JP3616659B2 - マイクロメカニックセンサおよびその製造方法 - Google Patents

マイクロメカニックセンサおよびその製造方法 Download PDF

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Publication number
JP3616659B2
JP3616659B2 JP12131594A JP12131594A JP3616659B2 JP 3616659 B2 JP3616659 B2 JP 3616659B2 JP 12131594 A JP12131594 A JP 12131594A JP 12131594 A JP12131594 A JP 12131594A JP 3616659 B2 JP3616659 B2 JP 3616659B2
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Japan
Prior art keywords
silicon
displacement
micromechanical
micromechanical sensor
oxide layer
Prior art date
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Expired - Lifetime
Application number
JP12131594A
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English (en)
Japanese (ja)
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JPH0799326A (ja
Inventor
ムホフ イェルク
ミュンツェル ホルスト
オッフェンベルク ミヒャエル
ヴァルトフォーゲル ヴィンフリート
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Robert Bosch GmbH
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Robert Bosch GmbH
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Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of JPH0799326A publication Critical patent/JPH0799326A/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
    • G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
    • G01P15/123—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
    • G01P2015/0825—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
    • G01P2015/0828—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being of the paddle type being suspended at one of its longitudinal ends

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Pressure Sensors (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
JP12131594A 1993-06-03 1994-06-02 マイクロメカニックセンサおよびその製造方法 Expired - Lifetime JP3616659B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4318466A DE4318466B4 (de) 1993-06-03 1993-06-03 Verfahren zur Herstellung eines mikromechanischen Sensors
DE4318466.9 1993-06-03

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2004260214A Division JP3762928B2 (ja) 1993-06-03 2004-09-07 マイクロメカニックセンサおよびその製造方法

Publications (2)

Publication Number Publication Date
JPH0799326A JPH0799326A (ja) 1995-04-11
JP3616659B2 true JP3616659B2 (ja) 2005-02-02

Family

ID=6489558

Family Applications (2)

Application Number Title Priority Date Filing Date
JP12131594A Expired - Lifetime JP3616659B2 (ja) 1993-06-03 1994-06-02 マイクロメカニックセンサおよびその製造方法
JP2004260214A Expired - Lifetime JP3762928B2 (ja) 1993-06-03 2004-09-07 マイクロメカニックセンサおよびその製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2004260214A Expired - Lifetime JP3762928B2 (ja) 1993-06-03 2004-09-07 マイクロメカニックセンサおよびその製造方法

Country Status (3)

Country Link
JP (2) JP3616659B2 (enrdf_load_stackoverflow)
DE (1) DE4318466B4 (enrdf_load_stackoverflow)
FR (1) FR2707043B1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104344917A (zh) * 2013-07-24 2015-02-11 横河电机株式会社 谐振传感器、其制造方法以及用于谐振传感器的多层结构

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19530736B4 (de) * 1995-02-10 2007-02-08 Robert Bosch Gmbh Beschleunigungssensor und Verfahren zur Herstellung eines Beschleunigungssensors
FR2732467B1 (fr) * 1995-02-10 1999-09-17 Bosch Gmbh Robert Capteur d'acceleration et procede de fabrication d'un tel capteur
DE19526691A1 (de) * 1995-07-21 1997-01-23 Bosch Gmbh Robert Verfahren zur Herstellung von Beschleunigungssensoren
DE19537814B4 (de) * 1995-10-11 2009-11-19 Robert Bosch Gmbh Sensor und Verfahren zur Herstellung eines Sensors
DE19632060B4 (de) * 1996-08-09 2012-05-03 Robert Bosch Gmbh Verfahren zur Herstellung eines Drehratensensors
DE19643893A1 (de) * 1996-10-30 1998-05-07 Siemens Ag Ultraschallwandler in Oberflächen-Mikromechanik
EP0895090B1 (en) * 1997-07-31 2003-12-10 STMicroelectronics S.r.l. Process for manufacturing high-sensitivity accelerometric and gyroscopic integrated sensors, and sensor thus produced
DE59907268D1 (de) * 1998-08-11 2003-11-13 Infineon Technologies Ag Verfahren zur Herstellung eines Mikromechanischen Sensors
US6379989B1 (en) * 1998-12-23 2002-04-30 Xerox Corporation Process for manufacture of microoptomechanical structures
DE10017976A1 (de) 2000-04-11 2001-10-18 Bosch Gmbh Robert Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren
US6479315B1 (en) 2000-11-27 2002-11-12 Microscan Systems, Inc. Process for manufacturing micromechanical and microoptomechanical structures with single crystal silicon exposure step
US6479311B1 (en) 2000-11-27 2002-11-12 Microscan Systems, Inc. Process for manufacturing micromechanical and microoptomechanical structures with pre-applied patterning
US6506620B1 (en) 2000-11-27 2003-01-14 Microscan Systems Incorporated Process for manufacturing micromechanical and microoptomechanical structures with backside metalization
DE10114036A1 (de) * 2001-03-22 2002-10-02 Bosch Gmbh Robert Verfahren zur Herstellung von mikromechanischen Sensoren und damit hergestellte Sensoren
DE10122765A1 (de) * 2001-05-10 2002-12-05 Campus Micro Technologies Gmbh Elektroakustischer Wandler zur Erzeugung oder Erfassung von Ultraschall, Wandler-Array und Verfahren zur Herstellung der Wandler bzw. der Wandler-Arrays
US6939809B2 (en) * 2002-12-30 2005-09-06 Robert Bosch Gmbh Method for release of surface micromachined structures in an epitaxial reactor
US6928879B2 (en) * 2003-02-26 2005-08-16 Robert Bosch Gmbh Episeal pressure sensor and method for making an episeal pressure sensor
US7335971B2 (en) * 2003-03-31 2008-02-26 Robert Bosch Gmbh Method for protecting encapsulated sensor structures using stack packaging
JP4552883B2 (ja) * 2006-04-19 2010-09-29 株式会社デンソー 振動検出方法
DE102008044371B4 (de) 2008-12-05 2016-10-27 Robert Bosch Gmbh Verfahren zur Herstellung einer Sensoranordnung

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4371421A (en) * 1981-04-16 1983-02-01 Massachusetts Institute Of Technology Lateral epitaxial growth by seeded solidification
JPH0712086B2 (ja) * 1984-01-27 1995-02-08 株式会社日立製作所 ダイヤフラムセンサの製造方法
US4893509A (en) * 1988-12-27 1990-01-16 General Motors Corporation Method and product for fabricating a resonant-bridge microaccelerometer
US5095401A (en) * 1989-01-13 1992-03-10 Kopin Corporation SOI diaphragm sensor
DE4000903C1 (enrdf_load_stackoverflow) * 1990-01-15 1990-08-09 Robert Bosch Gmbh, 7000 Stuttgart, De
DE4003473A1 (de) * 1990-02-06 1991-08-08 Bosch Gmbh Robert Kristallorientierter bewegungssensor und verfahren zu dessen herstellung
DE69113632T2 (de) * 1990-08-17 1996-03-21 Analog Devices Inc Monolithischer beschleunigungsmesser.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104344917A (zh) * 2013-07-24 2015-02-11 横河电机株式会社 谐振传感器、其制造方法以及用于谐振传感器的多层结构

Also Published As

Publication number Publication date
DE4318466B4 (de) 2004-12-09
JP3762928B2 (ja) 2006-04-05
FR2707043B1 (enrdf_load_stackoverflow) 1999-02-19
JPH0799326A (ja) 1995-04-11
FR2707043A1 (enrdf_load_stackoverflow) 1994-12-30
DE4318466A1 (de) 1994-12-08
JP2005062196A (ja) 2005-03-10

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