substrate 2 with a sufficient fixing force, that is, the electronic component 7 can be fixedly held on the resin substrate 2 only by the adhesive resin 4 against the bending restoring force of the resin substrate 2. 5 is completed, the backup member 13 is lowered, and the substrate pressing member 15 and the backup member 13 are used for the resin substrate, as shown in FIG. 5B. Release the state where 2 is sandwiched.
[0030]
That is, in the electronic component mounting method described above, the sandwiching of the resin substrate 2 is released at least during the period from the joining by the ultrasonic tool 21 to the completion of the thermosetting by the heating tool 22 for the resin substrate 2 to reach the aforementioned state. I try to continue without. Thereby, in the state where the backup member 13 is lowered, the thermosetting of the bonding resin 4 proceeds, and the electronic component 7 is bonded to the resin substrate 2 with a sufficient fixing force. Therefore, a problem that the metal joint surface between the bump 7a and the electrode 2a is peeled off by the bending restoring force of the resin substrate 2 is prevented.
[0031]
(Embodiment 2)
FIG. 6 is a perspective view of the electronic component mounting apparatus according to the second embodiment of the present invention. In FIG. 6, the electronic component mounting apparatus 1 </ b> A includes a substrate holding unit 5 similar to that shown in the first embodiment. As in the first embodiment, the resin substrate 2 coated with the adhesive resin 4 is carried into the substrate holder 5. Here, the substrate holding unit 5 is fixedly arranged. Above the substrate holding unit 5, the ultrasonic head 17 and the heating head 18 having the same configuration as in the first embodiment are moved by the moving table 26 in the X direction and the Y direction. It is arranged so that it can move horizontally in the direction.
[0032]
By driving the moving table 26, the ultrasonic head 17 and the heating head 18 move forward and backward with respect to the openings 15a of the substrate holding unit 5 fixedly arranged, and ultrasonic bonding is performed by the ultrasonic tool 21 and the heating tool 22, respectively. Work and heating work can be performed. Here, the moving table 26 serves as positioning means for relatively positioning the substrate deflection correcting portion of the substrate holding portion 5 with respect to the working position by the ultrasonic head 17 and the working position by the heating head 18.
[0033]
(Embodiment 3)
FIG. 7 is a perspective view of an electronic component mounting apparatus according to Embodiment 3 of the present invention. In FIG. 7, the electronic component mounting apparatus 1B has a configuration in which the board holding unit 5 is arranged on the XY table 10A, as in the first embodiment. As in the first embodiment, the resin substrate 2 coated with the adhesive resin 4 is carried into the substrate holder 5. Above the substrate holding unit 5, an ultrasonic head 17 and a heating head 18 having the same configuration as in the first embodiment are arranged. Here, the ultrasonic head 17 is movable in the Y direction by the moving table 16A. By driving the moving table 16A, the ultrasonic head 17 picks up the electronic component 7 from the component supply unit 6, and the working position B Then, an ultrasonic bonding operation is performed on the resin substrate 2 held by the substrate holding unit 5 and corrected for bending.
[0034]
The heating head 18 is fixedly arranged, and the heating operation of the adhesive resin 4 is performed at the operation position C indicated by a broken line, with the electronic component 7 ultrasonically bonded by the ultrasonic head 17 as a target. The substrate holding unit 5 is aligned with the work position C by driving the XY table 10A and moving the substrate holding unit 5 in the Y direction.
[0035]
That is, in the third embodiment, the work position B of the ultrasonic head 17 and the work position C of the heating head 18 are set to different positions, and the XY table 10A is set to these work positions B and C. This is a positioning means for relatively positioning the substrate deflection correcting portion provided in the substrate holding portion 5.
[0036]
(Embodiment 4)
8 is a perspective view of a carrier for transporting a resin substrate in the electronic component mounting method according to the fourth embodiment of the present invention, and FIG. 9 is a process explanatory diagram of the electronic component mounting method according to the fourth embodiment of the present invention. In the first, second, and third embodiments, the resin substrate 2 itself on which a plurality of electronic components are mounted is directly carried into the substrate holding unit 5, but only one electronic component is described as described below. The present invention can also be applied to a case where a resin substrate on which a substrate is mounted is held on a carrier for conveyance.
[0037]
In FIG. 8, the elongated rectangular carrier 30 is provided with a plurality of backup openings 30a, and alignment pins 31 are erected on the periphery of the backup openings 30a. Reference numeral 32 denotes a thin resin substrate made of the same material as the resin substrate 2 shown in the first embodiment. The resin substrate 32 is provided with a reference hole 32a. By fitting the alignment pin 31 into the reference hole 32a, the resin substrate 32 is held in a state of being positioned on the carrier 30 for conveyance. The resin substrate 32 is coated with an adhesive resin 4 for bonding the same electronic component 7 as in the first embodiment.
[0038]
FIG. 9 shows a state in which the carrier 30 for holding a plurality of resin substrates 32 is carried into the substrate holder 5. As shown in FIG. 9A, the transfer carrier 30 is carried in by the conveyor 14 a, and each resin substrate 32 is aligned with the opening 15 a of the substrate pressing member 15. Then, in this state, the backup member 13A is raised through the backup opening 30a, the resin substrate 32 is supported and pushed up from the lower surface, and the upper surface of the resin substrate 32 is brought into contact with the lower surface of the substrate pressing member 15. Thereby, the bending of the resin substrate 32 is corrected as in the first embodiment.
[0039]
As shown in each of the above embodiments, according to the electronic component mounting apparatus of the present invention, a dedicated jig is prepared for each board even when the target is a thin resin board that is likely to bend and deform. Thus, it is not necessary to detach the substrate, and the electronic component mounting work on the thin resin substrate can be easily performed.
[0040]
【The invention's effect】
According to the present invention, a resin substrate to which an adhesive resin is applied is sandwiched from above and below by a substrate pressing member and a backup member so that the bending of the resin substrate is corrected, and the bonding resin by the ultrasonic tool and the bonding resin by the heating tool are used. From the joining with the ultrasonic tool until the curing of the adhesive resin with the heating tool is completed, the resin substrate is kept without being released. There is no need to use it, and an electronic component mounting operation on a thin resin substrate can be easily performed.
[Brief description of the drawings]
FIG. 1 is a perspective view of an electronic component mounting apparatus according to a first embodiment of the present invention. FIG. 2 is a side sectional view of a substrate holding portion of the electronic component mounting apparatus according to the first embodiment of the present invention. FIG. 4 is a process explanatory diagram of the electronic component mounting method according to the first embodiment. FIG. 4 is a process explanatory diagram of the electronic component mounting method according to the first embodiment of the present invention. FIG. 6 is a perspective view of the electronic component mounting apparatus according to the second embodiment of the present invention. FIG. 7 is a perspective view of the electronic component mounting apparatus according to the third embodiment of the present invention. FIG. 9 is a perspective view of a carrier for transporting a resin substrate in the electronic component mounting method according to the fourth embodiment. FIG. 9 is a process explanatory diagram of the electronic component mounting method according to the fourth embodiment of the present invention.
1, 1A, 1B Electronic component mounting apparatus 2 Resin substrate 4 Adhesive resin 5 Substrate holding portion 7 Electronic component 7a Bump 8 Head mechanism portion 10, 10A XY table 13 Backup member 15 Substrate pressing member 16 Moving table 17 Ultrasonic head 18 Heating Head 21 Ultrasonic tool 22 Heating tool 24 Backup unit lifting mechanism 25 Control unit

Claims (5)

薄板状の樹脂基板に電子部品を接着用樹脂にて接着するとともにこの樹脂基板に形成された電極に前記電子部品の端子を接合する電子部品実装装置であって、接着用樹脂が塗布された樹脂基板の上面に当接する基板押さえ部材とこの樹脂基板の下面を支持するバックアップ部材とで上下から挟み込むことにより樹脂基板の撓みを矯正する基板撓み矯正部と、前記基板撓み矯正部で矯正された樹脂基板の電極に電子部品の端子を接触させ且つ電子部品の下面を前記接着用樹脂に接触させた状態で電子部品の裏面から超音波振動を加えることにより前記電極と前記端子を接合する超音波ツールを備えた超音波ヘッドと、前記超音波ヘッドによって前記電極に端子が接合された電子部品の裏面に当接して加熱することにより前記接着用樹脂を硬化させる加熱ツールを備えた加熱ヘッドと、少なくとも前記超音波ヘッドによる接合から前記加熱ヘッドによる硬化が完了するまでの間、前記基板撓み矯正部による前記樹脂基板の挟み込みを解除することなく継続させる制御部とを備えたことを特徴とする電子部品実装装置。An electronic component mounting apparatus for bonding an electronic component to a thin resin substrate with an adhesive resin and bonding a terminal of the electronic component to an electrode formed on the resin substrate, the resin having an adhesive resin applied thereto A substrate deflection correcting portion that corrects the deflection of the resin substrate by sandwiching the substrate from above and below by a substrate pressing member that contacts the upper surface of the substrate and a backup member that supports the lower surface of the resin substrate, and the resin corrected by the substrate deflection correcting portion An ultrasonic tool for joining the electrode and the terminal by applying ultrasonic vibration from the back surface of the electronic component in a state where the terminal of the electronic component is in contact with the electrode of the substrate and the lower surface of the electronic component is in contact with the adhesive resin And the adhesive resin is cured by abutting and heating the back surface of an electronic component having a terminal bonded to the electrode by the ultrasonic head. A heating head provided with a heating tool, and a control unit that continues at least from the joining by the ultrasonic head until the curing by the heating head is completed without releasing the pinching of the resin substrate by the substrate deflection correcting unit. An electronic component mounting apparatus comprising: 前記超音波ヘッドの作業位置と前記加熱ヘッドの作業位置が同一位置であり、前記超音波ヘッドと前記加熱ヘッドとを前記作業位置に対して進退させる進退手段とを備えたことを特徴とする請求項１記載の電子部品実装装置。The working position of the ultrasonic head and the working position of the heating head are the same position, and includes an advancing / retreating means for moving the ultrasonic head and the heating head back and forth with respect to the working position. Item 2. The electronic component mounting apparatus according to Item 1. 前記作業位置に対して前記基板撓み矯正部を相対的に位置決めする位置決め手段を備えたことを特徴とする請求項２記載の電子部品実装装置。3. The electronic component mounting apparatus according to claim 2, further comprising positioning means for positioning the substrate deflection correcting portion relative to the work position. 前記超音波ヘッドの作業位置と前記加熱ヘッドの作業位置が異なる位置であり、これらの作業位置に対して前記基板撓み矯正部を相対的に位置決めする位置決め手段を備えたことを特徴とする請求項１記載の電子部品実装装置。The working position of the ultrasonic head and the working position of the heating head are different positions, and positioning means is provided for positioning the substrate deflection correction portion relative to these working positions. The electronic component mounting apparatus according to 1. 薄板状の樹脂基板と電子部品を接着用樹脂にて接着するとともにこの樹脂基板に形成された電極に電子部品の端子を接合する電子部品実装方法であって、接着用樹脂が塗布された樹脂基板を基板押さえ部材とバックアップ部材とで上下から挟み込むことにより樹脂基板の撓みを矯正するステップと、前記撓みが矯正された樹脂基板の電極に電子部品の端子を接触させ且つ電子部品の下面を前記接着用樹脂に接触させた状態で電子部品の裏面から超音波ツールで超音波振動を加えることにより、前記電極と前記端子とを接合するステップと、前記超音波ツールによって前記電極に端子が接合された電子部品の裏面から加熱ツールにより前記接着用樹脂を加熱して硬化させるステップと、前記基板押さえ部材と前記バックアップ部材で前記樹脂基板を挟み込んだ状態を解除するステップとを含み、少なくとも前記超音波ツールによる接合から前記加熱ツールによる接着用樹脂の硬化が完了するまでの間、前記挟み込みを解除することなく継続することを特徴とする電子部品実装方法。An electronic component mounting method for bonding a thin plate-like resin substrate and an electronic component with an adhesive resin, and bonding terminals of the electronic component to electrodes formed on the resin substrate, wherein the resin substrate is coated with an adhesive resin The step of correcting the bending of the resin substrate by sandwiching the substrate from above and below with the substrate pressing member and the backup member, bringing the terminal of the electronic component into contact with the electrode of the resin substrate whose bending has been corrected, and bonding the lower surface of the electronic component to the adhesive A step of joining the electrode and the terminal by applying ultrasonic vibration with an ultrasonic tool from the back surface of the electronic component while being in contact with the resin, and the terminal is joined to the electrode by the ultrasonic tool A step of heating and curing the adhesive resin from the back surface of the electronic component with a heating tool; and the resin substrate using the substrate pressing member and the backup member. And the step of releasing the sandwiched state, and at least until the curing of the adhesive resin by the heating tool is completed from the joining by the ultrasonic tool, the sandwiching is continued without being released. Electronic component mounting method.
JP2002265096A 2002-09-11 2002-09-11 Electronic component mounting apparatus and electronic component mounting method Expired - Lifetime JP3724467B2 (en)

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