JP3620349B2 - Filling method of filler - Google Patents
Filling method of filler Download PDFInfo
- Publication number
- JP3620349B2 JP3620349B2 JP17419099A JP17419099A JP3620349B2 JP 3620349 B2 JP3620349 B2 JP 3620349B2 JP 17419099 A JP17419099 A JP 17419099A JP 17419099 A JP17419099 A JP 17419099A JP 3620349 B2 JP3620349 B2 JP 3620349B2
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- Japan
- Prior art keywords
- filling
- component
- filler
- sealing jig
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/921—Connecting a surface with connectors of different types
- H01L2224/9212—Sequential connecting processes
- H01L2224/92122—Sequential connecting processes the first connecting process involving a bump connector
- H01L2224/92125—Sequential connecting processes the first connecting process involving a bump connector the second connecting process involving a layer connector
Landscapes
- Coating Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Description
【０００１】
【発明の属する技術分野】
本発明は、プリント板ユニット製造における基板への部品の実装工程に関し、特に、部品と基板の接合部の信頼性を向上させる目的で使用する補強用充填材の充填に関する。
【０００２】
かかる充填においては、短時間で、部品と基板の間に十分に充填し、且つ周囲のテストパッド／部品に充填材が付着しないことが要求されている。
【０００３】
【従来の技術】
従来、部品と基板の接合部の補強のため、充填材を充填器具から押し出し、基板上に実装された部品の下面に充填している。
【０００４】
図７は、部品２と基板１の間隙Ｄ０が適度に狭い場合、例えば ０．５ｍｍ程度の例で、標準的なエポキシ樹脂の充填材７（粘度２４Ｐａ・ｓ程度）を用いた場合を示す。この場合、充填材７は、部品２と基板１間の毛細管現象により部品２下部に引き寄せられ、常温下３分程度で、部品幅１０ｍｍを浸透させ、部品２と基板１の間を十分に満たす充填が可能である。
【０００５】
しかし、セラミックパッケージのボールグリッドアレイを用いた部品等においては、図８に示す如く、部品２と基板１の間隙Ｄ０が、例えば ０．８ｍｍ程度と広く、毛細管現象による充填材７の引き込みが困難であるため、部品２周囲を回るように充填している。この場合、一度充填を行い、充填材７を部品２下部へ浸透させるため数分放置後、再度充填を行っている。
【０００６】
【発明が解決しようとする課題】
従来の充填方法においては、放置工程を含むため時間を要する上に、部品２下部に気泡が残留し、補強が不完全なため、十分な信頼性が得られない。
【０００７】
また、部品周囲への充填材７のダレが発生し、部品外周より１０ｍｍ程度の範囲で周囲部品へ充填材７が付着するため、テストパッドの使用制限や部品のリペア作業に支障を与えるという問題がある。
【０００８】
本発明は、かかる問題を解決し、短時間で部品下部の十分な充填を行い、且つ部品周囲のテストパッドや部品に充填材が付着することを防止することを目的とする。
【０００９】
【課題を解決するための手段】
本発明では、上記課題を解決するために、充填口及び排気口を備えた、部品の周囲を覆う封止治具を用い、充填材を強制的に充填することを特徴とする。
【００１０】
【発明の実施の形態】
図１は本発明の充填方法の実施例である。封止治具３を、部品２端面と基板１の間に隙間ができないように設置し、充填器具６を充填口４に装着し、排気口５から充填材７があふれるまで充填を行う。充填完了後、充填器具６を封止治具３から抜き取り、充填材７を硬化させる。充填材７硬化後、封止治具３を部品２周囲から取り外す。
【００１１】
これにより、一回の充填で、すなわち短時間で十分な充填を行い、かつ部品周囲への充填材７の付着をなくすことが可能となる。
【００１２】
本発明の封止治具の材料として、充填材、例えばエポキシ系の充填材７と離型性の良い材料、例えばフッ素系の樹脂にて構成することにより、充填材７硬化後、封止治具３の取り外しが容易となる。
【００１３】
図２は、二層構造の封止治具３の実施例であり、封止治具３本体は金属板で構成し、表面にフッ素系の樹脂を貼りつけた構成であることを特徴とする。封止治具の構造材として金属板を用い、表面はフッ素系の樹脂とする構成により、取り外しが容易な封止治具を安価に構成できる。
【００１４】
図３は、弾性材による封止治具を用いた充填方法の実施例である。本実施例では、弾性材による封止治具１３の外周Ｌ１、及び幅Ｄ１を、部品２の外周Ｌ０より小型で、部品２と基板１の間隙Ｄ０よりも幅の広いリング状、あるいは枠状の弾性材にて構成し、封止治具１３を、部品２周囲と基板１間を覆うように設置する。充填材７の充填は、弾性材による封止治具１３を押し広げて充填口、及び排気口とし、充填器具６及び排気パイプ１５を装着し、実施する。充填材７を充填した後、充填器具６と排気パイプ１５を引き抜き、弾性材による封止治具１３の収縮力によって封止する。
【００１５】
ここで用いる充填器具及び排気パイプの断面は、図４に示す如く、弾性材による封止治具１３と部品２の間の隙間を小さくする形状、例えば半円形であることが望ましい。
【００１６】
本実施例の封止治具は場所をとらないため、封止治具を装着した状態で充填作業完了としても良い。
【００１７】
充填後、弾性材による封止治具１３を取り外す場合は、弾性材の材料として、充填材、例えばエポキシ系の充填材７と離型性の良い材料、例えばフッ素ゴムを用いることにより充填材７硬化後、封止治具３の取り外しが容易となる。
【００１８】
図５は、上記各実施例において、基板１を傾斜させた他の実施例である。充填口４が下方に、排気口５が上方にくるように基板１を傾斜させることにより、充填材７の自重により充填材７が下方から充填されるため、部品２下部の気泡残留を防ぐ効果を高めることが可能となる。
【００１９】
上記の各実施例において、排気口５、あるいは排気パイプ１５に真空ポンプ等の強制排気手段を接続し、充填前から、あるいは充填と同時に部品２下部の排気を行い、充填後解除することにより、充填速度を高めても部品２下部の気泡残留を防ぐことが可能となる。
【００２０】
また、弾性材による封止治具１３の形状を、図６の如く充填器具及び排気パイプの形状に合わせた形状とすることで密閉性をあげ、排気効果を高めることが可能となる。
【００２１】
本発明の封止治具を用い、充填すべき範囲を規制することで部品周囲への充填材のダレによる付着を防止し、充填器具により充填口から、即ち一方向から強制的に充填することで、短時間で部品下部の気泡残留のない充填が可能となる。また、部品下部の強制排気を行うことで、充填速度をさらに高めることが可能となる。
【００２２】
【発明の効果】
従来、充填作業時間：２０分（充填率：７０％、充填材のダレによるテストパッドと部品に充填材が付着する範囲：周囲１０ｍｍ）であったものを、
充填作業時間：３分（充填率：１００％、充填材のダレによるテストパッドと部品に充填材が付着する範囲：周囲０ｍｍ）とすることが可能となる。
【００２３】
また、弾性材による封止治具を装着した状態で充填作業完了とした場合、充填材硬化工程、封止治具の取り外し工程を省くことで、大幅な作業時間の短縮が可能となる。
【図面の簡単な説明】
【図１】本発明での充填方法
【図２】二層構造の封止治具の実施例
【図３】弾性材による封止治具を用いた充填方法
【図４】充填器具及び排気パイプの断面が半円形の例
【図５】基板を傾斜させた本発明の実施例
【図６】弾性材による封止治具の他の実施例
【図７】部品と基板の間隙が適度に狭い場合
【図８】部品と基板の間隙が広い場合
【符号の説明】
１ 基板
２ 部品
３ 封止治具
４ 充填口
５ 排気口
６ 充填器具
７ 充填材
１３ 弾性材による封止治具
１５ 排気パイプ
Ｄ０ 部品と基板の間隙
Ｄ１ 弾性材による封止治具の幅
Ｌ０ 部品の外周
Ｌ１ 弾性材封止治具の外周[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component mounting process on a substrate in printed board unit manufacturing, and more particularly to filling of a reinforcing filler used for the purpose of improving the reliability of the joint between the component and the substrate.
[0002]
In such filling, it is required that the filling is sufficiently performed between the component and the substrate in a short time, and the filling material does not adhere to the surrounding test pads / components.
[0003]
[Prior art]
Conventionally, in order to reinforce the joint between the component and the substrate, the filler is extruded from the filling device and filled on the lower surface of the component mounted on the substrate.
[0004]
FIG. 7 shows a case where the gap D0 between the component 2 and the substrate 1 is reasonably narrow, for example, about 0.5 mm, and a standard epoxy resin filler 7 (viscosity of about 24 Pa · s) is used. In this case, the filler 7 is attracted to the lower part of the component 2 due to the capillary phenomenon between the component 2 and the substrate 1 and penetrates the component width of 10 mm in about 3 minutes at room temperature to sufficiently fill the space between the component 2 and the substrate 1. Filling is possible.
[0005]
However, in a component using a ball grid array of a ceramic package, as shown in FIG. 8, the gap D0 between the component 2 and the substrate 1 is as wide as about 0.8 mm, for example, and it is difficult to pull in the filler 7 due to a capillary phenomenon. Therefore, it is filled around the part 2. In this case, the filling is performed once, and the filling material 7 is allowed to stand for several minutes in order to infiltrate the lower part of the component 2, and then the filling is performed again.
[0006]
[Problems to be solved by the invention]
In the conventional filling method, since it includes a leaving step, it takes time, and bubbles remain in the lower part of the component 2 and the reinforcement is incomplete, so that sufficient reliability cannot be obtained.
[0007]
In addition, sagging of the filler 7 around the part occurs, and the filler 7 adheres to the surrounding part within a range of about 10 mm from the outer periphery of the part. There is.
[0008]
An object of the present invention is to solve this problem, to sufficiently fill the lower part of the component in a short time, and to prevent the filler from adhering to the test pad and the component around the component.
[0009]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, the present invention is characterized by forcibly filling a filler using a sealing jig that includes a filling port and an exhaust port and covers the periphery of the component.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 shows an embodiment of the filling method of the present invention. The sealing jig 3 is installed so that there is no gap between the end face of the component 2 and the substrate 1, and the filling device 6 is attached to the filling port 4 and filling is performed until the filler 7 overflows from the exhaust port 5. After filling is completed, the filling tool 6 is extracted from the sealing jig 3 and the filler 7 is cured. After the filler 7 is cured, the sealing jig 3 is removed from the periphery of the component 2.
[0011]
As a result, it is possible to perform sufficient filling in a single filling, that is, in a short time, and to eliminate the adhesion of the filler 7 around the part.
[0012]
As a material for the sealing jig of the present invention, a sealing material is cured after the filler 7 is cured by being composed of a filler, for example, an epoxy-based filler 7 and a material having good releasability, such as a fluorine-based resin. The tool 3 can be easily removed.
[0013]
FIG. 2 shows an embodiment of a sealing jig 3 having a two-layer structure, wherein the sealing jig 3 body is formed of a metal plate and has a configuration in which a fluorine-based resin is attached to the surface. . By using a metal plate as the structural material of the sealing jig and using a fluorine resin on the surface, a sealing jig that can be easily removed can be configured at low cost.
[0014]
FIG. 3 shows an embodiment of a filling method using a sealing jig made of an elastic material. In this embodiment, the outer periphery L1 and the width D1 of the
[0015]
As shown in FIG. 4, the cross section of the filling instrument and the exhaust pipe used here preferably has a shape that reduces the gap between the
[0016]
Since the sealing jig of this embodiment does not take up space, the filling operation may be completed with the sealing jig attached.
[0017]
When the
[0018]
FIG. 5 shows another embodiment in which the substrate 1 is inclined in each of the above embodiments. By inclining the substrate 1 so that the filling port 4 is directed downward and the exhaust port 5 is directed upward, the filler 7 is filled from below by the dead weight of the filler 7. Can be increased.
[0019]
In each of the above embodiments, a forced exhaust means such as a vacuum pump is connected to the exhaust port 5 or the exhaust pipe 15, and the lower part 2 is exhausted before or simultaneously with the filling, and then released after the filling, Even if the filling speed is increased, it is possible to prevent bubbles from remaining in the lower part of the component 2.
[0020]
Further, by making the shape of the
[0021]
By using the sealing jig of the present invention, the range to be filled is regulated to prevent the filler from adhering to the periphery of the part, and the filling device is forcibly filled from the filling port, that is, from one direction. Thus, filling without bubbles remaining in the lower part of the component can be performed in a short time. In addition, the filling speed can be further increased by performing forced exhaust of the lower part of the component.
[0022]
【The invention's effect】
Conventionally, the filling operation time: 20 minutes (filling rate: 70%, the range in which the filler adheres to the test pad and the part due to sagging of the filler: 10 mm circumference)
Filling operation time: 3 minutes (filling rate: 100%, range where the filler adheres to the test pad and the part due to sagging of the filler: 0 mm circumference).
[0023]
Further, when the filling operation is completed with the sealing jig made of an elastic material attached, the working time can be greatly shortened by omitting the filling material curing process and the sealing jig removing process.
[Brief description of the drawings]
FIG. 1 shows a filling method according to the present invention. FIG. 2 shows an example of a two-layer sealing jig. FIG. 3 shows a filling method using a sealing jig made of an elastic material. FIG. 5 shows an embodiment of the present invention in which the substrate is inclined. FIG. 6 shows another embodiment of a sealing jig made of an elastic material. FIG. 7 shows a reasonably narrow gap between the component and the substrate. Case [Figure 8] When the gap between the component and the board is wide [Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Parts 3 Sealing jig 4 Filling port 5 Exhaust port 6 Filling instrument 7
Claims (3)
封止治具を、該部品の外周より小型の外周を持つ弾性材にて構成し、該封止治具にて該部品の周囲を覆い充填する範囲を規制した後、充填器具、及び排気パイプを該封止治具及び該部品間に装着し、充填材を充填器具により強制的に充填し、封止治具の取り外し工程を省いて充填材を硬化させることを特徴とする充填材の充填方法。A method of filling a filler on a lower surface of a component mounted on a substrate,
The sealing jig is made of an elastic material having a smaller outer periphery than the outer periphery of the component, and the filling jig and the exhaust pipe are restricted after the range of the sealing jig covering the periphery of the component is regulated. Is filled between the sealing jig and the component , the filler is forcibly filled with a filling device, and the filling material is cured by omitting the step of removing the sealing jig. Method.
基板を傾斜させ、充填口あるいは充填器具を下方に設置し、排気口あるいは排気パイプを上方に設置して、強制充填することを特徴とする充填材の充填方法。The filling method according to claim 1,
A filling material filling method, wherein a substrate is inclined, a filling port or a filling device is installed downward, and an exhaust port or an exhaust pipe is installed upward to perform forced filling.
排気口から強制排気することを特徴とする充填材の充填方法。The filling method according to claim 1,
A filling material filling method, wherein forced exhaust is performed from an exhaust port.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17419099A JP3620349B2 (en) | 1999-06-21 | 1999-06-21 | Filling method of filler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17419099A JP3620349B2 (en) | 1999-06-21 | 1999-06-21 | Filling method of filler |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001007127A JP2001007127A (en) | 2001-01-12 |
| JP3620349B2 true JP3620349B2 (en) | 2005-02-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17419099A Expired - Fee Related JP3620349B2 (en) | 1999-06-21 | 1999-06-21 | Filling method of filler |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3620349B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5050573B2 (en) * | 2007-03-05 | 2012-10-17 | 富士通株式会社 | Manufacturing method of electronic device |
| JP5204185B2 (en) * | 2010-09-24 | 2013-06-05 | 株式会社東芝 | Control module manufacturing method |
-
1999
- 1999-06-21 JP JP17419099A patent/JP3620349B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001007127A (en) | 2001-01-12 |
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