JP3716925B2 - Au−Sn合金めっき液 - Google Patents

Au−Sn合金めっき液 Download PDF

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Publication number
JP3716925B2
JP3716925B2 JP2002022106A JP2002022106A JP3716925B2 JP 3716925 B2 JP3716925 B2 JP 3716925B2 JP 2002022106 A JP2002022106 A JP 2002022106A JP 2002022106 A JP2002022106 A JP 2002022106A JP 3716925 B2 JP3716925 B2 JP 3716925B2
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Prior art keywords
plating solution
plating
alloy
film
acid
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Japanese (ja)
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JP2003221694A (ja
JP2003221694A5 (enExample
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芳雄 金城
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株式会社ナウケミカル
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  • Electroplating And Plating Baths Therefor (AREA)
JP2002022106A 2002-01-30 2002-01-30 Au−Sn合金めっき液 Expired - Fee Related JP3716925B2 (ja)

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JP2002022106A JP3716925B2 (ja) 2002-01-30 2002-01-30 Au−Sn合金めっき液

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JP2002022106A JP3716925B2 (ja) 2002-01-30 2002-01-30 Au−Sn合金めっき液

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JP2003221694A JP2003221694A (ja) 2003-08-08
JP2003221694A5 JP2003221694A5 (enExample) 2005-08-11
JP3716925B2 true JP3716925B2 (ja) 2005-11-16

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JP2002022106A Expired - Fee Related JP3716925B2 (ja) 2002-01-30 2002-01-30 Au−Sn合金めっき液

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JP (1) JP3716925B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006200031A (ja) * 2005-01-24 2006-08-03 Nau Chemical:Kk Au−Sn合金のめっき皮膜
US10260159B2 (en) * 2013-07-05 2019-04-16 The Boeing Company Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with gold
JP6207655B1 (ja) 2016-04-12 2017-10-04 日本エレクトロプレイテイング・エンジニヤース株式会社 非シアン系Au−Sn合金めっき液

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JP2003221694A (ja) 2003-08-08

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