JP3635908B2

JP3635908B2 - Resistor and manufacturing method thereof

Info

Publication number: JP3635908B2
Application number: JP00665798A
Authority: JP
Inventors: 尚弘高嶋
Original assignee: Panasonic Corp; Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Corp; Panasonic Holdings Corp
Priority date: 1998-01-16
Filing date: 1998-01-16
Publication date: 2005-04-06
Anticipated expiration: 2018-01-16
Also published as: JPH11204306A

Description

【０００１】
【発明の属する技術分野】
本発明は、抵抗器およびその製造方法に関するものである。
【０００２】
【従来の技術】
従来の技術は、特開平４−１０２３０２号に開示されたものが知られている。
【０００３】
以下、従来の抵抗器およびその製造方法について、図面を参照しながら説明する。
【０００４】
図７は従来の抵抗器の断面図である。
図において、１は絶縁基板である。２は絶縁基板１の裏面の左右両端部に設けられた裏面電極層である。３は絶縁基板１の上面の左右両端部に設けられた第１の上面電極層である。４は第１の上面電極層３に一部が重なるように設けられた抵抗層である。５は抵抗値を修正するために抵抗層上に設けられたトリミング溝である。６は抵抗層４の上面にのみ設けられた第２の保護層である。７は第１の上面電極層３の上面に絶縁基板１の幅一杯まで延びるように設けられた第２の上面電極層である。８は裏面電極層２と第２の上面電極層７を電気的に接続するために絶縁基板１の側面に設けられた側面電極層である。９，１０は裏面電極層２、第２の上面電極層７および側面電極層８の表面に設けられたニッケルめっき層、はんだめっき層である。この時、側面電極層形成時に、上面電極層の上面部にまで側面電極層が回り込むため、上面電極層より側面電極層が高く形成される。つまり、従来の抵抗器は、上面電極層上では側面電極の形成されている側端部が一番高くなっている。
【０００５】
以上のように構成された従来の抵抗器について、以下にその製造方法を図面を参照しながら説明する。
【０００６】
図８，９は従来の抵抗器の製造方法を示す工程図である。
まず、図８（ａ）に示すように、絶縁基板１の裏面の左右両端部に裏面電極層２（図示せず）を塗着形成し、上面の左右両端部に第１の上面電極層３を塗着形成する。
【０００７】
次に、図８（ｂ）に示すように、第１の上面電極層３に一部が重なるように絶縁基板１の上面に抵抗層４を塗着形成する。
【０００８】
次に、図８（ｃ）に示すように、抵抗層４における全抵抗値が所定の抵抗値の範囲内に入るようにレーザ等により抵抗層４にトリミング溝５を施す。
【０００９】
次に、図９（ａ）に示すように、抵抗層４の上面にのみ第２の保護層６を塗着形成する。
【００１０】
次に、図９（ｂ）に示すように、第１の上面電極層３の上面に絶縁基板１の幅一杯まで延びるように第２の上面電極層７を塗着形成する。
【００１１】
次に、図９（ｃ）に示すように、第１の上面電極層３および絶縁基板の左右両端の側面に第１、第２の上面電極層３，７と電気的に接続するように側面電極層８を塗着形成する。
【００１２】
最後に、第２の上面電極層７および側面電極層８の表面にニッケルめっきを施した後、はんだめっきを施すことにより、ニッケルめっき層９、はんだめっき層１０を形成し、従来の抵抗器を製造していた。
【００１３】
【発明が解決しようとする課題】
しかしながら、上記従来の構成および製造方法では、側面電極層８形成時に第２の上面電極層７上に側面電極層８が回り込み、第２の上面電極層７よりも高く形成され、突出部１１が形成されるため、トリミング工程では、図１０（ａ）に示すように、第１の上面電極層３の上の突出部１１にトリミングプローブ１２が当接するのに対し、完成抵抗値選別工程では、図１０（ｂ）に示すように、突出部１３上のめっき層に完成抵抗値選別器プローブ１４が当接し、トリミング工程と完成抵抗値選別工程でのプローブの当接位置がずれる。また更に、側面電極材料の上面電極層への回り込み量が変化するため、完成抵抗値選別工程のプローブ当接位置が安定しない。そのため、特に低抵抗値（１Ω以下）の場合は、トリミングプローブ当接位置から完成抵抗値選別工程のプローブ当接位置までの抵抗値が無視できないためトリミング時の抵抗値と完成抵抗値選別時の抵抗値が変化する上にその変化量が製品毎に異なるため、歩留まりが悪化するという課題を有していた。
【００１４】
本発明は、上記従来の課題を解決するもので、トリミング工程でのプローブ当接位置と完成抵抗値選別工程でのプローブ当接位置を同一にすることで、低抵抗でも安定した生産のできる抵抗器およびその製造方法を提供することを目的とするものである。
【００１５】
【課題を解決するための手段】
上記目的を達成するために本発明は、第１の上面電極層の上面に基板の側縁から離間して設けられた前記第１の上面電極層と同材料の一対の第２の上面電極層を設けてなるものである。
【００１６】
また、第１の上面電極層と同一の電極材料にて前記第１の上面電極層の上面に前記シート基板の分割溝の真上から離間して第２の上面電極層を形成する工程と、前記第２の上面電極に少なくとも２端子のプローブを当接しながら所望の抵抗値となるように前記抵抗層をトリミングする工程とを含む製造方法とからなるものである。
【００１７】
【発明の実施の形態】
本発明の請求項１に記載の発明は、基板と、前記基板の下面の側部に設けられた一対の下面電極層と、前記基板の上面に設けられた抵抗層と、前記基板の側部に設けられると共に前記抵抗層に重畳するように設けられた前記下面電極層と電極材料の異なる一対の第１の上面電極層と、前記第１の上面電極層の上面に前記基板の側縁から離間して設けられた前記第１の上面電極層と同材料の一対の第２の上面電極層と、少なくとも前記抵抗層を覆うように設けられた保護層と、少なくとも前記基板の側部および第１の上面電極層の前記第２の上面電極層を有していない上面に設けられた前記第２の上面電極層より高さが低い側面電極層と、前記下面電極層、第２の上面電極層および側面電極層を覆うようにめっき層を設けてなるものである。
【００１８】
また、請求項２に記載の発明は、請求項１記載の抵抗層は、基板の側端部まで設けられてなるものである。
【００１９】
また、請求項３に記載の発明は、請求項１記載の下面電極層は、基板の側端部まで設けられてなるものである。
【００２０】
また、請求項４に記載の発明は、請求項１記載の第１の上面電極層は、基板の側端部まで設けられてなるものである。
【００２１】
また、請求項５に記載の発明は、請求項１記載の下面電極層は銅の導電粉体にガラスフリットを含有してなり、第１および第２の上面電極層は銅からなり、抵抗層はニッケルと銅の合金粉からなるものである。
【００２２】
また、請求項６に記載の発明は、請求項１記載の下面電極層は銀の導電粉体にガラスフリットを含有してなり、第１および第２の上面電極層は銀とパラジウムの導電粉体にガラスフリットを含有してなり、抵抗層は銀とパラジウムの合金粉からなるものである。
【００２３】
また、請求項７に記載の発明は、請求項１記載の側面電極層は、少なくともガラスまたは樹脂を含有してなる導電性材料からなるものである。
【００２４】
また、請求項８に記載の発明は、分割溝を有するシート基板の下面の分割溝を跨ぐように下面電極を形成する工程と、前記分割溝で区切られた一区画内の側部を除いた上面に抵抗層を形成する工程と、前記下面電極層の電極材料と異なる電極材料にて前記シート基板の上面の分割溝を跨ぐと共に前記抵抗層に一部が重畳するように第１の上面電極層を形成する工程と、前記第１の上面電極層と同一の電極材料にて前記第１の上面電極層の上面に前記シート基板の分割溝の真上から離間して第２の上面電極層を形成する工程と、前記第２の上面電極に少なくとも２端子のプローブを当接しながら所望の抵抗値となるように前記抵抗層をトリミングする工程と、少なくとも前記抵抗層を覆うように保護層を形成する工程と、前記保護層を有するシート基板を短冊状に分割する工程と、少なくとも前記短冊状基板の側面および第１の上面電極層の第２の上面電極層を有していない上面に前記第２の上面電極層より高さが低く側面電極層を形成する工程と、前記側面電極層を形成してなる前記短冊状基板を分割して個片基板を形成する工程と、前記下面電極層、第２の上面電極層および側面電極層を覆うようにめっき層を形成する工程と、前記第２の上面電極の上面の前記めっき層の上面でかつ前記トリミング工程と同位置に少なくとも２端子のプローブを当接して抵抗値を測定し所望の抵抗値範囲に選別する工程とからなるものである。
【００２５】
また、請求項９に記載の発明は、請求項８記載の抵抗層を形成する工程は、基板の側端部まで設けられてなる工程であるものである。
【００２６】
また、請求項１０に記載の発明は、請求項８記載の下面電極層を形成する工程は、基板の側端部まで設けられてなる工程であるものである。
【００２７】
また、請求項１１に記載の発明は、請求項８記載の第１の上面電極層を形成する工程は、基板の側端部まで設けられてなる工程であるものである。
【００２８】
また、請求項１２に記載の発明は、請求項８記載の下面電極層を形成する工程は銅の導電粉体にガラスフリットを含有してなる材料を印刷・焼成してなる工程で、第１および第２の上面電極層を形成する工程は、銅からなる材料を印刷・焼成してなる工程で、抵抗層を形成する工程はニッケルと銅またはニッケルとリンの合金粉からなる材料を印刷・焼成してなる工程であるものである。
【００２９】
また、請求項１３に記載の発明は、請求項８記載の下面電極層を形成する工程は銀の導電粉体にガラスフリットを含有してなる材料を印刷・焼成してなる工程で、第１および第２の上面電極層を形成する工程は銀とパラジウムの導電粉体にガラスフリットを含有してなる材料を印刷・焼成してなる工程で、抵抗層を形成する工程は銀とパラジウムの合金粉からなる材料を印刷・焼成してなる工程であるものである。
【００３０】
また、請求項１４に記載の発明は、請求項８記載の側面電極層を形成する工程は、少なくともガラスまたは樹脂を含有する導電性材料からなる材料を塗布・焼成または硬化してなる工程であるものである。
【００３１】
この構成および製造方法により、トリミング時のプローブ当接位置と完成抵抗値選別工程でのプローブ当接位置を同一にすることができ、低抵抗値でも抵抗値歩留まりの安定した抵抗器およびその製造方法を提供できるという作用を有するものである。
【００３２】
（実施の形態１）
以下、本発明の実施の形態１における抵抗器およびその製造方法について、図面を参照しながら説明する。
【００３３】
図１は、本発明の実施の形態１における抵抗器の断面図である。
【００３４】
図１において、２１はアルミナ等からなる基板である。２２は基板２１の下面側部に設けられた銅とガラスとの混合材料からなる一対の下面電極層である。２３は基板２１の上面に設けられた銅とニッケルとの混合材料からなる抵抗層である。２４は基板２１の上面側部に抵抗層２３に一部が重畳して電気的に接続するように設けられた下面電極層２２の電極材料の異なる銅からなる一対の第１の上面電極層である。２５は第１の上面電極層２４の上面に基板側部から離間して設けられた第１の上面電極層２４と同材料の銅からなる第２の上面電極層である。２６は抵抗層２３に設けられたトリミング溝である。２７は少なくとも前記抵抗層２３の上面を覆うように設けられたエポキシ系の樹脂等からなる保護層である。２８は第１の上面電極層２４と下面電極層２２を電気的に接続するように少なくとも基板２１の側面および第１の上面電極層２４の第２の上面電極層２５を有していない上面に設けられた銀とフェノール系の樹脂との混合材料等からなる側面電極層で、第２の上面電極層２５より高さが低く設けられたものである。２９は必要により下面電極層２２、第１、第２の上面電極層２４，２５および側面電極層２８を覆うように設けられたニッケルめっき等からなる第１のめっき層である。３０は必要により第１のめっき層２９を覆うように設けられたはんだめっき等からなる第２のめっき層である。
【００３５】
以上のように構成された抵抗器について、以下にその製造方法を図面を参照しながら説明する。
【００３６】
図２，３は本発明の実施の形態１における抵抗器の製造方法を示す工程図である。
【００３７】
まず、図２（ａ）に示すように、縦横の分割溝３１を有するアルミナ等からなるシート３２の一方の主面上に分割溝３１を跨ぐように銅とガラスとの混合ペースト材料をスクリーン印刷・乾燥し（図示せず）、シート３２の更に他方の主面上に分割溝３１で区切られた一区画内の側部を除いた上面に銅とニッケルとの混合ペースト材料をスクリーン印刷・乾燥して、窒素雰囲気のベルト式連続焼成炉によって約９５０℃の温度で、約５０分のプロファイルによって焼成し、下面電極層３３と抵抗層３４を形成する。
【００３８】
次に、図２（ｂ）に示すように、シート３２の上面の分割溝３１を跨いで、抵抗層３４の一部に重畳するように、銅のペースト材料をスクリーン印刷・乾燥し、更にその上に分割溝３１から離間して銅のペースト材料をスクリーン印刷・乾燥して、窒素雰囲気のベルト式連続焼成炉によって約９５０℃の温度で、約５０分のプロファイルによって焼成し、第１の上面電極層３５と第２の上面電極層３６を形成する。
【００３９】
次に、図２（ｃ）に示すように、抵抗層３４の抵抗値を修正するために、少なくとも２端子のプローブを第２の上面電極層３６上の３７部に当接しながらレーザ等によりトリミングし、トリミング溝３８を形成する。
【００４０】
次に、図２（ｄ）に示すように、少なくとも第１、第２の上面電極層３５，３６の重畳されていない抵抗層３４の上面を覆うようにエポキシ系樹脂ペーストをスクリーン印刷・乾燥し、箱形乾燥炉によって約２００℃の温度で、約３０分硬化し、保護層３９を形成する。
【００４１】
次に、図３（ａ）に示すように、シート３２の分割溝３１に沿って分割して、短冊状の基板４０を形成する。
【００４２】
次に、図３（ｂ）に示すように、下面電極層３３と第１の上面電極層３５とを電気的に接続するように、銀とフェノール系樹脂との混合ペースト材料をローラー転写印刷・乾燥し、箱形乾燥炉によって約２００℃の温度で、約３０分硬化し、側面電極層４１を形成する。
【００４３】
次に、図３（ｃ）に示すように、短冊状の基板４０を個片に分割して、個片状の基板４２を形成する。
【００４４】
最後に、図３（ｄ）に示すように、下面電極層３３、第１、第２の上面電極層３５，３６および側面電極層４１を覆うようにニッケルめっき等からなる第１のめっき層（図示せず）を形成するとともに、この第１のめっき層を覆うようにスズと鉛との合金めっき等からなる第２のめっき層４３を形成し、第２の上面電極層３６の上面部のめっき層４３でかつトリミング時と同位置４４に少なくとも２端子のプローブを当接して抵抗値を測定し、所望の抵抗値範囲に選別して抵抗器を製造するものである。
【００４５】
以上のように構成・製造された本発明の実施の形態１における抵抗器を３．２×２．５ｍｍサイズの５０ｍΩで作製し、その抵抗値分布並びに歩留まりを比較した。図４は従来の抵抗器と本実施の形態１における抵抗器とのトリミング工程における抵抗値分布特性を示す図であり、図５は本発明の実施の形態１における抵抗器の完成抵抗値選別工程における抵抗値分布特性を示す図である。また、（表１）に、同完成抵抗値歩留まりを示す。この時、抵抗値分布はｎ＝１００個をハンド測定を行ったときの結果で、歩留まりはｎ＝１０，０００個を完成抵抗値選別機で選別した結果である。
【００４６】
【表１】

【００４７】
図４（ａ）、図５（ａ）および（表１）から分かるように、従来の抵抗器ではトリミング工程から完成抵抗値選別工程で抵抗値が変化すると共に抵抗値分布が悪化しており、完成抵抗値選別機での歩留まりも悪い。それに対し、図４（ｂ）、図５（ｂ）および（表１）から分かるように、本実施の形態１の抵抗器では、トリミング工程と完成抵抗値選別工程でのプローブ当接位置を同一にすることができるため、トリミング工程から完成抵抗値選別工程で抵抗値も抵抗値分布もほとんど変化せず、完成抵抗値選別機での歩留まりも良好であることが分かる。
【００４８】
また、本発明の実施の形態において下面電極層２２と抵抗層２３を同時に形成し、第１の上面電極層２４と第２の上面電極層２５を同時に形成した場合について説明したが、それぞれ個別に、または全て同時に形成しても良い。
【００４９】
（実施の形態２）
以下、本発明の実施の形態２における抵抗器について、図面を参照しながら説明する。
【００５０】
図６は本発明の実施の形態２における抵抗器の断面図である。
ここで、実施の形態１と相違する点は、抵抗層５１が基板５２の側端部まで設けられたものである。抵抗層５１を基板の側端部まで設けることにより、短冊状に分割する際に、抵抗層５１で基板５２との密着強度を向上することにより、第１の上面電極層５３の剥がれやバリを低減することができるものである。
【００５１】
上述した抵抗層５１を基板５２の側端部まで設けた点以外は、実施の形態１と同一であるので、説明は省略する。
【００５２】
また、本発明の実施の形態において下面電極層２２、抵抗層２３、第１、第２の上面電極層２４，２５、保護層２７および側面電極層２８を（表２）に示す組み合わせとしたときに、（表２）に記載された他の優れた効果が得られる。
【００５３】
【表２】

【００５４】
【発明の効果】
以上のように本発明は、トリミング工程でのプローブ当接位置と完成抵抗値選別工程でのプローブ当接位置を同一にすることで、低抵抗でも歩留まりの良い安定した生産のできる抵抗器およびその製造方法を提供できるものである。
【図面の簡単な説明】
【図１】本発明の実施の形態１における抵抗器の断面図
【図２】同製造方法を示す工程図
【図３】同製造方法を示す工程図
【図４】（ａ）従来の抵抗器のトリミング工程での抵抗値分布を示す図
（ｂ）本発明の実施の形態１における抵抗器のトリミング工程での抵抗値分布を示す図
【図５】（ａ）従来の抵抗器の完成抵抗値選別工程での抵抗値分布を示す図
（ｂ）本発明の実施の形態１における抵抗器の完成抵抗値選別工程での抵抗値分布を示す図
【図６】本発明の実施の形態２における抵抗器の断面図
【図７】従来の抵抗器の断面図
【図８】同製造方法を示す工程図
【図９】同製造方法を示す工程図
【図１０】（ａ）従来の抵抗器のトリミング工程でのプローブ当接位置を示す図
（ｂ）同完成抵抗値選別工程でのプローブ当接位置を示す図
【符号の説明】
２１基板
２２下面電極層
２３抵抗層
２４第１の上面電極層
２５第２の上面電極層
２６トリミング溝
２７保護層
２８側面電極層
２９ニッケルめっき層
３０はんだめっき層[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a resistor and a manufacturing method thereof.
[0002]
[Prior art]
As a conventional technique, one disclosed in JP-A-4-102302 is known.
[0003]
Hereinafter, a conventional resistor and a manufacturing method thereof will be described with reference to the drawings.
[0004]
FIG. 7 is a cross-sectional view of a conventional resistor.
In the figure, reference numeral 1 denotes an insulating substrate. Reference numeral 2 denotes a back electrode layer provided on both right and left ends of the back surface of the insulating substrate 1. Reference numeral 3 denotes a first upper surface electrode layer provided at both left and right end portions of the upper surface of the insulating substrate 1. A resistance layer 4 is provided so as to partially overlap the first upper surface electrode layer 3. Reference numeral 5 denotes a trimming groove provided on the resistance layer in order to correct the resistance value. Reference numeral 6 denotes a second protective layer provided only on the upper surface of the resistance layer 4. Reference numeral 7 denotes a second upper surface electrode layer provided on the upper surface of the first upper surface electrode layer 3 so as to extend to the full width of the insulating substrate 1. Reference numeral 8 denotes a side electrode layer provided on the side surface of the insulating substrate 1 in order to electrically connect the back electrode layer 2 and the second top electrode layer 7.

Reference numerals

9 and 10 denote a nickel plating layer and a solder plating layer provided on the surfaces of the back electrode layer 2, the second top electrode layer 7 and the side electrode layer 8, respectively. At this time, when the side electrode layer is formed, the side electrode layer extends to the upper surface portion of the upper electrode layer, so that the side electrode layer is formed higher than the upper electrode layer. That is, in the conventional resistor, the side end portion on which the side electrode is formed is the highest on the upper electrode layer.
[0005]
A manufacturing method of the conventional resistor configured as described above will be described below with reference to the drawings.
[0006]
8 and 9 are process diagrams showing a conventional resistor manufacturing method.
First, as shown in FIG. 8A, a back electrode layer 2 (not shown) is applied and formed on both left and right end portions of the back surface of the insulating substrate 1, and the first top electrode layer 3 is formed on both left and right end portions of the top surface. Coating and forming.
[0007]
Next, as shown in FIG. 8B, a resistance layer 4 is formed on the upper surface of the insulating substrate 1 so as to partially overlap the first upper surface electrode layer 3.
[0008]
Next, as shown in FIG. 8C, a trimming groove 5 is formed in the resistance layer 4 with a laser or the like so that the total resistance value in the resistance layer 4 falls within a predetermined resistance value range.
[0009]
Next, as shown in FIG. 9A, the second protective layer 6 is applied and formed only on the upper surface of the resistance layer 4.
[0010]
Next, as shown in FIG. 9B, the second upper surface electrode layer 7 is formed on the upper surface of the first upper surface electrode layer 3 so as to extend to the full width of the insulating substrate 1.
[0011]
Next, as shown in FIG. 9C, the first upper surface electrode layer 3 and the side surfaces on both left and right ends of the insulating substrate are connected to the first and second upper

surface electrode layers

3 and 7 in side surfaces. The electrode layer 8 is formed by coating.
[0012]
Finally, after nickel plating is applied to the surfaces of the second upper surface electrode layer 7 and the side electrode layer 8, the nickel plating layer 9 and the solder plating layer 10 are formed by applying solder plating, and the conventional resistor is formed. It was manufactured.
[0013]
[Problems to be solved by the invention]
However, in the conventional configuration and manufacturing method described above, the side electrode layer 8 wraps around the second upper surface electrode layer 7 when the side electrode layer 8 is formed, is formed higher than the second upper surface electrode layer 7, and the protrusion 11 is formed. In the trimming process, as shown in FIG. 10A, the trimming probe 12 abuts on the protruding portion 11 on the first upper surface electrode layer 3, whereas in the completed resistance value selecting process, As shown in FIG. 10B, the completed resistance value selector probe 14 comes into contact with the plating layer on the protrusion 13, and the contact position of the probe in the trimming process and the completed resistance value selection process is shifted. Furthermore, since the amount of wrapping of the side electrode material to the upper electrode layer changes, the probe contact position in the completed resistance value selection step is not stable. Therefore, particularly in the case of a low resistance value (1Ω or less), the resistance value from the trimming probe contact position to the probe contact position in the completed resistance value selection process cannot be ignored. Since the resistance value is changed and the amount of change is different for each product, there is a problem that the yield is deteriorated.
[0014]
The present invention solves the above-described conventional problems, and by making the probe contact position in the trimming process the same as the probe contact position in the completed resistance value selection process, a resistance that enables stable production even at a low resistance. It is an object to provide a container and a method for manufacturing the same.
[0015]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides a pair of second upper surface electrode layers made of the same material as the first upper surface electrode layer provided on the upper surface of the first upper surface electrode layer so as to be separated from the side edge of the substrate. Is provided.
[0016]
A step of forming a second upper surface electrode layer on the upper surface of the first upper surface electrode layer by using the same electrode material as the first upper surface electrode layer, spaced apart from directly above the dividing groove of the sheet substrate; And a step of trimming the resistance layer so as to obtain a desired resistance value while abutting a probe having at least two terminals on the second upper surface electrode.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
According to a first aspect of the present invention, there is provided a substrate, a pair of lower surface electrode layers provided on a side portion of the lower surface of the substrate, a resistance layer provided on the upper surface of the substrate, and a side portion of the substrate. A pair of first upper surface electrode layers different in electrode material from the lower surface electrode layer provided so as to overlap with the resistance layer, and an upper surface of the first upper surface electrode layer from a side edge of the substrate A pair of second upper surface electrode layers made of the same material as the first upper surface electrode layer provided apart from each other, a protective layer provided to cover at least the resistance layer, at least a side portion of the substrate, and a first A side electrode layer having a height lower than that of the second upper surface electrode layer provided on an upper surface of the upper surface electrode layer of the first upper surface electrode layer, the lower surface electrode layer, and the second upper surface electrode; A plating layer is provided so as to cover the layer and the side electrode layer.
[0018]
According to a second aspect of the present invention, the resistance layer according to the first aspect is provided up to the side edge of the substrate.
[0019]
According to a third aspect of the present invention, the lower electrode layer according to the first aspect is provided up to the side edge of the substrate.
[0020]
According to a fourth aspect of the present invention, the first upper surface electrode layer according to the first aspect is provided up to the side edge of the substrate.
[0021]
According to a fifth aspect of the present invention, the lower electrode layer according to the first aspect comprises copper conductive powder containing glass frit, the first and second upper electrode layers are made of copper, and the resistance layer Is made of an alloy powder of nickel and copper.
[0022]
According to a sixth aspect of the present invention, the lower electrode layer according to the first aspect comprises silver conductive powder containing glass frit, and the first and second upper electrode layers are composed of silver and palladium conductive powder. The body contains glass frit, and the resistance layer is made of an alloy powder of silver and palladium.
[0023]
According to a seventh aspect of the present invention, the side electrode layer according to the first aspect is made of a conductive material containing at least glass or resin.
[0024]
The invention described in claim 8 excludes the step of forming the lower surface electrode so as to straddle the dividing groove on the lower surface of the sheet substrate having the dividing groove, and the side portion in one section delimited by the dividing groove. A step of forming a resistance layer on the upper surface, and a first upper surface electrode so as to straddle the dividing groove on the upper surface of the sheet substrate with an electrode material different from the electrode material of the lower surface electrode layer and to partially overlap the resistance layer Forming a layer, and a second upper surface electrode layer spaced apart from directly above the dividing groove of the sheet substrate on the upper surface of the first upper surface electrode layer with the same electrode material as the first upper surface electrode layer Forming a protective layer so as to cover at least the resistance layer, and a step of trimming the resistance layer so as to have a desired resistance value while abutting a probe having at least two terminals on the second upper surface electrode. Forming the protective layer A step of dividing the substrate into strips, and at least a side surface of the strip substrate and an upper surface of the first upper surface electrode layer that does not have the second upper surface electrode layer have a height higher than that of the second upper surface electrode layer. A step of forming a low side electrode layer, a step of dividing the strip substrate formed by forming the side electrode layer to form an individual substrate, the bottom electrode layer, the second top electrode layer, and the side electrode Forming a plating layer so as to cover the layer, and measuring the resistance value by contacting a probe of at least two terminals on the upper surface of the plating layer on the upper surface of the second upper surface electrode at the same position as the trimming step. And a step of selecting a desired resistance value range.
[0025]
According to a ninth aspect of the present invention, the step of forming the resistance layer according to the eighth aspect is a step in which the step is provided up to the side edge of the substrate.
[0026]
According to a tenth aspect of the present invention, the step of forming the lower surface electrode layer according to the eighth aspect is a step that is provided up to the side edge of the substrate.
[0027]
According to an eleventh aspect of the present invention, the step of forming the first upper surface electrode layer according to the eighth aspect is a step in which the step is provided up to the side edge of the substrate.
[0028]
According to a twelfth aspect of the present invention, the step of forming the bottom electrode layer according to the eighth aspect is a step of printing and baking a material containing glass frit on a copper conductive powder. The step of forming the second upper surface electrode layer is a step of printing and baking a material made of copper, and the step of forming the resistance layer is a printing of a material made of alloy powder of nickel and copper or nickel and phosphorus. It is a process formed by firing.
[0029]
According to a thirteenth aspect of the present invention, the step of forming the bottom electrode layer according to the eighth aspect is a step of printing and baking a material containing glass frit on a silver conductive powder. The step of forming the second upper surface electrode layer is a step of printing and firing a material containing glass frit on silver and palladium conductive powder, and the step of forming the resistance layer is an alloy of silver and palladium. This is a process of printing and baking a material made of powder.
[0030]
In the invention described in claim 14, the step of forming the side electrode layer described in claim 8 is a step formed by applying, firing or curing a material made of a conductive material containing at least glass or resin. Is.
[0031]
With this configuration and manufacturing method, the probe contact position at the time of trimming and the probe contact position in the completed resistance value selection step can be made the same, and a resistor having a stable resistance value yield even with a low resistance value, and a manufacturing method thereof It has the effect | action that can be provided.
[0032]
(Embodiment 1)
Hereinafter, the resistor and the manufacturing method thereof according to Embodiment 1 of the present invention will be described with reference to the drawings.
[0033]
FIG. 1 is a cross-sectional view of a resistor according to Embodiment 1 of the present invention.
[0034]
In FIG. 1, 21 is a substrate made of alumina or the like. Reference numeral 22 denotes a pair of lower surface electrode layers made of a mixed material of copper and glass provided on the lower surface side portion of the substrate 21. Reference numeral 23 denotes a resistance layer made of a mixed material of copper and nickel provided on the upper surface of the substrate 21. Reference numeral 24 denotes a pair of first upper surface electrode layers made of copper of different electrode materials of the lower surface electrode layer 22 provided so as to be partially connected to the resistance layer 23 and electrically connected to the upper surface side portion of the substrate 21. is there. Reference numeral 25 denotes a second upper surface electrode layer made of copper of the same material as the first upper surface electrode layer 24 provided on the upper surface of the first upper surface electrode layer 24 so as to be separated from the side of the substrate. Reference numeral 26 denotes a trimming groove provided in the resistance layer 23. Reference numeral 27 denotes a protective layer made of epoxy resin or the like provided so as to cover at least the upper surface of the resistance layer 23. Reference numeral 28 denotes at least a side surface of the substrate 21 and an upper surface of the first upper surface electrode layer 24 that does not have the second upper surface electrode layer 25 so as to electrically connect the first upper surface electrode layer 24 and the lower surface electrode layer 22. A side electrode layer made of a mixed material of silver and phenolic resin or the like, which is provided lower in height than the second upper surface electrode layer 25. Reference numeral 29 denotes a first plating layer made of nickel plating or the like provided so as to cover the lower surface electrode layer 22, the first and second upper surface electrode layers 24 and 25, and the side electrode layer 28. Reference numeral 30 denotes a second plating layer made of solder plating or the like provided so as to cover the first plating layer 29 as necessary.
[0035]
The manufacturing method of the resistor configured as described above will be described below with reference to the drawings.
[0036]
2 and 3 are process diagrams showing a method for manufacturing a resistor according to the first embodiment of the present invention.
[0037]
First, as shown in FIG. 2 (a), a mixed paste material of copper and glass is screen-printed on one main surface of a sheet 32 made of alumina or the like having vertical and horizontal dividing grooves 31 so as to straddle the dividing grooves 31. Dry (not shown), and screen-print and dry a mixed paste material of copper and nickel on the upper surface of the sheet 32 on the other main surface, excluding the side portions in one section partitioned by the dividing groove 31 Then, the lower electrode layer 33 and the resistance layer 34 are formed by baking in a belt-type continuous baking furnace in a nitrogen atmosphere at a temperature of about 950 ° C. with a profile of about 50 minutes.
[0038]
Next, as shown in FIG. 2 (b), the copper paste material is screen printed and dried so as to overlap the part of the resistance layer 34 across the dividing groove 31 on the upper surface of the sheet 32, and further The copper paste material is screen-printed and dried apart from the dividing groove 31 and fired in a belt-type continuous firing furnace in a nitrogen atmosphere at a temperature of about 950 ° C. with a profile of about 50 minutes. An electrode layer 35 and a second upper surface electrode layer 36 are formed.
[0039]
Next, as shown in FIG. 2C, in order to correct the resistance value of the resistance layer 34, trimming with a laser or the like while contacting a probe of at least two terminals with the 37 portion on the second upper surface electrode layer 36. Then, the trimming groove 38 is formed.
[0040]
Next, as shown in FIG. 2D, an epoxy resin paste is screen-printed and dried so as to cover at least the upper surface of the resistance layer 34 on which the first and second upper surface electrode layers 35 and 36 are not superimposed. The protective layer 39 is formed by curing for about 30 minutes at a temperature of about 200 ° C. in a box drying oven.
[0041]
Next, as shown in FIG. 3A, a strip-shaped substrate 40 is formed by dividing along the dividing groove 31 of the sheet 32.
[0042]
Next, as shown in FIG. 3B, a mixed paste material of silver and a phenolic resin is printed by roller transfer printing so that the lower electrode layer 33 and the first upper electrode layer 35 are electrically connected. The side electrode layer 41 is formed by drying and curing in a box drying furnace at a temperature of about 200 ° C. for about 30 minutes.
[0043]
Next, as shown in FIG. 3C, the strip-shaped substrate 40 is divided into individual pieces to form the individual substrate 42.
[0044]
Finally, as shown in FIG. 3D, a first plating layer (for example, nickel plating) covering the lower surface electrode layer 33, the first and second upper surface electrode layers 35 and 36, and the side surface electrode layer 41 ( (Not shown) and a second plating layer 43 made of an alloy plating of tin and lead or the like is formed so as to cover the first plating layer, and the upper surface portion of the second upper surface electrode layer 36 is formed. A resistance value is measured by contacting a probe of at least two terminals at the same position 44 as that at the time of trimming on the plating layer 43, and a resistor is manufactured by selecting a desired resistance value range.
[0045]
The resistor according to the first embodiment of the present invention configured and manufactured as described above was fabricated with a size of 3.2 × 2.5 mm and 50 mΩ, and the resistance value distribution and the yield were compared. FIG. 4 is a diagram showing resistance value distribution characteristics in the trimming process of the conventional resistor and the resistor in the first embodiment, and FIG. 5 is a completed resistance value selecting process in the resistor in the first embodiment of the present invention. It is a figure which shows the resistance value distribution characteristic in. Table 1 shows the completed resistance value yield. At this time, the resistance value distribution is a result when n = 100 pieces are measured by hand, and the yield is a result of selecting n = 10,000 pieces by a completed resistance value sorter.
[0046]
[Table 1]

[0047]
As can be seen from FIGS. 4 (a), 5 (a), and (Table 1), in the conventional resistor, the resistance value changes from the trimming process to the completed resistance value selection process and the resistance value distribution deteriorates. Yield with finished resistance value sorter is also poor. On the other hand, as can be seen from FIGS. 4B, 5B, and (Table 1), in the resistor of the first embodiment, the probe contact positions in the trimming process and the completed resistance selection process are the same. Therefore, it can be seen that the resistance value and the resistance value distribution hardly change from the trimming process to the completed resistance value selection process, and the yield in the completed resistance value selection machine is also good.
[0048]
In the embodiment of the present invention, the case where the lower surface electrode layer 22 and the resistance layer 23 are formed at the same time and the first upper surface electrode layer 24 and the second upper surface electrode layer 25 are formed at the same time has been described. Or all of them may be formed simultaneously.
[0049]
(Embodiment 2)
Hereinafter, the resistor in Embodiment 2 of this invention is demonstrated, referring drawings.
[0050]
FIG. 6 is a cross-sectional view of the resistor according to the second embodiment of the present invention.
Here, the difference from the first embodiment is that the resistance layer 51 is provided up to the side end of the substrate 52. By providing the resistance layer 51 up to the side edge of the substrate, when the strip is divided into strips, the resistance layer 51 improves the adhesion strength with the substrate 52, thereby removing the first upper surface electrode layer 53 from peeling or burr. It can be reduced.
[0051]
Since the above-described resistance layer 51 is the same as that of the first embodiment except that the resistance layer 51 is provided up to the side edge of the substrate 52, the description thereof is omitted.
[0052]
In the embodiment of the present invention, when the lower electrode layer 22, the resistance layer 23, the first and second upper electrode layers 24 and 25, the protective layer 27, and the side electrode layer 28 are combined as shown in (Table 2). In addition, other excellent effects described in (Table 2) can be obtained.
[0053]
[Table 2]

[0054]
【The invention's effect】
As described above, the present invention makes the probe contact position in the trimming process the same as the probe contact position in the finished resistance value selection process, and a resistor capable of stable production with good yield even at low resistance, and its A manufacturing method can be provided.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a resistor according to a first embodiment of the present invention. FIG. 2 is a process diagram showing the manufacturing method. FIG. 3 is a process diagram showing the manufacturing method. FIG. 5B is a diagram showing a resistance value distribution in the trimming process of FIG. 5B. FIG. 5A is a diagram showing a resistance value distribution in the resistor trimming process in the first embodiment of the present invention. FIG. 6B is a diagram showing the resistance value distribution in the sorting step. FIG. 6B is a diagram showing the resistance value distribution in the completed resistance value sorting step of the resistor according to the first embodiment of the present invention. FIG. 7 is a sectional view of a conventional resistor. FIG. 8 is a process diagram illustrating the manufacturing method. FIG. 9 is a process diagram illustrating the manufacturing method. FIG. 10 (a) Trimming of a conventional resistor. The figure which shows the probe contact position in a process (b) The figure which shows the probe contact position in the completion resistance value selection process Description of the code]
21 Substrate 22 Lower electrode layer 23 Resistance layer 24 First upper electrode layer 25 Second upper electrode layer 26 Trimming groove 27 Protective layer 28 Side electrode layer 29 Nickel plating layer 30 Solder plating layer

Claims

A substrate, a pair of lower surface electrode layers provided on the side of the lower surface of the substrate, a resistance layer provided on the upper surface of the substrate, and provided on the side of the substrate and overlapping the resistance layer A pair of first upper surface electrode layers different in electrode material from the provided lower surface electrode layer, and the first upper surface electrode provided on the upper surface of the first upper surface electrode layer apart from the side edge of the substrate A pair of second upper surface electrode layers made of the same material as the layer, a protective layer provided so as to cover at least the resistance layer, and at least the second upper surface electrode of the side surface of the substrate and the first upper surface electrode layer A side electrode layer having a height lower than that of the second upper surface electrode layer provided on the upper surface having no layer, and a plating layer so as to cover the lower electrode layer, the second upper electrode layer, and the side electrode layer Resistor provided.

The resistor according to claim 1, wherein the resistance layer is provided up to a side end portion of the substrate.

The resistor according to claim 1, wherein the lower electrode layer is provided up to a side end portion of the substrate.

The resistor according to claim 1, wherein the first upper surface electrode layer is provided up to a side end portion of the substrate.

2. The resistor according to claim 1, wherein the lower electrode layer is made of copper conductive powder containing glass frit, the first and second upper electrode layers are made of copper, and the resistance layer is made of an alloy powder of nickel and copper. .

The lower electrode layer is made of silver conductive powder containing glass frit, the first and second upper electrode layers are made of silver and palladium conductive powder containing glass frit, and the resistance layer is made of silver and palladium. The resistor according to claim 1, comprising the alloy powder of

The resistor according to claim 1, wherein the side electrode layer is made of a conductive material containing at least glass or resin.

Forming a bottom electrode so as to straddle the dividing groove on the bottom surface of the sheet substrate having the dividing groove, forming a resistance layer on the upper surface excluding side portions in one section divided by the dividing groove, and Forming a first upper electrode layer so as to straddle the dividing groove on the upper surface of the sheet substrate with an electrode material different from the electrode material of the lower electrode layer, and to partially overlap the resistance layer; Forming a second upper surface electrode layer on the upper surface of the first upper surface electrode layer by using the same electrode material as the upper surface electrode layer and spaced apart from directly above the dividing groove of the sheet substrate; and A step of trimming the resistance layer so as to have a desired resistance value while abutting at least a two-terminal probe on the electrode; a step of forming a protection layer so as to cover at least the resistance layer; and a sheet having the protection layer The process of dividing the substrate into strips Forming a side electrode layer having a height lower than that of the second upper surface electrode layer on at least a side surface of the strip-shaped substrate and an upper surface of the first upper surface electrode layer that does not have the second upper surface electrode layer; The step of dividing the strip-shaped substrate formed by forming the side electrode layer to form an individual substrate, and forming a plating layer so as to cover the lower electrode layer, the second upper electrode layer, and the side electrode layer And a step of abutting a probe having at least two terminals on the upper surface of the plating layer on the upper surface of the second upper surface electrode and at the same position as the trimming step to measure a resistance value and select a desired resistance value range; The manufacturing method of the resistor which consists of.

The method of manufacturing a resistor according to claim 8, wherein the step of forming the resistance layer is a step of providing up to a side end portion of the substrate.

The method of manufacturing a resistor according to claim 8, wherein the step of forming the lower surface electrode layer is a step of being provided up to a side end portion of the substrate.

The method of manufacturing a resistor according to claim 8, wherein the step of forming the first upper surface electrode layer is a step of forming the first upper surface electrode layer up to a side end portion of the substrate.

The step of forming the lower surface electrode layer is a step of printing and baking a material containing glass frit in a copper conductive powder, and the step of forming the first and second upper surface electrode layers is a material made of copper. 9. The method of manufacturing a resistor according to claim 8, wherein the step of forming the resistance layer is a step of printing and baking a material made of an alloy powder of nickel and copper.

The step of forming the lower surface electrode layer is a step of printing and baking a material containing glass frit on silver conductive powder, and the step of forming the first and second upper surface electrode layers is made of silver and palladium. The step of printing and baking a material containing glass frit in the conductive powder, and the step of forming the resistance layer is a step of printing and baking a material made of an alloy powder of silver and palladium. A method for manufacturing the resistor according to claim 8.

9. The method of manufacturing a resistor according to claim 8, wherein the step of forming the side electrode layer is a step of applying, firing or curing a material made of a conductive material containing at least glass or resin.