JP2001007127A - Method for filling filler - Google Patents

Method for filling filler

Info

Publication number
JP2001007127A
JP2001007127A JP11174190A JP17419099A JP2001007127A JP 2001007127 A JP2001007127 A JP 2001007127A JP 11174190 A JP11174190 A JP 11174190A JP 17419099 A JP17419099 A JP 17419099A JP 2001007127 A JP2001007127 A JP 2001007127A
Authority
JP
Japan
Prior art keywords
filling
filler
component
parts
sealing jig
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11174190A
Other languages
Japanese (ja)
Other versions
JP3620349B2 (en
Inventor
Toru Okada
徹 岡田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP17419099A priority Critical patent/JP3620349B2/en
Publication of JP2001007127A publication Critical patent/JP2001007127A/en
Application granted granted Critical
Publication of JP3620349B2 publication Critical patent/JP3620349B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73201Location after the connecting process on the same surface
    • H01L2224/73203Bump and layer connectors
    • H01L2224/73204Bump and layer connectors the bump connector being embedded into the layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92Specific sequence of method steps
    • H01L2224/921Connecting a surface with connectors of different types
    • H01L2224/9212Sequential connecting processes
    • H01L2224/92122Sequential connecting processes the first connecting process involving a bump connector
    • H01L2224/92125Sequential connecting processes the first connecting process involving a bump connector the second connecting process involving a layer connector

Landscapes

  • Coating Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

PROBLEM TO BE SOLVED: To prevent a filler from adhering to a test pad around parts and the parts by using a sealing tool for covering the surrounding of the parts with a filling vent and an exhaust vent, and forcibly filling the filler between the parts and a substrate. SOLUTION: A sealing tool 3 using a fluororesin material is installed so that there is no gap between the end face of parts 2 and a substrate 1, and a filling apparatus 6 is fitted to a filling vent 4 until a filler 7 is overflowed from an exhaust vent 5. Then, after the filling is completed, the filling apparatus 6 is extracted from the sealing tool 3 and the filler 7 is cured. After the curing, the sealing tool 3 is removed from the surrounding of the parts 2, thus quickly performing filling without any retention of bubbles at the lower portion of the parts 2 and forcibly evacuating the lower portion of the parts 2 and hence a filling speed can be further increased.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、プリント板ユニッ
ト製造における基板への部品の実装工程に関し、特に、
部品と基板の接合部の信頼性を向上させる目的で使用す
る補強用充填材の充填に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a process for mounting components on a board in the manufacture of a printed board unit,
The present invention relates to filling of a reinforcing filler used for the purpose of improving the reliability of a joint between a component and a board.

【0002】かかる充填においては、短時間で、部品と
基板の間に十分に充填し、且つ周囲のテストパッド/部
品に充填材が付着しないことが要求されている。
In such filling, it is required that the space between the component and the substrate be sufficiently filled in a short time, and that the filler does not adhere to the surrounding test pads / components.

【0003】[0003]

【従来の技術】従来、部品と基板の接合部の補強のた
め、充填材を充填器具から押し出し、基板上に実装され
た部品の下面に充填している。
2. Description of the Related Art Conventionally, in order to reinforce a joint between a component and a substrate, a filler is extruded from a filling device and is filled in the lower surface of the component mounted on the substrate.

【0004】図7は、部品2と基板1の間隙D0が適度
に狭い場合、例えば 0.5mm程度の例で、標準的なエポキ
シ樹脂の充填材7(粘度24Pa・s程度)を用いた場
合を示す。この場合、充填材7は、部品2と基板1間の
毛細管現象により部品2下部に引き寄せられ、常温下3
分程度で、部品幅10mmを浸透させ、部品2と基板1の間
を十分に満たす充填が可能である。
FIG. 7 shows a case where the gap D0 between the component 2 and the board 1 is appropriately narrow, for example, about 0.5 mm, and a case where a standard epoxy resin filler 7 (viscosity of about 24 Pa · s) is used. Show. In this case, the filler 7 is attracted to the lower part of the component 2 by the capillary action between the component 2 and the substrate 1, and becomes lower at room temperature.
In about a minute, a part width of 10 mm can be permeated and a sufficient filling between the part 2 and the substrate 1 can be achieved.

【0005】しかし、セラミックパッケージのボールグ
リッドアレイを用いた部品等においては、図8に示す如
く、部品2と基板1の間隙D0が、例えば 0.8mm程度と
広く、毛細管現象による充填材7の引き込みが困難であ
るため、部品2周囲を回るように充填している。この場
合、一度充填を行い、充填材7を部品2下部へ浸透させ
るため数分放置後、再度充填を行っている。
However, in a component using a ball grid array of a ceramic package, as shown in FIG. 8, the gap D0 between the component 2 and the substrate 1 is wide, for example, about 0.8 mm, and the filler 7 is drawn in by a capillary phenomenon. Is difficult to fill, so that it is filled around the part 2. In this case, the filling is performed once, and the filling is performed again after being left for several minutes in order to allow the filler 7 to penetrate into the lower part of the component 2.

【0006】[0006]

【発明が解決しようとする課題】従来の充填方法におい
ては、放置工程を含むため時間を要する上に、部品2下
部に気泡が残留し、補強が不完全なため、十分な信頼性
が得られない。
In the conventional filling method, a long time is required because of the necessity of a leaving step. In addition, bubbles remain at the lower part of the component 2 and reinforcement is incomplete, so that sufficient reliability can be obtained. Absent.

【0007】また、部品周囲への充填材7のダレが発生
し、部品外周より10mm程度の範囲で周囲部品へ充填
材7が付着するため、テストパッドの使用制限や部品の
リペア作業に支障を与えるという問題がある。
In addition, since the filler 7 is dripped around the component and adheres to the peripheral component within a range of about 10 mm from the outer periphery of the component, the use of the test pad is restricted and the repair work of the component is hindered. There is a problem of giving.

【0008】本発明は、かかる問題を解決し、短時間で
部品下部の十分な充填を行い、且つ部品周囲のテストパ
ッドや部品に充填材が付着することを防止することを目
的とする。
SUMMARY OF THE INVENTION It is an object of the present invention to solve such a problem and to sufficiently fill a lower portion of a component in a short time, and to prevent a filler from adhering to a test pad or a component around the component.

【0009】[0009]

【課題を解決するための手段】本発明では、上記課題を
解決するために、充填口及び排気口を備えた、部品の周
囲を覆う封止治具を用い、充填材を強制的に充填するこ
とを特徴とする。
In order to solve the above-mentioned problems, the present invention forcibly fills a filler by using a sealing jig having a filling port and an exhaust port and covering the periphery of a component. It is characterized by the following.

【0010】[0010]

【発明の実施の形態】図1は本発明の充填方法の実施例
である。封止治具3を、部品2端面と基板1の間に隙間
ができないように設置し、充填器具6を充填口4に装着
し、排気口5から充填材7があふれるまで充填を行う。
充填完了後、充填器具6を封止治具3から抜き取り、充
填材7を硬化させる。充填材7硬化後、封止治具3を部
品2周囲から取り外す。
FIG. 1 shows an embodiment of a filling method according to the present invention. The sealing jig 3 is installed so that there is no gap between the end surface of the component 2 and the substrate 1, the filling tool 6 is mounted on the filling port 4, and filling is performed until the filling material 7 overflows from the exhaust port 5.
After the filling is completed, the filling tool 6 is removed from the sealing jig 3 and the filler 7 is cured. After the filling material 7 is cured, the sealing jig 3 is removed from around the component 2.

【0011】これにより、一回の充填で、すなわち短時
間で十分な充填を行い、かつ部品周囲への充填材7の付
着をなくすことが可能となる。
As a result, it is possible to perform sufficient filling in one filling, that is, in a short time, and to eliminate the adhesion of the filler 7 around the components.

【0012】本発明の封止治具の材料として、充填材、
例えばエポキシ系の充填材7と離型性の良い材料、例え
ばフッ素系の樹脂にて構成することにより、充填材7硬
化後、封止治具3の取り外しが容易となる。
As a material of the sealing jig of the present invention, a filler,
For example, by using an epoxy-based filler 7 and a material having good releasability, for example, a fluorine-based resin, it is easy to remove the sealing jig 3 after the filler 7 is cured.

【0013】図2は、二層構造の封止治具3の実施例で
あり、封止治具3本体は金属板で構成し、表面にフッ素
系の樹脂を貼りつけた構成であることを特徴とする。封
止治具の構造材として金属板を用い、表面はフッ素系の
樹脂とする構成により、取り外しが容易な封止治具を安
価に構成できる。
FIG. 2 shows an embodiment of the sealing jig 3 having a two-layer structure. The sealing jig 3 is formed of a metal plate and has a structure in which a fluorine-based resin is adhered to the surface. Features. Since a metal plate is used as the structural material of the sealing jig and the surface is made of a fluorine-based resin, an easily removable sealing jig can be configured at low cost.

【0014】図3は、弾性材による封止治具を用いた充
填方法の実施例である。本実施例では、弾性材による封
止治具13の外周L1、及び幅D1を、部品2の外周L
0より小型で、部品2と基板1の間隙D0よりも幅の広
いリング状、あるいは枠状の弾性材にて構成し、封止治
具13を、部品2周囲と基板1間を覆うように設置す
る。充填材7の充填は、弾性材による封止治具13を押
し広げて充填口、及び排気口とし、充填器具6及び排気
パイプ15を装着し、実施する。充填材7を充填した
後、充填器具6と排気パイプ15を引き抜き、弾性材に
よる封止治具13の収縮力によって封止する。
FIG. 3 shows an embodiment of a filling method using a sealing jig made of an elastic material. In the present embodiment, the outer circumference L1 and the width D1 of the sealing jig 13 made of an elastic material are
0, and is made of a ring-shaped or frame-shaped elastic material wider than the gap D0 between the component 2 and the substrate 1, and the sealing jig 13 is provided so as to cover the periphery of the component 2 and the space between the substrate 1. Install. The filling of the filler 7 is performed by expanding the sealing jig 13 made of an elastic material to form a filling port and an exhaust port, and mounting the filling device 6 and the exhaust pipe 15. After the filling material 7 is filled, the filling device 6 and the exhaust pipe 15 are pulled out and sealed by the contracting force of the sealing jig 13 made of an elastic material.

【0015】ここで用いる充填器具及び排気パイプの断
面は、図4に示す如く、弾性材による封止治具13と部
品2の間の隙間を小さくする形状、例えば半円形である
ことが望ましい。
As shown in FIG. 4, the cross section of the filling device and the exhaust pipe used here is desirably a shape that reduces the gap between the sealing jig 13 and the component 2 made of an elastic material, for example, a semicircular shape.

【0016】本実施例の封止治具は場所をとらないた
め、封止治具を装着した状態で充填作業完了としても良
い。
Since the sealing jig of this embodiment does not take up space, the filling operation may be completed with the sealing jig mounted.

【0017】充填後、弾性材による封止治具13を取り
外す場合は、弾性材の材料として、充填材、例えばエポ
キシ系の充填材7と離型性の良い材料、例えばフッ素ゴ
ムを用いることにより充填材7硬化後、封止治具3の取
り外しが容易となる。
When the sealing jig 13 made of an elastic material is removed after the filling, a filler, for example, an epoxy-based filler 7 and a material having good releasability, for example, a fluorine rubber, are used as the elastic material. After the filling material 7 is cured, the sealing jig 3 can be easily removed.

【0018】図5は、上記各実施例において、基板1を
傾斜させた他の実施例である。充填口4が下方に、排気
口5が上方にくるように基板1を傾斜させることによ
り、充填材7の自重により充填材7が下方から充填され
るため、部品2下部の気泡残留を防ぐ効果を高めること
が可能となる。
FIG. 5 shows another embodiment in which the substrate 1 is inclined in each of the above embodiments. By inclining the substrate 1 so that the filling port 4 is at the bottom and the exhaust port 5 is at the top, the filling material 7 is filled from below by the own weight of the filling material 7. Can be increased.

【0019】上記の各実施例において、排気口5、ある
いは排気パイプ15に真空ポンプ等の強制排気手段を接
続し、充填前から、あるいは充填と同時に部品2下部の
排気を行い、充填後解除することにより、充填速度を高
めても部品2下部の気泡残留を防ぐことが可能となる。
In each of the above-described embodiments, a forced exhaust means such as a vacuum pump is connected to the exhaust port 5 or the exhaust pipe 15, and the lower portion of the component 2 is exhausted before or at the same time as filling, and is released after filling. This makes it possible to prevent bubbles from remaining at the lower part of the component 2 even when the filling speed is increased.

【0020】また、弾性材による封止治具13の形状
を、図6の如く充填器具及び排気パイプの形状に合わせ
た形状とすることで密閉性をあげ、排気効果を高めるこ
とが可能となる。
Further, by making the shape of the sealing jig 13 made of an elastic material conform to the shape of the filling device and the exhaust pipe as shown in FIG. 6, it is possible to improve the airtightness and enhance the exhaust effect. .

【0021】本発明の封止治具を用い、充填すべき範囲
を規制することで部品周囲への充填材のダレによる付着
を防止し、充填器具により充填口から、即ち一方向から
強制的に充填することで、短時間で部品下部の気泡残留
のない充填が可能となる。また、部品下部の強制排気を
行うことで、充填速度をさらに高めることが可能とな
る。
The sealing jig of the present invention is used to regulate the area to be filled, thereby preventing the filler from adhering to the periphery of the component due to sagging. By filling, it is possible to fill in a short time without remaining bubbles in the lower part of the component. Further, by performing the forced exhaust of the lower part of the component, the filling speed can be further increased.

【0022】[0022]

【発明の効果】従来、充填作業時間:20分(充填率:
70%、充填材のダレによるテストパッドと部品に充填
材が付着する範囲:周囲10mm)であったものを、充
填作業時間:3分(充填率:100%、充填材のダレに
よるテストパッドと部品に充填材が付着する範囲:周囲
0mm)とすることが可能となる。
Conventionally, the filling operation time: 20 minutes (filling rate:
What was 70%, the test pad due to the filler sagging and the area where the filler adheres to the parts: 10 mm around the part, but the filling work time: 3 minutes (filling rate: 100%, the test pad due to sagging of the filler) (A range where the filler adheres to the component: 0 mm around).

【0023】また、弾性材による封止治具を装着した状
態で充填作業完了とした場合、充填材硬化工程、封止治
具の取り外し工程を省くことで、大幅な作業時間の短縮
が可能となる。
Further, when the filling operation is completed with the sealing jig made of an elastic material mounted, the work time can be greatly reduced by omitting the filling material curing step and the removing step of the sealing jig. Become.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本発明での充填方法FIG. 1 shows a filling method according to the present invention.

【図2】 二層構造の封止治具の実施例FIG. 2 shows an embodiment of a sealing jig having a two-layer structure.

【図3】 弾性材による封止治具を用いた充填方法FIG. 3 A filling method using a sealing jig made of an elastic material.

【図4】 充填器具及び排気パイプの断面が半円形の例FIG. 4 shows an example in which the cross section of the filling device and the exhaust pipe is semicircular.

【図5】 基板を傾斜させた本発明の実施例FIG. 5 shows an embodiment of the present invention in which the substrate is inclined.

【図6】 弾性材による封止治具の他の実施例FIG. 6 shows another embodiment of a sealing jig made of an elastic material.

【図7】 部品と基板の間隙が適度に狭い場合FIG. 7: When the gap between the component and the board is appropriately narrow

【図8】 部品と基板の間隙が広い場合FIG. 8 When the gap between the component and the board is wide

【符号の説明】[Explanation of symbols]

1 基板 2 部品 3 封止治具 4 充填口 5 排気口 6 充填器具 7 充填材 13 弾性材による封止治具 15 排気パイプ D0 部品と基板の間隙 D1 弾性材による封止治具の幅 L0 部品の外周 L1 弾性材封止治具の外周 DESCRIPTION OF SYMBOLS 1 Substrate 2 Component 3 Sealing jig 4 Filling port 5 Exhaust port 6 Filling instrument 7 Filler 13 Sealing jig made of elastic material 15 Exhaust pipe D0 Gap between component and substrate D1 Width of sealing jig made of elastic material L0 Part Outer circumference L1 Outer circumference of elastic material sealing jig

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) H05K 3/28 H05K 3/28 B 5F061 Fターム(参考) 4D075 AC02 BB56Y DA06 DA33 DC21 EA05 EA60 EB16 EB33 4F041 AA05 CA02 CA11 CA13 4F042 AA06 AB00 DC00 DF07 4M109 AA01 BA03 CA06 DB07 5E314 AA39 BB06 BB09 BB11 CC00 FF01 GG19 5F061 AA01 BA03 CA06 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI theme coat ゛ (Reference) H05K 3/28 H05K 3/28 B 5F061 F term (Reference) 4D075 AC02 BB56Y DA06 DA33 DC21 EA05 EA60 EB16 EB33 4F041 AA05 CA02 CA11 CA13 4F042 AA06 AB00 DC00 DF07 4M109 AA01 BA03 CA06 DB07 5E314 AA39 BB06 BB09 BB11 CC00 FF01 GG19 5F061 AA01 BA03 CA06

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 基板上に実装された部品の下面に充填材
を充填する方法であって、充填口、及び排気口を備え
た、該部品の周囲を覆う封止治具により充填する範囲を
規制し、充填材を、充填口から充填器具により強制的に
充填することを特徴とする充填材の充填方法。
1. A method of filling a lower surface of a component mounted on a substrate with a filler, wherein a filling area provided with a filling port and an exhaust port is filled with a sealing jig surrounding the component. A filling method of a filling material, wherein the filling is regulated and the filling material is forcibly filled with a filling device from a filling port.
【請求項2】 基板上に実装された部品の下面に充填材
を充填する方法であって、封止治具を、該部品の外周よ
り小型の外周を持つ弾性材にて構成し、該封止治具にて
該部品の周囲を覆い充填する範囲を規制した後、充填器
具、及び排気パイプを該封止治具及び該部品間に装着
し、充填材を充填器具により強制的に充填することを特
徴とする充填材の充填方法。
2. A method of filling a lower surface of a component mounted on a substrate with a filler, wherein the sealing jig is made of an elastic material having an outer periphery smaller than the outer periphery of the component. After regulating the area to be filled by covering the periphery of the component with a fixing jig, a filling device and an exhaust pipe are mounted between the sealing jig and the component, and the filler is forcibly filled with the filling device. A method for filling a filler, characterized in that:
【請求項3】 請求項1及び2に記載の充填方法であっ
て、基板を傾斜させ、充填口あるいは充填器具を下方に
設置し、排気口あるいは排気パイプを上方に設置して、
強制充填することを特徴とする充填材の充填方法。
3. The filling method according to claim 1, wherein the substrate is tilted, a filling port or a filling device is installed below, and an exhaust port or an exhaust pipe is installed above,
A method for filling a filler, comprising forcibly filling.
【請求項4】 請求項1、2及び3に記載の充填方法で
あって、排気口から強制排気することを特徴とする充填
材の充填方法。
4. The filling method according to claim 1, 2 or 3, wherein forced exhaust is performed from an exhaust port.
JP17419099A 1999-06-21 1999-06-21 Filling method of filler Expired - Fee Related JP3620349B2 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008218708A (en) * 2007-03-05 2008-09-18 Fujitsu Ltd Resin filling equipment, filling method, and method for manufacturing electronic apparatus
JP2012069810A (en) * 2010-09-24 2012-04-05 Toshiba Corp Manufacturing method of control module

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008218708A (en) * 2007-03-05 2008-09-18 Fujitsu Ltd Resin filling equipment, filling method, and method for manufacturing electronic apparatus
JP2012069810A (en) * 2010-09-24 2012-04-05 Toshiba Corp Manufacturing method of control module
US9597824B2 (en) 2010-09-24 2017-03-21 Kabushiki Kaisha Toshiba Control module manufacturing method

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