JP3690796B2 - 検査冶具及びその製造方法並びに回路基板の製造方法 - Google Patents

検査冶具及びその製造方法並びに回路基板の製造方法 Download PDF

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Publication number
JP3690796B2
JP3690796B2 JP2002022873A JP2002022873A JP3690796B2 JP 3690796 B2 JP3690796 B2 JP 3690796B2 JP 2002022873 A JP2002022873 A JP 2002022873A JP 2002022873 A JP2002022873 A JP 2002022873A JP 3690796 B2 JP3690796 B2 JP 3690796B2
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hole
contact pin
plate
conductive wire
contact
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Expired - Fee Related
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Japanese (ja)
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JP2003222637A5 (enExample
JP2003222637A (ja
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和彦 両角
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株式会社コーヨーテクノス
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27745759&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP3690796(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
JP2002022873A 2002-01-31 2002-01-31 検査冶具及びその製造方法並びに回路基板の製造方法 Expired - Fee Related JP3690796B2 (ja)

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Application Number Priority Date Filing Date Title
JP2002022873A JP3690796B2 (ja) 2002-01-31 2002-01-31 検査冶具及びその製造方法並びに回路基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002022873A JP3690796B2 (ja) 2002-01-31 2002-01-31 検査冶具及びその製造方法並びに回路基板の製造方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2004333572A Division JP3690800B2 (ja) 2004-11-17 2004-11-17 検査冶具
JP2004333576A Division JP3690801B2 (ja) 2004-11-17 2004-11-17 接触ピン

Publications (3)

Publication Number Publication Date
JP2003222637A JP2003222637A (ja) 2003-08-08
JP2003222637A5 JP2003222637A5 (enExample) 2005-07-14
JP3690796B2 true JP3690796B2 (ja) 2005-08-31

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JP2002022873A Expired - Fee Related JP3690796B2 (ja) 2002-01-31 2002-01-31 検査冶具及びその製造方法並びに回路基板の製造方法

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010085107A (ja) * 2008-09-29 2010-04-15 Nidec-Read Corp 検査治具、電極構造及び電極構造の製造方法
KR101496081B1 (ko) * 2014-01-06 2015-03-02 양희성 인터포저 및 반도체 디바이스 검사용 마이크로 컨택 어레이 구조체의 제조방법

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006035856A1 (ja) * 2004-09-30 2006-04-06 Jsr Corporation 回路装置検査用電極装置およびその製造方法並びに回路装置の検査装置
JP3849948B1 (ja) 2005-11-16 2006-11-22 日本電産リード株式会社 基板検査用治具及び検査用プローブ
JP2008058215A (ja) * 2006-09-01 2008-03-13 Nidec-Read Corp 接点治具の製造方法及び接点治具
WO2008081704A1 (ja) * 2006-12-28 2008-07-10 Nhk Spring Co., Ltd. プローブユニットの配線固定方法およびプローブユニット
JP2012078297A (ja) * 2010-10-05 2012-04-19 Tokuso Riken:Kk ワイヤープローブ用治具並びにこれを用いた検査装置並びに検査方法
KR101317634B1 (ko) * 2012-03-28 2013-10-10 주식회사 브리지 반도체 테스트용 ｍｖｐ 프로브 보드 제조방법
KR20140020627A (ko) * 2012-08-10 2014-02-19 삼성전기주식회사 전기 검사용 지그의 제조방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010085107A (ja) * 2008-09-29 2010-04-15 Nidec-Read Corp 検査治具、電極構造及び電極構造の製造方法
KR101496081B1 (ko) * 2014-01-06 2015-03-02 양희성 인터포저 및 반도체 디바이스 검사용 마이크로 컨택 어레이 구조체의 제조방법

Also Published As

Publication number Publication date
JP2003222637A (ja) 2003-08-08

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