JP3664968B2 - 固体撮像素子、その製造方法及び固体撮像装置 - Google Patents

固体撮像素子、その製造方法及び固体撮像装置 Download PDF

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JP3664968B2
JP3664968B2 JP2000327663A JP2000327663A JP3664968B2 JP 3664968 B2 JP3664968 B2 JP 3664968B2 JP 2000327663 A JP2000327663 A JP 2000327663A JP 2000327663 A JP2000327663 A JP 2000327663A JP 3664968 B2 JP3664968 B2 JP 3664968B2
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semiconductor layer
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solid
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JP2001223351A5 (enExample
JP2001223351A (ja
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▲高▼ 三井田
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イノテック株式会社
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Priority to JP2000327663A priority Critical patent/JP3664968B2/ja
Priority to US09/715,065 priority patent/US6504194B1/en
Priority to TW089124519A priority patent/TW494574B/zh
Priority to EP00125237A priority patent/EP1107315A1/en
Priority to KR10-2000-0072100A priority patent/KR100416821B1/ko
Priority to CNB001344617A priority patent/CN1156011C/zh
Publication of JP2001223351A publication Critical patent/JP2001223351A/ja
Priority to HK02101057.6A priority patent/HK1040136B/xx
Priority to US10/176,174 priority patent/US6656777B2/en
Priority to US10/176,195 priority patent/US6677627B2/en
Publication of JP2001223351A5 publication Critical patent/JP2001223351A5/ja
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Publication of JP3664968B2 publication Critical patent/JP3664968B2/ja
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JP2000327663A 1999-12-01 2000-10-26 固体撮像素子、その製造方法及び固体撮像装置 Expired - Lifetime JP3664968B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2000327663A JP3664968B2 (ja) 1999-12-01 2000-10-26 固体撮像素子、その製造方法及び固体撮像装置
US09/715,065 US6504194B1 (en) 1999-12-01 2000-11-20 Solid state imaging device, method of manufacturing the same, and solid state imaging system
TW089124519A TW494574B (en) 1999-12-01 2000-11-20 Solid state imaging device, method of manufacturing the same, and solid state imaging system
EP00125237A EP1107315A1 (en) 1999-12-01 2000-11-23 Solid state imaging device and method of manufacturing the same
KR10-2000-0072100A KR100416821B1 (ko) 1999-12-01 2000-11-30 고체촬상소자, 그 구동방법 및 고체촬상장치
CNB001344617A CN1156011C (zh) 1999-12-01 2000-12-01 固态成像器件及其制造方法和固态成像系统
HK02101057.6A HK1040136B (en) 1999-12-01 2002-02-11 Solid state imaging device, method of manufacturing the same, and solid state imaging system
US10/176,174 US6656777B2 (en) 1999-12-01 2002-06-21 Solid state imaging device, method of manufacturing the same, and solid state imaging system
US10/176,195 US6677627B2 (en) 1999-12-01 2002-06-21 Solid state imaging device, method of manufacturing the same, and solid state imaging system

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP34258899 1999-12-01
JP11-342588 1999-12-01
JP2000327663A JP3664968B2 (ja) 1999-12-01 2000-10-26 固体撮像素子、その製造方法及び固体撮像装置

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JP2001223351A JP2001223351A (ja) 2001-08-17
JP2001223351A5 JP2001223351A5 (enExample) 2004-11-11
JP3664968B2 true JP3664968B2 (ja) 2005-06-29

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JP2000327663A Expired - Lifetime JP3664968B2 (ja) 1999-12-01 2000-10-26 固体撮像素子、その製造方法及び固体撮像装置

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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4004484B2 (ja) 2004-03-31 2007-11-07 シャープ株式会社 固体撮像素子の製造方法
JP2005294555A (ja) * 2004-03-31 2005-10-20 Sharp Corp 固体撮像素子およびその製造方法、電子情報機器
JP4718875B2 (ja) 2005-03-31 2011-07-06 株式会社東芝 固体撮像素子
JP4679340B2 (ja) * 2005-11-11 2011-04-27 株式会社東芝 固体撮像装置
JP2008021875A (ja) 2006-07-13 2008-01-31 Toshiba Corp 固体撮像装置
JP2008103566A (ja) 2006-10-19 2008-05-01 Toshiba Corp 固体撮像装置
JP6305030B2 (ja) 2013-11-22 2018-04-04 キヤノン株式会社 光電変換装置の製造方法
JP6595750B2 (ja) * 2014-03-14 2019-10-23 キヤノン株式会社 固体撮像装置及び撮像システム

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